Intel® Server System H2000JF Family TPS

Intel®Server System H2000JF Family
Technical Product Specification
Intel order number: G39462-013
Revision 2.2
November, 2013
Enterprise Platforms and Services Division
Intel® Server System H2000JF Family TPS
Revision History
Revision History
Date
Revision Number
Modifications
January, 2012
1.0
Initial release.
February, 2012
1.1
Added environmental data.
March, 2012
1.2
May, 2012
1.3
July, 2012
1.4
August, 2012
1.5
October, 2012
1.6
November, 2012
1.7
January, 2013
1.8
June, 2013
1.9
September, 2013
2.0
October, 2013
2.1
Updated environmental specifications.
 Updated environmental specifications with ASHRAE specification.
 Updated Processor TDP to conditional support 135W.
 Added new bridge board for 6G SAS support.
 Added riser support for non-transparent bridge.
 Updated safety notice to rail kit installation.
 Updated InfiniBand* usage recommendation.
 Corrected typo in USB device beep in POST.
 Added new 6G SAS module solution.
 Updated power redundant scheme.
 Updated link to Rail specification.
 Updated system specification.
 Updated description of double width add-in card.
 Updated warning message on PSU configuration.
Updated E5-2600V2 support information.
Updated Rail installation note.
Updated power working mode.
Updated POST LED decode table, Video POST decode table, and
POST error beep code.
Updated IOM carrier specification.
November, 2013
2.2
Updated chassis air flow specification.
ii
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Disclaimers
Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly,
in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION
CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES,
SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH,
HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS'
FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL
INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR
NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF
THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not
rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves
these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this
information.
The products described in this document may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your
product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may
be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.
Revision 2.2
Intel order number: G39462-013
iii
Table of Contents
Intel® Server System H2000JF Family TPS
Table of Contents
1.
Introduction .......................................................................................................................... 1
1.1
Chapter Outline ........................................................................................................ 1
1.2
Server Board Use Disclaimer .................................................................................. 2
2. Product Overview ................................................................................................................. 3
2.1
System Views .......................................................................................................... 5
2.2
System Dimensions ................................................................................................. 5
2.3
System Level Environmental Limits ......................................................................... 6
2.3.1
High Temperature Ambience (HTA) Support ........................................................... 7
2.3.2
Set Throttling Mode ............................................................................................... 11
2.3.3
Altitude ................................................................................................................... 11
2.3.4
Set Fan Profile ....................................................................................................... 11
2.3.5
Fan PWM Offset .................................................................................................... 11
2.3.6
Quiet Fan Idle Mode .............................................................................................. 11
2.3.7
Thermal Sensor Input for Fan Speed Control ........................................................ 12
2.4
System Parts ......................................................................................................... 13
2.5
Hard Drive and Peripheral Bays ............................................................................ 14
2.6
Server Board Overview .......................................................................................... 14
2.7
Front Bezel Support ............................................................................................... 17
2.8
Rack and Cabinet Mounting Options ..................................................................... 18
3. Power Subsystem .............................................................................................................. 19
3.1
Mechanical Overview ............................................................................................. 19
3.1.1
AC Power Supply Unit Dimension Overview ......................................................... 19
3.1.2
AC Power Supply Unit General Data ..................................................................... 20
3.1.3
AC Input Connector ............................................................................................... 20
3.1.4
AC Power Cord Specification Requirements ......................................................... 20
3.1.5
Power Supply Unit DC Output Connector .............................................................. 20
3.1.6
Handle Retention ................................................................................................... 21
3.1.7
LED Marking and Identification .............................................................................. 21
3.1.8
Power Cage with Power Distribution Board ........................................................... 22
3.1.9
Power Cage Output Pin Assignment ..................................................................... 22
3.2
AC Input Specification ........................................................................................... 24
3.2.1
Input Voltage and Frequency ................................................................................. 24
3.2.2
AC Input Power Factor .......................................................................................... 24
3.2.3
Efficiency ............................................................................................................... 24
3.2.4
AC Line Fuse ......................................................................................................... 25
3.2.5
AC Line Inrush ....................................................................................................... 25
3.2.6
AC Line Dropout/Holdup ........................................................................................ 25
3.2.7
AC Line Fast Transient (EFT) Specification .......................................................... 26
3.2.8
Hot Plug ................................................................................................................. 26
iv
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
3.2.9
3.2.10
3.2.11
3.2.12
3.2.13
3.2.14
3.2.15
3.2.16
3.2.17
3.2.18
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
3.3.9
3.3.10
3.3.11
3.3.12
3.3.13
3.3.14
3.3.15
3.4
3.4.1
3.4.2
3.5
3.5.1
3.5.2
3.5.3
3.6
3.6.1
3.6.2
3.6.3
3.7
3.7.1
3.7.2
3.8
Revision 2.2
Table of Contents
Susceptibility Requirements .................................................................................. 26
Electrostatic Discharge Susceptibility .................................................................... 26
Fast Transient/Burst .............................................................................................. 26
Radiated Immunity ................................................................................................. 26
Surge Immunity ...................................................................................................... 26
AC Line Transient Specification ............................................................................. 27
Power Recovery .................................................................................................... 27
Voltage Interruptions .............................................................................................. 27
AC Line Isolation .................................................................................................... 27
AC Power Inlet ....................................................................................................... 28
DC Ouput Specification ......................................................................................... 28
Output Power/Currents .......................................................................................... 28
Standby Output ...................................................................................................... 28
Voltage Regulation ................................................................................................ 29
Dynamic Loading ................................................................................................... 29
Capacitive Loading ................................................................................................ 29
Ripple/Noise .......................................................................................................... 29
Grounding .............................................................................................................. 30
Closed Loop Stability ............................................................................................. 30
Residual Voltage Immunity in Standby Mode ........................................................ 30
Common Mode Noise ............................................................................................ 30
Soft Starting ........................................................................................................... 30
Zero Load Stability Requirement ........................................................................... 31
Hot Swap Requirement .......................................................................................... 31
Forced Load Sharing ............................................................................................. 31
Timing Requirement .............................................................................................. 31
Power Supply Cold Redundancy Support ............................................................. 32
1200W CRPS Cold Redundancy ........................................................................... 33
1600W CRPS Cold Redundancy ........................................................................... 33
Control And Indicator Functions ............................................................................ 33
PSON# Input Signal ............................................................................................... 34
PWOK (Power Good) Output Signal ...................................................................... 34
SMBAlert# Signal ................................................................................................... 34
Protection Circuits .................................................................................................. 35
Current Limit (OCP) ............................................................................................... 35
Over Voltage Protection (OVP) .............................................................................. 35
Over Thermal Protection (OTP) ............................................................................. 36
PMBus* .................................................................................................................. 36
PSU Address Lines A0 .......................................................................................... 36
Accuracy ................................................................................................................ 37
Power Management Policy .................................................................................... 37
Intel order number: G39462-013
v
Table of Contents
Intel® Server System H2000JF Family TPS
4.
Cooling Subsystem ............................................................................................................ 39
4.1
Processor Heatsink ................................................................................................ 39
4.2
Node Cooling Fans ................................................................................................ 40
4.3
Power Supply Fan ................................................................................................. 41
4.4
Air Duct Module ..................................................................................................... 41
4.5
Drive Bay Population Requirement ........................................................................ 42
5. System Boards in the Node Tray ...................................................................................... 43
5.1
Node Docking Board .............................................................................................. 43
5.1.1
Overview of Node Docking Board .......................................................................... 43
5.1.2
Pin-out Definition on Node Docking Board ............................................................ 44
5.2
Bridge Board .......................................................................................................... 45
5.2.1
Overview of Bridge Board ...................................................................................... 45
5.2.2
Pin-out Definition on Bridge Board ........................................................................ 47
5.3
6Gbs SAS Support Option 1 .................................................................................. 48
5.3.1
Overview of Bridge Board ...................................................................................... 48
5.3.2
Pin-out Definition on SAS 6Gbs Bridge Board ....................................................... 50
5.4
6Gbs SAS Support Option 2 .................................................................................. 51
5.4.1
Bridge Board .......................................................................................................... 51
5.4.2
Riser Card .............................................................................................................. 53
5.4.3
SAS Controller Module .......................................................................................... 55
6. Hard Disk Drive Support .................................................................................................... 57
6.1
Hard Disk Drive Bays Scheme .............................................................................. 57
6.2
Hard Drive Carrier .................................................................................................. 57
6.3
Hot-Swap Hard Drive Support ............................................................................... 58
6.3.1
Backplane Feature Set .......................................................................................... 59
6.3.2
Backplane Block Diagram ...................................................................................... 60
6.3.3
3.5" Hot Swap Backplane Connector Scheme ...................................................... 60
6.3.4
2.5" Hot Swap Backplane Connector Scheme ...................................................... 61
6.3.5
Backplane LED Support ........................................................................................ 63
6.3.6
Backplane Connector Definition ............................................................................ 63
7. Front Panel Control and Indicators .................................................................................. 67
7.1
Control Panel Button .............................................................................................. 68
7.2
Control Panel LED Indicators ................................................................................ 68
7.2.1
Power/Sleep LED .................................................................................................. 69
7.2.2
System Status LED ................................................................................................ 69
7.2.3
System Status LED – BMC Initialization ................................................................ 70
8. Configuration Jumpers ...................................................................................................... 71
8.1
Force Integrated BMC Update (J6B1) ................................................................... 72
8.2
Force ME Update (J1E2) ....................................................................................... 73
8.3
Password Clear (J1E3) .......................................................................................... 73
8.4
BIOS Recovery Mode (J1E1) ................................................................................ 74
vi
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Table of Contents
8.5
Reset BIOS Settings (J1D5) .................................................................................. 75
9. PCI Express* Riser Card and Assembly .......................................................................... 77
9.1
PCI Express* Riser for Slot 1 ................................................................................. 77
9.1.1
Overview of PCI-Express* Riser ............................................................................ 77
9.1.2
Pin-out Definition on Slot 1 Riser ........................................................................... 77
9.2
PCI Express* Riser with IOM Carrier for Slot 2 (Optional) ..................................... 82
9.2.1
Overview of PCI-E* Riser with IOM Carrier ........................................................... 82
9.2.2
Pin-out Definition on Slot 2 Riser and IOM Carrier ................................................ 83
Appendix A: Integration and Usage Tips ................................................................................ 89
Appendix B: POST Code LED Decoder .................................................................................. 90
Appendix C: Video POST Code Errors ................................................................................... 95
Glossary................................................................................................................................... 102
Reference Documents ............................................................................................................ 105
Revision 2.2
Intel order number: G39462-013
vii
List of Figures
Intel® Server System H2000JF Family TPS
List of Figures
Figure 1. System Overview (Air Duct Removed) .......................................................................... 5
Figure 2. Compute Node Scheme (Rear View) ............................................................................ 5
Figure 3. Fan Control Model ....................................................................................................... 13
Figure 4. Major System Parts ..................................................................................................... 13
Figure 5. Intel® Server System H2312JF Drive Bay Overview .................................................... 14
Figure 6. Intel® Server System H2216JF Drive Bay Overview .................................................... 14
Figure 7. Intel® Server Board S2600JFQ/S2600JFF .................................................................. 15
Figure 8. Intel® Server Board S2600JF Components ................................................................. 16
Figure 9. Back Panel Feature Overview ..................................................................................... 16
Figure 10. Light-Guided Diagnostic LED Locations(Block A) ..................................................... 17
Figure 11. System Bezel Front View ........................................................................................... 17
Figure 12. AC Power Supply Unit Dimension Overview ............................................................. 19
Figure 13. Power Cage Overview ............................................................................................... 22
Figure 14. Power Distribution Board ........................................................................................... 23
Figure 15. AC Power Cord Specification .................................................................................... 28
Figure 16. Turn On/Off Timing (Power Supply Signals) .............................................................. 32
Figure 17. Power Supply Device Address .................................................................................. 36
Figure 18. PMBus* Monitoring Accuracy .................................................................................... 37
Figure 19. Processor Heatsink Overview .................................................................................... 39
Figure 20. Node Fan Set and Power/Control Connection ........................................................... 41
Figure 21. Compute Node Air Duct (Top View) .......................................................................... 42
Figure 22. Compute Node Tray Overview .................................................................................. 43
Figure 23. Node Docking Board .................................................................................................. 43
Figure 24. Bridge Board Overview .............................................................................................. 45
Figure 25. Connectors on Bridge Board ..................................................................................... 46
Figure 26. SAS 6Gbs Bridge Board Overview ............................................................................ 49
Figure 27. Connectors and Components on Spare Bridge Board .............................................. 50
Figure 28. Overview of the Bridge Board .................................................................................... 52
Figure 29. Connectors on Bridge Board ..................................................................................... 52
Figure 30. Overview of the Riser Card ........................................................................................ 53
Figure 31. SAS Controller Module Overview .............................................................................. 56
Figure 32. HDD Scheme for H2312JF ........................................................................................ 57
Figure 33. HDD Scheme for H2216JF ........................................................................................ 57
Figure 34. 3.5-inch HDD Assembly Overview ............................................................................. 58
Figure 35. 2.5-inch HDD Assembly Overview ............................................................................. 58
Figure 36. Passive Backplane Block Diagram (for One Node) ................................................... 60
Figure 37. 3.5" Backplane Component and Connectors (Front View) ........................................ 60
Figure 38. 3.5" Backplane Component and Connectors (Back View) ......................................... 61
Figure 39. 2.5" Backplane Component and Connectors (Front View) ........................................ 62
viii
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
List of Figures
Figure 40. 2.5" Backplane Component and Connectors (Back View) ......................................... 62
Figure 41. Hard Drive Carrier LED .............................................................................................. 63
Figure 42. Front Control Panel .................................................................................................... 67
Figure 43. Jumper Locations and Functions ............................................................................... 71
Figure 44. PCI Express* Riser for Riser Slot 1 ........................................................................... 77
Figure 45. PCI Express* Riser with Bracket for Riser Slot 2 ....................................................... 82
Figure 46. IOM Carrier ................................................................................................................ 82
Figure 47. Diagnostic LED Location ........................................................................................... 90
Revision 2.2
Intel order number: G39462-013
ix
List of Tables
Intel® Server System H2000JF Family TPS
List of Tables
Table 1. System Feature Set ........................................................................................................ 3
Table 2. System SKU Matrix ......................................................................................................... 4
Table 3. Chassis Dimension (SKU: H2312JF) .............................................................................. 5
Table 4. Chassis Dimension (SKU: H2216JF) .............................................................................. 6
Table 5. System Environmental Limits Summary ......................................................................... 6
Table 6. Ambient Temperature versus System Configuration ...................................................... 9
Table 7. Specification Data for AC Power Supply Unit ............................................................... 20
Table 8. AC Power Cord Specification ........................................................................................ 20
Table 9. DC Output Power Connector ........................................................................................ 20
Table 10. Power Supply Status LED ........................................................................................... 21
Table 11. Pin Assignment of Power Ouput Connector ............................................................... 23
Table 12. Pin Assignment of Control Signal Connector .............................................................. 23
Table 13. AC Input Rating ........................................................................................................... 24
Table 14. Typical Power Factor .................................................................................................. 24
Table 15. Platinum Efficiency Requirement ................................................................................ 25
Table 16. AC Power Holdup Requirement .................................................................................. 25
Table 17. Performance Criteria ................................................................................................... 26
Table 18. AC Line Sag Transient Performance .......................................................................... 27
Table 19. AC Line Surge Transient Performance ....................................................................... 27
Table 20. Load Ratings for Single Power Supply Unit ................................................................ 28
Table 21. Voltage Regulation Limits ........................................................................................... 29
Table 22. Transient Load Requirements ..................................................................................... 29
Table 23. Capacitive Loading Conditions ................................................................................... 29
Table 24. Ripple and Noise ......................................................................................................... 30
Table 25. Timing Requirement .................................................................................................... 31
Table 26. 1200W CRPS Cold Redundancy Threshold ............................................................... 33
Table 27. 1600W CRPS Cold Redundancy Threshold ............................................................... 33
Table 28. PSON# Signal Characteristics .................................................................................... 34
Table 29. PWOK Signal Characteristics ..................................................................................... 34
Table 30. SMBAlert# Signal Characteristics ............................................................................... 35
Table 31. Over Current Protection .............................................................................................. 35
Table 32. Over Voltage Protection (OVP) Limits ........................................................................ 36
Table 33. PSU Addressing .......................................................................................................... 37
Table 34. PMBus* Accuracy ....................................................................................................... 37
Table 35. Power Management Policy ......................................................................................... 38
Table 36. 8-Pin Connector Pin-Out for Node Dual Rotor Fans ................................................... 41
Table 37. Main Power Input Connector ...................................................................................... 44
Table 38. Fan Control Signal Connector ..................................................................................... 44
Table 39. Node Fan Connector ................................................................................................... 44
x
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
List of Tables
Table 40. Main Power Output Connector .................................................................................... 45
Table 41. Card Edge Connector Pin-out ..................................................................................... 47
Table 42. AHCI SATA0 DOM Connector Pin-out ........................................................................ 48
Table 43. USB 2.0 Type-A Connector Pin-out ............................................................................ 48
Table 44. 5V_AUX Power Connector Pin-out ............................................................................. 48
Table 45. Pin-out of Card Edge to Base Board ........................................................................... 50
Table 46. Pin-out of Card Edge to Hot Swap Back Plane ........................................................... 51
Table 47. Pin-out of Mini SAS Connector ................................................................................... 51
Table 48. Card Edge Pin-out of Bridge Board to SAS Controller ................................................ 53
Table 49. Card Edge Pin-out of Riser Card to SAS Controller ................................................... 53
Table 50. Card Edge Pin-out of Riser Card to PCIe Slot2 of Baseboard .................................... 54
Table 51. Hard Drive Carrier Status LED Functions ................................................................... 63
Table 52. Hard Drive Carrier Activity LED Functions .................................................................. 63
Table 53. Backplane Input Power Connector Pin-out ................................................................. 64
Table 54. 2-Blade Compute Node Power Connector Pin-out ..................................................... 64
Table 55. 2x40 Pin Connector Pin-out for Node Bridge Board ................................................... 64
Table 56. Front Panel Connector Pin-out ................................................................................... 65
Table 57. Power Supply Control Connector Pin-out ................................................................... 66
Table 58. Front Control Button Function ..................................................................................... 68
Table 59. Front LED Indicator Functions .................................................................................... 68
Table 60. Power LED Operation ................................................................................................. 69
Table 61. System Status LED Operation .................................................................................... 69
Table 62. Force Integrated BMC Update Jumper ....................................................................... 72
Table 63. Force Integrated BMC Update Jumper ....................................................................... 72
Table 64. Force ME Update Jumper ........................................................................................... 73
Table 65. BIOS Password Clear Jumper .................................................................................... 74
Table 66. BIOS Recovery Mode Jumper .................................................................................... 74
Table 67. Reset BIOS Jumper .................................................................................................... 75
Table 68. Riser Card Edge Pin-out ............................................................................................. 77
Table 69. PCI Express* Slot Pin-out on Riser Card .................................................................... 80
Table 70. Dedicated NIC Port LED Functionality ........................................................................ 83
Table 71. Riser Card Edge Pin-out ............................................................................................. 83
Table 72 PCI Express* Slot Pin-out on Riser Card ..................................................................... 85
Table 73. IO Module Slot on Carrier ........................................................................................... 87
Table 74. POST Code Diagnostic LED Location ........................................................................ 90
Table 75. POST Progress Code LED Example .......................................................................... 91
Table 76. Diagnostic LED POST Code Decoder ........................................................................ 91
Table 77. POST Error Message and Message ........................................................................... 95
Table 78. POST Error Beep Codes .......................................................................................... 100
Revision 2.2
Intel order number: G39462-013
xi
List of Tables
Intel® Server System H2000JF Family TPS
<This page is intentionally left blank.>
xii
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
1.
Introduction
Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high-level architecture of the Intel® Server System H2000JF family.
You can also refer to the Intel® Server Board S2600JF Family Technical Product Specification to
obtain greater detail of functionality and architecture of the server board integrated in this server
system.
In addition, you can obtain design-level information for specific subsystems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available. They are only made available
under NDA with Intel and must be ordered through your local Intel representative. For a
complete list of available documents, refer to the Reference Documents section at the end of
this document.
The Intel® Server System H2000JF may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Refer to the Intel® Server Board
S2600JF/Intel® Server System H2000JF Specification Update for published errata.
1.1
Chapter Outline
This document is divided into the following chapters:














Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Power Subsystem
Chapter 4 – Cooling Subsystem
Chapter 5 – System Boards in the Node Tray
Chapter 6 – Hard Disk Drive Support
Chapter 7 – Front Panel Control and Indicators
Chapter 8 – Configuration Jumpers
Chapter 9 – PCI Express* Riser Card and Assembly
Appendix A – Integration and Usage Tips
Appendix B – POST Code LED Decoder
Appendix C – Video POST Code Errors
Glossary
Reference Documents
Revision 2.2
Intel order number: G39462-013
1
Intel® Server System H2000JF Family TPS
Introduction
1.2
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel ensures through
its own chassis development and testing that when Intel server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or
non-operating limits.
2
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
2.
Product Overview
Product Overview
The Intel® Server System H2000JF family includes two major SKUs: H2312JF and H2216JF,
which are rack mount 2U 4-node server systems, purpose-built for high-density and lowest total
cost of ownership in dense computing applications, such as HPC and IPDC. The system is
integrated with four units of Intel® Server Board S2600JF, and supports up to twelve 3.5" or
sixteen 2.5" hot-swap SAS or SATA hard drives with Common Redundant Power Supply (CRPS)
capability.
This chapter provides a high-level overview of the system features. The following chapters
provide greater detail for each major system component or feature.
Table 1. System Feature Set
Feature
Processor
Memory
Chipset
System
Connectors/Headers
System Fan Support
Description
®
®
Support Intel Xeon Processor E5-2600 and E5-2600V2 series processors:

Up to eight GT/s Intel® QuickPath Interconnect (Intel® QPI)

LGA 2011 Socket R

Thermal Design Power (TDP) up to 135W with conditional ambient temperature

Unbuffered DDR3 and registered DDR3 with ECC DIMMs

Memory DDR3 data transfer rates of 800/1066/1333/1600/1867 MT/s

Load Reduced DDR3 DIMM

DDR3 standard I/O voltage of 1.5V (all speed) and DDR3 Low Voltage of 1.35V
(1600MT/s or below)
Intel® C600 Platform Controller Hub (PCH) with support for optional Storage Upgrade Key
External I/O connectors:

DB-15 Video connectors

Two RJ-45 Network Interface for 10/100/1000 LAN

One stacked two port USB 2.0 (Port 0/1) connectors

One dedicated 1GbE management port on rIOM carrier (optional)

One InfiniBand* QDR QSFP port (Board SKU: S2600JFQ) or

One InfiniBand* FDR QSFP port (Board SKU: S2600JFF)
Internal connectors/headers:

Bridge Slot to extend board I/O with common bridge board
SCU0 (Four SAS 3Gb/s ports) to backplane
Front control panel signals
One SATA (Port 0) 6Gb/s port for DOM

Bridge Slot to extend board I/O with spare bridge board
Mini SAS port (Four SAS 6Gb/s ports) from add-in RAID card to backplane
Front control panel signals

One Type-A USB 2.0 connector (USB port 2)

One 2x7pin header for system FAN module

One DH-10 serial Port A connector

One SATA 6Gb/s (Port 1)

One 2x4 pin header for Intel® RMM4 Lite

One 1x4 pin header for Storage Upgrade Key
Three sets of dual rotor fan for each node
Add-in Adapter Support
Three PCIe Gen III x16 riser slots:

Riser slot 1 supports PCIe Gen III x16 Riser with LP PCIe add-in card.

