LG-150-8SEF/WK-DT-A02 - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-150-8SEF/WK-DT-A02
DATA SHEET
DOC. NO :
QW0905-LG-150-8SEF/WK-DT-A02
REV.
:
A
DATE
:
22 - Jul. - 2013
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/13
PART NO. LG-150-8SEF/WK-DT-A02
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with reflow solder process.
Descriptions:
1. The LG-150 SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
LG-150-8SEF/WK-DT-A02
MATERIAL
COLOR
Emitted
AlGaInP
Orange
InGaN
White
Lens
Yellow Diffused
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Page 2/13
PART NO. LG-150-8SEF/WK-DT-A02
Package Dimensions
Cathode Mark
2
DIE2
1
1.1
0.5
Resin
3.2
0.6
2.0
Soldering
Terminal
DIE1
0.6
4
3
PCB
0.4
0.6
1.6
2
1
WK
8SEF
4
3
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
0.6
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Page 3/13
PART NO. LG-150-8SEF/WK-DT-A02
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Ratings
Symbol
8SEF
WK
UNIT
Power Dissipation
PD
65
108
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
60
100
mA
Forward Current
IF
25
30
mA
Reverse Current @5V
Ir
10
50
μA
Electrostatic Discharge
ESD
2000
500
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Dominant Wavelength
Chromaticity Coordinates
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Min.
Typ.
8SEF
50
125
----
WK
200
500
----
8SEF
598
----
612
0.28
----
0.31
0.255
----
0.34
8SEF
----
20
----
WK
----
30
----
8SEF
1.7
----
2.6
WK
2.8
----
3.6
WK
----
120
----
8SEF
----
120
----
Symbol
Iv
λD
X
Y
△λ
VF
2θ 1/2
WK
Max. UNIT
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
CONDITION
mcd
IF=20mA
nm
IF=20mA
----
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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Page 4/13
PART NO. LG-150-8SEF/WK-DT-A02
Luminous Intensity Classification
BIN CODE
8SEF
Min.
Max.
P
50
80
Q
80
125
R
125
200
S
200
320
BIN CODE
WK
Iv(mcd) at 20mA
Iv(mcd) at 20mA
Min.
Max.
S
200
320
T
320
500
U
500
800
Dominant Wavelength Classification
BIN CODE
8SEF
λD(nm) at 20mA
Min.
Max.
20
598
600
21
600
603
22
603
606
23
606
609
24
609
612
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Page 5/13
PART NO. LG-150-8SEF/WK-DT-A02
CIE Chromaticity Diagram
0.42
0.40
0.38
0.36
0.34
0.32
B5
0.30
B4
B3
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.20
0.22
0.24
0.26
0.28
0.30
0.32
0.34
0.36
Chromaticity Coordinates Specifications For Bin Grading
Color Coordiante at20mA
BIN CODE
1
3
2
4
X
Y
X
Y
X
Y
X
Y
B3
0.28
0.295
0.28
0.255
0.29
0.27
0.29
0.31
B4
0.29
0.31
0.29
0.27
0.3
0.285
0.3
0.325
B5
0.3
0.325
0.3
0.285
0.31
0.3
0.31
0.34
LIGITEK ELECTRONICS CO.,LTD.
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Page 6/13
PART NO. LG-150-8SEF/WK-DT-A02
Typical Electro-Optical Characteristics Curve
8SEF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
1.5
2.0
2.5
3.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
100
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
650
Fig.6 Directive Radiation
80
100
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Page 7/13
PART NO. LG-150-8SEF/WK-DT-A02
Typical Electro-Optical Characteristics Curve
WK CHIP
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
SPECTRAL RADIANCE
100
Intensity
80
60
40
20
0
600
Wavelength (nm)
700
2.5
2.0
1.5
1.0
0.5
0.0
-20
0
20
40
60
80
Ambient Temperature( ℃)
Fig.5 Luminous Spectrum(Ta=25 ℃)
500
3.0
-40
Ambient Temperature( ℃)
400
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
800
100
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Page 8/13
PART NO. LG-150-8SEF/WK-DT-A02
Carrier Type Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
4.0±0.2
1.36
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-150-8SEF/WK-DT-A02
8.0mm tape,7"reel
3000 devices
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 9/13
PART NO. LG-150-8SEF/WK-DT-A02
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
PART :
LG-150-8SEF/WK-DT-A02
LOT :
GS11370168
QTY(PCS):
3000
VF:1.7-2.6
BIN/HUE :
P/21-S/B5
VF:2.8-3.6
BIN : Luminous Intensity
HUE : Dominant Wavelength
VF: Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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Page 10/13
PART NO. LG-150-8SEF/WK-DT-A02
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 11/13
PART NO. LG-150-8SEF/WK-DT-A02
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
120 ~ 150℃
Preheat
120 ~ 180 sec
3 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
90 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 12/13
PART NO. LG-150-8SEF/WK-DT-A02
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
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Page 13/13
PART NO. LG-150-8SEF/WK-DT-A02
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5℃
2.RH=90%~95%
3.t=1000hrs¡Ó2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5℃&-40℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25℃ ~ -55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260°C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020