RENESAS HVU131

HVU131
Silicon Epitaxial Planar Pin Diode for Antenna Switching
REJ03G0435-0600
(Previous: ADE-208-239E)
Rev.6.00
Oct 29, 2004
Features
• Low capacitance. (C = 0.8 pF max)
• Low forward resistance. (rf = 1.0 Ω max)
• Ultra small Resin Package (URP) is suitable for surface mount design.
Ordering Information
Type No.
HVU131
Laser Mark
P1
Package Code
URP
Pin Arrangement
Cathode mark
Mark
1
P1
2
1. Cathode
2. Anode
Rev.6.00 Oct 29, 2004 page 1 of 4
HVU131
Absolute Maximum Ratings
(Ta = 25°C)
Item
Peak reverse voltage
Reverse voltage
Forward current
Power dissipation
Junction temperature
Storage temperature
Symbol
Value
65
60
100
150
125
−55 to +125
VRM
VR
IF
Pd
Tj
Tstg
Unit
V
V
mA
mW
°C
°C
Electrical Characteristics
(Ta = 25°C)
Item
Reverse current
Forward voltage
Capacitance
Forward resistance
Symbol
IR
VF
C
rf
Rev.6.00 Oct 29, 2004 page 2 of 4
Min
—
—
—
—
Typ
—
—
—
—
Max
0.1
1.0
0.8
1.0
Unit
µA
V
pF
Ω
Test Condition
VR = 60 V
IF = 10 mA
VR = 1 V, f = 1 MHz
IF = 10 mA, f = 100 MHz
HVU131
Main Characteristic
10–2
10–7
10–8
10
Reverse current IR (A)
Forward current IF (A)
10–4
–6
Ta= 50°C
10–8
Ta= 25°C
10–10
10–12
10–9
10–10
Ta= 50°C
10–11
Ta= 25°C
10–12
0
0.2
0.4
0.6
0.8
1.0
10–13
0
20
40
60
80
100
Forward voltage VF (V)
Reverse voltage VR (V)
Fig.1 Forward current vs. Forward voltage
Fig.2 Reverse current vs. Reverse voltage
103
f = 1MHz
f = 100MHz
Forward resistance rf (Ω)
Capacitance C (pF)
10
1.0
0.1
1.0
10
100
102
101
100
10–1
10–5
10–4
10–3
10–2
Reverse voltage VR (V)
Forward current IF (A)
Fig.3 Capacitance vs. Reverse voltage
Fig.4 Forward resistance vs. Forward current
Rev.6.00 Oct 29, 2004 page 3 of 4
HVU131
Package Dimensions
As of January, 2003
Rev.6.00 Oct 29, 2004 page 4 of 4
0.9 ± 0.15
0 – 0.10
1.25 ± 0.15
1.7 ± 0.15
2.5 ± 0.15
0.3 ± 0.15
Unit: mm
Package Code
JEDEC
JEITA
Mass (reference value)
URP
Conforms
—
0.004 g
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0