Riser slot 2 supports PCIe Gen III x8 Riser (Intel® rIOM).

Riser slot 3 cannot be used with bridge board covered.
One Bridge Slot for board I/O expansion
On-board Video
On-board Server Engines* LLC Pilot III Controller
Revision 2.2
Intel order number: G39462-013
3
Intel® Server System H2000JF Family TPS
Product Overview
Feature
Hard Disk Drive
Description

Integrated 2D Video Controller

128MB DDR2 Memory
12x 3.5-inch SATA/SAS HDD bays (SKU: H2312JF)
Supported
16x 2.5-inch SATA/SAS HDD bays (SKU: H2216JF)
RAID Support

Intel® RSTe SW RAID 0/1/10/5 for SATA mode

LSI* SW RAID 0/1/10/5
For each node:

One Gigabit Ethernet device i350 connect to PCI-E x4 interfaces on the PCH,
providing 2GbE ports for each node

One QSFP port from Mellanox* ConnectX-3* to support QDR/FDR Infiniband* based
on board SKU

One dedicated 1GbE management port with RMM4 Lite installed
1200w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC,
supporting CRPS configuration. Chassis SKU: H2312JFJR, H2216JFJR
LAN
System Power
1600w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC,
supporting CRPS configuration. Chassis SKU: H2312JFKR, H2216JFKR
Server Management





On-board ServerEngines* LLC Pilot III* Controller
Support for Intel® Remote Management Module 4 Lite solutions
Intel® Light-Guided Diagnostics on field replaceable units
Support for Intel® System Management Software
Support for Intel® Intelligent Power Node Manager (Need PMBus*-compliant power
supply)
Table 2. System SKU Matrix
Board SKU vs Chassis
S2600JF
3.5” HDD with 1200W
CRPS
H2312JFJR
2.5” HDD with 1200W
CRPS
H2216JFJR
3.5” HDD with 1600W
CRPS
H2312JFKR
2.5” HDD with 1600W
CRPS
H2216JFKR
S2600JFQ
H2312JFQJR
H2216JFQJR
H2312JFQKR
H2216JFQKR
S2600JFF
H2312JFFJR
H2216JFFJR
H2312JFFKR
H2216JFFKR
The Intel® Server System H2000JF family supports all Intel® Xeon® processor E5-2600 series
with TDP 135W (8-core, 6-core) and below, or 80W (4-core) and below. You can find a full list of
supported processors at the Intel® Support Website:
http://www.intel.com/p/en_US/support/highlights/server/ss-h2000jf.
4
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
2.1
Product Overview
System Views
Figure 1. System Overview (Air Duct Removed)
Figure 2. Compute Node Scheme (Rear View)
Caution: Installing two Power Supply Units with different wattage ratings on a system is not
supported. This does not provide Power Supply Redundancy and causes the system to log
multiple errors.
2.2
System Dimensions
Table 3. Chassis Dimension (SKU: H2312JF)
Height
87.9mm
3.46''
Width
438mm
17.24''
Depth
Weight
771mm
kg
30
38
30.35''
lbs
66.14
83.78
Chassis – basic configured (2 PSU, 0 drives)
Chassis – fully configured (2 PSU, 12 drives)
Revision 2.2
Intel order number: G39462-013
5
Intel® Server System H2000JF Family TPS
Product Overview
Table 4. Chassis Dimension (SKU: H2216JF)
Height
87.9mm
3.46''
Width
438mm
17.24''
Depth
Weight
733mm
kg
29
32
28.86''
lbs
63.93
70.55
Chassis – basic configured (2 PSU, 0 drives)
Chassis – fully configured (2 PSU, 16 drives)
2.3
System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 5. System Environmental Limits Summary
Parameter
Limits
Temperature
Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC (50ºF to 95ºF) with the
maximum rate of change not to exceed 10ºC per hour
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hours per year.
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hours per year.
Shipping
-40ºC to 70ºC (-40ºF to 158ºF)
Non-Operating
50% to 90%, non-condensing with a maximum wet bulb of 28°C (at temperatures
from 25°C to 35°C)
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25g, velocity change is based on packaged weight
Packaged
Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Unpackaged
5 Hz to 500 Hz
2.20 g RMS random
Packaged
5 Hz to 500 Hz
1.09 g RMS random
Voltage
90V to 132V and 180V to 264
Frequency
47Hz to 63Hz
Source
Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Nonoperating and
operating
Unidirectional
Line to earth
Only
AC Leads
I/O Leads
DC Leads
Air Discharged
8.0 kV
Humidity
Shock
Vibration
AC-DC
2.0 kV
1.0 kV
0.5 kV
ESD
6
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Parameter
Product Overview
Limits
Contact
Discharge
8.0 kV
Operating
-16 to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 feet, the maximum operating temperature is derated 1°F/550 ft.
Storage
-16 to 10,600 m (-50 to 35,000 ft)
Acoustics
Sound
Power
Measured
–
–
Air Flow
Operation
H2312xxKR: 8 to 41 CFM per node
H2216xxKR: 8 to 61 CFM per node
Power in
Watts
All range
Servers/Rack
Mount BA
- 3.5'' HDD SKU: 6.9BA at idle and 7.4BA at active mode
- 2.5'' HDD SKU: 6.5BA at idle and 7.07BA at active mode
Altitude
Note:
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server
building blocks are used together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or
the server board does not operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
In order to maintain comprehensive thermal protection, deliver the best system acoustics, and
improve fan power efficiency, an intelligent Fan Speed Control (FSC) and thermal management
technology (mechanism) is used. Options in <F2> BIOS Setup (BIOS > Advanced > System
Acoustic and Performance Configuration) allow for parameter adjustments based on the
actual system configuration and usage. Refer to the following sections for a description of each
setting.
2.3.1
High Temperature Ambience (HTA) Support
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:

The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2) with short term excursion based operation up to 45ºC (ASHRAE Class A4).
o The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per
year.
Revision 2.2
Intel order number: G39462-013
7
Product Overview
Intel® Server System H2000JF Family TPS
o



The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per
year.
o System performance may be impacted when operating within the extended
operating temperature range.
o There is no long term system reliability impact when operating at the extended
temperature range within the approved limits.
Specific configuration requirements and limitations are documented in the configuration
matrix found in the Intel® Server Board S2600JF Product Family Power Budget and
Thermal Configuration Guidelines Tool, available as a download tool online at
http://www.intel.com/p/en_US/support/.
The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must
be installed at all times, with or without a processor installed.
Memory Slot population requirements:
Note: Specified memory slots can be populated with a DIMM or supplied DIMM Blank. Memory
population rules apply when installing DIMMs.
DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C,
and D.
o DIMM Population on CPU-2 – Install DIMMs in order; Channels E, F, G, and H.
o The following system configurations require that specific memory slots be
populated at all times using either a DIMM or supplied DIMM Blank
o System Configuration – 16x 2.5" hard drive bay or 12x 3.5" hard drive bay
configuration + Intel® Server Board S2600JF (8-DIMM server board)
All hard drive bays must be populated. Hard drive carriers can be populated with a hard
drive or supplied drive blank.
With the system operating, the air duct must be installed at all times.
In single power supply configurations, the second power supply bay must have the
supplied filler blank installed at all times.
Thermally, the system can support the following PCI add-in cards:
o Add-in cards with a minimum 100 LFM (0.5 m/s) air flow requirement can be
installed in any available add-in card slot in both Riser Card #1 and Riser Card
for IO Module carrier.
o Add-in cards with a >200 LFM air flow requirement cannot be supported.
o




Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some
high power add-in cards have minimum air flow requirements of 200 LFM (1 m/s). System
integrators must verify PCI add-in card air flow requirements from vendor specifications when
integrating add-in cards into the system.


8
The system top-cover must be installed at all times when the system is in operation.
Supported ambient temperature versus processor TDP is as follows.
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Product Overview
Table 6. Ambient Temperature versus System Configuration
Notes:
1.
25°C is limited to elevations of 900m or less.
2.
Quad Port IO Modules cannot be installed
simultaneously with PCI Cards.
3.
Processor – 130W-4C and 135W-8C may have
some performance impact.
4.
Processors – There may be some performance
impact during fan failures.
5.
For A3/A4 individual PS selection:
a.
b.
For dual power supply configuration,
power budget must fit within single
power supply rated load and be
installed in dual configuration, or
Base System SKUs:
H2216JF
Base System SKUs:
H2312JF
For single power supply configuration,
power budget must be sized with 30%
margin to single power supply rated
load.
6.
LV refers to low voltage DIMMs (1.35V).
7.
When identifying memory in the table, only
Rank and Width are required. Capacity is not
required.
8.
Fan fail of dual-rotor fans refers to one rotor
fail. "Fan Fail Support" indicates whether fan
fail can be supported with specified
configuration in each column.
ASHRAE (See
note 1)
Cooling (See
note 8)
PS (See note 5)
EP Processors
(See notes 3 and
4)
Revision 2.2
Classifications
A2
A3
A4
25C
A2
A3
A4
Max Ambient
35C
40C
45C
25C
35C
40C
45C
Redundant Fan Configuration
●
●
●
●
●
●
●
Fan Fail Support
●
●
●
See Power
Budget Tool
Power Supplies
Intel® Xeon® processor E52630L, 60w, 6C
●
●
Intel® Xeon® processor E52650L, 70w, 8C
●
●
See Power Budget Tool
●
Intel order number: G39462-013
See
note 1
See
note 5
●
●
●
See
note 4
●
●
●
See
note 4
9
Intel® Server System H2000JF Family TPS
Product Overview
Memory Type
(See note 6 and
7)
Add-in Cards
(See note 2)
Module (See
note 2)
10
Intel® Xeon® processor E52620, E5-2630, E5-2640, 95w,
6C
●
●
●
●
●
●
●
See
note 4
Intel® Xeon® processor E52650, E5-2660, 95w, 8C
●
●
●
●
●
●
●
See
note 4
Intel® Xeon® processor E52665, E5-2670, 115w, 8C
●
●
●
●
●
●
Intel® Xeon® processor E52667, 130w, 6C
●
●
●
●
●
See
note 4
Intel® Xeon® processor E52680, 130w, 8C
●
●
●
See
note 4
Intel® Xeon® processor E52690, 135w, 8C
●
●
Intel® Xeon® processor E52637, 80w, 2C
●
●
●
●
●
●
●
See
note 4
Intel® Xeon® processor E52603, E5-2609, 80w, 4C
●
●
●
●
●
●
●
See
note 4
Intel® Xeon® processor E52643, 130w, 4C
●
Dual Rank x8
●
●
●
●
●
●
Dual Rank x4
●
●
●
●
●
Quad Rank x8
●
●
●
●
●
Quad Rank x4
●
●
●
Load Reduced DIMM
●
●
●
PCI Cards
●
●
●
●
●
●
●
AXX10GBTWLIOM – Dual
10GBASE-T IO Module
●
●
●
●
●
●
●
AXX10GBNIAIOM – Dual
SFP+ port 10GbE IO Module
●
●
●
●
●
●
●
AXX1FDRIBIOM – Single Port
FDR Infiniband* IO Module
●
●
●
●
●
●
●
AXX2FDRIBIOM – Dual Port
FDR Infiniband* IO Module
●
●
●
●
●
●
●
AXX4P1GBPWLIOM – Quad
Port 1GbE IO Module
●
●
●
●
●
●
●
See
note 4
●
●
Intel order number: G39462-013
See
note 2
See
note 2
Revision 2.2
Intel® Server System H2000JF Family TPS
2.3.2
Product Overview
Set Throttling Mode
This option is used to select the desired memory thermal throttling mechanism. Available
settings include [Auto], [DCLTT], [SCLTT], and [SOLTT].
[Auto] – Factory Default Setting: BIOS automatically detects and identifies the appropriate
thermal throttling mechanism based on DIMM type, airflow input, and DIMM sensor
availability.
[DCLTT] – Dynamic Closed Loop Thermal Throttling: For the SOD DIMM with system airflow
input
[SCLTT] – Static Close Loop Thermal Throttling: For the SOD DIMM without system airflow
input
[SOLTT] – Static Open Loop Thermal Throttling: For the DIMMs without sensor on DIMM
(SOD)
2.3.3
Altitude
This option is used to select the proper altitude that the system will be used in. Available
settings include: [300m or less], [301m-900m], [901m-1500m], [Above 1500m].
Selecting an altitude range that is lower than the actual altitude the system will be operating at,
can cause the fan control system to operate less efficiently, leading to higher system thermals
and lower system performance. If the altitude range selected is higher than the actual altitude
the system will be operating at, the fan control system may provide better cooling but with
higher acoustics and higher fan power consumption. If the altitude is not known, selecting a
higher altitude is recommended in order to provide sufficient cooling.
2.3.4
Set Fan Profile
This option is used to set the desired Fan Profile. Available settings include [Performance] and
[Acoustic].
The Acoustic mode offers the best acoustic experience and appropriate cooling capability
covering the mainstream and the majority of the add-in cards used. Performance mode is
designed to provide sufficient cooling capability covering all kinds of add-in cards on the market.
2.3.5
Fan PWM Offset
This option is reserved for manual adjustment to the minimum fan speed curves. The valid
range is from [0 to 100] which stands for 0% to 100% PWM adding to the minimum fan speed.
This feature is valid when Quiet Fan Idle Mode is at Enabled state. The default setting is [0].
2.3.6
Quiet Fan Idle Mode
This feature can be [Enabled] or [Disabled]. If enabled, the fans will either shift to lower speeds
or stop when the aggregate sensor temperatures are satisfied, indicating the system is at ideal
thermal/light loading conditions. When the aggregate sensor temperatures are not satisfied, the
fans will shift back to normal control curves. If disabled, the fans will never shift to lower fan
speeds or stop, regardless of whether the aggregate sensor temperatures are satisfied. The
default setting is [Disabled].
Note: The feature above may or may not be in effect and depends on the actual thermal
characteristics of the specified system.
Revision 2.2
Intel order number: G39462-013
11
Intel® Server System H2000JF Family TPS
Product Overview
2.3.7
Thermal Sensor Input for Fan Speed Control
The BMC uses various IPMI sensors as inputs to fan speed control. Some of the sensors are
actual physical sensors and some are “virtual” sensors derived from calculations.
The following IPMI thermal sensors are used as input to fan speed control:













Front Panel Temperature Sensor 1
Server board Temperature Sensor 2
Processor Margin Sensors 3, 5, 6
DIMM Thermal Margin Sensors 3, 5
Exit Air Temperature Sensor 1, 4, 8
Chipset Temperature Sensor 4,6
On-board Ethernet Controller Temperature Sensors 4, 6
Add-In Intel SAS/IO Module Temperature Sensors 4, 6
Power Supply Thermal Sensor 4, 9
Processor VR Temperature Sensors 4, 7
DIMM VR Temperature Sensors 4, 7
BMC Temperature Sensor 4, 7
Global Aggregate Thermal Margin Sensors 8
Notes:
1. For fan speed control in Intel chassis
2. For fan speed control in 3rd party chassis
3. Temperature margin from throttling threshold
4. Absolute temperature
5. PECI value or margin value
6. On-die sensor
7. On-board sensor
8. Virtual sensor
9. Available only when PSU has PMBus*
12
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Product Overview
The following diagram illustrates the fan speed control structure.
Figure 3. Fan Control Model
2.4
A
B
C
D
System Parts
E
F
G
H
Compute Node 3 Tray
Compute Node 1 Tray
Compute Node 4 Tray
Compute Node 2 Tray
Common Redundant Power Supply
HDD bays with Hot Swap Backplane
Upper and Lower Power Distribution Boards
Front Control Panel
Note: Not shown – Rack slide rail and top cover.
Figure 4. Major System Parts
Revision 2.2
Intel order number: G39462-013
13
Intel® Server System H2000JF Family TPS
Product Overview
2.5
Hard Drive and Peripheral Bays
Intel®Server System H2312JF
Not Supported
Intel®Server System H2216JF
Not Supported
Not Supported
Not Supported
SATA/SAS Hard Disk Drives (3.5-inch)
Up to 12
Not Supported
SATA/SAS Hard Disk Drives (2.5-inch)
Not Supported
Up to 16
Support
Support
Slim-line SATA Optical Drive
Internal USB Floppy Drive
SATA DOM
Figure 5. Intel® Server System H2312JF Drive Bay Overview
Figure 6. Intel® Server System H2216JF Drive Bay Overview
2.6
Server Board Overview
The chassis is mechanically and functionally designed to support half-width server board,
including Intel® Server Board S2600JF. The following sections provide an overview of the server
board feature sets.
14
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Product Overview
Figure 7. Intel® Server Board S2600JFQ/S2600JFF
The following figure shows the layout of the server board. Each connector or major component
is identified by a number or letter, and a description is given in the following figure.
A
2x7 fan control
connector
I
Slot2 (PCIe
Gen3x16)
Q
VGA out
Y
SATA port 1
B
VRS (4 total)
J
Infiniband*
QDR/FDR
R
Dual port 1Gbe
NIC
Z
PCH C600
C
Slot3 (PCIe
Gen3x16)
K
RMM4 lite
S
NIC Port 2
AA
CPU 1
D
CPU2 DIMM
(4 total)
L
POST and
InfiniBand* Status
LED
T
Serial Port A
AB
XDP connector
E
CPU1 DIMM
(4 total)
M
QSFP
U
NIC Port 1
AC
CPU 2
Revision 2.2
Intel order number: G39462-013
15
Intel® Server System H2000JF Family TPS
Product Overview
F
Bridge board
connector
N
USB x2
V
Slot1 (PCIe
Gen3x16)
G
IPMB
O
Debug connector
W
Integrated BMC
H
2x5 USB
P
Status and ID
LED
X
Storage Upgrade
key
AD
2x3 PWR
connector (2 total)
Figure 8. Intel® Server Board S2600JF Components
A
Description
NIC port 1 (RJ45)1
E
Description
Status LED
B
NIC port 2 (RJ45)1
F
Dual port USB connector
C
DB15 video out
G
QSFP Connector2
D
ID LED
H
QSFP status and Diagnostic
LED
Figure 9. Back Panel Feature Overview
Note 1: The Intel® Server System H2312JF and H2216JF require the use of shielded LAN cable
to comply with Emission/Immunity regulatory requirements. Use of non shield cables may result
in product non-compliance.
Note 2: The Intel® Server System H2312JFF and H2216JFF are recommended to use two
meters or three meters length cables for better EMI performance.
16
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
A
Diagnostic LED Group
Product Overview
B
QSFP Link/Activity LED
Figure 10. Light-Guided Diagnostic LED Locations(Block A)
2.7
Front Bezel Support
®
Intel Server System H2000JF family provides front panel bezel. The bezel provides protection
to system HDD bays with a lock to chassis. The front view of the bezel is as below.
Figure 11. System Bezel Front View
Revision 2.2
Intel order number: G39462-013
17
Intel® Server System H2000JF Family TPS
Product Overview
2.8
Rack and Cabinet Mounting Options
The chassis is designed to support 19 inches wide by up to 30 inches deep server cabinets. The
system bundles with the following Intel rack mount option:

A basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the
chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible server
cabinet.
Caution: THE MAXIMUM RECOMMENDED SERVER WEIGHT FOR THE RACK RAILS CAN
BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm.
EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE
SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Use of a
mechanical assist to install and align server into the rack rails is recommended.
Advisory Note: The AXXELVRAIL value rack mount rail kit is not designed to support shipment
of the server system while installed in a rack.
Advisory Note: The AXXELVRAIL only supports specific rack type with 3/8” square and 7.1mm
round holes.
18
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
3.
Power Subsystem
Power Subsystem
The system supports AC 1+1 hot swap power supply module and two power distribution board
which can support 2U rack high density server system. Two different power supply units are
supported: 1200W and 1600W. The single power supply module has Platinum level energy
efficiency, demonstrating climate saver with silver rating.
3.1
Mechanical Overview
The power supply module has a simple retention mechanism to retain the module self after it is
inserted. This mechanism withstands the specified mechanical shock and vibration
requirements. The power distribution board is fixed in the chassis with screws. This specification
defines a 1+1 hot swap redundancy power supply that supports 2U server system. Using
existing power supply module provided by vendor with updated PMBus* and custom-made
power connector board supports four nodes of Intel® Server Board S2600JF. The power supply
has two outputs: 12V and 12VSB. The input is auto ranging and power factor corrected. The
PMBus* features included in this specification are requirements for AC silver rated box power
supply for use in server systems based on Intel® Server System H2000JF Family. This
specification is based on the PMBus* Specifications part I and II, revision 1.1.
3.1.1
AC Power Supply Unit Dimension Overview
The casing dimension is 73.5mm x 265.0mm x 39/40mm (W x L x H). The power supply
contains a single 40mm fan. The power supply has a card edge output that interfaces with a
2x25 card edge connector in the system. The AC plugs directly into the external face of the
power supply.
Figure 12. AC Power Supply Unit Dimension Overview
Revision 2.2
Intel order number: G39462-013
19
Intel® Server System H2000JF Family TPS
Power Subsystem
3.1.2
AC Power Supply Unit General Data
Following is general specification data for AC Power Supply Unit.
Table 7. Specification Data for AC Power Supply Unit
Wattage
Voltage
Heat Dissipation
Maximum Inrush Current
1200W/1600W (Energy Smart)
90 – 264 VAC, auto-ranging, 47 Hz-63 Hz
2560 BTU/hr
Under typical line conditions and over the entire system ambient operating
range, the inrush current may reach 65 A per power supply for 5 ms
Platinum
Platinum
80 Plus rating
Climate Saver (CS) rating
3.1.3
AC Input Connector
The power supply has an internal IEC320 C14 power inlet. The inlet is rated for a minimum of
10A at 250VAC.
3.1.4
AC Power Cord Specification Requirements
The AC power cord used meets the following specification requirements.
Table 8. AC Power Cord Specification
Cable Type
Wire Size
Temperature Rating
Amperage Rating
Cable Type
3.1.5
SJT
16 AWG
105ºC
13A
SJT
Power Supply Unit DC Output Connector
The DC output connector pin-out is defined as follows.
Table 9. DC Output Power Connector
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
20
GND
GND
GND
GND
GND
GND
GND
GND
GND
+12V
+12V
+12V
+12V
+12V
+12V
+12V
+12V
+12V
PSU Output Connector
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
Intel order number: G39462-013
GND
GND
GND
GND
GND
GND
GND
GND
GND
+12V
+12V
+12V
+12V
+12V
+12V
+12V
+12V
+12V
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
PSU Output Connector
A19
PMBus* SDA*
B19
A0* (SMBus* address)
A20
PMBus* SCL*
B20
A1* (SMBus* address)
A21
PSON
B21
12V STBY
A22
SMBAlert#
B22
Cold Redundancy Bus*
A23
Return Sense
B23
12V load share bus
A24
+12V Remote Sense
B24
No Connect
A25
PWOK
B25 CRPS Compatibility Check pin*
* Refer to CRPS Common Requirements Specification.
3.1.6
Handle Retention
The power supply has a handle to assist extraction. The module can be inserted and extracted
without the assistance of tools. The power supply also has a latch which retains the power
supply into the system and prevents the power supply from being inserted or extracted from the
system when the AC power cord is pulled into the power supply.
The handle protects the operator from any burn hazard through the use of industrial designed
plastic handle or equivalent material.
3.1.7
LED Marking and Identification
The power supply uses a bi-color LED, Amber and Green, for status indication. The following
table shows the LED states for each power supply operating state.
Table 10. Power Supply Status LED
Power Supply Condition
Output ON and OK
No AC power to all power supplies
AC present / Only 12VSB on (PS off) or PS in Cold
redundant state
AC cord unplugged or AC power lost, with a second
power supply in parallel still with AC input power
Power supply warning events where the power supply
continues to operate; high temp, high power, high current,
slow fan
Power supply critical event causing a shutdown; failure,
OCP, OVP, Fan Fail
Power supply FW updating
Revision 2.2
Intel order number: G39462-013
LED State
Solid GREEN
OFF
1Hz Blink GREEN
Solid AMBER
1Hz Blink Amber
Solid AMBER
2Hz Blink GREEN
21
Intel® Server System H2000JF Family TPS
Power Subsystem
3.1.8
Power Cage with Power Distribution Board
The power cage is at the middle of the chassis, consisting of two Power Distribution Boards
(PDBs) to support Common Redundant Power Supplies (CRPS).
Caution: Installing two Power Supply Units with different wattage ratings on a system is not
supported. This does not provide Power Supply Redundancy and causes the system to log
multiple errors.
Following is the power system overview.
A
B
C
Power Distribution Board 1
Power Distribution Board 2
Power Supply Unit #2 (upper) and #1 (lower)
Figure 13. Power Cage Overview
3.1.9
Power Cage Output Pin Assignment
The power cage provides +12V and +12VSTB output to the system. Each PDB has two 2x9
power output cables to system backplane, together with one 2x8 signal control cable for power
management. Refer to the following table for PDB pin assignment.
22
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
A
B
C
D
Power Subsystem
Main Power Output Connector P1
Power Supply Unit Connector
Control Signal Connector
Main Power Output Connector P2
Figure 14. Power Distribution Board
Table 11. Pin Assignment of Power Ouput Connector
Pin
Description
Pin
Description
1
GND
2
+12V
3
GND
4
+12V
5
GND
6
+12V
7
GND
8
+12V
9
GND
10
+12V
11
GND
12
+12V
13
GND
14
+12V
15
GND
16
+12V
17
GND
18
+12V
Table 12. Pin Assignment of Control Signal Connector
Pin
Revision 2.2
Description
Pin
Description
1
PMBus* SDA
2
A0 (SMBus* Address)
3
PMBus* SCL
4
A1 (SMBus* Address)
5
PSON#
6
12V Load Share Bus
7
SMBAlert#
8
Cold Redundancy Bus
Intel order number: G39462-013
23
Intel® Server System H2000JF Family TPS
Power Subsystem
Pin
3.2
3.2.1
Description
Pin
Description
9
Return Sense
10
PWOK
11
+12V Remote Sense
12
Compatibility Bus
13
Reserved
14
+12VSB
15
+12VSB
16
Key Pin (removed)
AC Input Specification
Input Voltage and Frequency
The power supply operates within all specified limits over the following input voltage range.
Harmonic distortion of up to 10% THD does not cause the power supply to go out of specific
limits. The power supply is capable of start-up (power-on) with full rated power load, at line
voltage as low as 90VAC.
Table 13. AC Input Rating
Parameter
Min
Rated
Max
Start up VAC
Power Off VAC
110VAC
220VAC
Frequency
90 Vrms
180 Vrms
47 Hz
100-127 Vrms
200-240 Vrms
50/60 Hz
140 Vrms
264 Vrms
63 Hz
85 VAC± 4VAC
70VAC±5VAC
Note:
1. Maximum input current at low input voltage range is measured at 90VAC, at max load.
2. Maximum input current at high input voltage range is measured at 180VAC, at max load.
3. This requirement is not to be used for determining agency input current markings.
3.2.2
AC Input Power Factor
The power supply meets the power factor requirements stated in the Energy Star Program
Requirements for Computer Servers. These requirements are stated below.
Table 14. Typical Power Factor
Output Power
Power Factor
10% load
> 0.80
20% load
> 0.90
50% load
> 0.90
100% load
> 0.95
Note: Tested at 230VAC, 50Hz and 60Hz and 115VAC, 60Hz. Tested according to Generalized
Internal Power Supply Efficiency Testing Protocol, Rev 6.4.3. This is posted at
http://efficientpowersupplies.epri.com/methods.asp.
3.2.3
Efficiency
The following table provides the required minimum efficiency level at various loading conditions.
These are provided at different load levels; 100%, 50%, 20%, and 10%. Output is loaded
according to the proportional loading method defined by 80 Plus in Generalized Internal Power
Supply Efficiency Testing Protocol, Rev 6.4.3. This is posted at:
http://efficientpowersupplies.epri.com/methods.asp.
24
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
Table 15. Platinum Efficiency Requirement
Loading
100% of maximum
50% of maximum
20% of maximum
10% of maximum
91%
94%
90%
82%
Minimum Efficiency
The power supply passes with enough margin to make sure in production that all power
supplies meet these efficiency requirements.
3.2.4
AC Line Fuse
The power supply has one line fused in the single line fuse on the line (Hot) wire of the AC
input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow
blow type. AC inrush current does not cause the AC line fuse to blow under any conditions. All
protection circuits in the power supply do not cause the AC fuse to blow unless a component in
the power supply has failed. This includes DC output load short conditions.
3.2.5
AC Line Inrush
The AC line inrush current does not exceed 65A peak for up to one-quarter of the AC cycle,
after which the input current is no more than the specified maximum input current. The peak
inrush current is less than the ratings of its critical components (including input fuse, bulk
rectifiers, and surge limiting device).
The power supply meets the inrush requirements for any rated AC voltage, during turn on at any
phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after
AC dropout of any duration, and over the specified temperature range (Top).
3.2.6
AC Line Dropout/Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC
line for any length of time. During an AC dropout the power supply meets dynamic voltage
regulation requirements. An AC line dropout of any duration does not cause tripping of control
signals or protection circuits. If the AC dropout lasts longer than the holdup time, the power
supply will recover and meet all turn on requirements. The power supply meets the AC dropout
requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration
does not cause damage to the power supply.
Table 16. AC Power Holdup Requirement
Loading
70%
Holdup Time
10.6 msec
The 12VSTB output voltage stays in regulation under its full load (static or dynamic) during an AC
dropout of 70ms min (=12VSB holdup time) whether the power supply is in ON or OFF state
(PSON asserted or de-asserted).
Revision 2.2
Intel order number: G39462-013
25
Intel® Server System H2000JF Family TPS
Power Subsystem
3.2.7
AC Line Fast Transient (EFT) Specification
The power supply meets the EN61000-4-5 directive and any additional requirements in
IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the
following conditions and exceptions:
 These input transients do not cause any out-of-regulation conditions, such as overshoot
and undershoot, nor cause any nuisance trips of any of the power supply protection
circuits.

The surge-withstand test does not produce damage to the power supply.
The supply meets surge-withstand test conditions under maximum and minimum DC-output
load conditions.
3.2.8
Hot Plug
The power supply is designed to allow connection into and removal from the system without
removing power to the system. During any phase of insertion, start-up, shutdown, or removal,
the power supply does not cause any other modules in the system to deviate outside of their
specifications. When AC power is applied, the auxiliary supply will turn on providing bias power
internal to the supply and the 5VSB standby output.
3.2.9
Susceptibility Requirements
The power supply meets the following electrical immunity requirements when connected to a
cage with an external EMI filter, which meets the criteria defined in the SSI document EPS
Power Supply Specification. For further information on customer standards, request a copy of
the customer Environmental Standards Handbook.
Table 17. Performance Criteria
Level
A
B
C
3.2.10
Description
The apparatus continues to operate as intended. No degradation of performance.
The apparatus continues to operate as intended. No degradation of performance beyond spec
limits.
Temporary loss of function is allowed provided the function is self-recoverable or can be restored
by the operation of the controls.
Electrostatic Discharge Susceptibility
The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-42:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
3.2.11
Fast Transient/Burst
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
3.2.12
Radiated Immunity
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24.
3.2.13
Surge Immunity
The power supply is tested with the system for immunity to AC Ring wave and AC Unidirectional
wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992.
26
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
The pass criteria include: No unsafe operation is allowed under any condition; all power supply
output voltage levels stay within proper spec levels; No change in operating state or loss of data
during and after the test profile; No component damage under any condition.
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
3.2.14
AC Line Transient Specification
AC line transient conditions are defined as sag and surge conditions. Sag conditions are also
commonly referred to as “brownout”; these conditions are defined as the conditions when the
AC line voltage drops below nominal voltage. Surge conditions are defined as the conditions
when the AC line voltage rises above nominal voltage.
The power supply meets the requirements under the following AC line sag and surge conditions.
Table 18. AC Line Sag Transient Performance
AC Line Sag (10 sec interval between each sagging)
Duration
Sag
0 to ½ AC
cycle
95%
> 1 AC cycle
>30%
Operating AC Voltage
Nominal AC Voltage
ranges
Nominal AC Voltage
ranges
Line
Frequency
Performance Criteria.
50/60Hz
No loss of function or performance
50/60Hz
Loss of function acceptable, selfrecoverable
Table 19. AC Line Surge Transient Performance
AC Line Surge
Duration
Surge
Operating AC Voltage
Line Frequency
Continuous
10%
Nominal AC Voltages
50/60Hz
0 to ½ AC
cycle
30%
Mid-point of nominal AC
Voltages
50/60Hz
3.2.15
Performance Criteria
No loss of function or
performance
No loss of function or
performance
Power Recovery
The power supply recovers automatically after an AC power failure. AC power failure is defined
to be any loss of AC power that exceeds the dropout criteria.
3.2.16
Voltage Interruptions
The power supply complies with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using
the IEC 61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined
in Annex B of CISPR 24.
3.2.17
AC Line Isolation
The power supply meets all safety agency requirements for dielectric strength. Transformers’
isolation between primary and secondary windings complies with the 3000VAC (4242VDC)
dielectric strength criteria. If the working voltage between primary and secondary dictates a
higher dielectric strength test voltage, the highest test voltage will be used. In addition the
insulation system complies with reinforced insulation per safety standard IEC 950. Separation
Revision 2.2
Intel order number: G39462-013
27
Intel® Server System H2000JF Family TPS
Power Subsystem
between the primary and secondary circuits, and primary to ground circuits, complies with the
IEC 950 spacing requirements.
3.2.18
AC Power Inlet
The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A/250 VAC.
The AC power cord meets the following specification requirements.
Cable Type
Wire Size
SJT
16 AWG
Temperature Rating
105ºC
Amperage Rating
13 A
Voltage
125V
Figure 15. AC Power Cord Specification
3.3
3.3.1
DC Ouput Specification
Output Power/Currents
The following table defines the minimum power and current ratings. The power supply meets
both static and dynamic voltage regulation requirements for all conditions.
Table 20. Load Ratings for Single Power Supply Unit
Note:
1.
2.
3.
3.3.2
Parameter
PSU SKU
Min
Max
1200W
1600W
Peak 2,3
1200W 1600W
Unit
+12V main (200-240VAC)
0.0
100
133
133
175
A
+12V main (100-127VAC)
0.0
83
83
110
110
A
+12VSTB
0.0
3.0
3.5
3.5
2.4
A
12VSTB provides 4.0A with two power supplies in parallel. The power supply fan is allowed to run in standby
mode for loads > 1.5A.
Peak combined power for all outputs does not exceed 1600W (for 1200W PSU) and 2100W (for 1600W
PSU).
Length of time peak power can be supported based on thermal sensor and assertion of the SMBAlert#
signal. Minimum peak power duration is 20 seconds without asserting the SMBAlert# signal.
Standby Output
The 12VSB output is present when an AC input greater than the power supply turn on voltage is
applied.
28
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
3.3.3
Power Subsystem
Voltage Regulation
The power supply output voltages stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
These are measured at the output connectors.
Table 21. Voltage Regulation Limits
Parameter
Min
Nom
Max
Unit
Tolerance
+12VSTB
+11.40V
+12.000V
+12.60V
Vrms
±5%
+12V
+11.40V
+12.000V
+12.60V
Vrms
±5%
The combined output continuous power of all outputs does not exceed 3200W (1600W from
each power supply unit). Each output has a maximum and minimum current rating shown in
the table below. The power supply meets both static and dynamic voltage regulation
requirements for the minimum dynamic loading conditions. The power supply meets only the
static load voltage regulation requirements for the minimum static load conditions.
3.3.4
Dynamic Loading
The output voltages remain within limits specified for the step loading and capacitive loading
specified in the table below. The load transient repetition rate is tested between 50Hz and 5kHz
at duty cycles ranging from 10% to 90%. The load transient repetition rate is only a test
specification. The  step load may occur anywhere within the MIN load to the MAX load
conditions.
Table 22. Transient Load Requirements
Output
+12VSTB
+12V
 Step Load Size
1.0A
60% of max load
Load Slew Rate
0.25 A/sec
0.25 A/sec
Test Capacitive Load
20 F
2000 F
Note: For dynamic condition +12V min loading is 1A.
3.3.5
Capacitive Loading
The power supply is stable and meets all requirements with the following capacitive loading
conditions.
Table 23. Capacitive Loading Conditions
3.3.6
Output
+12V
Min
500
Max
25,000
Units
F
+12VSTB
20
3100
F
Ripple/Noise
The maximum allowed ripple/noise output of the power supply is defined in the table below. This
is measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A
10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of
measurement.
Revision 2.2
Intel order number: G39462-013
29
Intel® Server System H2000JF Family TPS
Power Subsystem
Table 24. Ripple and Noise
+12V
120mVp-p
3.3.7
+12VSTB
120mVp-p
Grounding
The output ground of the pins of the power supply provides the output power return path. The
output connector ground pins are connected to the safety ground (power supply enclosure).
This grounding is well designed to ensure passing the max allowed Common Mode Noise levels.
The power supply is provided with a reliable protective earth ground. All secondary circuits are
connected to protective earth ground. Resistance of the ground returns to chassis does not
exceed 1.0 m. This path may be used to carry DC current.
3.3.8
Closed Loop Stability
The power supply is unconditionally stable under all line/load/transient load conditions including
capacitive load ranges specified in Section 4.6. A minimum of: 45 degrees phase margin and 10dB-gain margin is required. The power supply manufacturer provides proof of the unit’s
closed-loop stability with local sensing through the submission of Bode plots. Closed-loop
stability is ensured at the maximum and minimum loads as applicable.
3.3.9
Residual Voltage Immunity in Standby Mode
The power supply is immune to any residual voltage placed on its outputs (Typically a leakage
voltage through the system from standby output) up to 500mV. There is no additional heat
generated, nor stressing of any internal components with this voltage applied to any individual
or all outputs simultaneously. It also does not trip the protection circuits during turn on.
The residual voltage at the power supply outputs for no load condition does not exceed 100mV
when AC voltage is applied and the PSON# signal is de-asserted.
3.3.10
Common Mode Noise
The Common Mode noise on any output does not exceed 350mVp-p over the frequency band
of 10Hz to 20MHz.
1. The measurement is made across a 100Ω resistor between each of DC outputs,
including ground at the DC power connector and chassis ground (power subsystem
enclosure).
2. The test set-up uses a FET probe such as Tektronix model P6046 or equivalent.
3.3.11
Soft Starting
The Power Supply contains control circuit which provides monotonic soft start for its outputs
without overstress of the AC line or any power supply components at any specified AC line or
load conditions.
30
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
3.3.12
Power Subsystem
Zero Load Stability Requirement
When the power subsystem operates in a no load condition, it does not need to meet the output
regulation specification, but it must operate without any tripping of over-voltage or other fault
circuitry. When the power subsystem is subsequently loaded, it begins to regulate and source
current without fault.
3.3.13
Hot Swap Requirement
Hot swapping a power supply is the process of inserting and extracting a power supply from an
operating power system. During this process the output voltages remain within the limits with
the capacitive load specified. The hot swap test is conducted when the system is operating
under static, dynamic, and zero loading conditions. The power supply uses a latching
mechanism to prevent insertion and extraction of the power supply when the AC power cord is
inserted into the power supply.
3.3.14
Forced Load Sharing
The +12V output has active load sharing. The output shares within 10% at full load. The failure
of a power supply does not affect the load sharing or output voltages of the other supplies still
operating. The supplies can load share in parallel and operate in a hot-swap/redundant 1+1
configurations. The 12VSB output is not required to actively share current between power
supplies (passive sharing). The 12VSB outputs of the power supplies are connected together in
the system so that a failure or hot swap of a redundant power supply does not cause these
outputs to go out of regulation in the system.
3.3.15
Timing Requirement
These are the timing requirements for the power supply operation. The output voltages rise from
10% to within regulation limits (Tvout_rise) within 5 to 70ms. For 12VSB, it is allowed to rise from
1.0 to 25ms. All outputs must rise monotonically. Table below shows the timing
requirements for the power supply being turned on and off through the AC input, with PSON
held low and the PSON signal, with the AC input applied.
Table 25. Timing Requirement
Item
Description
Min
5.0 *
Max
Units
70 *
ms
Tvout_rise
Output voltage rise time.
T sb_on_delay
Delay from AC being applied to 12VSB being within regulation.
1500
ms
T ac_on_delay
Delay from AC being applied to all output voltages being within
regulation.
3000
ms
T vout_holdup
Time 12Vl output voltage stay within regulation after loss of
AC.
13
ms
T pwok_holdup
Delay from loss of AC to de-assertion of PWOK.
10.6
ms
T
Delay from PSON# active to output voltages within regulation
limits.
5
pson_on_delay
T pson_pwok
Delay from PSON# deactivate to PWOK being de-asserted.
T pwok_on
Delay from output voltages within regulation limits to PWOK
Revision 2.2
Intel order number: G39462-013
100
400
ms
5
ms
500
ms
31
Intel® Server System H2000JF Family TPS
Power Subsystem
Item
Description
Min
Max
Units
asserted at turn on.
T pwok_off
Delay from PWOK de-asserted to output voltages dropping out
of regulation limits.
1
ms
T pwok_low
Duration of PWOK being in the de-asserted state during an
off/on cycle using AC or the PSON signal.
100
ms
T sb_vout
Delay from 12VSB being in regulation to O/Ps being in
regulation at AC turn on.
50
Time 12VSBoutput voltage stays within regulation after loss of
AC.
70
T
12VSB_holdup
1000
ms
ms
Note: * The 12VSTB output voltage rise time is from 1.0ms to 25ms.
AC Input
Tvout_holdup
Vout
Tpwok_low
TAC_on_delay
Tsb_on_delay
PWOK
12Vsb
Tpwok_off
Tpwok_on
Tsb_on_delay
Tpwok_on
Tpwok_holdup
Tsb_vout
Tpwok_off
Tpson_pwok
T5Vsb_holdup
Tpson_on_delay
PSON
AC turn on/off cycle
PSON turn on/off cycle
Figure 16. Turn On/Off Timing (Power Supply Signals)
3.4
Power Supply Cold Redundancy Support
Power supplies that support cold redundancy can be enabled to go into a low-power state (that
is, cold redundant state) in order to provide increased power usage efficiency when system
loads are such that both power supplies are not needed. When the power subsystem is in Cold
Redundant mode, only the needed power supply to support the best power delivery efficiency is
ON. Any additional power supplies, including the redundant power supply, are in Cold Standby
state.
Each power supply has an additional signal that is dedicated to supporting Cold Redundancy,
CR_BUS. This signal is a common bus between all power supplies in the system. CR_BUS is
32
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
asserted when there is a fault in any power supply OR the power supplies output voltage falls
below the Vfault threshold. Asserting the CR_BUS signal causes all power supplies in Cold
Standby state to power ON.
Enabling power supplies to maintain best efficiency is achieved by looking at the Load Share
bus voltage and comparing it to a programmed voltage level through a PMBus* command.
Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on
the bus all power supplies are ON irrespective of their defined Cold Redundant roll (active or
Cold Standby). This guarantees that incorrect programming of the Cold Redundancy states of
the power supply will never cause the power subsystem to shut down or become over loaded.
The default state of the power subsystem is all power supplies ON. There needs to be at least
one power supply in Cold Redundant Active state or Standard Redundant state to allow the
Cold Standby state power supplies to go into Cold Standby state.
Caution: Installing two Power Supply Units with different wattage ratings on a system is not
supported. This does not provide Power Supply Redundancy and causes the system to log
multiple errors.
3.4.1
1200W CRPS Cold Redundancy
If the output power is less than 480W (40%), the Cold redundant function will be enabled. Thus
you will see one PSU working normal and the second PSU will be in CR mode. The Power
Supply LED will be blinking green.
Table 26. 1200W CRPS Cold Redundancy Threshold
Cold
Standby
1 (02h)
3.4.2
Enable (V)
percent
power (W)
Disable (V)
percent
power (W)
3.2
40.00%
480(±5%)
1.44
18.00%
432(±5%)
1600W CRPS Cold Redundancy
If the output power is less than 640W (40%), the Cold redundant function will be enabled. Thus
you will see one PSU working normal and the second PSU will be in CR mode. The Power
Supply LED will be blinking green.
Table 27. 1600W CRPS Cold Redundancy Threshold
Cold
Standby
1 (02h)
3.5
Enable (V)
percent
power (W)
Disable (V)
percent
power (W)
3.2
40.00%
640(±5%)
1.44
18.00%
576(±5%)
Control And Indicator Functions
The following sections define the input and output signals from the power supply.
Signals that can be defined as low true use the following convention: Signal# = low true
Revision 2.2
Intel order number: G39462-013
33
Intel® Server System H2000JF Family TPS
Power Subsystem
3.5.1
PSON# Input Signal
#
The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low
signal that turns on the +12V power rail. When this signal is not pulled low by the system, or left
open, the outputs (except the +12VSB) turn off. This signal is pulled to a standby voltage by a
pull-up resistor internal to the power supply. Refer to the following table for the timing diagram.
Table 28. PSON# Signal Characteristics
Signal Type
PSON# = Low
PSON# = High or Open
Logic level low (power supply ON)
Logic level high (power supply OFF)
Source current, Vpson = low
Power up delay: Tpson_on_delay
PWOK delay: T pson_pwok
3.5.2
Accepts an open collector/drain input from the system. Pull-up
to VSB located in power supply.
ON
OFF
MIN
MAX
0V
1.0V
2.0V
3.46V
4mA
5msec
400msec
50msec
PWOK (Power Good) Output Signal
PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the
outputs are within the regulation limits of the power supply. When any output voltage falls below
regulation limits or when AC power has been removed for a time sufficiently long so that power
supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. See the
table below for a representation of the timing characteristics of PWOK. The start of the PWOK
delay time is inhibited as long as any power supply output is in current limit.
Table 29. PWOK Signal Characteristics
Signal Type
PWOK = High
PWOK = Low
Power OK
Power Not OK
Logic level low voltage, Isink=400uA
Logic level high voltage, Isource=200A
Sink current, PWOK = low
Source current, PWOK = high
PWOK delay: Tpwok_on
PWOK rise and fall time
Power down delay: Tpwok_off
3.5.3
MIN
0V
2.4V
100ms
1ms
MAX
0.4V
3.46V
400uA
2mA
1000ms
100sec
200msec
SMBAlert# Signal
This signal indicates that the power supply is experiencing a problem that the user should
investigate. This is asserted due to Critical events or Warning events. The signal is activated in
case the critical component temperature reaches a warning threshold, general failure, over-
34
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
current, over-voltage, under-voltage, or failed fan. This signal may also indicate the power
supply is reaching its end of life or is operating in an environment exceeding the specified limits.
This signal is to be asserted in parallel with LED turning solid Amber or blinking Amber.
Table 30. SMBAlert# Signal Characteristics
Signal Type (Active Low)
Alert# = High
Alert# = Low
Logic level low voltage, Isink=4 mA
Logic level high voltage, Isink=50 A
Sink current, Alert# = low
Sink current, Alert# = high
Alert# rise and fall time
3.6
Open collector/drain output from power supply. Pullup to VSB located in system.
OK
Power Alert to system
MIN
MAX
0V
0.4 V
3.46 V
4 mA
50 A
100 s
Protection Circuits
Protection circuits inside the power supply cause only the power supply’s main outputs to shut
down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for
15sec and a PSON# cycle HIGH for 1sec will be able to reset the power supply.
3.6.1
Current Limit (OCP)
The power supply has current limit to prevent the outputs from exceeding the values shown in
table below. If the current limits are exceeded, the power supply will shut down and latch off.
The latch will be cleared by toggling the PSON# signal or by an AC power interruption. The
power supply will not be damaged from repeated power cycling in this condition. 12VSB will be
auto-recovered after removing OCP limit.
Table 31. Over Current Protection
Output Voltage
PSU SKU
+12V
+12VSTB
3.6.2
Input Voltage Range
90 – 264VAC
90 – 264VAC
Over Current Limits
1200W
1600W
140A min; 170A max
180A min; 200A max
2.5A min; 3A max
2.5A min; 3A max
Over Voltage Protection (OVP)
The power supply over voltage protection is locally sensed. The power supply will shut down
and latch off after an over voltage condition occurs. This latch will be cleared by toggling the
PSON# signal or by an AC power interruption. The values are measured at the output of the
power supply’s connectors. The voltage does never exceed the maximum levels when
measured at the power connectors of the power supply connector during any single point of fail.
The voltage does never trip any lower than the minimum levels when measured at the power
connector. 12VSB will be auto-recovered after removing OVP limit.
Revision 2.2
Intel order number: G39462-013
35
Intel® Server System H2000JF Family TPS
Power Subsystem
Table 32. Over Voltage Protection (OVP) Limits
Output Voltage
+12V
+12VSB
3.6.3
MIN (V)
13.3
13.3
MAX (V)
14.5
14.5
Over Thermal Protection (OTP)
The power supply is protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shut down. When
the power supply temperature drops to within specified limits, the power supply will restore
power automatically, while the 12VSB remains always on. The OTP circuit has built-in margin
so that the power supply does not oscillate on and off due to temperature recovering condition.
The OTP trip level has a minimum of 4C of ambient temperature margin.
3.7
PMBus*
The PMBus* features are requirements for power supply unit for use in server systems. This
specification is based on the PMBus* specifications part I and II, revision 1.1. The power supply
device address locations are shown below.
Figure 17. Power Supply Device Address
The PMBus* from PDB is connected to BMC of all four nodes. Only one board BMC is assigned
to be the master BMC and communicate with PSU as single point. Other board BMCs receive
PSU data from the master BMC. In case the master BMC is down, one of the slave board BMC
will be promoted automatically as master BMC and maintain communication.
3.7.1
PSU Address Lines A0
Address pins A0 is used by end use system to allocate unit address to a power supply in
particular slot position.
36
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Power Subsystem
For redundant systems there are two signals to set the address location of the power supply
after it is installed in the system, Address0 and Address1. For non-redundant systems the
power supply device address locations align with the Address0/Address1 location of 0/0.
Table 33. PSU Addressing
3.7.2
PDB addressing Address0
0
1
Power supply PMBus* device
B0h
B2h
Accuracy
The sensor commands meet the following accuracy requirements. The accuracies are met over
the specified ambient temperature and the full range of rated input voltage.
Table 34. PMBus* Accuracy
Output Loading
10% - 20%
READ_PIN and READ_EIN
> 20% - 50%
See graphs below
READ_FAN
+/-500 RPM
READ_IOUT
+/-5%
+/-2%
READ_TEMPERATURE
+/-2%
+/- 3ºC
Accuracy, +/-W
Accuracy, +/-%
PMBus Input power monitoring accuracy
6.0%
25
5.0%
20
4.0%
15
3.0%
10
2.0%
Accuracy, +/- W
Accuracy, +/-%
> 50% - 100%
5
1.0%
950
1000
900
850
800
750
700
650
600
550
500
450
400
350
300
250
200
150
50
100
0
37.5
0.0%
Input power, W
Figure 18. PMBus* Monitoring Accuracy
3.8
Power Management Policy
When working with Intel® Server Board S2600JF, the BMC on each node will monitor its fans
and temperature for critical failures. When there is a fan failure and a critical temperature event
Revision 2.2
Intel order number: G39462-013
37
Intel® Server System H2000JF Family TPS
Power Subsystem
at the same time, the node will be powered down. When this occurs, the node will need to be
manually powered back on.
When system power is beyond 1200W or 1600W in 1+1 mode that it automatically shifts from
1+1 mode to 2+0 mode if power load is high so that would be expected behavior on H2000JF
system.
Additionally on Intel® Server Board S2600JF, the BMC on node 3 and node 4 will monitor for a
power supply over current condition or power supply over temperature condition. If either of
these occurs and the Shutdown Policy has been enabled, the node will be powered down.
When this occurs, the node will need to be manually powered back on. However, if the over
current or over temperature event is detected again, the node will be powered back off. The
following table shows the scheme of system power redundancy mode with node behavior.
Table 35. Power Management Policy
Intel®Server System H2000 Intel®Server System H2000
System Power Redundancy
Load with 2x 1200W
Load with 2x 1600W
Mode
supplies
supplies
System Power Load
Unconstrained
<1200W
<1600W
Redundant Mode
1200W< current load <
1800W
1600W< current load <
2160W
Optimal Redundant
Mode
>1800W
>2160W
Non Redundant Mode
System behavior with one PSU AC lost or
failed
No system throttling. All four
nodes work normally.
With BIOS setting “server
management – shutdown policy” set
to “disable”, all nodes in the system
may be throttled to maintain power.
This may cause lower performance.
With BIOS “server management –
shutdown policy” set to “enable”,
Nodes 3 and 4 will shut down while
Nodes 1 and 2 keep running without
throttling. Node 1 and Node 2 will
have no performance loss.
All nodes in the system may shut
down.
The Shutdown Policy setting is only shown on Node 3 and Node 4, and is disabled by default
but can be enabled or disabled in the BIOS setup Server Management page or by using the Set
Shutdown Policy command.
Caution: Installing two Power Supply Units with different wattage ratings on a system is not
supported. This does not provide Power Supply Redundancy and causes the system to log
multiple errors.
38
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
4.
Cooling Subsystem
Cooling Subsystem
The chassis cooling system contains the fan cooling subsystem of each node and common fan
cooling in the power supply units. Both node fans and PSU fans work together as thermal
solution to the chassis.
For each node, several components and configuration requirements make up the cooling
subsystem. These include processors, chipsets, VR heatsinks, system fan module, CPU air
duct, and drive bay population. All are necessary to provide and regulate the air flow and air
pressure needed to maintain the system’s thermals when operating at or below the maximum
specified thermal limits.
In order to maintain the necessary airflow within the system, you must properly install the air
duct, HDD dummy carrier, PSU dummy filler, and the top cover.
Each node uses a variable fan speed control engine to provide adequate cooling for the node
and whole system at various ambient temperature conditions, under various server workloads,
and with the least amount of acoustic noise possible. The fans operate at the lowest speed for
any given condition to minimize acoustics.
Note: The server system does not support redundant cooling fans. If any of the node fans fail,
you must power down the respective node as soon as possible to replace the fan.
4.1
Processor Heatsink
A heatsink is included in the system package. This heatsink is designed for optimal cooling and
performance. To achieve better cooling performance, you must properly attach the heatsink
bottom base with TIM (thermal interface material). ShinEtsu* G-751 or 7783D or Honeywell*
PCM45F TIM is recommended. The mechanical performance of the heatsink must satisfy
mechanical requirement of Intel® Xeon® E5-2600 series processors. To keep chipsets and VR
temperature at or below maximum temperature limit, the heatsink is required if necessary.
Figure 19. Processor Heatsink Overview
Note: The passive heatsink is Intel standard thermal solution for 1U/2U rack chassis.
Revision 2.2
Intel order number: G39462-013
39
Cooling Subsystem
4.2
Intel® Server System H2000JF Family TPS
Node Cooling Fans
The cooling subsystem for each node consists of three 40 x 40 x 56 dual rotor fans, and CPU
air duct. These components provide the necessary cooling and airflow to the system node.
To maintain the necessary airflow within the system, the air duct and the top cover must be
properly installed.
Note: The Intel® Server System H2000JF Family does not support redundant cooling. If one of
the node fan fails, it is recommended to replace the failed fan as soon as possible.
However, the system design still reserves limited thermal margin to fan failure.
For Intel® Server System H2312JF with 12x 3.5'' HDD, the system allows one fan fail at one
time per node with ASHRAE-A2. Certain level of CPU throttling will occur during fan fail but the
percent is below 1% which is considered to be acceptable from thermal perspective. For 130W
CPU configuration, the confidence level of system exit air temperature to meet 70°C is 98%
which is acceptable. For 95W CPU configuration, the system exit air temperature can meet
70°C specification. All other system components are within thermal specification.
For Intel® Server System H2216JF with 16x 2.5'' HDD, the system allows one fan fail at one
time per node with ASHRAE-A2. There is no throttling on CPU. All other system components
are within thermal specification.
Each fan within the node can support multiple speeds. Fan speed changes automatically when
internal ambient temperature of the system or processor temperature changes. The fan speed
control algorithm is programmed into the server board’s BIOS.
Each fan connector within the module supplies a tachometer signal that allows the BMC to
monitor the status of each fan. If one of the fans fails, the system fault LED in the front panel will
light up.
The fan control signal is from BMC on mother board to Node Docking Board and then distribute
to three sets of dual rotor fans. See below for detail.
40
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Cooling Subsystem
Figure 20. Node Fan Set and Power/Control Connection
The fan connector pin-out definition is as follows.
Table 36. 8-Pin Connector Pin-Out for Node Dual Rotor Fans
4.3
Pin
1
GND
Signal Name
Ground
Description
2
P12V
Power Supply +12 V
3
Tach1 Out
FAN_TACH1 signal output
4
PWM1 In
PWM1 signal input
5
GND
Ground
6
P12V
Power Supply +12 V
7
Tach2 Out
FAN_TACH2 signal output
8
PWM1 In
PWM1 signal input
Power Supply Fan
Each power supply module supports one non-redundant dual rotor 40 mm fan. The fans control
the cooling of the power supply and some drive bays. These fans are not replaceable. Therefore,
if a power supply fan fails, you must replace the power supply module.
4.4
Air Duct Module
Each node requires the use of an air duct module to direct airflow over critical areas within the
node. Before slide the node tray into chassis, make sure the air duct is installed properly.
Revision 2.2
Intel order number: G39462-013
41
Intel® Server System H2000JF Family TPS
Cooling Subsystem
Figure 21. Compute Node Air Duct (Top View)
4.5
Drive Bay Population Requirement
In order to maintain system thermal requirements, you must fully populate all hard drive bays.
Hard drive trays used for hot-swap drives must either have a hard drive installed or not have a
hard drive installed.
If only one power supply unit is used, a PSU dummy filler must be used to match the airflow
requirement.
Important Note: If the drive bay is missing or not fully populated, the system will not meet the
thermal cooling requirements of the processor, which will most likely result in degraded
performance as a result of throttling or thermal shutdown of the system. It is recommended to
keep/apply the dummy plastic blocker (as shipped with HDD carrier) on any blank HDD carrier.
42
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
5.
System Boards in the Node Tray
System Boards in the Node Tray
The Node tray includes mother board, node docking board, bridge board, and node fan set.
A
B
C
D
Node Docking Board
Node Fan Set
Baseboard
Bridge Board
Figure 22. Compute Node Tray Overview
5.1
5.1.1
Node Docking Board
Overview of Node Docking Board
The Node Docking Board provides hot swap docking of 12V main power between the compute
node and the server. It supports three dual rotor fan connections, 12V main power hot swap
controller, and current sensing. The HW Power Docking Board is intended to support the usage
of compute node of Intel® Server Board S2600JF family.
A
B
C
D
E
F
2x6 pin Minifit Jr main power output connector
8 pin connector for node fan 2
12 pin connector for main power input
8 pin connector for node fan 3
8 pin connector for node fan 1
2x7 pin fan control connector
Figure 23. Node Docking Board
Revision 2.2
43
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
The Node Docking Board implements the following features:

