Industrial Applications using EnerChip Solid State Batteries

Industrial Applications using
EnerChip Solid State Batteries
Presentation Overview
• The 10 Key Industrial Product Innovation
Drivers
• Examine examples of these trends and
enabling technologies
• Introduce new concepts for micro-power and
nano-power designs
• Show innovative powering and energy
storage techniques used in new industrial
equipment applications
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2
Key Innovation Drivers for
Successful Industrial Products
1. Ultra Low Power Electronics – MCUs, DSP, MEMs
2. Smart devices in everything
3. Sensors everywhere – data capture and retention
4. Wireless is pervasive
5. Miniaturization
6. Integration
7. High Reliability
8. Eco-Friendly – transportation, use and disposal
9. Renewable Energy Sources – rechargeable and EH
10. Reduce Cost – first cost and life cycle cost
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Semiconductors Using Low Power
Standby Current
Over 1µA
Hundreds of nA |
Driver 1: reducing microWatts to nanoWatts
2005
Q1-2009
2007
2009
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2011
4
Smart Devices in Everything
Driver 2: Intelligence in all industrial products
Industrial
Process
Monitoring
and
Control
Vision and
Precise
Motion
Control
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Wireless
Handheld
Scanners
and Input
Devices
Facility
Monitors
and
Controls
5
Sensors Everywhere
Driver 3: Gathering data from everything
Source: HP Semicon West 2010 MEMS Sensor Presentation
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Wireless is Pervasive
Driver 4: no cords for Data or Power
Displays
Lights
Awnings
Vehicles
Windows
Signals
Wireless
Network
Sensors
Toys
Phones
PCs
Clothing
Media
Players
Purses
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Miniaturization
Driver 5 : Everything is getting tiny
Tiny Solar Energy
Harvesting Sensor
Advanced Flexible
Microelectronics
Q1-2009
3-Axis Accelerometer from HP
– 1000X higher resolution
Integrated Wireless Industrial Sensors
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All Innovative New Industrial
Products Need Energy Storage
Ultra Low
Power
Smart
Devices
Integration
Embedded
Energy Storage
is an Absolute
Requirement
Miniaturization
Wireless
Is Pervasive
Sensors in
Everything
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What are the Requirements for
Micro Power Energy Storage?
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Q1-2009
High Energy Density
Small Footprint
Rechargeable
Permanent for life of product
Safe and Reliable
Eco-friendly throughout lifecycle
Package compatible with other ICs
Cost effective
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New Battery Innovation is Needed
• Legacy batteries and capacitors do not have the
characteristics required.
• A completely new type of energy storage device
is needed that eliminates pastes, binders,
additives and bulky packaging to reduce size
and improve electrochemical efficiency
• The solution is solid state rechargeable thin film
batteries that are component class, highly
rechargeable, low profile, constructed with
minimal raw materials and handled like an
integrated circuit device.
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EnerChip Solid State Battery
Device Construction
Permits System-on-Chip Integration and Surface Mount Packaging
Image Courtesy DOE-ORNL
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Ideal Energy Storage Attributes for
Integrated Applications
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Q1-2009
Flat discharge voltage profile
Fast Recharge Capability
Low self discharge (low leakage)
Maintain Capacity over Cycle life
Stable cell resistance
Rechargeable thousands of times
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SSBs Provide Ideal Storage
Attributes Over Other Options
Flat Output Voltage Profile
High Cycle Life
Capacity with Cycling
70
60
Capacity (µAh)
50
4.2V
4.15V
40
4.1V
4.3V
30
4.0V
20
10
0
0
100
200
300
400
500
600
700
800
900
1000
Discharge Cycle #
Low Self-Discharge
Fast and Simple Charge
Charge Current & Charge Capacity vs, Charge Time
Percent of Charge
3.5
3.0
80
2.5
60
2.0
1.5
40
1.0
20
0.5
0
10
20
30
40
50
60
0
15
14
Charge Loss %
4.0
100
0
Self-Discharge
4.5
Charge Current/ Battery Capacity
120
13
12
11
Non-Recoverable
10
9
8
7
6
Recoverable
5
4
3
2
1
0
1
Time (Minutes)
Q1-2009
2
3
4
5
Stand Time (Years)
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EnerChip SSB Assembly Process
SMT and Reflow Solder Tolerant
Wafer
Packaged Part
Bare Die
Diced
Packaged
SSB on Board
Final
Assembly
Q1-2009
To Reflow Solder
To Surface Mount
Machine
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Tape & Reel
15
Co-Package EnerChip Devices
Driver 6: Integration reduces size and cost
• Side by side with copackaged ICs
• System in Package
• All In One Packages
• Stacked Die with
microcontrollers, RTC,
or SRAM
EnerChip Bare Die
µController, Sensor, RTC
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Integrated Ultra Low Power
Management Requirements
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•
•
•
•
•
•
•
Q1-2009
Accept wide input voltage range
Ultra low power – active and quiescent
Manage battery charging and cutoff
Regulated output voltage
Mode control
Status indicators
Small ASIC bumpable bare die
Ideally a drop-in solution
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EnerChip CC with Integrated
Power Management
EnerChip CC Functional Diagram
Q1-2009
EnerChip CC 20 Pin DFN Package
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High Reliability
Driver 7: Life of Product Performance
EnerChip CC : The Superior Solution
Feature
EnerChip CC
SuperCap
Coin Cell
High-cycle life (>5000)
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!
