Replacing Spansion S25FL_P with Macronix MX25L_35E

APPLICATION NOTE
Replacing Spansion S25FL_P with Macronix MX25L_35E
1. Introduction
Macronix offers MX25L_35E high performance serial flash in densities from 32Mb to 256Mb. MX25L_35E
and Spansion S25FL_P devices have similar features, performance, and command codes, but there are
differences. This application note explains how to accommodate those differences when replacing Spansion
S25FL_P devices with equivalent Macronix MX25L_35E series flash products.
The information in this document is based on datasheets listed in Section 8. Newer versions of the
datasheets may override the contents of this document.
2. Feature Comparison
Both flash device families have similar features and functions as shown in Table 2-1. Significant differences
are highlighted in blue and may require special considerations.
Table 2-1: Features
Feature
Vcc voltage range
I/O mode*1*2
Macronix MX25L_35E
2.7V ~ 3.6V
1-1-1
1-1-2/1-2-2
1-1-4/1-4-4
Sector Size
4KB/32KB/64KB
Program Buffer Size
Security OTP
Configurable Dummy Cycle
S/W Reset Command
Hold# Pin
Reset# Pin
Individual Block Protection
Manufacturer ID
32Mb
Device ID
64Mb
128Mb
256 Byte
4Kb
Yes*3
Yes
Yes
Yes*4
Yes
C2h
20h/16h
20h/17h
20h/18h
8-SOP (209 mil)
16-SOP (300mil)
8-WSON (6x5mm)
8-WSON (6x8mm)
24-BGA (4x6 Ball)
Package
Spansion S25FL_P
2.7V ~ 3.6V
1-1-1
1-1-2/1-2-2
1-1-4/1-4-4
64KB w/ 4KB boot sector*2
/256KB
256 Byte
128bit*2
Yes
01h
02h/15h
02h/16h
02h/18h
8-pin SO (209 mil)
16-PIN SOP (300mil)
8-WSON (6x5mm)
8-WSON (8x6mm)
24-BGA (4x6 Ball)
Note:
1. x-y-z in I/O mode indicates the number of active pins used for opcode(x), address(y) and data(z).
2. S25FL128P doesn’t support multi I/O mode, 4KB boot sector, Security OTP.
3. MX25L12835E doesn’t support Configurable Dummy Cycles.
4. MX25L12835E supports Reset# Pin in 16-SOP package only.
P/N: AN0189
1
REV.1, Sep 07, 2014
APPLICATION NOTE
3. Performance Comparison
Tables 3-1 and 3-2 show MX25L_E series and S25FL_P series AC performance which should be
used as a reference for the design.
Table 3-1: Read Performance
Parameter
Macronix MX25L_35E
Normal Read (max.)
50MHz
Fast Read (max.)
104MHz
86MHz/104MHz*2
Multo I/O Read 32Mb – 64Mb
(max.)
128Mb
70MHz
15pf
6ns
tCLQV / tV
(max.)
30pf
8ns
Spansion S25FL_P
50MHz*1
104MHz
80MHz
80MHz
7ns(3.0V-3.6V)
8ns
Note:
1. S25FL128P max SCK Clock Frequency for READ command is 40MHz.
2. MX25L3235E/MX25L6435E run 86MHz with 6 dummy cycles; 104Hhz with 8 dummy cycles.
Table 3-2: Write Performance
Parameter
Erase
Chip Erase
Program
Macronix MX25L_35E
Spansion S25FL_P
4KB (typ.)
32KB (typ.)
64KB (typ.)
256KB (typ.)
32Mb (typ.)
64Mb (typ.)
128Mb (typ.)
Byte
60ms
0.5s
0.7s
-25s
50s
80s
12us
page
1.4ms
200ms
-0.5s
2s
32s
64s
128s
-1.5ms/1.2ms w/ ACC
1.2ms/1.0ms w/ ACC*1
Write/Erase Cycles
(Endurance)
100,000
100,000
Note:
1. S25FL128P page program performance.
P/N: AN0189
2
REV.1, Sep 07, 2014
APPLICATION NOTE
4. DC Characteristics Comparison
DC characteristics are similar for both device families.
Table 4-1: Read / Write Current
Parameter
Read Current @
1xI/O
32Mb
64Mb
Macronix MX25L_35E
19mA (max.) @ 104MHz
19mA (max.) @ 104MHz
128Mb
19mA (max.) @ 104MHz
32Mb
Standby Current 64Mb
128Mb
Write Current
80uA (max.)