Main 12V hot swap connectivity between compute node and chassis power.

Current sensing of 12V main power for use with node manager.

One 2x6pin mini-fit jr high current connectors for cabling either the HW baseboard or a
double width add-in card in a customized chassis. Different cable lengths will be needed
for the different depth HW baseboards.

2x7pin fan single connector, discrete cabled to the HW baseboard.

Three 8-pin dual rotor fan connectors.

Four loose screws used to secure board to the compute node.
5.1.2
Pin-out Definition on Node Docking Board
The table below lists the connector type and pin definition on Node Docking Board.
Table 37. Main Power Input Connector
Pin
1
3
5
7
9
11
Signal Description
Pin
Lower Blade (Circuit 1)
GND
2
GND
4
GND
6
Upper Blade (Circuit 2)
P12V
8
P12V
10
P12V
12
Signal Description
GND
GND
GND
P12V
P12V
P12V
Table 38. Fan Control Signal Connector
Pin
1
3
5
7
9
11
13
Signal Description
PWM1
Tach0
Tach2
Tach4
NODE_ON
SMBUS_R4 CLK
NODE_ADR0
Pin
2
4
6
8
10
12
14
Signal Description
Reserved
Tach1
Tach3
Tach5
GND
SMBUS_R4 DAT
NODE_PWRGD
Table 39. Node Fan Connector
Pin
1
2
3
4
5
6
7
8
44
Signal Description
GND
P12V
TACH1
PWM1
GND
P12V
TACH2
PWM1
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
Table 40. Main Power Output Connector
Pin
1
2
3
4
5
6
5.2
Signal Description
GND
GND
GND
GND
GND
GND
Pin
7
8
9
10
11
12
Signal Description
P12V_HS
P12V_HS
P12V_HS
P12V_HS
P12V_HS
P12V_HS
Bridge Board
There are several types of bridge boards that implement different features and functions when
working with Intel® Server Board S2600JF family. This section describes the common bridge
board which is shipping with H2000JF system.
5.2.1
Overview of Bridge Board
The bridge board is a common board across all baseboards going into the H2000JF serials
server chassis. The bridge board provides hot swap interconnect of all electrical signals to the
backplane of the server chassis (except for main 12V power). It supports up to 4x lanes of
SAS/SATA, a 7-pin SATA connector for SATA DOM devices, and type-A USB connector for
USB flash device. One bridge board is used per one compute node. The bridge board is
secured with three loose screws to the compute node tray.
Figure 24. Bridge Board Overview
Bridge board passes all electrical connectivity through a 2x40pin card edge hot swap
interconnect between compute node and chassis backplane. The bridge board passes the
following features (per compute node) to the backplane of the server:
Revision 2.2
45
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray

4x 6Gb SAS/SATA ports for HSBP drives

Two x4 lane 6Gb SAS/SATA re-drivers

Four chassis ID signals to determine the physical location of the compute node

One SGPIO SFF-8485 interface to the HSBP microcontroller

5V_AUX power generated on HSBP and provided to the compute node

3.3V power generated on HSBP and provided to bridge board to run SAS/SATA redrivers

Global PMBus* alert signal for CLST support

Four SMBus* interfaces:
o
SMBUS* R1: For chassis temp sensor and chassis FRU EEPROM device
o
SMBUS* R5: Connectivity to up to two HSBP controllers and one shared .12V
current monitoring device
o
SMBUS* R7: Connectivity to up to two common redundant power supply (CRPS)
module PMBus*
o
IPMB: For OEM requirement not used on EPSD HW servers
o
Front panel button signals: Power, reset, NMI, and ID
o
Front panel LEDs signals: Power, fault, status, fabric activity, ID, HDD activity

One 7-pin 6Gb SATA port connector for DOM device docking to the bridge board

USB2.0 interface to a 4-pin type-A connector for flash device docking to bridge board

2-Pin 5V_AUX power for the SATA DOM in need of cabling power
A
B
C
D
E
2x40 pin card edge connector (to backplane)
USB 2.0 Type-A connector
2-pin 5V_AUX power
AHCI SATA0 DOM port connector
2x40 pin card edge connector (to baseboard slot)
Figure 25. Connectors on Bridge Board
46
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
5.2.2
System Boards in the Node Tray
Pin-out Definition on Bridge Board
The table below lists the connector pin definition on the bridge board.
Table 41. Card Edge Connector Pin-out
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
Signal Description
5V Aux
SATA0_TXN
SATA0_TXP
GND
NODE_PRESENT_N
(GND)
ALL_NODE_OFF
spare
GND
IPMB-Data
IPMB-Clk
GND
SMBUS_R1 DATA
SMBUS_R1 CLK
GND
SMBUS_R5 DATA
SMBUS_R5 CLK
GND
SMBUS_R7 DATA
SMBUS_R7 CLK
GND
PMBUS Alert_N
NODEx_ON_N
SGPIO DATA IN
SGPIO Data Out
SGPIO LD
SPKR
GND
SAS3_RX
SAS3_RX
GND
SAS2_TX
SAS2_TX
GND
SAS1_RX
SAS1_RX
GND
SAS0_TX
SAS0_TX
GND
P3V3 (HSBP Side) and
GND (HW Baseboard
Side)
Pin
2
4
6
8
Signal Description
5V Aux
USB2_OC
GND
SATA0_RXN
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
SATA0_RXP
GND
USB2_P0P
USB2_P0N
GND
FP HDD_ACT_LED_N
FP Activity LED_N
FP Health LEDA_N
FP Health LEDG_N
FP PWR LED_N
FP ID LED_N
FP ID BTN_N
FP RST BTN_N
FP PWR BTN_N
FP NMI BTN_N
SPA_SOUT_N
SPA_SIN_N
ID3
ID2
ID1
ID0
SGPIO CLK
GND
SAS3_TX
SAS3_TX
GND
SAS2_RX
SAS2_RX
GND
SAS1_TX
SAS1_TX
GND
SAS0_RX
SAS0_RX
GND
P3V3 (HSBP Side) and
SATA_SAS_N (HW
Baseboard Side)
80
Revision 2.2
47
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
The SATA DOM used on SATA0 port can be either powered by the SATA port, or using external
power from 5V-AUX connector.
Table 42. AHCI SATA0 DOM Connector Pin-out
Pin
1
2
3
4
5
6
7
Signal Description
GND
SATA0_TXP
SATA0_TXN
GND
SATA0_RXN
SATA0_RXP
P5V_SATA/GND
Table 43. USB 2.0 Type-A Connector Pin-out
Pin
1
2
3
4
Signal Description
P5V_USB
USB2_P0N
USB2_P0P
GND
Table 44. 5V_AUX Power Connector Pin-out
Pin
1
2
5.3
Signal Description
GND
P5V
6Gbs SAS Support Option 1
This bridge board is designed to support 6Gbs SAS signal from internal SAS RAID controller.
This bridge board is not connect to SCU ports from baseboard but makes all other power and
control signals available to backplane. It ships together with a dedicated SAS cable as a spare
of the system.
5.3.1
Overview of Bridge Board
The bridge board is a spare board across all baseboards going into the H2000JF serials server
chassis, to upgrade the system for 6Gbs SAS support. The bridge board provides hot swap
interconnect of all electrical signals to the backplane of the server chassis (except for main 12V
power). It supports up to 4x lanes of SAS/SATA and one mini SAS connector for cable
connection to PCIe based RAID card or SAS ROC. One bridge board is used per one compute
node. The bridge board is secured with several loose screws to the compute node tray.
A dedicated mini SAS cable is shipped together with the bridge board, which is mechanically
fitted into the node tray.
48
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
Figure 26. SAS 6Gbs Bridge Board Overview
This bridge board passes all electrical connectivity through a 2x40pin card edge hot swap
interconnect between compute node/SAS RAID card and chassis backplane. The bridge board
passes the follow features (per compute node) to the backplane of the server:

4x 6Gb SAS/SATA signals through Mini SAS port to HSBP drives

Two x4 lane 6Gb SAS/SATA re-drivers

Four chassis ID signals to determine the physical location of the compute node

One SGPIO SFF-8485 interface to the HSBP microcontroller

5V_AUX power generated on HSBP and provided to the compute node

3.3V power generated on HSBP and provided to bridge board to run SAS/SATA redrivers

