Cannon Cover headline Cover headline Micro D-Subminiature MDM Series Visit our website at www.ittcannon.com ITT Interconnect Solutions Cannon, VEAM, BIW Connector System Maintaining reliability and saving space for the high performance connector market Features & Benefits Global Design & Manufacturing Customer Support North America MEXICO - Cannon, VEAM Av.Libre Comercio s/n entre Calzada Industrial Nuevo Nogales y Calzada del Raquet Club, Parque Industrial Nuevo Nogales 84093 Nogales, Sonora phone: +52.631.3110050 fax: +52.631.3110060 USA - Cannon 666 East Dyer Road Santa Ana, CA 92705 toll free: +1.800.854.3028 phone: +1.714.557.4700 fax: +1.714.628.2142 USA - BIW Connector Systems 500 Tesconi Circle Santa Rosa, CA 95401 phone: +1.707.523.2300 fax: +1.707.523.3567 USA - VEAM 100 New Wood Road Watertown, CT 06795 phone: +1.860.274.9681 fax: +1.860.274.4963 Europe & Middle East FRANCE - Cannon, VEAM 15, Boulevard Robert Thiboust 77700 Serris phone: +33.1.60.04.93.93 fax: +33.1.60.04.93.90 GERMANY - Cannon, VEAM ITT Cannon GmbH Cannonstrasse 1 71384 Weinstadt phone: +49.7151.699.0 fax: +49.7151.699.217 ITALY - Cannon, VEAM Corso Europa 41/43 20020 Lainate (MI) phone: +39.02938721 fax: +39.0293872300 LEBANON - BIW Connector Systems P.O. Box 199 Jounieh Lebanon phone: +961.9.911.560 fax: +961.9.912.126 UK - Cannon, VEAM Jays Close, Viables Estate Basingstoke RG22 4BA phone: +44.1256.311200 fax: +44.1256.323356 Asia CHINA - Cannon, VEAM Tuopandun Industrial Area, Jinda Cheng, Xiner Village, Shajing Town, Baoan District, Shenzhen City, Guangdong Province, 518125 phone: +86.755.2726.7238 fax: +86.755.2726.7515 HONG KONG - Cannon, VEAM Units 2405-6, 24/F, ING Tower 308 Des Voeux Road Central Hong Kong phone: +852.2732.2720 fax: +852.2732.2919 INDIA - Cannon, VEAM ITT Corporation India Pvt. Ltd. Money Chamber, Unit No. 202 #6, KH Road Bangalore 560027 phone: +91.80.41465632 fax: +91.80.41465631 JAPAN - Cannon, VEAM 5-11-3 Hibarigaoka, Zama-shi Kanagawa 252-0003 phone: +81.462.57.2010 fax: +81.462.57.1680 SINGAPORE - Cannon, VEAM 10 Jalan Kilang #06-01 159410 Singapore phone: +65.62763693 ext 232 fax: +65.62763685 The “ITT Engineered Blocks“ symbol, “Engineered for life”, “ITT”, “Cannon“, “VEAM“ and “BIW Connector Systems“ are registered trademarks of ITT Corporation. Specification and other data are based on information available at the time of printing, and are subject to change without notice. © 2013 ITT Corporation Front page photo © Festo, inside page right hand: Fotolia.com Micro D-Subminiature MDM Series – Assuring 100% reliability in over 5,000 missile launches Delivering a durable, reliable and innovative product for harsh environment applications Micro D-Subminiature MDM Series has produced many product extensions since its introduction to the miniature technology marketplace over 60 years ago, offering unique mechanical engagement and locking mechanism to meet the demand of harsh environment applications. The MDM D-Subminiature MDM Series is designed to meet applications requiring reliable, extremely small and lightweight form factors. This high density rectangular form factor meets the increasing demand for environmentally safe, rugged and moisture-sealed microminature connectors. As a founder in the connector industry, ITT’s Micro line is applicable for the defense, military and commercial aviation, industrial, and medical environments. With a global engineering team that has centuries of combined experience, ITT is a leader in designing custom connectors and sophisticated custom cable assemblies. 2 Why customers benefit from choosing ITT‘s MDM Micro • Aluminum shell with multiple plating options • Uses high performance twist pin contact technology • Available in high temperature (200°C) and nonmagnetic versions 4 Mixed power, coax and signal layouts Wire range AWG 30 – 24 (AWG 16 Power) Current rating 3A / max. voltage 600 VAC (40A Power) Turnkey Cabling 4 4 Twist Pin Technology 4 4 Originally developed by ITT, the twist pin contact offers a superior electrical and mechanical system that outperforms traditional machined or stamped electrical contact systems. Space Grade Cable Assemblies All of ITT’s Space rated micro interconnect assemblies utilize ITT QPL M83518 connectors to meet the most stringent performance requirements. 1 Technical overview -40°C to +125°C (200°C available upon request) Turnkey cable assemblies for all of ITT’s Micro and high density Nano connectors allow customers a breadth of assemblies in 0.075, 0.050 and 0.025 contact spacing. 3 4 4 For more information please visit our website at www.ittcannon.com 1 2 3 Jackscrew Series The metal shell provides greater strength, prevents chips, cracks or breaks resulting in a longer life-span and mechanical defects. MDM’s extremely small and lightweight form factor can accommodate from 9 to 100 contacts for reliable power in small spaces. Flex circuitry and high reliability in high density are met with board-to-board, board-to-cable and cableto-cable assemblies. Printed Circuit Board Product Portfolio Micro jackscrews provide reliable interconnects for boardto-board, board-to-cable and in-line cable-to-cable applications. Available in 8 shell sizes the PCB connectors are also available with jackpost mounting for use with locking hardware. Custom Cable Assemblies ITT offers multiple contact systems where signal speed, coax and power contacts can be incorporated into a complete cable assembly solution. 4 The Micro contact system allows use in areas not normally designated such as high temp oil field electric logging operations. Micro Contact Resistance 8 milliohms max. Contact Material Gold plated copper alloy Plating Options Electroless Nickel, Cadmium/Yellow Chromate over Nickel, Gold over Nickel, Irridite/Alodine, Black Anodize Configuration Polarized D Shell Material Available Layouts Aluminum 9, 15, 21, 25, 31, 37, 51, 100, 7C2*, 10C10*, 16C5*, 24C4* RoHS Factory Terminated •Solderpot versions available for end user termination. *C-Coax, P-Power, C is interchangeable with P depending on contact. Available Yes•