lg-192hrf-9ug-ct Pdf - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-192HRF/9UG-CT
DATA SHEET
DOC. NO :
QW0905-LG-192HRF/9UG-CT
REV.
:
A
DATE
:
30 - Apr. - 2012
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/12
PART NO. LG-192HRF/9UG-CT
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-192 SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
LG-192HRF/9UG-CT
MATERIAL
COLOR
Emitted
AlGaInP
Red
AlGaInP
Green
Lens
Water Clear
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Page 2/12
PART NO. LG-192HRF/9UG-CT
Package Dimensions
Cathode
Mark
0.4
0.8
0.2
1
2
0.25
0.25
Resin
0.45
DIES2
1.6
Soldering
Terminal
1.0
DIES1
4
0.45
3
PCB
1
2
HRF
9UG
4
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.6
0.3
0.6
0.8
0.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
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Page 3/12
PART NO. LG-192HRF/9UG-CT
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Ratings
Symbol
HRF
9UG
UNIT
Power Dissipation
PD
72
78
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
90
60
mA
Forward Current
IF
30
30
mA
Reverse Current @5V
Ir
10
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Symbol
Iv
λD
△λ
VF
2θ 1/2
Min. Typ.
Max. UNIT
HRF
32
80
----
9UG
20
50
----
HRF ----
630
----
9UG ----
574
----
HRF ----
20
----
9UG ----
20
----
HRF 1.5
----
2.4
9UG 1.7
----
2.6
HRF ----
130
----
9UG ----
130
----
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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PART NO. LG-192HRF/9UG-CT
Luminous Intensity Classification
BIN CODE
HRF
N
P
Q
R
BIN CODE
9UG
M
N
P
Q
Iv(mcd) at 20mA
Min.
Max.
32
50
80
125
50
80
125
200
Iv(mcd) at 20mA
Min.
Max.
20
32
50
80
32
50
80
125
Dominant Wavelength Classification
BIN CODE
HRF
29
30
31
32
BIN CODE
9UG
7
8
9
10
λD(nm) at 20mA
Min.
Max.
624
627
630
633
627
630
633
636
λD(nm) at 20mA
Min.
Max.
568
570
571
572
570
571
572
574
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Page 5/12
PART NO. LG-192HRF/9UG-CT
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
3.0
2.5
2.0
1.5
1.0
0.5
0
1.5
1.0
2.0
2.5
3.0
1.0
10
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize@25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
1000
100
550
600
650
Wavelength (nm)
700
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Fig.6 Directive Radiation
100
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PART NO. LG-192HRF/9UG-CT
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA
Normalize @25℃
Forward Voltage@20mA
Normaliz @25℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
100
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Page 7/13
PART NO. LG-192HRF/9UG-CT
Carrier Tape Dimensions
2.0
1.5
4.0±0.2
0.25
1.75
3.5±0.2
8.0±0.3
5.3
1.75
Polarity
0.6
4.0±0.2
0.9
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-192HRF/9UG-CT
8.0mm tape,7"reel
4000 devices
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Page 8/13
PART NO. LG-192HRF/9UG-CT
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
BIN : Luminous Intensity
PART :
LG-192HRF/9UG-CT
LOT :
GS1-080168
QTY(PCS):
4000
VF:1.5-2.4
BIN/HUE :
Q/31-M/8
VF:1.7-2.4
HUE : Dominant Wavelength
VF : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
60±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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Page 9/13
PART NO. LG-192HRF/9UG-CT
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-192HRF/9UG-CT
Page 10/12
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
120 ~ 150℃
Preheat
120 ~ 180 sec
3 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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PART NO. LG-192HRF/9UG-CT
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year at <30℃ and <90% relative humidity(RH) (from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 12/12
PART NO. LG-192HRF/9UG-CT
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5℃
2.RH=90%~95%
3.t=1000hrs¡Ó2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5℃&-40℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25℃ ~ -55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260°C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020