Global PMBus* alert signal for CLST support

Four SMBus* interfaces:
o
SMBus* R1: For chassis temp sensor and chassis FRU EEPROM device
o
SMBus* R5: Connectivity to up to two HSBP controllers and one shared .12V
current monitoring device
o
SMBus* R7: Connectivity to up to two common redundant power supply (CRPS)
module PMBus*
o
IPMB: For OEM requirement not used on EPSD HW servers
o
Front panel button signals: Power, reset, NMI, and ID
o
Front panel LEDs signals: Power, fault, status, fabric activity, ID, and HDD
activity
Revision 2.2
49
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
A
B
C
2x40 pin card edge connector (to backplane)
2x40 pin card edge connector (to baseboard bridge slot)
4-port Mini SAS Connector
Figure 27. Connectors and Components on Spare Bridge Board
5.3.2
Pin-out Definition on SAS 6Gbs Bridge Board
The table below lists the connector pin definition on the bridge board.
Table 45. Pin-out of Card Edge to Base Board
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
50
Signal Name
5V_AUX
N/C
N/C
GND
NODE_PRESENT_N
ALL_NODE_OFF
N/C
GND
IPMB_DATA
IPMB_CLK
GND
SMB_SNSR_DATA
SMB_SNSR_CLK
GND
SMB_HSBP_DATA
SMB_HSBP_CLK
GND
SMB_PMBUS_DATA
SMB_PMBUS_CLK
GND
Pin
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Signal Name
5V_AUX
USB2_OC
GND
N/C
N/C
GND
N/C
N/C
GND
LED_HDD_ACT_N
FP_ACT_LED_N
FP_LED_STSA_N
FP_LED_STSG_N
FP_PWR_LED_N
FP_ID_LED_N
FP_ID_BTN_N
FP_RST_BTN_N
FP_PWR_BTN_N
FP_NMI_BTN_N
SPA_SOUT
Pin
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
Signal Name
PMBUS_ALERT_N
NODE_ON_N
SGPIO_DATA_IN
SGPIO_DATA_OUT
SGPIO_LOAD
SPEAKER_IN
GND
N/C
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
GND
Intel order number: G39462-013
Pin
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
Signal Name
SPA_SIN
IBMC_NODEID_3
IBMC_NODEID_2
IBMC_NODEID_1
IBMC_NODEID_0
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
SAS_SATA_SET_N
Revision 2.2
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
Table 46. Pin-out of Card Edge to Hot Swap Back Plane
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
Signal Name
5V_AUX
N/C
N/C
GND
NODE_PRESENT_N
ALL_NODE_OFF
3V3_AUX
GND
IPMB_DATA
IPMB_CLK
GND
SMB_R1_DATA
SMB_R1_CLK
GND
SMB_HSBP_DATA
SMB_HSBP_CLK
GND
SMB_PMBUS_DATA
SMB_PMBUS_CLK
GND
Pin
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Signal Name
5V_AUX
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
LED_HDD_ACT_N
FP_ACT_LED_N
FP_LED_STSA_N
FP_LED_STSG_N
FP_PWR_LED_N
FP_ID_LED_N
FP_ID_BTN_R_N
FP_RST_BTN_N
FP_PWR_BTN_N
FP_NMI_BTN__N
SPA_SOUT
Pin
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
Signal Name
PMBUS_ALERT_N
NODE_ON_N
SGPIO_DATA_IN
SGPIO_DATA_OUT
SGPIO_LOAD
SPEAKER_IN
GND
SAS3_RX_BP_N
SAS3_RX_BP_P
GND
SAS2_TX_BP_N
SAS2_TX_BP_P
GND
SAS1_RX_BP_N
SAS1_RX_BP_P
GND
SAS0_TX_BP_N
SAS0_TX_BP_P
GND
3V3
Pin
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
Signal Name
SPA_SIN
IBMC_NODEID_3
IBMC_NODEID_2
IBMC_NODEID_1
IBMC_NODEID_0
SGPIO_CLOCK
GND
SAS3_TX_BP_N
SAS3_TX_BP_P
GND
SAS2_RX_BP_N
SAS2_RX_BP_P
GND
SAS1_TX_BP_N
SAS1_TX_BP_P
GND
SAS0_RX_BP_N
SAS0_RX_BP_P
GND
3V3
Table 47. Pin-out of Mini SAS Connector
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
A1
GND
A10
GND
B1
GND
B10
SGPIO_DATA_OUT
A2
A3
A4
A5
SAS0_TX_P
SAS0_TX_N
GND
SAS1_TX_P
A11
A12
A13
A14
N/C
GND
SAS2_TX_P
SAS2_TX_N
B2
B3
B4
B5
SAS0_RX_P
SAS0_RX_N
GND
SAS1_RX_P
B11
B12
B13
B14
SGPIO_DATA_IN
GND
SAS2_RX_P
SAS2_RX_N
A6
A7
SAS1_TX_N
GND
A15
A16
GND
SAS3_TX_P
B6
B7
SAS1_RX_N
GND
B15
B16
GND
SAS3_RX_P
A8
A9
SGPIO_CLOCK
SGPIO_LOAD
A17
A18
SAS3_TX_N
GND
B8
B9
SAS_BP_TYPE
N/C
B17
B18
SAS3_RX_N
GND
5.4
6Gbs SAS Support Option 2
The dedicated 6Gbs SAS controller RMS25LB040 is designed for Intel® Server System
H2000JF, together with dedicated bridge board and riser card as total solution kit. This solution
leaves the PCIe slot 1 available for additional LP PCIe base add-in card.
The solution kit includes three major parts: bridge board, riser card, and SAS controller module.
5.4.1
Bridge Board
The bridge board in the solution kit is shown below. The original bridge board in the base
system must be replaced with this bridge board in order to install the rest riser card and SAS
controller module.
Revision 2.2
51
Intel order number: G39462-013
System Boards in the Node Tray
Intel® Server System H2000JF Family TPS
Figure 28. Overview of the Bridge Board
Main connectors on the bridge board are defined as follows.
A
B
C
D
E
2x40 pin card edge connector (to backplane)
SATA DOM Connector
Auxiliary SATA DOM Power
2x18 pin card edge connector (to SAS Controller)
2x40 pin card edge connector ( to bridge slot on baseboard)
Figure 29. Connectors on Bridge Board
The pin-out of card edge to Hot Swap Backplane is the same as defined in
52
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
Table 46, and pin-out of card edge to bridge board slot is the same as defined in Table 45. The
pin-out of card edge to SAS controller module is defined below.
Table 48. Card Edge Pin-out of Bridge Board to SAS Controller
Pin
A1
A2
A3
A4
A5
A6
A7
A8
A9
Signal Name
NC
SGPIO_LOAD
SGPIO_CLOCK
GND
SAS3_TX_N
SAS3_TX_P
GND
GND
SAS2_RX_N
Pin
B1
B2
B3
B4
B5
B6
B7
B8
B9
Signal Name
GND
SGPIO_DATA_IN
SGPIO_DATA_OUT
GND
SAS3_RX_P
SAS3_RX_N
GND
GND
SAS2_TX_P
Pin
A10
A11
A12
A13
A14
A15
A16
A17
A18
Signal Name
SAS2_RX_P
GND
SAS1_TX_N
SAS1_TX_P
GND
GND
SAS0_RX_N
SAS0_RX_P
GND
Pin
B10
B11
B12
B13
B14
B15
B16
B17
B18
Signal Name
SAS2_TX_N
GND
SAS1_RX_P
SAS1_RX_N
GND
SAS0_TX_P
SAS0_TX_N
GND
NC
Pin definition for SATA DOM and Auxiliary Power connectors are the same as defined in Table
42 and Table 44.
5.4.2
Riser Card
The riser card provides electrically connectivity for installing a standard PCIe x8 Gen3 low
profile form factor adapter card. It supports a PCIe Gen3 x8 card edge connection, and for
passing an RGMII interface across to SAS Module. The riser card is secured with two loose
screws to the compute node sheet metal bracket.
Figure 30. Overview of the Riser Card
Riser card pin-out definition is as follows.
Table 49. Card Edge Pin-out of Riser Card to SAS Controller
Pin
A1
Signal Name
P12V
Pin
B1
Signal Name
P3V3_1
Pin
Signal Name
Pin
A26
P3E_RX_DP<
5>
B26
Revision 2.2
Signal Name
GND
53
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
System Boards in the Node Tray
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
B27
GND
B28
A2
P12V
B2
P3V3_2
A27
A3
P12V
B3
P3V3_3
A28
P3E_RX_DN<
5>
GND
A4
P12V
B4
A29
GND
B29
A5
B5
A30
B6
PD_P3E_PRSNT_N
A31
B31
GND
A7
GND
B7
LED_HDD_ACT_N
A32
P3E_RX_DP<
4>
P3E_RX_DN<
4>
GND
B30
A6
SMB_CLK_P3E_P3V3
_AUX
P3V3_AUX
SMB_DAT_P3E_P3V3_A
UX
P5V_STBY
P3E_TX_C_D
P<5>
P3E_TX_C_D
N<5>
GND
B32
A8
RGMII_IBMC_RMM4_T
XD_0
RGMII_IBMC_RMM4_T
XD_1
RGMII_IBMC_RMM4_T
XD_2
RGMII_IBMC_RMM4_T
XD_3
GND
B8
A33
GND
B33
A34
B34
B35
GND
A36
P3E_RX_DP<
3>
P3E_RX_DN<
3>
GND
B36
A37
GND
B37
RGMII_IBMC_RMM4_T
X_CLK
RGMII_IBMC_RMM4_T
X_CTRL
RGMII_IBMC_RMM4_
MDIO
RST_P3E_N
B13
RGMII_IBMC_RMM4_RX
D_3
RGMII_IBMC_RMM4_RX
D_2
RGMII_IBMC_RMM4_RX
D_1
RGMII_IBMC_RMM4_RX
D_0
RGMII_IBMC_RMM4_RX
_CTRL
GND
P3E_TX_C_D
P<4>
P3E_TX_C_D
N<4>
GND
A38
B38
RGMII_IBMC_RMM4_RX
_CLK
RGMII_IBMC_RMM4_M
DC
GND
A39
B39
GND
A40
P3E_RX_DP<
2>
P3E_RX_DN<
2>
GND
P3E_TX_C_D
P<3>
P3E_TX_C_D
N<3>
GND
B40
A41
GND
B41
B17
B43
GND
P3E_RX_DN<7>
B19
A44
P3E_RX_DP<
1>
P3E_RX_DN<
1>
GND
B42
A19
CLK_100M_P3E_REF_D
P
CLK_100M_P3E_REF_D
N
GND
A42
A18
TP_IRQ_LVC3_WAKE
_N
P3E_RX_DP<7>
P3E_TX_C_D
P<2>
P3E_TX_C_D
N<2>
GND
B44
A20
GND
B20
P3E_TX_C_DP<7>
A45
GND
B45
A21
GND
B21
P3E_TX_C_DN<7>
A46
P3E_RX_DP<
0>
B46
P3E_TX_C_D
P<1>
P3E_TX_C_D
N<1>
GND
A22
P3E_RX_DP<6>
B22
GND
A47
B47
GND
A23
P3E_RX_DN<6>
B23
GND
A48
P3E_RX_DN<
0>
GND
B48
A24
GND
B24
P3E_TX_C_DP<6>
A49
GND
B49
P3E_TX_C_D
P<0>
P3E_TX_C_D
N<0>
A25
GND
B25
P3E_TX_C_DN<6>
A9
A10
A11
A12
A13
A14
A15
A16
A17
B9
B10
B11
B12
B14
B15
B16
B18
A35
A43
Table 50. Card Edge Pin-out of Riser Card to PCIe Slot2 of Baseboard
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
P3E_RX_DP<
5>
P3E_RX_DN<
5>
A26
GND
A27
GND
B1
P12V
A1
P3V3_1
B26
B2
P12V
A2
P3V3_2
B27
54
Intel order number: G39462-013
Signal Name
Revision 2.2
Intel® Server System H2000JF Family TPS
Pin
Signal Name
Pin
System Boards in the Node Tray
Signal Name
Pin
Signal Name
Pin
Signal Name
B3
P12V
A3
P3V3_3
B28
GND
A28
B4
P12V
A4
B29
GND
A29
B5
A5
B30
A6
PD_P3E_PRSNT_N
B31
A31
GND
B7
GND
A7
LED_HDD_ACT_N
B32
P3E_RX_DP<
4>
P3E_RX_DN<
4>
GND
A30
B6
SMB_CLK_P3E_P3V3
_AUX
P3V3_AUX
SMB_DAT_P3E_P3V3_A
UX
P5V_STBY
P3E_TX_C_D
P<5>
P3E_TX_C_D
N<5>
GND
A32
B8
RGMII_IBMC_RMM4_T
XD_0
RGMII_IBMC_RMM4_T
XD_1
RGMII_IBMC_RMM4_T
XD_2
RGMII_IBMC_RMM4_T
XD_3
GND
A8
B33
GND
A33
B34
A34
A35
GND
B36
P3E_RX_DP<
3>
P3E_RX_DN<
3>
GND
A36
B37
GND
A37
RGMII_IBMC_RMM4_T
X_CLK
RGMII_IBMC_RMM4_T
X_CTRL
RGMII_IBMC_RMM4_
MDIO
RST_P3E_N
A13
RGMII_IBMC_RMM4_RX
D_3
RGMII_IBMC_RMM4_RX
D_2
RGMII_IBMC_RMM4_RX
D_1
RGMII_IBMC_RMM4_RX
D_0
RGMII_IBMC_RMM4_RX
_CTRL
GND
P3E_TX_C_D
P<4>
P3E_TX_C_D
N<4>
GND
B38
A38
RGMII_IBMC_RMM4_RX
_CLK
RGMII_IBMC_RMM4_M
DC
GND
B39
A39
GND
B40
P3E_RX_DP<
2>
P3E_RX_DN<
2>
GND
P3E_TX_C_D
P<3>
P3E_TX_C_D
N<3>
GND
A40
B41
GND
A41
A17
A43
GND
P3E_RX_DN<7>
A19
B44
P3E_RX_DP<
1>
P3E_RX_DN<
1>
GND
A42
B19
CLK_100M_P3E_REF_D
P
CLK_100M_P3E_REF_D
N
GND
B42
B18
TP_IRQ_LVC3_WAKE
_N
P3E_RX_DP<7>
P3E_TX_C_D
P<2>
P3E_TX_C_D
N<2>
GND
A44
B20
GND
A20
P3E_TX_C_DP<7>
B45
GND
A45
B21
GND
A21
P3E_TX_C_DN<7>
B46
A46
B22
P3E_RX_DP<6>
A22
GND
B47
A47
GND
B23
P3E_RX_DN<6>
A23
GND
B48
P3E_RX_DP<
0>
P3E_RX_DN<
0>
GND
P3E_TX_C_D
P<1>
P3E_TX_C_D
N<1>
GND
A48
B24
GND
A24
P3E_TX_C_DP<6>
B49
GND
A49
P3E_TX_C_D
P<0>
P3E_TX_C_D
N<0>
B25
GND
A25
P3E_TX_C_DN<6>
B9
B10
B11
B12
B13
B14
B15
B16
B17
5.4.3
A9
A10
A11
A12
A14
A15
A16
A18
B35
B43
SAS Controller Module
The SAS Module uses the LSI* 2308 host controller, totally generating up to 8ports of 6Gb
SAS/SATA. SAS Module consists of a 1GbE PHY device RTL8211D which offers a dedicated
management RJ45 1GbE port.
6Gb SAS Controller Module Key features:
1. LSI* 2308 SAS controller supporting up to eight 6Gb SAS/SATA ports
Revision 2.2
55
Intel order number: G39462-013
System Boards in the Node Tray
Intel® Server System H2000JF Family TPS
2.
3.
4.
5.
6.
7.
8.
Up to x8 lanes of PCIe Gen3 allowing up to 8Gb/s per direction
16MBytes Flash ROM memory
32kByte MRAM memory for write journaling support
150MHz core clock
1.0V core & 1.0V analog VRs, and 1.8V VR
Up to two universal keyed 36pin Mini-SAS connectors
Up to two SFF-8485 SGPIOs (SFF-8448 complaint sideband signals on each mini-SAS
connector)
9. “Heart beat” & system error status LEDs
10. 8kByte Bootstrap EEPROM
11. 256Byte chassis FRU EEPROM (unstuffed) & TMP75 temp sensor (stuffed)
12. One UART Debug headers
13. A dedicated RJ45 connector & PHY with 1Gb RGMII interface
SAS Controller Module Key Components are listed below.
A
B
C
D
E
F
G
H
I
J
RJ45 connector for 1GbE RGMII
LSI* 2308 SAS Controller
Riser Slot (with riser card installed)
Bridge Board Slot
HDD LED ACT Header
Mini SAS Connector 1 (Depop)
Mini SAS Connector 2 (Depop)
Voltage Regulator
RAID Key Header (Depop)
UART Debug Header
Figure 31. SAS Controller Module Overview
56
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
6.
Hard Disk Drive Support
Hard Disk Drive Support
The server system provides two SKUs to support different types of Hard Disk Drives (HDD):

H2312JF: Supports 12x 3.5" HDD

H2216JF: Supports 16x 2.5" HDD
6.1
Hard Disk Drive Bays Scheme
The server system H2000 chassis can support up to 12 carrier-mounted SATA/SAS 3.5-inch
hard disk drives, or 16 carrier-mounted SATA/SAS 2.5-inch hard disk drives. The drives may be
“electrically” hot-swapped while the system power is applied, but you must take caution before
hot-swapping while the system is functioning under operating system/application control or data
may be lost.
Following are hard disk drive distribution schemes on different SKUs of H2000 chassis family.
Figure 32. HDD Scheme for H2312JF
Figure 33. HDD Scheme for H2216JF
Note: If a failed drive needs to be replaced, it is recommended you replace it with the same
manufacturer, model, and capacity.
6.2
Hard Drive Carrier
There are two types of HDD carriers for two chassis SKUs respectively.
Revision 2.2
57
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
Figure 34. 3.5-inch HDD Assembly Overview
Figure 35. 2.5-inch HDD Assembly Overview
Hot-swap drive carriers make insertion and extraction of the drive from the system very simple.
Each type of drive carrier has its own latching mechanism, which is used to both insert and
extract drives from the chassis and lock the carrier in place. Each type of drive carrier supports
two light pipes to direct light from the drive status LEDs on the backplane to the carrier’s face
allowing it to be viewable from the front of the system.
6.3
Hot-Swap Hard Drive Support
Both the Intel® Server System H2312JF and H2216JFcan support hot-swap SATA/SAS hard
drives. Hard drives interface with the passive backplane through a blind mate connection when
drives are installed into a hard drive bay using hot-swap drive carriers.
The passive backplane acts as an intermediate pass-through interface board where SATA/SAS
ports of SCU0 from server board are hard wired to the backplane. The on board Intel® C600
Chipset (PCH) provides the necessary drive interface.
Each compute node in the system has dedicated Hot Swap Controller (HSC) to manage three
or four HDDs. There are totally four sets of independent Programmable System On Chip (PSOC)
on the backplane to function as HSC respectively to the four compute nodes.
58
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
The following sections describe the feature and connections between the backplane and server
board.
6.3.1





Backplane Feature Set
Common HSBP Microcontroller Cypress* PSoC 1 part.
H2312JF: 12x SAS/SATA 3.5" HDDs at 6Gb/s SAS/SATA or slower speeds, divided into
4 groups of three hot swap hard drives. Each HDD group is associated with one of the
four compute nodes respectively in the 2U chassis.
H2216JF: 16x SAS/SATA 2.5" HDDs at 6Gb/s SAS/SATA or slower speeds, divided into
4 groups of four hot swap hard drives. Each HDD group is associated with one of the
four compute nodes respectively in the 2U chassis.
One SGPIO SFF-8485 interface per compute node, total of four SGPIO on the
backplane.
Three SMBus* interfaces supported on the HSBP:
o
SMBus* R1: For chassis temp sensor and chassis FRU EEPROM device.
o
SMBus* R5: Connectivity to up to two HSBP controllers and one shared 12V
current monitoring device.
o
SMBus* R7: Connectivity to up to two common redundant power supply (CRPS)
module PMBus*.

Integrated front panel control connectors.

Status LED and Activity LED for each hard disk drive.

5V_AUX switcher regulator (from 12V and 12VSB) for HDD power and for compute
nodes.

Each grouping of HDD slots has switches for 5V and 12V power, only when
corresponding compute node is plugged in and operating will power be provided to the
HDDs.

3.3V switcher regulator (from 12V) to power microcontroller, SAS/SATA re-drivers on the
bridge board and various other components.

3.3V_AUX linear regulator (from 5V_AUX) for temp sensor, and chassis FRU EEPROM
located on the HSBP.

Four 80-pin bridge board connectors, one per compute node.

Four compute node main power connectors, one per compute node.

Four 2x9pin power cable connections and one 2x9pin power control cable connections.
These cables are routing to two power distribution boards (PDB).

