MX23L6410 64M-BIT (8M x 8 / 4M x 16) Mask ROM ORDER INFORMATION FEATURES Part No. Access Time MX23L6410MC-10 100ns MX23L6410MC-12 120ns MX23L6410MC-15 150ns MX23L6410TC-90 90ns MX23L6410TC-10 100ns MX23L6410TC-12 120ns MX23L6410TC-15 150ns MX23L6410RC-10 100ns • Bit organization - 8M x 8 (byte mode) - 4M x 16 (word mode) • Fast access time - Random access: 90ns (max.) for 3.0V~3.6V 100ns (max.) for 2.7V~3.6V Notes: die form: 2.7~3.6V 90ns • Current - Operating: 50mA (max.) - Standby: 15uA (max.) • Supply voltage - 2.7V~3.6V • Package - 44 pin SOP (500 mil) - 48 pin TSOP (12mm x 20mm) - 44 pin TSOP (Type II) MX23L6410RC-12 120ns MX23L6410RC-15 150ns MX23L6410YC-10 MX23L6410YC-12 MX23L6410YC-15 MX23L6410TI-10 100ns 120ns 150ns 100ns Package 44 pin SOP 44 pin SOP 44 pin SOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 44 pin TSOP 44 pin TSOP 44 pin TSOP 48 pin TSOP Note: Industrial grade temperature: -40°C~ 85°C Commercial grade temperature: 0°C ~ 70°C P/N:PM0408 REV. 3.8, NOV. 07, 2006 1 MX23L6410 PIN DESCRIPTION PIN CONFIGURATION A21 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE VSS OE D0 D8 D1 D9 D2 D10 D3 D11 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 MX23L6410 44 SOP/44 TSOP 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Pin Function A0~A21 Address Inputs D0~D14 Data Outputs D15/A-1 D15 (Word Mode) / LSB Address (Byte Mode) CE Chip Enable Input OE Output Enable Input Byte Word / Byte Mode Selection VCC Power Supply Pin VSS Ground Pin NC No Connection 48 TSOP (REVERSE TYPE) 48 TSOP (NORMAL TYPE) BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 A21 A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE Symbol 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 MX23L6410 (Normal Type) VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE VSS VSS VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE VSS VSS 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 MX23L6410 (Reverse Type) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 A21 A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE MODE SELECTION CE H L L L OE X H L L Byte X X H L D15/A-1 X X Output Input D0~D7 High Z High Z D0~D7 D0~D7 P/N:PM0408 D8~D15 High Z High Z D8~D15 High Z Mode Word Byte Power Stand-by Active Active Active REV. 3.8, NOV. 07, 2006 2 MX23L6410 BLOCK DIAGRAM A0/(A-1) Address Buffer Memory Array Page Buffer Word/ Byte Output Buffer A21 D0 D15/(D7) CE BYTE OE ABSOLUTE MAXIMUM RATINGS Item Symbol Ratings Supply Voltage Relative to VSS VCC -0.3V to 4.3V Voltage on any Pin Relative to VSS VIN -0.5V to VCC + 2V Ambient Operating Temperature Topr Storage Temperature Tstg 0°C to 70°C (Commercial Grade) -40°C to 85°C (Industrial Grade) -65°C to 125°C DC CHARACTERISTICS (Ta = 0° C ~ 70°°C for Commercial Grade , Ta = -40°°C ~ 85°°C for Industrial Grade,VCC = 2.7V~3.6V) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (TTL) Standby Current (CMOS) Input Capacitance Output Capacitance Symbol VOH MIN. 2.4V MAX. - Conditions IOH = -0.4mA VOL