CYMBET CBC050-BDC-WP

EnerChip™ CBC050
Rechargeable Solid State Energy Storage: 50µAh, 3.8V
Features
•
•
•
•
•
•
All Solid State Construction
SMT Package and Process
Lead-Free Reflow Tolerant
Thousands of Recharge Cycles
Low Self-Discharge
Eco-Friendly, RoHS Compliant
Electrical Properties
Output voltage: Capacity (typical):
Charging source:
Recharge time to 80%:
Charge/Discharge cycles:
Physical Properties
Package size: Operating temperature:
Storage temperature:
8 mm x 8 mm
QFN SMT Package
3.8V
50µAh
4.00V to 4.15V
20 minutes
>5000 to 10% DOD
8 mm x 8 mm
-20°C to 70°C
-40°C to 125°C
Applications
• Standby supply for non-volatile SRAM, real-time
clocks, controllers, supply supervisors, and other
system-critical components.
• Wireless sensors and RFID tags and other
powered, low duty cycle applications.
• Localized power source to keep microcontrollers
and other devices alert in standby mode.
• Power bridging to provide backup power to
system during exchange of main batteries.
• Energy Harvesting by coupling the EnerChip
with energy transducers such as solar panels.
• Embedded Energy where bare die can be
embedded into modules or co-packaged with
other ICs.
Pin Number(s)
Description
1
V+
4
V-
2,3
NIC
5-16
NIC
Note: NIC = No Internal Connection
5.7 mm x 6.1 mm
Bare Die
The EnerChip™ CBC050 is a surface-mount, solid
state, rechargeable energy storage device rated
for 50µAh at 3.8V. It is ideal as a localized, onboard power source for SRAMs, real-time clocks
and microcontrollers which require standby power
to retain time or data. It is also suitable for RFID
tags, smart sensors, and remote applications
which require a miniature, low-cost, and rugged
power source. For many applications, the CBC050
is a superior alternative to coin cell batteries and
supercapacitors.
Because of their solid state design, EnerChip™
storage devices are able to withstand solder reflow
temperatures and can be processed in highvolume manufacturing lines similar to conventional
semiconductor devices. There are no harmful gases,
liquids or special handling procedures, in contrast to
traditional rechargeable batteries.
The EnerChip recharge is fast and simple, with a
direct connection to a 4.1V voltage source and
no current limiting components. Recharge time is
20 minutes to 80% capacity. Robust design offers
thousands of charge/discharge cycles. The CBC050
is packaged in an 8 mm x 8 mm quad flat package. It
is available in reels for use with automatic insertion
equipment.
CBC050 Schematic - Top View
©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-01 Rev B
Page 1 of 4
EnerChip™ CBC050 Solid State Energy Storage
Operating Characteristics
Parameter
Condition
Min
Typical
Max
Units
Discharge Cutoff Voltage
25°C
3.0
-
-
V
Charge Voltage
25°C
4.0(2)
4.1
4.3
V
Pulse Discharge Current
25°C
300(3)
-
-
µA
Cell Resistance (25°C)
(1)
Charge cycle 2
-
750
2000
Charge cycle 1000
-
4200
7000
Non-recoverable
-
2.5
-
% per year
Recoverable
-
1.5(4)
-
% per year
Operating Temperature
-
-20
25
+70
°C
Storage Temperature
-
-40
-
125(5)
°C
10% depth-of-discharge
5000
-
-
cycles
50% depth-of discharge
1000
-
-
cycles
10% depth-of-discharge
2500
-
-
cycles
50% depth-of-discharge
500
-
-
cycles
Self-Discharge (5yr average; 25°C)
Recharge Cycles
(to 80% of rated
capacity; 4.1V charge
voltage)
25°C
40°C
Recharge Time (to 80% of rated capacity;
4.1V charge voltage)
Capacity
Charge cycle 2
-
20
35
Charge cycle 1000
-
60
95
100µA discharge; 25°C
50
-
-
Ω
minutes
µAh
(1)
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
(3)
Typical pulse duration = 20 milliseconds.
(4)
First month recoverable self-discharge is 5% average.
(5)
Storage temperature is for uncharged EnerChip.
(2)
Note: All specifications contained within this document are subject to change without notice
EnerChip Discharge Characteristics
Ordering Information
EnerChip Part Number
Description
Notes
CBC050-M8C
50µAh in 16-pin M8 QFN Package
tube
CBC050-M8C-TR1
50µAh in 16-pin M8 QFN Package
tape & reel 1000 pcs
CBC050-M8C-TR5
50µAh in 16-pin M8 QFN Package
tape & reel 5000 pcs
CBC050-M8C-WP
50µAh in 16-pin M8 QFN Package
waffle pack
CBC050-BDC-WP
50µAh Bare Die
Contact Cymbet
CBC050-BUC-WP
50µAh Bumped Bare Die
Contact Cymbet
©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-01 Rev B
Page 2 of 4
EnerChip™ CBC050 Solid State Energy Storage
Package Dimensions - 16-pin QFN (package code M8)
[Dimensions in inches [mm]
©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-01 Rev B
Page 3 of 4
EnerChip™ CBC050 Solid State Energy Storage
Printed Circuit Board (PCB) Layout Guidelines and Recommendations
Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup
energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering
power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the
board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative
terminals are routed near each other and under the package, where it is difficult to wash the flux residue away.
To avoid this situation, make sure positive and negative traces are routed outside of the package footprint to
ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a
leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of
the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the
reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the
region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where
the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder
pads, traces, or vias.
When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of
the package and all metal pads. Failure to observe this precaution can result in package cracking during solder
reflow due to the silk screen material interfering with the solder solidification process during cooling.
A recommended CBC050 PCB layout is shown in Figure 1 below. Notice that there should not be a center pad
on the PCB to mate with the exposed die pad on the CBC050 package. Again, this is to reduce the possible
number and severity of leakage paths between the EnerChip terminals.
16
15
14
13
1
12
2
11
3
10
4
9
5
6
7
8
Dimensions in inches [mm]
Figure 1: Recommended PCB layout for the CBC050 package. Do not route signal traces under the EnerChip
as they could become shorted to the die pad (as shown by the dotted lines) on the package underside.
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit
boards, and for instructions on in-circuit electrical testing of the EnerChip.
Disclaimer of Warranties; As Is
The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any
kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the
implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of
dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users
shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted
for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and
any use of the Cymbet EnerChip product described herein in any such product or applications.
Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved
©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-01 Rev B
Page 4 of 4