Shared speaker for all compute nodes.
Revision 2.2
59
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
6.3.2
Backplane Block Diagram
Figure 36. Passive Backplane Block Diagram (for One Node)
6.3.3
3.5" Hot Swap Backplane Connector Scheme
The following diagrams show the layout of major components and connectors for 3.5" Hot Swap
backplane.
A
SATA/SAS connectors for Node 1
B
SATA/SAS connectors for Node 2
C
SATA/SAS connectors for Node 3
D
SATA/SAS connectors for Node 4
Figure 37. 3.5" Backplane Component and Connectors (Front View)
60
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
A
20-pin Front Panel cable connector for Node 2, 4
B
2-Blade Compute Node Power connector for Node 4
C
2x40 pin Bridge Board connector for Node 4
D
2x9 pin Power supply input connector
E
2x9 pin Power supply input connector
F
2x7 pin Power Control cable connector
G
2-Blade Compute Node Power connector for Node 3
H
2x40 pin Bridge Board connector for Node 3
I
2x40 pin Bridge Board connector for Node 1
J
20-pin Front Panel cable connector for Node 1, 3
K
2-Blade Compute Node Power connector for Node 1
L
2x9 pin Power supply input connector
M
2x9 pin Power supply input connector
N
2x40 pin Bridge Board connector for Node 2
O
2-Blade Compute Node Power connector for Node 2
Hard Disk Drive Support
Figure 38. 3.5" Backplane Component and Connectors (Back View)
6.3.4
2.5" Hot Swap Backplane Connector Scheme
The following diagrams show the layout of major components and connectors for 2.5" Hot Swap
backplane.
Revision 2.2
61
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
A
SATA/SAS connectors for Node 1
B
SATA/SAS connectors for Node 2
C
SATA/SAS connectors for Node 3
D
SATA/SAS connectors for Node 4
Figure 39. 2.5" Backplane Component and Connectors (Front View)
A
2-Blade Compute Node Power connector for Node 4
B
2x40 pin Bridge Board connector for Node 4
C
2x9 pin Power supply input connector
D
2x7 pin Power Control cable connector
E
2x9 pin Power supply input connector
F
2-Blade Compute Node Power connector for Node 3
G
2x40 pin Bridge Board connector for Node 3
H
2x40 pin Bridge Board connector for Node 1
I
20-pin Front Panel cable connector for Node 1, 3
J
2-Blade Compute Node Power connector for Node 1
K
2x9 pin Power supply input connector
L
2x9 pin Power supply input connector
M
2x40 pin Bridge Board connector for Node 2
N
2-Blade Compute Node Power connector for Node 2
O
20-pin Front Panel cable connector for Node 2, 4
Figure 40. 2.5" Backplane Component and Connectors (Back View)
62
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
6.3.5
Hard Disk Drive Support
Backplane LED Support
The backplanes support both HDD online and activity/fault LEDs for each of the hard drive
connectors. A light duct in HDD tray is used to conduct LED light to front panel. The following
lists LED functionality.
Figure 41. Hard Drive Carrier LED
General HDD LED functionality is displayed below.
Table 51. Hard Drive Carrier Status LED Functions
Amber
Off
Solid On
Blink
No access and no fault
Hard Drive Fault has occurred
Raid rebuild in progress (1hz) Identify (2hz)
Table 52. Hard Drive Carrier Activity LED Functions
Condition
Power on with no drive activity
Power on with drive activity
Green
Power on and drive spinning down
Power on and drive spinning up
6.3.6
Drive Type
SAS
SATA
SAS
SATA
SAS
SATA
SAS
SATA
Behavior
LED stays on.
LED stays off.
LED blinks off when processing a command.
LED blinks off when processing a command.
LED stays off.
LED stays off.
LED blinks.
LED stays off.
Backplane Connector Definition
The backplanes include several different connectors. This section defines the purpose and pinout associated with each.
1. 2x9 Pin Power Input Connector
The backplane is powered by +12V and +12VSTB from PDB of CRPS. The input power is
distributed by backplane to all four nodes.
Revision 2.2
63
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
Table 53. Backplane Input Power Connector Pin-out
Pin
2
4
6
8
10
12
14
16
18
Signal Description
P12V
P12V
P12V
P12V
P12V
P12V
P12V
P12V
P12V
Pin
1
3
5
7
9
11
13
15
17
Signal Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
2. 2-Blade Compute Node Power Connector
The backplane provides main power to compute node through 2-Blade power connector.
Table 54. 2-Blade Compute Node Power Connector Pin-out
Pin
1
3
5
7
9
11
13
15
Signal Description
Pin
Lower Blade (Circuit 1)
GND
2
GND
4
GND
6
GND
8
Upper Blade (Circuit 2)
P12V
10
P12V
12
P12V
14
P12V
16
Signal Description
GND
GND
GND
GND
P12V
P12V
P12V
P12V
3. 2x40 Pin Bridge Board Connector
The Compute Node provides four SATA/SAS ports (in SCU0) to backplane, together with front
panel control signals and SMBus*.
Table 55. 2x40 Pin Connector Pin-out for Node Bridge Board
Pin
1
3
5
7
9
11
13
15
17
19
64
Signal Description
5V_AUX
SATA0_TXN
SATA0_TXP
GND
NODE_Present_N (GND)
ALL_NODE_OFF
spare
GND
IPMB-Data
IPMB-Clk
Pin
2
4
6
8
10
12
14
16
18
20
Signal Description
5V_AUX
USB2_OC
GND
SATA0_RXN
SATA0_RXP
GND
USB2_P0P
USB2_P0N
GND
FP HDD_ACT_LED_N
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Pin
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
Signal Description
GND
SMBUS_R1 DATA
SMBUS_R1 CLK
GND
SMBUS_R5 DATA
SMBUS_R5 CLK
GND
SMBUS_R7 DATA
SMBUS_R7 CLK
GND
PMBUS Alert_N
NODEx_ON_N
SGPIO DATA IN
SGPIO Data Out
SGPIO LD
SPKR
GND
SAS3_RX
SAS3_RX
GND
SAS2_TX
SAS2_TX
GND
SAS1_RX
SAS1_RX
GND
SAS0_TX
SAS0_TX
GND
3.3V
Hard Disk Drive Support
Pin
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
Signal Description
FP Activity LED_N
FP Health LEDA_N
FP Health LEDG_N
FP PWR LED_N
FP ID LED_N
FP ID BTN_N
FP RST BTN_N
FP PWR BTN_N
FP NMI BTN_N
SPA_SOUT_N
SPA_SIN_N
ID3
ID2
ID1
ID0
SGPIO CLK
GND
SAS3_TX
SAS3_TX
GND
SAS2_RX
SAS2_RX
GND
SAS1_TX
SAS1_TX
GND
SAS0_RX
SAS0_RX
GND
3.3V
4. 20-Pin Front Panel Connector
The backplanes provide connectors for front panel control signals. Each connector integrates
the control signals of two compute nodes.
Table 56. Front Panel Connector Pin-out
Pin
1
2
3
4
5
6
7
8
Signal Description
GND
FP1_PWR_BTN_N
FP1_RST_BTN_N
FP1_ID_BTN_N
P5VSB
FP1_PWR_LED_N
FP1_HEALTH_LEDG_N
FP1_HEALTH_LEDA_N
Revision 2.2
65
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Hard Disk Drive Support
Pin
9
10
11
12
13
14
15
16
17
18
19
20
Signal Description
FP1_ACTIVITY_LED_N
FP1_ID_LED_N
GND
FP2_PWR_BTN_N
FP2_RST_BTN_N
FP2_ID_BTN_N
P3V3SB
FP2_PWR_LED_N
FP2_HEALTH_LEDG_N
FP2_HEALTH_LEDA_N
FP2_ACTIVITY_LED_N
FP2_ID_LED_N
5. 2x7 Pin Power Supply Control Signal Connector
The backplanes provide power supply control signals, together with PMBus* functionality
integrated.
Table 57. Power Supply Control Connector Pin-out
Pin
1
3
5
7
9
11
13
66
Signal Description
SMBUS_R7_DATA
SMBUS_R7_CLK
PMBUS_ALERT_N
PWROK
Reserved
PDU1-12VSB
PDU2-12VSB
Pin
2
4
6
8
10
12
14
Intel order number: G39462-013
Signal Description
A0
PSON_N
12V RS_RTN
12V RS
PDU1-12VSB
PDU2-12VSB
Reserved
Revision 2.2
Intel® Server System H2000JF Family TPS
7.
Front Panel Control and Indicators
Front Panel Control and Indicators
The Intel® Server System H2000JF family Front Control Panel is integrated with rack handles at
the both sides of the chassis. Each control panel contains two sets of node control buttons and
status LEDs. The control panel assembly is pre-assembled and fixed with the rack handles.
A
B
C
D
System Power Button with LED
System ID LED Button
System Status LED
Network Link/Activity LED
Figure 42. Front Control Panel
Revision 2.2
67
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Front Panel Control and Indicators
7.1
Control Panel Button
The following table lists the control panel features and functions. The control panel features a
system power button.
Table 58. Front Control Button Function
Feature
Power Button with Power LED
System ID Button with ID LED
7.2
Function
Toggles the system power on/off. This button also integrates the power
LED.
Toggles between ID LED on and off
Control Panel LED Indicators
The control panel houses independent two LEDs and two button integrated LEDs for each node,
which are viewable to display the system’s operating status. The following table identifies each
LED and describes their functionality.
Table 59. Front LED Indicator Functions
LED Indicator
Power
LAN (i350 Dual NIC)
System Status
Color
Condition
Green
Green
Green
Green
Green
Green
On
Blink
Off
On
Blink
Off
On
Blink
Amber
On
Amber
Blink
-
Off
Description
Power On / ACPI S0 state
Sleep / ACPI S1 state
Power Off / ACPI S5 state
LAN Link no Access
LAN Activity
No Link
System Ready / No Alarm
System ready, but degraded: redundancy lost such
as the power supply or fan failure; non-critical
temp/voltage threshold; battery failure; or predictive
power supply failure.
Critical Alarm: Critical power modules failure, critical
fans failure, voltage (power supply), critical
temperature and voltage
Non-Critical Alarm: Redundant fan failure, redundant
power module failure, non-critical temperature and
voltage
Power off: System unplugged
Power on: System powered off and in standby, no
prior degraded\non-critical\critical state
Notes:
1. Blink rate is ~1 Hz at 50% duty cycle.
2. It is also off when the system is powered off (S5) or in a sleep state (S1).
3. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down
without going through the BIOS, the LED state in effect at the time of power off is restored when the system
is powered on until the BIOS clears it.
4. If the system is not powered down normally, it is possible the Power LED will blink at the same time the
system status LED is off due to a failure or configuration change that prevents the BIOS from running.
68
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
7.2.1
Front Panel Control and Indicators
Power/Sleep LED
Table 60. Power LED Operation
State
Power Off
Power On
Power Mode
Non-ACPI
Non-ACPI
LED
Off
Solid On
S5
ACPI
Off
S1 Sleep
ACPI
Blink
S0
ACPI
Solid On
Note: Blink rate is ~ 1Hz at 50% duty cycle.
7.2.2
Description
System power is off and the BIOS has not initialized the chipset.
System power is on but the BIOS has not yet initialized the
chipset.
Mechanical is off and the operating system has not saved any
context to the hard disk.
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
System and the operating system are up and running.
System Status LED
Table 61. System Status LED Operation
Color
Off
N/A
State
Criticality
Not ready
Description
Power off or BMC initialization completes if no degraded, noncritical, critical, or non-recoverable conditions exist after power cable
plug-in.
Green/
Amber
Both Solid
On
Not ready
Pre DC Power On – 15-20 second BMC Initialization when AC is
applied to the server. The system will not POST until BMC
initialization completes.
Green
Solid on
Ok
System ready.
Green
Blink
Degraded
BIOS detected:
1. Unable to use all of the installed memory (more than one DIMM
installed).1
2. In a mirrored configuration, when memory mirroring takes place
and system loses memory redundancy. This is not covered by
(2). 1
3. PCI Express* correctable link errors.
Integrated BMC detected:
1. One of redundant power supplies not present.
2. CPU disabled – if there are two CPUs and one CPU is disabled.
3. Fan alarm – Fan failure. Number of operational fans should be
more than minimum number needed to cool the system.
4. Non-critical threshold crossed – Temperature, voltage, power
nozzle, power gauge, and PROCHOT2 (Therm Ctrl) sensors.
5. Battery failure.
6. Predictive failure when the system has redundant power
supplies.
Amber
Blink
Non-critical
Non-fatal alarm – System is likely to fail.
BIOS Detected:
1. In non-mirroring mode, if the threshold of ten correctable errors
is crossed within the window.1
2. PCI Express* uncorrectable link errors.
Integrated BMC Detected:
1. Critical threshold crossed – Voltage, temperature, power nozzle,
power gauge, and PROCHOT (Therm Ctrl) sensors.
Revision 2.2
69
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Front Panel Control and Indicators
Color
State
Criticality
2.
3.
4.
Amber
Solid on
Critical, nonrecoverable
Description
VRD Hot asserted.
One of the redundant power supplies failed.
Minimum number of fans to cool the system are not present or
have failed.
Fatal alarm – System has failed or shut down.
BIOS Detected:
1. DIMM failure when there is one DIMM present and no good
memory is present.1
2. Run-time memory uncorrectable error in non-redundant mode.1
3. CPU configuration error (for instance, processor stepping
mismatch).
Integrated BMC Detected:
1. CPU CATERR signal asserted.
2. CPU 1 is missing.
3. CPU THERMTRIP.
4. System cooling fan failure.
5. No power good – Redundant power fault.

Power Unit Redundancy sensor – Insufficient resources
offset (indicates not enough power supplies are present).
Notes:
1. The BIOS detects these conditions and sends a Set Fault Indication command to the Integrated BMC to
provide the contribution to the system status LED.
2. Blink rate is ~ 1Hz at 50% duty cycle.
7.2.3
System Status LED – BMC Initialization
When power is first applied to the system and 5V-STBY is present, the BMC controller on the
server board requires 15-20 seconds to initialize. During this time, the system status LED will be
solid on, both amber and green. After BMC initialization has completed, the status LED will stay
green solid on. If power button is pressed before BMC initialization completes, the system will
not boot to POST.
70
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
8.
Configuration Jumpers
Configuration Jumpers
The following table provides a summary and description of configuration, test, and debug
jumpers on the Intel® Server Board S2600JF, which is used in Intel® Server System H2000JF
Family as Compute Node.
Figure 43. Jumper Locations and Functions
Revision 2.2
71
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
Configuration Jumpers
Table 62. Force Integrated BMC Update Jumper
Jumper Name
J6B1: BMC Force
Update jumper
J1E2: ME Force Update
J1E3: Password Clear
Jumper Position
1-2
Mode of Operation
Normal
Normal mode
Note
2-3
Update
BMC in force update mode
1-2
Normal
Normal mode
2-3
Update
ME in force update mode
1-2
Normal
Normal mode, password in protection
2-3
Clear Password
BIOS password is cleared
J1E1: BIOS Recovery
Mode
1-2
Normal
Normal mode
2-3
Recovery
BIOS in recovery mode
J1D5: BIOS Default
1-2
Normal
Normal mode
2-3
Clear BIOS
Settings
BIOS settings are reset to factory default
8.1
Force Integrated BMC Update (J6B1)
When performing a standard BMC firmware update procedure, the update utility places the
BMC into an update mode, allowing the firmware to load safely onto the flash device. In the
unlikely event the BMC firmware update process fails due to the BMC not being in the proper
update state, the server board provides a BMC Force Update jumper (J6B1) which will force the
BMC into the proper update state. The following procedure should be followed in the event the
standard BMC firmware update process fails.
Table 63. Force Integrated BMC Update Jumper
Jumper Position
1-2
2-3
Mode of Operation
Normal
Update
Note
Normal Operation
BMC in force update mode
Steps to perform the Force Integrated BMC Update:
1. Power down and remove the AC power cord.
2. Open the server chassis. See your server chassis documentation for instructions.
3. Move jumper from the default operating position (covering pins 1 and 2) to the enabled
position (covering pins 2 and 3).
4. Close the server chassis.
5. Reconnect the AC cord and power up the server.
6. Perform the BMC firmware update procedure as documented in the ReleaseNote.TXT
file included in the given BMC firmware update package. After successful completion of
the firmware update process, the firmware update utility may generate an error stating
the BMC is still in update mode.
7. Power down and remove the AC power cord.
8. Open the server chassis.
9. Move the jumper from the enabled position (covering pins 2 and 3) to the disabled
position (covering pins 1 and 2).
10. Close the server chassis.
11. Reconnect the AC cord and power up the server.
72
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Configuration Jumpers
Note: Normal BMC functionality is disabled with the Force BMC Update jumper set to the
enabled position. You should never run the server with the BMC Force Update jumper set in this
position. You should only use this jumper setting when the standard firmware update process
fails. This jumper should remain in the default/disabled position when the server is running
normally.
The server board has several 3-pin jumper blocks that can be used to configure, protect, or
recover specific features of the server board.
8.2
Force ME Update (J1E2)
When this 3-pin jumper is set, it manually puts the ME firmware in update mode, which enables
the user to update ME firmware code when necessary.
Table 64. Force ME Update Jumper
Jumper Position
1-2
Mode of
Operation
Normal
Note
Normal operation
2-3
Update
ME in force update mode
Note: Normal ME functionality is disabled with the Force ME Update jumper set to the enabled
position. You should never run the server with the ME Force Update jumper set in this position.
You should only use this jumper setting when the standard firmware update process fails. This
jumper should remain in the default/disabled position when the server is running normally.
Steps to perform the Force ME Update:
1.
Power down and remove the AC power cord.
2.
Open the server chassis. For instructions, see your server chassis documentation.
3.
Move jumper from the default operating position (covering pins 1 and 2) to the enabled
position (covering pins 2 and 3).
4.
Close the server chassis.
5.
Reconnect the AC cord and power up the server.
6.
Perform the ME firmware update procedure as documented in the README.TXT file
that is included in the given ME firmware update package (same package as BIOS).
7.
Power down and remove the AC power cord.
8.
Open the server chassis.
9.
Move jumper from the enabled position (covering pins 2 and 3) to the disabled position
(covering pins 1 and 2).
10. Close the server chassis.
8.3
Password Clear (J1E3)
This 3-pin jumper is used to clear the BIOS password.
Revision 2.2
73
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
Configuration Jumpers
Table 65. BIOS Password Clear Jumper
Jumper Position
1-2
2-3
Mode of Operation
Normal
Clear Password
Note
Normal mode. Password in protection
BIOS password is cleared
Steps to perform the password clear:
1.
Power down server. Do not unplug the power cord.
2.
Open the chassis. For instructions, refer to your server chassis documentation.
3.
Move the jumper (J1F2) from the default operating position (covering pins 1 and 2) to
the password clear position (covering pins 2 and 3).
4.
Close the server chassis.
5.
Power up the server, wait 10 seconds or until POST completes.
6.
Power down the server.
7.
Open the chassis and move the jumper back to default position (covering pins 1 and 2).
8.
Close the server chassis.
9.
Power up the server. The password is now cleared and you can reset it by going into
the BIOS setup. The BIOS password is now cleared.
8.4
BIOS Recovery Mode (J1E1)
The Intel® Server Board S2600JF uses BIOS recovery to repair the system BIOS from flash
corruption in the main BIOS and Boot Block. This 3-pin jumper is used to reload the BIOS when
the image is suspected to be corrupted. For directions on how to recover the BIOS, refer to the
specific BIOS Release Notes.
Table 66. BIOS Recovery Mode Jumper
Jumper
Position
1-2
2-3
Mode of
Operation
Normal
Note
Normal mode
Recovery
BIOS in recovery mode
You can accomplish a BIOS recovery from the SATA CD and USB Mass Storage device. Note
that this platform does not support recovery from a USB floppy.
The recovery media must contain the following files under the root directory:
1.
2.
3.
4.
RML.ROM
UEFI iFlash32 11.0 Build 2 (including iFlash32.efi and ipmi.efi)
*Rec.CAP
Startup.nsh (update accordingly to use proper *Rec.CAP file)
The BIOS starts the recovery process by first loading and booting to the recovery image file
(RML.ROM) on the root directory of the recovery media (USB disk). This process takes place
74
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Configuration Jumpers
before any video or console is available. After the system boots to this recovery image file
(FVMAIN.FV), it boots automatically into the EFI Shell to invoke the Startup.nsh script and start
the flash update application (IFlash32.efi). IFlash32.efi requires the supporting BIOS Capsule
image file (*Rec.CAP).
After the update is complete, a message displays, stating the “BIOS has been updated
successfully”. This indicates the recovery process is finished.
The user should then switch the recovery jumper back to normal operation and restart the
system by performing a power cycle.
The following steps demonstrate this recovery process:
1. Power off the system.
2. Insert recovery media.
3. Switch the recovery jumper. Details regarding the jumper ID and location can be obtained
from the Board EPS for that Platform.
4. Power on the system.
5. The BIOS POST screen appears displaying the progress, and the system automatically
boots to the EFI SHELL.
6. The Startup.nsh file executes, and initiates the flash update (IFlash32.efi) with a new
capsule file (*Rec.CAP). The regular iFlash message displays at the end of the process—
after the flash update succeeds.
7. Power off the system, and revert the recovery jumper position to "normal operation".
8. Power on the system.
9. Do NOT interrupt the BIOS POST during the first boot.
8.5
Reset BIOS Settings (J1D5)
This jumper is used to be the CMOS Clear jumper. The BIOS has moved CMOS data to the
NVRAM region of the BIOS flash since the previous generation. The BIOS checks during boot
to determine whether the data in the NVRAM must be set to default.
Table 67. Reset BIOS Jumper
Jumper Position
1-2
Mode of Operation
Normal
2-3
Reset BIOS Configuration
Note
These pins should have a jumper in place for normal
system operation (Default).
If these pins 2-3 are connected with AC power plugged,
the CMOS settings are cleared within five seconds.
These pins should not be connected for normal
operation.
Steps to reset the BIOS settings to default:
1. Power down server. Do not unplug the power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
Revision 2.2
75
Intel order number: G39462-013
Configuration Jumpers
Intel® Server System H2000JF FamilyTPS
3. Move jumper (J1D5) from the default operating position (covering pins 1 and 2) to the
reset/clear position (covering pins 2 and 3).
4. Wait five seconds.
5. Remove AC power.
6. Move the jumper back to default position (covering pins 1 and 2).
7. Close the server chassis.
8. Power up the server.
The BIOS settings are now cleared and you can reset it by going into the BIOS setup.
Note: Removing AC Power before performing the BIOS settings Clear operation causes the
system to automatically power up and immediately power down, after the procedure is followed
and AC power is re-applied. If this happens, remove the AC power cord again, wait 30 seconds,
and re-install the AC power cord. Power-up the system and proceed to the <F2> BIOS Setup
Utility to reset the desired settings.
76
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
9.
PCI Express* Riser Card and Assembly
PCI Express* Riser Card and Assembly
Each compute node in Intel® Server System H2000JF Family includes three PCI Express* riser
slots that accepts dedicated PCI Express* x16 Gen3 Risers to support low profile add-in card
and Intel® IO module. Only Riser Slot 1 and Riser Slot 2 are available for risers. Riser Slot 3 is
hidden by bridge board. The PCI Express* slot on riser also accommodates PCI Express* x8, x4,
and x1 adapters.
9.1
PCI Express* Riser for Slot 1
9.1.1
Overview of PCI-Express* Riser
Riser slot 1 on baseboard provides standard PCI Express* x16 Gen3 signals, together with
specific power pins to support high-power double width graphic add-in card.
Note: Riser Slot 1 on baseboard only supports Intel® 1U/2U Risers. It will cause damage to any
PCI-E based add-in card, which is directly plugged into the Riser Slot 1 on baseboard.
Figure 44. PCI Express* Riser for Riser Slot 1
9.1.2
Pin-out Definition on Slot 1 Riser
The following table is a list of pin definition on Slot 1 Riser.
Table 68. Riser Card Edge Pin-out
Pin
Pin Name
Description
Pin
Pin Name
Description
B1
12V
20W 3.3V generated on riser
A1
12V
20W 3.3V generated on riser
B2
12V
66W for double width add-in
card
A2
12V
66W for double width add-in
card
B3
12V
66W for double width add-in
card
A3
12V
66W for double width add-in
card
B4
12V
66W for double width add-in
card
A4
SMDATA
Revision 2.2
77
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
PCI Express* Riser Card and Assembly
Pin
B5
Pin Name
Description
SMCLK
B6
Pin
A5
For wake on LAN
Pin Name
3.3VAUX
For wake on LAN
GPU_NODE_ON
Turn on double width card
power
A6
3.3VAUX
Description
B7
GND
A7
GPU_PWRGD
B8
Tach9
A8
Tach11
B9
Tach8
A9
Tach10
B10
Tach7
A10
Tach6
B11
Spare
A11
Spare
KEY
B12
A12
Spare
PWM2
Double width card fan speed
control
B13
Spare
A13
GND
B14
GND
A14
PERST#
B15
SMBUS_R4
CLK
A15
WAKE#
B16
SMBUS_R4
DAT
A16
GND
B17
GND
A17
REFCLK+
Clock pair 1
B18
PETxP0
Tx Lane 0+
A18
REFCLK-
Clock pair 1
B19
PETxN0
Tx Lane 0-
A19
GND
B20
GND
A20
PERxP0
Rx Lane 0+
B21
GND
A21
PERxN0
Rx Lane 0-
B22
PETxP1
Tx Lane 1+
A22
GND
B23
PETxN1
Tx Lane 1-
A23
GND
B24
GND
A24
PERxP1
Rx Lane 1+
B25
GND
A25
PERxN1
Rx Lane 1-
B26
PETxP2
Tx Lane 2+
A26
GND
B27
PETxN2
Tx Lane 2-
A27
GND
B28
GND
A28
PERxP2
Rx Lane 2+
B29
GND
A29
PERxN2
Rx Lane 2-
B30
PETxP3
Tx Lane 3+
A30
GND
B31
PETxN3
Tx Lane 3-
A31
GND
B32
GND
A32
PERxP3
Rx Lane 3+
B33
GND
A33
PERxN3
Rx Lane 3-
B34
PETxP4
Tx Lane 4+
A34
GND
B35
PETxN4
Tx Lane 4-
A35
GND
B36
GND
A36
PERxP4
Rx Lane 4+
B37
GND
A37
PERxN4
Rx Lane 4-
B38
PETxP5
Tx Lane 5+
A38
GND
B39
PETxN5
Tx Lane 5-
A39
GND
B40
GND
A40
PERxP5
Rx Lane 5+
B41
GND
A41
PERxN5
Rx Lane 5-
B42
PETxP6
A42
GND
78
Tx Lane 6+
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Pin
Pin Name
Description
Tx Lane 6-
PCI Express* Riser Card and Assembly
Pin
Pin Name
Description
B43
PETxN6
A43
GND
B44
GND
A44
PERxP6
Rx Lane 6+
B45
GND
A45
PERxN6
Rx Lane 6-
B46
PETxP7
Tx Lane 7+
A46
GND
B47
PETxN7
Tx Lane 7-
A47
GND
B48
GND
A48
PERxP7
Rx Lane 7+
B49
GND
A49
PERxN7
Rx Lane 7-
B50
PETxP8
Tx Lane 8+
A50
GND
B51
PETxN8
Tx Lane 8-
A51
GND
B52
GND
A52
PERxP8
Rx Lane 8+
B53
GND
A53
PERxN8
Rx Lane 8-
B54
PETxP9
Tx Lane 9+
A54
GND
B55
PETxN9
Tx Lane 9-
A55
GND
B56
GND
A56
PERxP9
Rx Lane 9+
B57
GND
A57
PERxN9
Rx Lane 9-
B58
PETxP10
Tx Lane 10+
A58
GND
B59
PETxN10
Tx Lane 10-
A59
GND
B60
GND
A60
PERxP10
Rx Lane 10+
B61
GND
A61
PERxN10
Rx Lane 10-
B62
PETxP11
Tx Lane 11+
A62
GND
B63
PETxN11
Tx Lane 11-
A63
GND
B64
GND
A64
PERxP11
Rx Lane 11+
B65
GND
A65
PERxN11
Rx Lane 11-
B66
PETxP12
Tx Lane 12+
A66
GND
B67
PETxN12
Tx Lane 12-
A67
GND
B68
GND
A68
PERxP12
Rx Lane 12+
B69
GND
A69
PERxN12
Rx Lane 12-
B70
PETxP13
Tx Lane 13+
A70
GND
B71
PETxN13
Tx Lane 13-
A71
GND
B72
GND
A72
PERxP13
Rx Lane 13+
B73
GND
A73
PERxN13
Rx Lane 13-
B74
PETxP14
Tx Lane 14+
A74
GND
B75
PETxN14
Tx Lane 14-
A75
GND
B76
GND
A76
PERxP14
Rx Lane 14+
B77
REFCLK+
Clock pair 2
A77
PERxN14
Rx Lane 14-
B78
REFCLK-
Clock pair 2
A78
GND
B79
GND
A79
PERxP15
Rx Lane 15+
B80
PETxP15
Tx Lane 15+
A80
PERxN15
Rx Lane 15-
B81
PETxN15
Tx Lane 15-
A81
GND
B82
GND
A82
Riser ID
Revision 2.2
Fix to High: PCIe x16
79
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
PCI Express* Riser Card and Assembly
There is a standard PCI Express* Gen3 x16 slot on riser card for PCI-E* based add-in card. The
pin definition for the slot is as below.
Table 69. PCI Express* Slot Pin-out on Riser Card
Pin-Side B
82
80
PCI Spec Signal
RSVD
Pin-Side A
82
PCI Spec Signal
GND
81
PRSNT2#
81
HSIN15
80
GND
80
HSIP15
79
HSON15
79
GND
78
HSOP15
78
GND
77
GND
77
HSIN14
76
GND
76
HSIP14
75
HSON14
75
GND
74
HSOP14
74
GND
73
GND
73
HSIN13
72
GND
72
HSIP13
71
HSON13
71
GND
70
HSOP13
70
GND
69
GND
69
HSIN12
68
GND
68
HSIP12
67
HSON12
67
GND
66
HSOP12
66
GND
65
GND
65
HSIN11
64
GND
64
HSIP11
63
HSON11
63
GND
62
HSOP11
62
GND
61
GND
61
HSIN10
60
GND
60
HSIP10
59
HSON10
59
GND
58
HSOP10
58
GND
57
GND
57
HSIN9
56
GND
56
HSIP9
55
HSON9
55
GND
54
HSOP9
54
GND
53
GND
53
HSIN8
52
GND
52
HSIP8
51
HSON8
51
GND
50
HSOP8
50
RSVD
49
GND
49
GND
48
PRSNT2#
48
HSIN7
47
GND
47
HSIP7
46
HSON7
46
GND
45
HSOP7
45
GND
44
GND
44
HSIN6
43
GND
43
HSIP6
42
HSON6
42
GND
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Pin-Side B
41
PCI Spec Signal
HSOP6
PCI Express* Riser Card and Assembly
Pin-Side A
41
PCI Spec Signal
GND
40
GND
40
HSIN5
39
GND
39
HSIP5
38
HSON5
38
GND
37
HSOP5
37
GND
36
GND
36
HSIN4
35
GND
35
HSIP4
34
HSON4
34
GND
33
HSOP4
33
RSVD
32
GND
32
RSVD
31
PRSNT2#
31
GND
30
RSVD
30
HSIN3
29
GND
29
HSIP3
28
HSON3
28
GND
27
HSOP3
27
GND
26
GND
26
HSIN2
25
GND
25
HSIP2
24
HSON2
24
GND
23
HSOP2
23
GND
22
GND
22
HSIN1
21
GND
21
HSIP1
20
HSON1
20
GND
19
HSOP1
19
RSVD
18
GND
18
GND
17
PRSNT2#
17
HSIN0
16
GND
16
HSIP0
15
HSON0
15
GND
14
HSOP0
14
REFCLK-
13
GND
13
REFCLK+
12
RSVD
12
GND
KEY
KEY
KEY
KEY
11
WAKE#
11
PWRGD
10
3.3V AUX
10
3.3V
9
JTAG1
9
3.3V
8
3.3V
8
JTAG5
7
GND
7
JTAG4
6
SMDAT
6
JTAG3
5
SMCLK
5
JTAG2
4
GND
4
GND
3
RSVD
3
12V
2
12V
2
12V
1
12V
1
PRSNT1#
Revision 2.2
81
Intel order number: G39462-013
PCI Express* Riser Card and Assembly
9.2
9.2.1
Intel® Server System H2000JF FamilyTPS
PCI Express* Riser with IOM Carrier for Slot 2 (Optional)
Overview of PCI-E* Riser with IOM Carrier
The Riser with IOM carrier is provided as accessory to the server system. It is combined with
below functions:

