LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Pa LG-195-9UG/DBK-CT DATA SHEET DOC. NO : QW0905-LG-195-9UG/DBK-CT REV: A DATE : 15- Nov. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-195-9UG/DBK-CT Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-195-9UG/HRF SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-195-9UG/DBK-CT MATERIAL COLOR Emitted AlGaInP Green InGaN Blue Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-195-9UG/DBK-CT Package Dimensions 2 1.5 Soldering Terminal 0.55 1 0.25 0.18 0.4 Die2 Die1 1.6 1.1 0.4 RESIN 3 0.6 PCB 0.85 4 2 1 _ _ DBK 9UG + + 3 4 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 2.2 0.9 1.5 0.5 Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm. 0.6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-195-9UG/DBK-CT Absolute Maximum Ratings at Ta=25℃ Parameter Ratings Symbol 9UG DBK UNIT Power Dissipation PD 78 120 mW Peak Forward Current Duty 1/10@10KHz IFP 60 100 mA Forward Current IF 30 30 mA Reverse Current @5V Ir 10 10 μA Electrostatic Discharge ESD 2000 500 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25℃) Items Luminous Intensity Symbol Iv Peak Wavelength λP Dominant Wavelength λD Spectral Line Half-Width Forward Voltage Viewing Angle △λ VF 2θ 1/2 Min. Typ. Max. UNIT 9UG 20 50 ---- DBK 50 125 ---- 9UG ---- 575 ---- DBK ---- 465 ---- 9UG ---- 574 ---- DBK ---- 470 ---- 9UG ---- 20 ---- DBK ---- 30 ---- 9UG 1.7 ---- 2.6 DBK 2.8 ---- 3.6 9UG ---- 130 ---- DBK ---- 130 ---- Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-195-9UG/DBK-CT BIN CODE LIST BIN CODE 9UG M N P Q BIN CODE DBK P Q R Iv(mcd) at 5mA Min. Max. 20 32 50 80 32 50 80 125 Iv(mcd) at 5mA Min. Max. 50 80 125 80 125 200 Dominant Wavelength Classification BIN CODE 9UG 6 7 8 9 10 BIN CODE DBK 0D 0C 0B 0A λD(nm) at 20mA Min. Max. 566 568 570 572 574 568 570 572 574 576 λD(nm) at 20mA Min. Max. 465 468 471 474 468 471 474 477 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-195-9UG/DBK-CT Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Relative Intensity @20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-195-9UG/DBK-CT Typical Electro-Optical Characteristics Curve DBK CHIP Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 550 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-195-9UG/DBK-CT Carrier Tape Dimensions 4.0±0.2 0.23 2.0 1.75 3.5±0.2 8.0±0.3 1.75 5.3 0.7 1.65 4.0±0.2 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-195-9UG/DBK-CT 8.0mm tape,7"reel 4000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-195-9UG/DBK-CT Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LG-195-9UG/DBK-CT LOT : GS1-080168 QTY(PCS): 4000 VF:1.7-2.6 BIN/HUE : M/6-Q/0D VF:2.8-3.6 BIN : Luminous Intensity HUE : Dominant Wavelength VF :Forward Voltage Reel Dimensions 0.2 0.4 0.8 178±1.5 60±1.0 0.8 0.6 0.2 0.4 0.6 2.0±0.5 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-195-9UG/DBK-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-195-9UG/DBK-CT Page 10/12 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec 120 ~ 150℃ Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-195-9UG/DBK-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-195-9UG/DBK-CT Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020