80uA (max.)
100uA (max.)
25mA (max.)
Spansion S25FL_P
25mA (max.) @ 104MHz
26mA (max.) @ 104MHz
25mA (max.) @ 104MHz
22mA (max.) @ 104MHz *1
200uA (max.)
200uA (max.)
200uA (max.)
26mA (max.)
Note:
1. S25FL128P read current value.
This section will show voltage values between the two families. Generally, Spansion supports ACC
Program Acceleration Voltage for acceleration program, but Macronix doesn’t. The 9V off-line
programming voltage could damage the Macronix device.
Table 4-2: Input / Output Voltage
Parameter
ACC Program
Acceleration Voltage
Input Low Voltage
Input High Voltage
Macronix MX25L_35E
Spansion S25FL_P
-
8.5V ~ 9.5V
-0.3V (min.) / 0.3Vcc(max.)
0.7Vcc (min.) / Vcc+0.5V (max.)
Output Low Voltage
-0.5V (min.) / 0.8 (max.)
0.7VCC (min.) / VCC+0.4V
(max.)
0.4V (max.)
Output High Voltage
VCC-0.2 (min.)
Vcc-0.6 (min.)
P/N: AN0189
3
0.4 (max.)
REV.1, Sep 07, 2014
APPLICATION NOTE
5. Hardware Considerations
Both devices are available in 8-SOP, 16-SOP, 8-WSON and 24-BGA packages with
identical footprints. The figures below show the common packages and the pinout
assignments for the Macronix and Spansion devices.
16-SOP (300mil)
HOLD#/SIO3
VCC
1
2
16
SCLK
HOLD#/IO3
1
16
SCK
HOLD#/IO3
1
16
SCK
SI/SIO0
VCC
2
15
SI/IO0
VCC
2
15
SI
NC
DNC
3
14
DNC
NC
3
14
PO6
13
DNC
PO2
4
13
PO5
12
DNC
PO1
5
12
PO4
NC
3 Reset# for MX25L12835E
15
14
NC
4
13
NC
DNC
4
NC
5
12
NC
DNC
5
NC
6
11
NC
DNC
6
11
DNC
PO6
6
11
PO3
CS#
7
10
GND
CS#
7
10
GND
CS#
7
10
GND
SO/SIO1
8
9
SO/IO1
8
9
SO/PO7
8
9
MX25L_35E
WP#/SIO2
S25FL_P
WP# /ACC/IO2
S25FL128P
WP# /ACC
Reset# and Hold# signals are internal pull high
8-SOP (200mil): Macronix and Spansion 32Mb device
CS#
1
2
SO/SIO1
WP#SIO2
3
GND
4
MX25L_35E
8
VCC
7
6
Hold#/SIO3
CS#
5
SI/SIO0
SCLK
SO/SIO1
1
2
WP#/ACC/SIO2
3
GND
4
S25FL_P
8
VCC
7
6
Holdt#/SIO3
5
SI/SIO0
SCK
Hold# signal is internal pull high
8-WSON (6x5mm, 8x6mm)
1
8
VCC
SO/SIO1
2
7
Hold#/SIO3
WP#SIO2
3
6
SCLK
GND
4
5
SI/SIO0
CS#
MX25L_35E
CS#
1
SO/SIO1
2
WP#/ACC/SIO2 p
GND
3
S25FL_P
4
8
VCC
7
HOLD#/SIO3
6
SCK
5
SI/SIO0
CS#
1
SO
2
WP#/ACC p
GND
3
4
S25FL128P
8
VCC
7
HOLD#
6
SCK
5
SI
Hold# signal is internal pull high
24-BGA (6x4 ball array): Macronix and Spansion 64Mb device
4
NC
VCC
WP#/
SIO2
HOLD
#/SIO3
NC
NC
4
NC
VCC
WP#/
ACC/S
IO2
HOLD
#/SIO3
NC
NC
3
NC
GND
NC
SI/SIO
0
NC
NC
3
NC
GND
NC
SI/IO0
NC
NC
NC
NC
2
NC
SCLK
CS#
SO/SI
O1
NC
NC
2
NC
SCK
CS#
SO/IO
1
NC
NC
1
NC
NC
NC
NC
NC
NC
1
NC
NC
NC
NC
NC
NC
A
B
C
D
E
F
A
B
C
D
E
F
Hold# signal is internal pull high
P/N: AN0189
4
REV.1, Sep 07, 2014
APPLICATION NOTE
6. Software Considerations
Basic command sets of both flash families are similar. Status Register and Configuration Register
definitions may be slightly different, but the concepts are the same. Minor modifications to the
algorithm may be necessary depending on your application. See the Macronix datasheet for a
complete list of commands, as additional features are provided and not shown.