Provide PCI Express* x8 Gen 3 signals from riser

Integrated 1GbE management port for Intel® Remote Management Module 4

Support PCI-E* x8 based Intel® IO Module
Riser slot 2 on baseboard provides standard PCI Express* x16 Gen3 signals, together with
specific power pins to support high-power double width Graphic add-in card.
Note: Riser Slot 2 on baseboard only supports Intel® 1U/2U Risers. It will cause damage to any
PCI-E* based add-in card, which is directly plugged into the Riser Slot 1.
The PCI-E* slot on Riser is x16 mechanically with x8 electrically. The IOM carrier is using PCIE* x8 card edge with PCI-E* x8 IO module slot.
Figure 45. PCI Express* Riser with Bracket for Riser Slot 2
Figure 46. IOM Carrier
82
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
PCI Express* Riser Card and Assembly
The 1GbE port is dedicated NIC port for RMM4 Lite module. It only works after the RMM4 Lite
module is installed in the system. The LED of dedicated NIC port is following the definition
below.
Table 70. Dedicated NIC Port LED Functionality
LED
Color
Green
Condition
On
Functionality
1Gbps mode
Dedicated NIC Speed
Amber
On
100Mbps mode
Off
10Mbps mode
Green
On
LAN link and no access
Green
Blink
LAN access
Off
Idle
Dedicated NIC
Activity
9.2.2
Pin-out Definition on Slot 2 Riser and IOM Carrier
Following is a list of pin definition for Slot 2 Riser and IOM Carrier.
Table 71. Riser Card Edge Pin-out
Pin
Pin Name
Description
Pin
Pin Name
Description
B1
12V
20W 3.3V generated on riser
A1
12V
20W 3.3V generated on riser
B2
12V
66W for double width add-in
card
A2
12V
66W for double width add-in
card
B3
12V
66W for double width add-in
card
A3
12V
66W for double width add-in
card
B4
12V
66W for double width add-in
card
A4
SMDATA
For rIOM temp sensor
B5
SMCLK
for rIOM temp sensor
A5
5VAUX
For DNM and IOM wake on
LAN
PRESENT#
DNM function present
B6
3.3V Aux
B7
GND
B8
TXD_0
B9
TXD_1
B10
For DNM and IOM wake on
LAN
A6
A7
RIOM_ACT#
RGMII txmit data
A8
RXD_3
RGMII receive data
RGMII txmit data
A9
RXD_2
RGMII receive data
TXD_2
RGMII txmit data
A10
RXD_1
RGMII receive data
B11
TXD_3
RGMII txmit data
A11
KEY
RXD_0
RGMII receive data
B12
GND
A12
RX_CTL
RGMII receive Cntrl
B13
TX_CLK
RGMII txmit Clock
A13
GND
B14
TX_CTL
RGMII txmit Cntrl
A14
RX_CLK
B15
MDIO
A15
MDC
B16
PERST#
A16
GND
B17
WAKE#
A17
REFCLK+
Clock pair 1
B18
PETxP0
Tx Lane 0+
A18
REFCLK-
Clock pair 1
B19
PETxN0
Tx Lane 0-
A19
GND
Revision 2.2
RGMII receive Clock
83
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
PCI Express* Riser Card and Assembly
Pin
Pin Name
Description
Pin
Pin Name
Description
B20
GND
A20
PERxP0
Rx Lane 0+
B21
GND
A21
PERxN0
Rx Lane 0-
B22
PETxP1
Tx Lane 1+
A22
GND
B23
PETxN1
Tx Lane 1-
A23
GND
B24
GND
A24
PERxP1
Rx Lane 1+
B25
GND
A25
PERxN1
Rx Lane 1-
B26
PETxP2
Tx Lane 2+
A26
GND
B27
PETxN2
Tx Lane 2-
A27
GND
B28
GND
A28
PERxP2
Rx Lane 2+
B29
GND
A29
PERxN2
Rx Lane 2-
B30
PETxP3
Tx Lane 3+
A30
GND
B31
PETxN3
Tx Lane 3-
A31
GND
B32
GND
A32
PERxP3
Rx Lane 3+
B33
GND
A33
PERxN3
Rx Lane 3-
B34
PETxP4
Tx Lane 4+
A34
GND
B35
PETxN4
Tx Lane 4-
A35
GND
B36
GND
A36
PERxP4
Rx Lane 4+
B37
GND
A37
PERxN4
Rx Lane 4-
B38
PETxP5
Tx Lane 5+
A38
GND
B39
PETxN5
Tx Lane 5-
A39
GND
B40
GND
A40
PERxP5
Rx Lane 5+
B41
GND
A41
PERxN5
Rx Lane 5-
B42
PETxP6
Tx Lane 6+
A42
GND
B43
PETxN6
Tx Lane 6-
A43
GND
B44
GND
A44
PERxP6
Rx Lane 6+
B45
GND
A45
PERxN6
Rx Lane 6-
B46
PETxP7
Tx Lane 7+
A46
GND
B47
PETxN7
Tx Lane 7-
A47
GND
B48
GND
A48
PERxP7
Rx Lane 7+
B49
GND
A49
PERxN7
Rx Lane 7-
B50
PETxP8
Tx Lane 8+
A50
GND
B51
PETxN8
Tx Lane 8-
A51
GND
B52
GND
A52
PERxP8
Rx Lane 8+
B53
GND
A53
PERxN8
Rx Lane 8-
B54
PETxP9
Tx Lane 9+
A54
GND
B55
PETxN9
Tx Lane 9-
A55
GND
B56
GND
A56
PERxP9
Rx Lane 9+
B57
GND
A57
PERxN9
Rx Lane 9-
B58
PETxP10
Tx Lane 10+
A58
GND
B59
PETxN10
Tx Lane 10-
A59
GND
B60
GND
A60
PERxP10
Rx Lane 10+
B61
GND
A61
PERxN10
Rx Lane 10-
84
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Description
PCI Express* Riser Card and Assembly
Pin
Pin Name
Pin
Pin Name
Description
B62
PETxP11
Tx Lane 11+
A62
GND
B63
PETxN11
Tx Lane 11-
A63
GND
B64
GND
A64
PERxP11
Rx Lane 11+
B65
GND
A65
PERxN11
Rx Lane 11-
B66
PETxP12
Tx Lane 12+
A66
GND
B67
PETxN12
Tx Lane 12-
A67
GND
B68
GND
A68
PERxP12
Rx Lane 12+
B69
GND
A69
PERxN12
Rx Lane 12-
B70
PETxP13
Tx Lane 13+
A70
GND
B71
PETxN13
Tx Lane 13-
A71
GND
B72
GND
A72
PERxP13
Rx Lane 13+
B73
GND
A73
PERxN13
Rx Lane 13-
B74
PETxP14
Tx Lane 14+
A74
GND
B75
PETxN14
Tx Lane 14-
A75
GND
B76
GND
A76
PERxP14
Rx Lane 14+
B77
REFCLK+
Clock pair 2
A77
PERxN14
Rx Lane 14-
B78
REFCLK-
Clock pair 2
A78
GND
B79
GND
A79
PERxP15
Rx Lane 15+
B80
PETxP15
Tx Lane 15+
A80
PERxN15
Rx Lane 15-
B81
PETxN15
Tx Lane 15-
A81
GND
B82
GND
A82
Riser ID
Fix to Low: PCIe 2x8
Table 72 PCI Express* Slot Pin-out on Riser Card
Pin-Side B
82
PCI Spec Signal
RSVD
Pin-Side A
82
PCI Spec Signal
GND
81
PRSNT2#
81
HSIN15
80
GND
80
HSIP15
79
HSON15
79
GND
78
HSOP15
78
GND
77
GND
77
HSIN14
76
GND
76
HSIP14
75
HSON14
75
GND
74
HSOP14
74
GND
73
GND
73
HSIN13
72
GND
72
HSIP13
71
HSON13
71
GND
70
HSOP13
70
GND
69
GND
69
HSIN12
68
GND
68
HSIP12
67
HSON12
67
GND
66
HSOP12
66
GND
65
GND
65
HSIN11
64
GND
64
HSIP11
Revision 2.2
85
Intel order number: G39462-013
Intel® Server System H2000JF FamilyTPS
PCI Express* Riser Card and Assembly
Pin-Side B
63
86
PCI Spec Signal
HSON11
Pin-Side A
63
GND
PCI Spec Signal
62
HSOP11
62
GND
61
GND
61
HSIN10
60
GND
60
HSIP10
59
HSON10
59
GND
58
HSOP10
58
GND
57
GND
57
HSIN9
56
GND
56
HSIP9
55
HSON9
55
GND
54
HSOP9
54
GND
53
GND
53
HSIN8
52
GND
52
HSIP8
51
HSON8
51
GND
50
HSOP8
50
RSVD
49
GND
49
GND
48
PRSNT2#
48
HSIN7
47
GND
47
HSIP7
46
HSON7
46
GND
45
HSOP7
45
GND
44
GND
44
HSIN6
43
GND
43
HSIP6
42
HSON6
42
GND
41
HSOP6
41
GND
40
GND
40
HSIN5
39
GND
39
HSIP5
38
HSON5
38
GND
37
HSOP5
37
GND
36
GND
36
HSIN4
35
GND
35
HSIP4
34
HSON4
34
GND
33
HSOP4
33
RSVD
32
GND
32
RSVD
31
PRSNT2#
31
GND
30
RSVD
30
HSIN3
29
GND
29
HSIP3
28
HSON3
28
GND
27
HSOP3
27
GND
26
GND
26
HSIN2
25
GND
25
HSIP2
24
HSON2
24
GND
23
HSOP2
23
GND
22
GND
22
HSIN1
21
GND
21
HSIP1
20
HSON1
20
GND
19
HSOP1
19
RSVD
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Pin-Side B
18
PCI Spec Signal
GND
PCI Express* Riser Card and Assembly
Pin-Side A
18
PCI Spec Signal
GND
17
PRSNT2#
17
HSIN0
16
GND
16
HSIP0
15
HSON0
15
GND
14
HSOP0
14
REFCLK-
13
GND
13
REFCLK+
12
RSVD
12
GND
KEY
KEY
KEY
KEY
11
WAKE#
11
PWRGD
10
3.3V AUX
10
3.3V
9
JTAG1
9
3.3V
8
3.3V
8
JTAG5
7
GND
7
JTAG4
6
SMDAT
6
JTAG3
5
SMCLK
5
JTAG2
4
GND
4
GND
3
RSVD
3
12V
2
12V
2
12V
1
12V
1
PRSNT1#
Table 73. IO Module Slot on Carrier
Pin
Signal
Signal
Pin
1
3.3V
12V
2
3
3.3V
12V
4
5
3.3V
12V
6
7
3.3V
12V
8
9
RSVD
FRU/TEMP ADDR [I]
10
11
GND
5VSB
12
13
RSVD+
FM_IO_MODULE_EN
14
15
RSVD-
3.3VSTBY
16
17
GND
LED_GLOBAL ACT#
18
19
RSVD
FM_IOM_PRESENT_N
20
21
RSVD
WAKE#
22
23
GND
PERST#
24
25
SMB CLK
GND
26
27
SMB DAT
rIOM REFCLK+ [0]
28
29
GND
rIOM REFCLK- [0]
30
31
PCIe Gen3 Tn [7]]
GND
32
33
PCIe Gen3 Tp [7]
PCIe Gen3 Rn [7]
34
Revision 2.2
87
Intel order number: G39462-013
PCI Express* Riser Card and Assembly
88
Intel® Server System H2000JF FamilyTPS
Pin
Signal
Signal
Pin
35
GND
PCIe Gen3 Rp [7]
36
37
PCIe Gen3 Tn [6]
GND
38
39
PCIe Gen3 Tp [6]
PCIe Gen3 Rn [6]
40
41
GND
PCIe Gen3 Rp [6]
42
43
PCIe Gen3 Tn [5]
GND
44
45
PCIe Gen3 Tp [5]
PCIe Gen3 Rn [5]
46
47
GND
PCIe Gen3 Rp [5]
48
49
PCIe Gen3 Tn [4]
GND
50
51
PCIe Gen3 Tp [4]
PCIe Gen3 Rn [4]
52
53
GND
PCIe Gen3 Rp [4]
54
55
PCIe Gen3 Tn [3]
GND
56
57
PCIe Gen3 Tp [3]
PCIe Gen3 Rn [3]
58
59
GND
PCIe Gen3 Rp [3]
60
61
PCIe Gen3 Tn [2]
GND
62
63
PCIe Gen3 Tp [2]
PCIe Gen3 Rn [2]
64
65
GND
PCIe Gen3 Rp [2]
66
67
PCIe Gen3 Tn [1]
GND
68
69
PCIe Gen3 Tp [1]
PCIe Gen3 Rn [1]
70
71
GND
PCIe Gen3 Rp [1]
72
73
PCIe Gen3 Tn [0]
GND
74
75
PCIe Gen3 Tp [0]
PCIe Gen3 Rn [0]
76
77
GND
PCIe Gen3 Rp [0]
78
79
RSVD
GND
80
Intel order number: G39462-013
Revision 2.2
Appendix A: Integration and Usage Tips
Intel® Server System H2000JF Family TPS
Appendix A: Integration and Usage Tips
Before attempting to integrate and configure your system, you should reference this section,
which provides a list of useful information.

After the system is integrated with processors, memory, and peripheral devices, the
FRUSDR utility must be run to load the proper Sensor Data Record data to the
integrated Server Management subsystem. Failure to run this utility may prevent Server
Management from accurately monitoring system health and may affect system
performance. The FRUSDR utility for this server system can either be run from the Intel®
Deployment CDROM that came with your system, or can be downloaded from the Intel
website referenced at the bottom of this page.

To ensure the highest system reliability, make sure the latest system software is loaded
on the server before deploying the system onto a live networking environment. This
includes system BIOS, FRUSDR, BMC firmware, and hot-swap controller firmware. The
system software can be updated using the Intel® Deployment CDROM that came with
your system or can be downloaded from the Intel website referenced at the bottom of
this page.

System fans are not hot-swappable.

Only supported memory validated by Intel should be used in this server system. A list of
supported memory can be found in the Intel® Server Board S2600JF Tested Memory List
which can be downloaded from the Intel website referenced at the bottom of this page.

This system supports the Intel® Xeon® processor E5-2600 and E5-2600V2 sequence.
You cannot use Intel® Xeon® processors not referenced on the supported processor list
in this server system.

You must use the CPU/memory air duct to maintain system thermals.

To maintain system thermals, you must populate all hard drive bays with either a hard
drive or drive blank.