No external charge circuit
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!
No sockets/holders
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!
SMT Assembly
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Low self discharge
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!
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Stable output voltage
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!
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Smaller area
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!
No hazardous chemicals
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!
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Power Fail Indicator
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!
Integrated DC-DC Converter
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!
!
Internal Supply Supervisor
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EnerChip SSBs are Eco-Friendly :
Driver 8: Transport, Use and Disposal
Completely safe to
transport via air
RoHS compliant
for US and EU
WEEE compliant
dispose like other
Integrated Circuits
REACH compliant
for EU
China RoHS
Compliant
Solid State Energy
devices contain no
toxic heavy metals
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CE mark does not
apply to these
devices
20
EnerChips for Energy Harvesting
Driver 9: Renewable Energy Sources
Cymbet EnerChip SSB and EnerChip EP Energy Processor
enables many Energy Harvesting applications :
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EnerChip Energy Harvesting
Wireless Sensor Examples
Univ. of Mich. Solar EH Micro Sensor
Nanomaterial-based Thermoelectric
Generator EH Sensor
Q1-2009
TI eZ430-RF2500-SEH Kit
Piezo MEMS EH Transducer using
Energy Processor
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EnerChips Drive Cost Reductions
Driver 10: Reduce Life Cycle Costs
Surface Mount
with Reflow Solder
and Mfg Testing
No hand
assembly in
Factory or by
Customer in
field
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Rechargeable
devices last the
life of the product
No expensive
service calls to
change batteries
in difficult places
23
EnerChip Rechargeable SSBs
Enable Powerful Solutions
Requirements
Embedded Power
EnerChip
Bare Die
•
•
•
•
•
•
Eco-Friendly Energy Storage
Permanent and Reliable
Low cost Automated Assembly
Low profile; Small Footprint
Embed at board or chip level
Low total cost
Energy
Harvesting
Data Devices
EnerChip CC
Co-Package
Back-up Power
EnerChip
SMT Package
Solid State
Energy
Storage
EnerChip CC
Co-Package
EnerChip Advantages
Pervasive Power
•
•
•
•
•
•
Q1-2009
EnerChip EH
Modules
EnerChip EH
Integrated
Solutions
Simple “drop in” Power
SMT/Reflow Tolerant
No special disposal needed
Rechargeable - No Replacement
Broad Customer Acceptance
Many applications, many industries
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Zero Power
Wireless Nodes
Energy Harvesting
Building Controls
24
Getting Started is Easy
Complete Applications, Evaluation & Design Info
Website
Application Notes
& Datasheets
EnerChip™ Samples
Product
Brochures
Evaluation Kits & Demo Boards
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Leverage Cymbet’s Capabilities
World’s leader in Solid State Battery Solutions
Intellectual
Property
• 66 Patents and
Patents Pending
• Hundreds of
Trade Secrets
• Global Brand
Portfolio
• Industry leading
expertise in
Energy Storage
Solutions
Q1-2009
Manufacturing
Capabilities
• 2 Fab Facilities
• New world-class
Mfg Partner
• Advanced
EnerChip Mfg
Tools
• Highest Mfg
capacity of any
SSB vendor with
room for
expansion
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Cymbet
Team
• Leading experts
in all key roles
• Experienced
Leadership
• Cymbet
Customer
Support System
• Premier Design
Partner Program
26
Cymbet Customer Support
Distribution
200 Sales Reps
Customer
Support
Strategic Investors
Q1-2009
Industry Awards
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Successful Industrial Product
Innovation Summary
• New Industrial Product Innovation Trends and Drivers
are demanding new energy storage and power
management solutions
• Solid state batteries co-packaged with ultra-low power
electronics is available today.
• These new energy storage solutions are eco-friendly and
very cost effective
• Single chip Energy Harvesting power conversion, energy
storage and power management are available now.
• For additional information go to www.cymbet.com and
register to win a free EnerChip Evaluation kit.
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