HVU131 Silicon Epitaxial Planar Pin Diode for Antenna Switching REJ03G0435-0600 (Previous: ADE-208-239E) Rev.6.00 Oct 29, 2004 Features • Low capacitance. (C = 0.8 pF max) • Low forward resistance. (rf = 1.0 Ω max) • Ultra small Resin Package (URP) is suitable for surface mount design. Ordering Information Type No. HVU131 Laser Mark P1 Package Code URP Pin Arrangement Cathode mark Mark 1 P1 2 1. Cathode 2. Anode Rev.6.00 Oct 29, 2004 page 1 of 4 HVU131 Absolute Maximum Ratings (Ta = 25°C) Item Peak reverse voltage Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Symbol Value 65 60 100 150 125 −55 to +125 VRM VR IF Pd Tj Tstg Unit V V mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Reverse current Forward voltage Capacitance Forward resistance Symbol IR VF C rf Rev.6.00 Oct 29, 2004 page 2 of 4 Min — — — — Typ — — — — Max 0.1 1.0 0.8 1.0 Unit µA V pF Ω Test Condition VR = 60 V IF = 10 mA VR = 1 V, f = 1 MHz IF = 10 mA, f = 100 MHz HVU131 Main Characteristic 10–2 10–7 10–8 10 Reverse current IR (A) Forward current IF (A) 10–4 –6 Ta= 50°C 10–8 Ta= 25°C 10–10 10–12 10–9 10–10 Ta= 50°C 10–11 Ta= 25°C 10–12 0 0.2 0.4 0.6 0.8 1.0 10–13 0 20 40 60 80 100 Forward voltage VF (V) Reverse voltage VR (V) Fig.1 Forward current vs. Forward voltage Fig.2 Reverse current vs. Reverse voltage 103 f = 1MHz f = 100MHz Forward resistance rf (Ω) Capacitance C (pF) 10 1.0 0.1 1.0 10 100 102 101 100 10–1 10–5 10–4 10–3 10–2 Reverse voltage VR (V) Forward current IF (A) Fig.3 Capacitance vs. Reverse voltage Fig.4 Forward resistance vs. Forward current Rev.6.00 Oct 29, 2004 page 3 of 4 HVU131 Package Dimensions As of January, 2003 Rev.6.00 Oct 29, 2004 page 4 of 4 0.9 ± 0.15 0 – 0.10 1.25 ± 0.15 1.7 ± 0.15 2.5 ± 0.15 0.3 ± 0.15 Unit: mm Package Code JEDEC JEITA Mass (reference value) URP Conforms — 0.004 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2004. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0