MX23C1610

MX23C1610
5 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM
FEATURES
ORDER INFORMATION
PIN CONFIGURATION
48 TSOP (Normal Type)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX23C1610
(Normal Type)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX23C1610
(Reverse Tpye)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX23C1610RC-12
120ns
MX23C1610RC-15
150ns
MX23C1610PC-10
MX23C1610PC-12
MX23C1610PC-15
MX23C1610YC-10
MX23C1610YC-12
MX23C1610YC-15
100ns
120ns
150ns
100ns
120ns
150ns
44 SOP/44 TSOP
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
VSS
OE
D0
D8
D1
D9
D2
D10
D3
D11
48 TSOP (Reverse Type)
VSS
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
Access
100ns
120ns
150ns
100ns
120ns
150ns
100ns
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
A21
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
MX23C1610
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
VSS
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
Part No.
MX23C1610MC-10
MX23C1610MC-12
MX23C1610MC-15
MX23C1610TC-10
MX23C1610TC-12
MX23C1610TC-15
MX23C1610RC-10
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
Package
44 pin SOP
44 pin SOP
44 pin SOP
48 pin TSOP
48 pin TSOP
48 pin TSOP
48 pin TSOP
(Reverse type)
48 pin TSOP
(Reverse type)
48 pin TSOP
(Reverse type)
42 pin DIP
42 pin DIP
42 pin DIP
44 pin TSOP
44 pin TSOP
44 pin TSOP
42 PDIP
NC
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
VSS
OE
D0
D8
D1
D9
D2
D10
D3
D11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
MX23C1610
• Bit organization
- 2M x 8 (byte mode)
- 1M x 16 (word mode)
• Fast access time
- Random access: 100ns (max.)
• Current
- Operating: 60mA
- Standby: 50uA
• Supply voltage
- 5V±10%
• Package
- 44 pin SOP (500mil)
- 48 pin TSOP (12mm x 20mm)
- 42 pin DIP (600mil)
- 44 pin TSOP (Type II)
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
REV. 3.5, JUN. 20, 2003
P/N:PM0139
1
MX23C1610
PIN DESCRIPTION
Symbol
Pin Function
A0~A19
Address Inputs
D0~D14
Data Outputs
D15/A-1
D15 (Word Mode)/ LSB Address
(Byte Mode)
CE
Chip Enable Input
OE
Output Enable Input
Byte
Word/ Byte Mode Selection
VCC
Power Supply Pin
VSS
Ground Pin
NC
No Connection
MODE SELECTION
CE
OE
Byte
D15/A-1
D0~D7
D8~D15
Mode
Power
H
X
X
X
High Z
High Z
-
Stand-by
L
H
X
X
High Z
High Z
-
Active
L
L
H
Output
D0~D7
D8~D15
Word
Active
L
L
L
Input
D0~D7
High Z
Byte
Active
BLOCK DIAGRAM
A0(A-1)
Address
Buffer
Memory
Array
Page
Decoder
Page
Buffer
A19
Word/
Byte
Output
Buffer
D0
D15/(D7)
CE
BYTE
OE
P/N:PM0139
REV. 3.5, JUN. 20, 2003
2
MX23C1610
ABSOLUTE MAXIMUM RATINGS
Item
Voltage on any Pin Relative to VSS
Ambient Operating Temperature
Storage Temperature
Symbol
VIN
Topr
Tstg
Ratings
-0.5V to 7.0V
0°C to 70°C
-65°C to 125°C
Note: Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot VSS to 1.3V for periods of up to 20ns. Maximum DC voltage on input or I/O pins is VCC+0.5V. During voltage transitions,
input may overshoot VCC to VCC+2.0V for periods of up to 20ns.
DC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 5V±10%)
Item
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Leakage Current
Output Leakage Current
Operating Current
Symbol
VOH
VOL
VIH
VIL
ILI
ILO
ICC1
MIN.
2.4V
2.2V
-0.3V
-
MAX.