Table 6-1: Command Comparison
Instruction
Instruction
Type
Read ID
Read
RDID
READ
FAST_READ
DREAD
2READ
QREAD
4READ
Write
Register
Other Command
WREN
WRDI
PP
SE 4K
SE 32K
SE 64K
CE
RDSR
RDCR
WRSR
RDSCUR
WRSCUR
DP
RES
OTPP
OTPR
ENSO
EXSO
Entry
Exit
RSTEN
RST
Description
Read Identification
Read Data Bytes
Read Data Bytes at Higher Speed
1I/2O read
2xI/O Read
1I/4O read
4xI/O Read
Write Enable
Write Disable
Page Program
Sector Erase
Sector Erase 32KB
Sector Erase 64KB
Chip Erase
Read Status Register
Read Configuration Register
Write Status Register
Read Security Register
Write Security Register
Deep Power Down
Release from Deep Power Down
Program OTP memory
Read OTP Memory
Enter Secure OTP
Exit Secure OTP
Enter x8 Parallel Mode
Exit x8 Parallel Mode
Reset Enable
Reset Memory
Macronix Spansion
MX25L_35E S25FL_P
9Fh
03h
0Bh
3Bh
BBh
6Bh
9Fh
03h
0Bh
3Bh*1
BBh*1
6Bh*1
EBh
EBh
*1
06h
04h
02h
20h
52h
D8h
60 or C7h
06h
04h
02h
20h*1
20h*2 or D8h
60 or C7h
05h
15h
01h
2Bh
2Fh
B9h
ABh
B1h
C1h
66h
99h
05h
35h
01h
B9h
ABh
42h
4Bh
55h*1
45h*1
-
Note:
1. S25FL128P doesn’t support multi I/O mode, 4KB boot sector, Security OTP, and has special x8 Parallel mode.
2. S25FL128P option 00 device supports 64KB erase size and uses both 20h and D8h to erase the 64KB block.
S25FL128P option 01 device supports 256KB erase size and uses only D8h to erase the 256KB block.
P/N: AN0189
5
REV.1, Sep 07, 2014
APPLICATION NOTE
6-2. Status Register, Configuration Register, and Security Register
Both devices use registers to setup flash conditions, but there are some differences that designers need to
be aware of as modifications to software may be needed. A detailed register comparison is shown in Table
6-2 to Table 6-4. If a detailed functional description of register bits is required please refer to the datasheets
listed in section 8.
Table 6-2: Status Register
Register Bit
Macronix MX25L_35E
Bit0
Bit1
Bit2
Bit3
Bit4
Bit5
Bit6
Bit7
WIP; 1=write operation
WEL; 1=write enable
BP0; BP protection
BP1; BP protection
BP2; BP protection
BP3; BP protection
QE; 1=Quad mode enable
SRWD; 1=SR write disable
Table 6-3: Configuration Register
Register Bit
Macronix MX25L_35E
Bit0
Bit1
Bit2
Bit3
Bit4
Bit5
Bit6
Bit7
Reserved
Reserved
Reserved
TB; 1=Bottom area protect
Reserved
Reserved
Reserved
DC; 1=8 dummy cycle
Table 6-4: Security Register
Register Bit
Macronix MX25L_35E
Bit0
Bit1
Bit2
Bit3
Bit4
Bit5
Bit6
Bit7
4Kb Secured OTP; 1=factory
lock
LDSO; 1=OTP lock down
Reserved
Reserved
CP mode; 1=CP mode enable
P_FAIL; 1=program fail
E_FAIL; 1=erase fail
WPSEL; 1=individual WP
Spansion S25FL_P
WIP; 1=write operation
WEL; 1=write enable
BP0; BP protection
BP1; BP protection
BP2; BP protection
*1
E_ERR; 1=erase fail
*1
P_ERR; 1=program fail
SRWD; 1=SR write disable
Spansion S25FL_P
FREEZE; 1=BPx write disable
QUAD; 1=Quad mode enable
*2
TBPARM; 1= Top parameter sector
BPNV; 1=BPx is Volatile
NA
TBPROT; 1=boot array protect
NA
NA
Spansion S25FL_P
-
-
Note:
1. S25FL128P doesn’t have E_ERR & P_ERR function. It’s NA in 256KB structure and BP3 in 64KB structure.
2. Bit2 of Configuration Register is NA in the S25FL129P with 256KB structure option.
3. MX25L12835E and S25FL128P don’t have Configuration Register.
P/N: AN0189
6
REV.1, Sep 07, 2014
APPLICATION NOTE
6-3. Manufacturer ID and Device ID
Manufacturer IDs are different. This permits software to identify the device manufacturer. The
Device IDs are different in the 32Mb and 64Mb densities. The same command is used to read the
different IDs.
Table 6-5: Manufacturer and Device ID
Command Type
32Mb
RDID 9Fh
64Mb
128Mb
32Mb
REMS 90h
64Mb
128Mb
Macronix MX25L_35E
C2h/20h/16h
C2h/20h/17h
C2h/20h/18h
C2h/15h
C2h/16h
C2h/17h
Spansion S25FL_P
01h/02h/15h
01h/02h/16h
01h/02h/18h
01h/15h
01h/16h
01h/17h
7. Summary
The Macronix MX25L_35E and Spansion S25FL_P have similar commands, functions, and
features. Additionally, the supported package types have identical footprints and nearly identical
pinout definitions. A more detailed analysis should be done if any of the “special” functions not
supported by the Macronix flash are used, such as the Spansion 8KB erase size, 8-bit parallel
programming, or the 9V off-line accelerated programming voltage. Commands to access and
program the OTP area are different as well. If common features are used in standard traditional
modes, the replacement may need only minimal software modification.
8. References
Table 8-1 shows the datasheet versions used for comparison in this application note. For the most
current, detailed specification, please refer to the Macronix Website at http://www.macronix.com
Table 8-1: Datasheet Version
Datasheet
MX25L3235E
MX25L6435E
MX25L12835E
S25FL032P
S25FL064P
S25FL128P
S25FL129P
P/N: AN0189
Location
Website
Website
Website
Website
Website
Website
Website
7
Data Issued
JUN. 18, 2012
APR. 19, 2012
MAY 28, 2012
DEC. 07, 2011
NOV. 18, 2011
May. 16, 2012
May. 16, 2012
Version
Rev. 1.1
Rev. 0.05
Rev. 1.3
Rev. 06
Rev. 05
Rev. 10
Rev. 07
REV.1, Sep 07, 2014
APPLICATION NOTE
9. Appendix
Table 9-1 shows the basic part number and package information cross reference
between Macronix MX25L_35E and Spansion S25FL_P parts.
Table 9-1: Part Number Cross Reference
Density
32Mb
64Mb
Macronix Part No.
Spansion Part No.
Package
Dimension
MX25L3235EMI-10G
S25FL032P0XMFI00
16-SOP
300 mil
MX25L3235EM2I-10G
S25FL032P0XMFI01
8-SOP
208 mil
MX25L3235EZNI-10G
S25FL032P0XNFI01
8-WSON
6x5mm
MX25L6435EMI-10G
S25FL064P0XMFI00
16-SOP
300 mil
MX25L6435EM2I-10G
-
8-SOP
208 mil
MX25L6435EZNI-10G
-
8-WSON
6x5mm
MX25L6435EXCI-10G
S25FL064P0XBHI03
24-BGA
6x4 Ball
16-SOP
300 mil
8-WSON
8x6mm
/
MX25L12835EMI-10G
128Mb
S25FL128P0XMFI00 01
S25FL129P0XMFI00/01
/
MX25L12835EZNI-10G
*1
25FL128P0XNFI00 01
*1
*1
S25FL129P0XNFI00/01
*1
Note:
1. S25FL128P & S25FL129P have two sector structures. 00:64KB structure; 01: 256KB structure.
P/N: AN0189
8
REV.1, Sep 07, 2014
APPLICATION NOTE
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit,
Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo,
BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV,
and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes
only
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0189
9
REV.1, Sep 07, 2014