VIH VIL ILI ILO ICC1 ISTB1 ISTB2 CIN COUT 2.2V -0.3V - 0.4V VCC+0.3V 0.8V 5uA 5uA 50mA 1mA 15uA 10pF 10pF IOL = 1.6mA P/N:PM0408 0V, VCC 0V, VCC f=5MHz, all output open CE = VIH CE>VCC-0.2V Ta = 25°C, f = 1MHZ Ta = 25°C, f = 1MHZ REV. 3.8, NOV. 07, 2006 3 MX23L6410 AC CHARACTERISTICS (Ta = 0°°C ~ 70°°C for Commercial Grade , Ta = -40°°C ~ 85°°C for Industrial Grade,VCC = 2.7V~3.6V) Item Symbol Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Time Output Hold After Address Output High Z Delay tRC tAA tACE tOE tOH tHZ 23L6410-90 MIN. MAX. 90ns 90ns 90ns 30ns 0ns 20ns 23L6410-10 MIN. MAX. 100ns 100ns 100ns 30ns 0ns 20ns 23L6410-12 MIN. MAX. 120ns 120ns 120ns 60ns 0ns 20ns 23L6410-15 MIN. MAX. 150ns 150ns 150ns 70ns 0ns 20ns Note:Output high-impedance delay (tHZ) is measured from OE or CE going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0.4V~ 2.4V 10ns 1.4V 1.4V See Figure IOH (load)=-0.4mA DOUT IOL (load)=1.6mA C<100pF Note:No output loading is present in tester load board. TIMING DIAGRAM Active loading is used and under software programming control. Output loading capacitance includes load board's and all stray capacitance. RANDOM READ ADD ADD ADD ADD tRC tACE CE OE tOE tAA DATA tOH VALID VALID tHZ VALID Note: CE,OE are enable P/N:PM0408 REV. 3.8, NOV. 07, 2006 4 MX23L6410 PACKAGE INFORMATION P/N:PM0408 REV. 3.8, NOV. 07, 2006 5 MX23L6410 P/N:PM0408 REV. 3.8, NOV. 07, 2006 6 MX23L6410 P/N:PM0408 REV. 3.8, NOV. 07, 2006 7 MX23L6410 P/N:PM0408 REV. 3.8, NOV. 07, 2006 8 MX23L6410 REVISION HISTORY REVISION 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 DESCRIPTION AC CHARACTERISTICS tOH 10ns-->0ns DC CHARACTERISTICS ISTB2 5uA-->15uA DC Characteristics voltage range VCC=2.9V~3.6V-->3.0V~3.6V Modify Operating Current:60mA-->50mA Modify Package Information Added 44-pin TSOP Package Added Access time:100ns Change VCC from 3.0~3.6V to 2.7~3.3V Change Voltage:2.7V~3.3V--->2.7V~3.6V Change Voltage:2.7V~3.6V--->2.4V~3.6V Change Operating Current:50mA-->13mA Change Voltage:2.4V~3.6V--->2.7V~3.6V Change Operating Current:13mA-->50mA Removed 44-pin TSOP Package 1. Add supply voltage relative to VSS 2. Change voltage on any pin relative to VSS:-0.5V to VCC+2.0 1. Modify Package Information 1. Add 44-pin TSOP package 1. Add access time:90ns 1. Delete MX23L6410RC/MC/YC-90 1. Modify random access: 90ns (max.) for 3.0V~3.6V; 100ns (max.) for 2.7V~3.6V 1. Add Notes: die form: 2.7~3.6V 90ns 1. Add I-grade package 1. Add I-grade temperature 1. Added statement P/N:PM0408 PAGE P3 P3 P3 P1,3 P5,6 P1,7 P1,3 P1,3 P1,3 P1,3 P1,3 P1,3 P1,3 P1,7 P3 P3 P5~7 P1,8 P1,3 P1 P1 DATE JAN/29/1999 SEP/03/1999 DEC/24/1999 DEC/29/2000 JUL/18/2001 P1 P1 P3,4 P10 MAY/25/2004 JUL/15/2004 JUL/29/2004 NOV/07/2006 AUG/03/2001 AUG/21/2001 NOV/26/2001 NOV/29/2001 JAN/15/2002 JUL/19/2002 NOV/21/2002 MAY/13/2003 JUL/09/2003 SEP/08/2003 SEP/26/2003 REV. 3.8, NOV. 07, 2006 9 MX23L6410 Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications. 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