0.4V
VCC+0.3V
0.8V
10uA
10uA
60mA
Standby Current (TTL)
Standby Current (CMOS)
Input Capacitance
Output Capacitance
ISTB1
ISTB2
CIN
COUT
-
1mA
50uA
10pF
10pF
Conditions
IOH = -1.0mA
IOL = 2.1mA
0V, VCC
0V, VCC
f=5MHz, all output open,
CE=VIL, OE=VIH
CE = VIH
CE>VCC-0.2V
Ta = 25°C, f = 1MHZ
Ta = 25°C, f = 1MHZ
AC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 5V±10%)
Item
Symbol
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Time
Output Hold After Address
Output High Z Delay
tRC
tAA
tACE
tOE
tOH
tHZ
23C1610-10
MIN.
MAX.
100ns 100ns
100ns
50ns
0ns
20ns
23C1610-12
MIN.
MAX.
120ns
120ns
120ns
60ns
0ns
20ns
23C1610-15
MIN.
MAX.
150ns
150ns
150ns
70ns
0ns
20ns
Note:Output high-impedance delay (tHZ) is measured
from OE or CE going high, and this parameter guaranteed by design over the full voltage and temperature
operating range - not tested.
P/N:PM0139
REV. 3.5, JUN. 20, 2003
3
MX23C1610
AC Test Conditions
Input Pulse Levels
Input Rise and Fall Times
Input Timing Level
Output Timing Level
Output Load
0.4V~ 2.4V
10ns
1.5V
0.8V and 2.0V
See Figure
IOH (load)=-1mA
DOUT
IOL (load)=2.1mA
C<100pF
Note:
No output loading is present in tester load board.
Active loading is used and under software programming control.
Output loading capacitance includes load board's and all stray capacitance.
TIMING DIAGRAM
RANDOM READ
ADD
ADD
ADD
ADD
tRC
tACE
CE
tOE
OE
tOH
tAA
VALID
DATA
VALID
tHZ
VALID
Note:CE, OE are enable
P/N:PM0139
REV. 3.5, JUN. 20, 2003
4
MX23C1610
PACKAGE INFORMATION
P/N:PM0139
REV. 3.5, JUN. 20, 2003
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MX23C1610
P/N:PM0139
REV. 3.5, JUN. 20, 2003
6
MX23C1610
P/N:PM0139
REV. 3.5, JUN. 20, 2003
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MX23C1610
P/N:PM0139
REV. 3.5, JUN. 20, 2003
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MX23C1610
P/N:PM0139
REV. 3.5, JUN. 20, 2003
9
MX23C1610
REVISION HISTORY
Revision
2.9
3.0
3.1
3.2
3.3
3.4
3.5
Description
DC Characteristics:The standby current (CMOS) ISTB2 is changed
as 50 uA instead of 100uA.
AC Characteristics:Add 90ns grade item, deleted 200ns grade item.
The output enable time (tOE) is changed as 60ns instead of 70ns in
120ns grade item, and 70ns instead of 80ns in 150ns grade item.
The output high Z delay is changed as 20ns instead of 70ns.
AC Characteristics: tOH 10ns --> 0ns
Typing error correction
1.Added 44-pin TSOP(Type II) Package
2.Modify Package Information
1.Delete Access Time:90ns
1. Modify Package Information
1. Modify 42-PDIP Package Information
P/N:PM0139
Page
Date
SEP/17/1997
P3
P1
P1,8
P5~7
P1,3
P5~9
P5
FEB/01/1999
JAN/18/2000
JUL/18/2001
OCT/18/2001
NOV/21/2002
JUN/20/2003
REV. 3.5, JUN. 20, 2003
10
MX23C1610
Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure
of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or
property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix
and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due
to use of Macronix's products in the prohibited applications.
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Headquarters
Macronix, Int'l Co., Ltd.
Taipei Office
Macronix, Int'l Co., Ltd.
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MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.