You must remove AC power from the system prior to opening the chassis for service
You can download the latest system documentation, drivers, and system software from the
Intel® Support website at http://www.intel.com/p/en_US/support/highlights/server/ss-h2000jf.
Revision 2.2
89
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Appendix B: POST Code LED Decoder
Appendix B: POST Code LED Decoder
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS displays the POST code to the POST Code Diagnostic LEDs on the
back edge of the server board. To assist in troubleshooting a system hang during the POST
process, you can use the diagnostic LEDs to identify the last POST process executed.
Figure 47. Diagnostic LED Location
Table 74. POST Code Diagnostic LED Location
90
A
ID LED
B
Status LED
C
Diagnostic LED #7 MSB
G
Diagnostic LED #3
D
Diagnostic LED #6
H
Diagnostic LED #2
E
Diagnostic LED #5
I
Diagnostic LED #1
F
Diagnostic LED #4
J
Diagnostic LED #0 LSB
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix B: POST Code LED Decoder
Each POST code is represented by the eight amber diagnostic LEDs. The POST codes are
divided into two nibbles, an upper nibble and a lower nibble. The upper nibble bits are
represented by diagnostic LEDs #4, #5, #6, and #7. The lower nibble bits are represented by
diagnostics LEDs #0, #1, #2, and #3. If the bit is set in the upper and lower nibbles, the
corresponding LED is lit. If the bit is clear, the corresponding LED is off.
The diagnostic LED #7 is labeled as “MSB” (Most Significant Bit), and the diagnostic LED #0 is
labeled as “LSB” (Least Significant Bit).
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The
LEDs are decoded as follows.
Table 75. POST Progress Code LED Example
Upper Nibble LEDs
LEDs
Status
Results
MSB
LED #7
8h
ON
1
LED #6
4h
OFF
0
LED #5
2h
ON
1
Lower Nibble LEDs
LED #4
1h
OFF
0
LED #3
8h
ON
1
LED #2
4h
ON
1
LED #1
2h
OFF
0
LSB
LED #0
1h
OFF
0
Ah
Ch
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh.
Table 76. Diagnostic LED POST Code Decoder
Progress Code
Description
SEC Phase
0x01
First POST code after CPU reset
0x02
Microcode load begin
0x03
CRAM initialization begin
0x04
Pei Cache When Disabled
0x05
SEC Core At Power On Begin
0x06
Early CPU initialization during Sec
Phase
0x07
Early SB initialization during Sec Phase
0x08
Early NB initialization during Sec Phase
0x09
End Of Sec Phase
0x0E
Microcode Not Found
0x0F
Microcode Not Loaded
PEI Phase
0x10
PEI Core
0x11
CPU PEIM
Revision 2.2
91
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Appendix B: POST Code LED Decoder
Progress Code
Description
0x15
NB PEIM
0x19
SB PEIM
MRC Progress Codes
At this point the MRC Progress Code sequence is executed
0x31
Memory Installed
0x32
CPU PEIM (CPU Init)
0x33
CPU PEIM (Cache Init)
0x34
CPU PEIM (BSP Select)
0x35
CPU PEIM (AP Init)
0x36
CPU PEIM (CPU SMM Init)
0x4F
Dxe IPL started
DXE Phase
92
0x60
DXE Core started
0x61
DXE NVRAM Init
0x62
SB RUN Init
0x63
DXE CPU Init
0x68
DXE PCI Host Bridge Init
0x69
DXE NB Init
0x6A
DXE NB SMM Init
0x70
DXE SB Init
0x71
DXE SB SMM Init
0x72
DXE SB devices Init
0x78
DXE ACPI Init
0x79
DXE CSM Init
0x90
DXE BDS Started
0x91
DXE BDS connect drivers
0x92
DXE PCI Bus begin
0x93
DXE PCI Bus HPC Init
0x94
DXE PCI Bus enumeration
0x95
DXE PCI Bus resource requested
0x96
DXE PCI Bus assign resource
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix B: POST Code LED Decoder
Progress Code
Description
0x97
DXE CON_OUT connect
0x98
DXE CON_IN connect
0x99
DXE SIO Init
0x9A
DXE USB start
0x9B
DXE USB reset
0x9C
DXE USB detect
0x9D
DXE USB enable
0xA1
DXE IDE begin
0xA2
DXE IDE reset
0xA3
DXE IDE detect
0xA4
DXE IDE enable
0xA5
DXE SCSI begin
0xA6
DXE SCSI reset
0xA7
DXE SCSI detect
0xA8
DXE SCSI enable
0xA9
DXE verifying SETUP password
0xAB
DXE SETUP start
0xAC
DXE SETUP input wait
0xAD
DXE Ready to Boot
0xAE
DXE Legacy Boot
0xAF
DXE Exit Boot Services
0xB0
RT Set Virtual Address Map Begin
0xB1
RT Set Virtual Address Map End
0xB2
DXE Legacy Option ROM init
0xB3
DXE Reset system
0xB4
DXE USB Hot plug
0xB5
DXE PCI BUS Hot plug
0xB6
DXE NVRAM cleanup
0xB7
DXE Configuration Reset
0x00
INT19
Revision 2.2
93
Intel order number: G39462-013
Intel® Server System H2000JF Family TPS
Appendix B: POST Code LED Decoder
Progress Code
Description
S3 Resume
0xE0
S3 Resume PEIM (S3 started)
0xE1
S3 Resume PEIM (S3 boot script)
0xE2
S3 Resume PEIM (S3 Video Repost)
0xE3
S3 Resume PEIM (S3 OS wake)
BIOS Recovery
94
0xF0
PEIM which detected forced Recovery
condition
0xF1
PEIM which detected User Recovery
condition
0xF2
Recovery PEIM (Recovery started)
0xF3
Recovery PEIM (Capsule found)
0xF4
Recovery PEIM (Capsule loaded)
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
Appendix C: Video POST Code Errors
Whenever possible, the BIOS outputs the current boot progress codes on the video screen.
Progress codes are 32-bit quantities plus optional data. The 32-bit numbers include class,
subclass, and operation information. The class and subclass fields point to the type of hardware
being initialized. The operation field represents the specific initialization activity. Based on the
data bit availability to display progress codes, a progress code can be customized to fit the data
width. The higher the data bit, the higher the granularity of information that can be sent on the
progress port. The progress codes may be reported by the system BIOS or option ROMs.
The Response section in the following table indicates one of these actions:
Minor: The message is displayed on the screen or on the Error Manager screen, and an
error is logged to the SEL. The system continues booting in a degraded state. The user
may want to replace the erroneous unit. The POST Error Pause option setting in the
BIOS setup does not have any effect on this error.
Major: The message is displayed on the Error Manager screen, and an error is logged to
the SEL. The POST Error Pause option setting in the BIOS setup determines whether
the system pauses to the Error Manager for this type of error so the user can take
immediate corrective action or the system continues booting.
Note that for 0048 “Password check failed”, the system halts, and then after the next
reset/reboot will displays the error code on the Error Manager screen.
Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal
error found. System will not boot until the error is resolved” and “Press <F2> to
enter setup” The POST Error Pause option setting in the BIOS setup does not have
any effect with this class of error.
When the operator presses the F2 key on the keyboard, the error message is displayed
on the Error Manager screen, and an error is logged to the SEL with the error code. The
system cannot boot unless the error is resolved. The user needs to replace the faulty
part and restart the system.
Again, note that these Error Codes and the messages that go with them must be coordinated
with the master list maintained by the Server Management Utilities team.
Be aware that the POST Error Code list shown in this table may contain error codes which do
not necessarily apply uniformly to every platform. Only a subset of these error codes will be
applicable to any given server board.
Table 77. POST Error Message and Message
Error Code
0012
System RTC date/time not set
Response
Major
0048
Password check failed
Major
113
Fixed media not detected
Major
0140
PCI component encountered a PERR error
Major
0141
PCI resource conflict
Major
0146
PCI out of resources error
Major
Revision 2.2
Error Message
Intel order number: G39462-013
95
Appendix C: Video POST Code Errors
Intel® Server System H2000JF Family TPS
Error Code
0191
Error Message
Processor core/thread count mismatch detected
Response
Fatal
0192
Processor cache size mismatch detected
Fatal
0194
Processor family mismatch detected
Fatal
0195
Processor Intel(R) QPI link frequencies unable to synchronize
Fatal
0196
Processor model mismatch detected
Fatal
0197
Processor frequencies unable to synchronize
Fatal
5220
BIOS Settings reset to default settings
Major
5221
Passwords cleared by jumper
Major
5224
Password clear jumper is Set
Major
8130
Processor 01 disabled
Major
8131
Processor 02 disabled
Major
8132
Processor 03 disabled
Major
8133
Processor 04 disabled
Major
8160
Processor 01 unable to apply microcode update
Major
8161
Processor 02 unable to apply microcode update
Major
8162
Processor 03 unable to apply microcode update
Major
8163
Processor 04 unable to apply microcode update
Major
8170
Processor 01 failed Self Test (BIST)
Major
8171
Processor 02 failed Self Test (BIST)
Major
8172
Processor 03 failed Self Test (BIST)
Major
8173
Processor 04 failed Self Test (BIST)
Major
8180
Processor 01 microcode update not found
Minor
8181
Processor 02 microcode update not found
Minor
8182
Processor 03 microcode update not found
Minor
8183
Processor 04 microcode update not found
Minor
8190
Watchdog timer failed on last boot
Major
8198
OS boot watchdog timer failure
Major
8300
Baseboard management controller failed self test
Major
8305
Hot Swap Controller failure
Major
83A0
Management Engine (ME) failed self test
Major
83A1
Management Engine (ME) Failed to respond.
Major
84F2
Baseboard management controller failed to respond
Major
84F3
Baseboard management controller in update mode
Major
84F4
Sensor data record empty
Major
84FF
System event log full
Minor
8500
Memory component could not be configured in the selected RAS mode
Major
8501
DIMM Population Error
Major
8520
DIMM_A1 failed test/initialization
Major
8521
DIMM_A2 failed test/initialization
Major
8522
DIMM_A3 failed test/initialization
Major
8523
DIMM_B1 failed test/initialization
Major
8524
DIMM_B2 failed test/initialization
Major
8525
DIMM_B3 failed test/initialization
Major
8526
DIMM_C1 failed test/initialization
Major
8527
DIMM_C2 failed test/initialization
Major
96
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
Error Code
8528
DIMM_C3 failed test/initialization
Response
Major
8529
DIMM_D1 failed test/initialization
Major
852A
DIMM_D2 failed test/initialization
Major
852B
DIMM_D3 failed test/initialization
Major
852C
DIMM_E1 failed test/initialization
Major
852D
DIMM_E2 failed test/initialization
Major
852E
DIMM_E3 failed test/initialization
Major
852F
DIMM_F1 failed test/initialization
Major
8530
DIMM_F2 failed test/initialization
Major
8531
DIMM_F3 failed test/initialization
Major
8532
DIMM_G1 failed test/initialization
Major
8533
DIMM_G2 failed test/initialization
Major
8534
DIMM_G3 failed test/initialization
Major
8535
DIMM_H1 failed test/initialization
Major
8536
DIMM_H2 failed test/initialization
Major
8537
DIMM_H3 failed test/initialization
Major
8538
DIMM_J1 failed test/initialization
Major
8539
DIMM_J2 failed test/initialization
Major
853A
DIMM_J3 failed test/initialization
Major
853B
DIMM_K1 failed test/initialization
Major
853C
DIMM_K2 failed test/initialization
Major
853D
DIMM_K3 failed test/initialization
Major
853E
DIMM_L1 failed test/initialization
Major
853F
(Go to
85C0)
DIMM_L2 failed test/initialization
Major
8540
DIMM_A1 disabled
Major
8541
DIMM_A2 disabled
Major
8542
DIMM_A3 disabled
Major
8543
DIMM_B1 disabled
Major
8544
DIMM_B2 disabled
Major
8545
DIMM_B3 disabled
Major
8546
DIMM_C1 disabled
Major
8547
DIMM_C2 disabled
Major
8548
DIMM_C3 disabled
Major
8549
DIMM_D1 disabled
Major
854A
DIMM_D2 disabled
Major
854B
DIMM_D3 disabled
Major
854C
DIMM_E1 disabled
Major
854D
DIMM_E2 disabled
Major
854E
DIMM_E3 disabled
Major
854F
DIMM_F1 disabled
Major
8550
DIMM_F2 disabled
Major
8551
DIMM_F3 disabled
Major
8552
DIMM_G1 disabled
Major
Revision 2.2
Error Message
Intel order number: G39462-013
97
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
Error Code
8553
DIMM_G2 disabled
Response
Major
8554
DIMM_G3 disabled
Major
8555
DIMM_H1 disabled
Major
8556
DIMM_H2 disabled
Major
8557
DIMM_H3 disabled
Major
8558
DIMM_J1 disabled
Major
8559
DIMM_J2 disabled
Major
855A
DIMM_J3 disabled
Major
855B
DIMM_K1 disabled
Major
855C
DIMM_K2 disabled
Major
855D
DIMM_K3 disabled
Major
855E
DIMM_L1 disabled
Major
855F
(Go to
85D0)
DIMM_L2 disabled
Major
8560
DIMM_A1 encountered a Serial Presence Detection (SPD) failure
Major
8561
DIMM_A2 encountered a Serial Presence Detection (SPD) failure
Major
8562
DIMM_A3 encountered a Serial Presence Detection (SPD) failure
Major
8563
DIMM_B1 encountered a Serial Presence Detection (SPD) failure
Major
8564
DIMM_B2 encountered a Serial Presence Detection (SPD) failure
Major
8565
DIMM_B3 encountered a Serial Presence Detection (SPD) failure
Major
8566
DIMM_C1 encountered a Serial Presence Detection (SPD) failure
Major
8567
DIMM_C2 encountered a Serial Presence Detection (SPD) failure
Major
8568
DIMM_C3 encountered a Serial Presence Detection (SPD) failure
Major
8569
DIMM_D1 encountered a Serial Presence Detection (SPD) failure
Major
856A
DIMM_D2 encountered a Serial Presence Detection (SPD) failure
Major
856B
DIMM_D3 encountered a Serial Presence Detection (SPD) failure
Major
856C
DIMM_E1 encountered a Serial Presence Detection (SPD) failure
Major
856D
DIMM_E2 encountered a Serial Presence Detection (SPD) failure
Major
856E
DIMM_E3 encountered a Serial Presence Detection (SPD) failure
Major
856F
DIMM_F1 encountered a Serial Presence Detection (SPD) failure
Major
8570
DIMM_F2 encountered a Serial Presence Detection (SPD) failure
Major
8571
DIMM_F3 encountered a Serial Presence Detection (SPD) failure
Major
8572
DIMM_G1 encountered a Serial Presence Detection (SPD) failure
Major
8573
DIMM_G2 encountered a Serial Presence Detection (SPD) failure
Major
8574
DIMM_G3 encountered a Serial Presence Detection (SPD) failure
Major
8575
DIMM_H1 encountered a Serial Presence Detection (SPD) failure
Major
8576
DIMM_H2 encountered a Serial Presence Detection (SPD) failure
Major
8577
DIMM_H3 encountered a Serial Presence Detection (SPD) failure
Major
8578
DIMM_J1 encountered a Serial Presence Detection (SPD) failure
Major
8579
DIMM_J2 encountered a Serial Presence Detection (SPD) failure
Major
857A
DIMM_J3 encountered a Serial Presence Detection (SPD) failure
Major
857B
DIMM_K1 encountered a Serial Presence Detection (SPD) failure
Major
857C
DIMM_K2 encountered a Serial Presence Detection (SPD) failure
Major
857D
DIMM_K3 encountered a Serial Presence Detection (SPD) failure
Major
98
Error Message
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
Error Code
857E
Error Message
DIMM_L1 encountered a Serial Presence Detection (SPD) failure
Response
Major
857F
(Go to
85E0)
DIMM_L2 encountered a Serial Presence Detection (SPD) failure
Major
85C0
DIMM_L3 failed test/initialization
Major
85C1
DIMM_M1 failed test/initialization
Major
85C2
DIMM_M2 failed test/initialization
Major
85C3
DIMM_M3 failed test/initialization
Major
85C4
DIMM_N1 failed test/initialization
Major
85C5
DIMM_N2 failed test/initialization
Major
85C6
DIMM_N3 failed test/initialization
Major
85C7
DIMM_P1 failed test/initialization
Major
85C8
DIMM_P2 failed test/initialization
Major
85C9
DIMM_P3 failed test/initialization
Major
85CA
DIMM_R1 failed test/initialization
Major
85CB
DIMM_R2 failed test/initialization
Major
85CC
DIMM_R3 failed test/initialization
Major
85CD
DIMM_T1 failed test/initialization
Major
85CE
DIMM_T2 failed test/initialization
Major
85CF
DIMM_T3 failed test/initialization
Major
85D0
DIMM_L3 disabled
Major
85D1
DIMM_M1 disabled
Major
85D2
DIMM_M2 disabled
Major
85D3
DIMM_M3 disabled
Major
85D4
DIMM_N1 disabled
Major
85D5
DIMM_N2 disabled
Major
85D6
DIMM_N3 disabled
Major
85D7
DIMM_P1 disabled
Major
85D8
DIMM_P2 disabled
Major
85D9
DIMM_P3 disabled
Major
85DA
DIMM_R1 disabled
Major
85DB
DIMM_R2 disabled
Major
85DC
DIMM_R3 disabled
Major
85DD
DIMM_T1 disabled
Major
85DE
DIMM_T2 disabled
Major
85DF
DIMM_T3 disabled
Major
85E0
DIMM_L3 encountered a Serial Presence Detection (SPD) failure
Major
85E1
DIMM_M1 encountered a Serial Presence Detection (SPD) failure
Major
85E2
DIMM_M2 encountered a Serial Presence Detection (SPD) failure
Major
85E3
DIMM_M3 encountered a Serial Presence Detection (SPD) failure
Major
85E4
DIMM_N1 encountered a Serial Presence Detection (SPD) failure
Major
85E5
DIMM_N2 encountered a Serial Presence Detection (SPD) failure
Major
85E6
DIMM_N3 encountered a Serial Presence Detection (SPD) failure
Major
85E7
DIMM_P1 encountered a Serial Presence Detection (SPD) failure
Major
85E8
DIMM_P2 encountered a Serial Presence Detection (SPD) failure
Major
Revision 2.2
Intel order number: G39462-013
99
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
Error Code
85E9
Error Message
DIMM_P3 encountered a Serial Presence Detection (SPD) failure
Response
Major
85EA
DIMM_R1 encountered a Serial Presence Detection (SPD) failure
Major
85EB
DIMM_R2 encountered a Serial Presence Detection (SPD) failure
Major
85EC
DIMM_R3 encountered a Serial Presence Detection (SPD) failure
Major
85ED
DIMM_T1 encountered a Serial Presence Detection (SPD) failure
Major
85EE
DIMM_T2 encountered a Serial Presence Detection (SPD) failure
Major
85EF
DIMM_T3 encountered a Serial Presence Detection (SPD) failure
Major
8604
POST Reclaim of non-critical NVRAM variables
Minor
8605
BIOS Settings are corrupted
Major
8606
NVRAM variable space was corrupted and has been reinitialized
Major
92A3
Serial port component was not detected
Major
92A9
Serial port component encountered a resource conflict error
Major
9505
ATA/ATAPI interface error
Major
A000
TPM device not detected.
Minor
A001
TPM device missing or not responding.
Minor
A002
TPM device failure.
Minor
A003
TPM device failed self test.
Minor
A100
BIOS ACM Error
Major
A421
PCI component encountered a SERR error
Fatal
A5A0
PCI Express component encountered a PERR error
Minor
A5A1
PCI Express component encountered an SERR error
Fatal
A6A0
DXE Boot Services driver: Not enough memory available to shadow a Legacy
Option ROM.
Minor
POST Error Beep Codes
The following table lists POST error beep codes. Prior to system video initialization, the BIOS
uses these beep codes to inform users on error conditions. The beep code is followed by a
user-visible code on POST Progress LEDs.
Table 78. POST Error Beep Codes
Beeps
Error Message
USB device action
POST Progress Code
N/A
Description
Short beep sounded whenever USB device is discovered in
POST, or inserted or removed during runtime.
1 long
Intel® TXT security
violation
0xAE, 0xAF
System halted because Intel® Trusted Execution
Technology detected a potential violation of system
security.
3
Memory error
Multiple
System halted because a fatal error related to the memory
was detected.
1
The following Beep Codes are sounded during BIOS Recovery.
2
Recovery started
N/A
Recovery boot has been initiated.
4
Recovery failed
N/A
Recovery has failed. This typically happens so quickly after
recovery is initiated that it sounds like a 2-4 beep code.
100
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Appendix C: Video POST Code Errors
The following Beep Codes are from the BMC. They are listed here for convenience.
1-5-2-1
CPU socket
population error
N/A
CPU1 socket is empty, or sockets are populated incorrectly
– CPU1 must be populated before CPU2.
1-5-2-4
MSID Mismatch
N/A
MSID mismatch occurs if a processor is installed into a
system board that has incompatible power capabilities.
1-5-4-2
Power fault
N/A
DC power unexpectedly lost (power good dropout) – Power
unit sensors report power unit failure offset.
1-5-4-4
Power control fault
N/A
Power good assertion timeout – Power unit sensors report
soft power control failure offset.
1-5-1-2
VR Watchdog
Timer
N/A
VR controller DC power on sequence not completed in
time.
1-5-1-4
Power Supply
Status
N/A
The system does not power on or unexpectedly powers off
and a Power Supply Unit (PSU) is present that is an
incompatible model with one or more other PSUs in the
system.
USB Device Beeps When POST
Intel® Server Boards of the S2600JF family are designed to indicate USB readiness by a series
of beep codes early during POST, just before video becomes available. These four to five
beeps mean that the USB is powered and initialized, in order for USB devices such as keyboard
and mouse to become operational.
If a USB device such as a pen drive or USB CD/DVD ROM drive is attached to any external
USB port, a beep code means that the device is recognized, powered and initialized. Each USB
port will issue a beep after an external device is ready for use.
These beep codes do not signal any errors. They are designed to advise the user of USB
readiness during POST and while attaching external devices.
This USB Beep is OS independent.
Revision 2.2
Intel order number: G39462-013
101
Intel® Server System H2000JF Family TPS
Glossary
Glossary
Term
ACPI
Advanced Configuration and Power Interface
AP
Application Processor
APIC
Advanced Programmable Interrupt Control
ASIC
Application Specific Integrated Circuit
ASMI
Advanced Server Management Interface
BIOS
Basic Input/Output System
BIST
Built-In Self Test
BMC
Baseboard Management Controller
Bridge
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP
Bootstrap Processor
Byte
8-bit quantity.
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.)
CEK
Common Enabling Kit
CHAP
Challenge Handshake Authentication Protocol
CMOS
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board
DPC
Direct Platform Control
EEPROM
Electrically Erasable Programmable Read-Only Memory
EHCI
Enhanced Host Controller Interface
EMP
Emergency Management Port
EPS
External Product Specification
ESB2-E
Enterprise South Bridge 2
FBD
Fully Buffered DIMM
FMB
Flexible Mother Board
FRB
Fault Resilient Booting
FRU
Field Replaceable Unit
FSB
Front Side Bus
GB
1024MB
GPIO
General Purpose I/O
GTL
Gunning Transceiver Logic
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2 C
Inter-Integrated Circuit Bus
IA
Intel® Architecture
IBF
Input Buffer
ICH
I/O Controller Hub
ICMB
Intelligent Chassis Management Bus
IERR
Internal Error
IFB
I/O and Firmware Bridge
INTR
Interrupt
102
Definition
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Term
Glossary
Definition
IP
Internet Protocol
IPMB
Intelligent Platform Management Bus
IPMI
Intelligent Platform Management Interface
IR
Infrared
ITP
In-Target Probe
KB
1024 bytes
KCS
Keyboard Controller Style
LAN
Local Area Network
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LPC
Low Pin Count
LUN
Logical Unit Number
MAC
Media Access Control
MB
1024KB
MCH
Memory Controller Hub
MD2
Message Digest 2 – Hashing Algorithm
MD5
Message Digest 5 – Hashing Algorithm – Higher Security
ms
milliseconds
MTTR
Memory Type Range Register
Mux
Multiplexor
NIC
Network Interface Controller
NMI
Nonmaskable Interrupt
OBF
Output Buffer
OEM
Original Equipment Manufacturer
Ohm
Unit of electrical resistance
PEF
Platform Event Filtering
PEP
Platform Event Paging
PIA
Platform Information Area (This feature configures the firmware for the platform hardware.)
PLD
Programmable Logic Device
PMI
Platform Management Interrupt
POST
Power-On Self Test
PSMI
Power Supply Management Interface
PWM
Pulse-Width Modulation
RAM
Random Access Memory
RASUM
Reliability, Availability, Serviceability, Usability, and Manageability
RISC
Reduced Instruction Set Computing
RMM3
Remote Management Module – 3rd generation
RMM3 NIC
Remote Management Module – 3rd generation dedicated management NIC
ROM
Read Only Memory
RTC
Real-Time Clock (Component of ICH peripheral chip on the server board.)
SDR
Sensor Data Record
SECC
Single Edge Connector Cartridge
SEEPROM
Serial Electrically Erasable Programmable Read-Only Memory
Revision 2.2
Intel order number: G39462-013
103
Intel® Server System H2000JF Family TPS
Glossary
Term
Definition
SEL
System Event Log
SIO
Server Input/Output
SMI
Server Management Interrupt (SMI is the highest priority nonmaskable interrupt.)
SMM
Server Management Mode
SMS
Server Management Software
SNMP
Simple Network Management Protocol
SSI
Server System Infrastructure
TBD
To Be Determined
TIM
Thermal Interface Material
UART
Universal Asynchronous Receiver/Transmitter
UDP
User Datagram Protocol
UHCI
Universal Host Controller Interface
UTC
Universal time coordinate
VID
Voltage Identification
VRD
Voltage Regulator Down
Word
16-bit quantity
ZIF
Zero Insertion Force
104
Intel order number: G39462-013
Revision 2.2
Intel® Server System H2000JF Family TPS
Reference Documents
Reference Documents
Refer to the following documents for additional information:

Intel® Server Board S2600JF Technical Product Specification (Intel Order Code:
G31608)

ACPI 3.0: http://www.acpi.info/spec.htm

IPMI 2.0

Data Center Management Interface Specification v1.0, May 1, 2008:
www.intel.com/go/dcmi

PCI Bus Power Management Interface Specification 1.1: http://www.pcisig.com/

PCI Express* Base Specification Rev 2.0 Dec 06: http://www.pcisig.com/

PCI Express* Card Electromechanical Specification Rev 2.0: http://www.pcisig.com/

PMBus*: http://pmbus.org

SATA 2.6: http://www.sata-io.org/

SMBIOS 2.4

SSI-EEB 3.0: http://www.ssiforum.org

USB 1.1: http://www.usb.org

USB 2.0: http://www.usb.org

Windows* Logo/SDG 3.0

Intel® Dynamic Power Technology Node Manager 1.5 External Interface
Specification using IPMI, 2007. Intel Corporation.

Node Power and Thermal Management Architecture Specification v1.5, rev.0.79.
2007, Intel Corporation.

Intel® Server System Integrated Baseboard Management Controller Core External
Product Specification, 2007 Intel Corporation.

Intel® Thurley Server Platform Services IPMI Commands Specification, 2007. Intel
Corporation.

Intel® Server Safety and Regulatory, 2011. Intel Corporation. (Intel Order Code:
G23122)

Intelligent Platform Management Bus Communications Protocol Specification,
Version 1.0, 1998. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation,
Dell* Computer Corporation.

Platform Environmental Control Interface (PECI) Specification, Version 2.0. Intel
Corporation.

Platform Management FRU Information Storage Definition, Version 1.0, Revision 1.2,
2002. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation, Dell*
Computer Corporation: http://developer.intel.com/design/servers/ipmi/spec.htm.
Revision 2.2
Intel order number: G39462-013
105