RS1A thru RS1MA

RS1A thru RS1MA
Glass Passivated Junction Fast Switching Rectifiers
Reverse Voltage 50 to 1000V Forward Current 1.0A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically
bonded construction
* Cavity-free glass passivated junction
* Capable of meeting environmental standards
of MIL-S-19500
* Fast Switching for high efficiency
* Typical IR less than 1.0µA
* High temperature soldering guaranteed:
260°C/10 seconds
Mechanical Data
Case: JEDEC DO-214AC, molded plastic over glass die
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0023oz., 0.065 g
Handling precautin:None
We declare that the material of product compliance
with ROHS requirements
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Device marking code
Maximum repetitive peak reverse voltage
symbol
VRRM
Maximum RMS voltage
VRMS
VDC
Maximum DC blocking voltage
Maximum average forward rectified current
IF(AV)
0.375" (9.5mm) lead length SEE Fig. 1
Peak forward surge current 8.3ms single half sine-wave
IFSM
superimposed on rated load (JEDEC Method)
Typical thermal resistance (Note 2)
RθJA
Operating junction and storage temperature range
RS1A RS1B RS1D RS1G
S1A
S1B
S1D
S1G
50
100
200
400
RS1J
S1J
600
RS1K RS1M RS1MA
S1K
S1M S1MA
800
1000
1000
Unit
V
35
70
140
280
420
560
700
700
V
50
100
200
400
600
800
1000
1000
V
TJ, TSTG
1.0
A
30
A
75
°C/W
–65 to +175
°C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current TA = 25°C
at rated DC blocking voltage TA = 125°C
Typical reverse recovery time (Note 1)
Typical junction capacitance at 4.0V, 1MHz
NOTES:
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2. 8.0mm2 (.013mm thick) land areas
symbol
VF
RS1A RS1B RS1D RS1G RS1J
1.30
5.0
50
IR
trr
CJ
RS1K RS1M RS1MA
150
µA
250
8
Unit
V
500
300
ns
PF
RS1A thru RS1MA
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
0.5
60 Hz
Resistive or
Inductive Load
0.375" (9.5mm) Lead Length
0
0
25 50 75 100 125 150 175
Ambient Temperature, °C
Fig 3. – Typical Instantaneous Forward
Characteristics
100
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
10
1.0
0.1
1000
50
TJ = TJ max
8.3ms Single Half Sine-wave
(JEDEC Method)
40
30
20
10
0
1
Tj=125℃
10
1.0
0.1
Tj=25℃
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 6. – Typical Junction Capacitance
100
10
1.0
0.01
0.1
1.0
10
t,Pulse duration,sec
100
100
100
0.01
0.8
1.0
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
Fig 5. –typical transient thermal
impedance
100
10
Number of Cycles at 60Hz
Fig 4. – Typical Reverse Characteristics
Junction Capacitance (pF)
Transient thermal impedance(°C/W)
0.01
0.6
Average Forward Rectified Current (A)
1.0
Instantaneous Reverse Current (µA)
Instantaneous Forward Current (A)
Average Forward Rectified Current (A)
Fig. 1 – Forward Current Derating Curve
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
10
1.0
0.1
1
10
Reverse Voltage (V)
100
RS1A thru RS1MA
3. dimension:
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
2 页
SMD产品通用包装材料规格以及包装产品数量
General packaging materials spec. and quantity
1.1 卷装 reel
A.卷盘规格reel spec
单位:mm
规格
SMA 7"卷盘
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
A
177.0±2.0
330.0±2.0
330.0±2.0
330.0±2.0
B
54.0±0.5
75.0±0.5
75.0±0.5
75.0±0.5
C
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
每卷数量
2K
5K
3K
3K
W
13.2±0.2
13.2±0.2
13.5±0.5
17.0±0.5
B. 13"卷盘内盒 inner box
单位:mm
尺寸
A
335±5.0
B
335±2.0
C
40±1.0
按以上包装方式,产品包装数量:quantity
规格
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
每盒数量
10K
6K
6K
标题Titile:
塑封生产线SMD产品包装规范
文件编号:
WI-258
文件编号:
WI-258
Packaging specification of SMD
第
3
页
C. 7"卷盘盒 box
单位:mm
尺寸
A
B
C
188±2.0
188±2.0
138±2.0
按以上包装方式,产品包装数量:quantity
每盒数量
16K
7"卷盘
D. 卷盘外箱 reel carton
单位:mm
尺寸
A
B
C
350±2.0
340±2.0
350±2.0
按以上包装方式,产品包装数量:
规格
SMA 7"卷盘
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
1.2 编带规格 tape spec
A. 盖带 Cover tape
单位:mm
A
SMA
SMB
9.30±0.10
SMC
13.30±0.10
B
0.068±0.005
每箱数量
80K
80K
48K
36K
文件编号:
标题Titile:
第 3 版
Packaging specification of SMD
B. 载带
t
Do
Po
P2
B'
第
P1
A
D1
A'
Bo
W
F
E
塑封生产线SMD产品包装规范
B
SEC.:B-B'
Ao
Ko
产品负极端(编
带有孔一边)
SEC.:A-A'
WI-258
第 0 次修改
4
页
类型
SMA
SMB
SMC
W
12±0.3
12±0.3
16±0.3
P1
4±0.1
8±0.1
8±0.1
E
1.75±0.1
F
5.5±.05
1.75±0.1 1.75±0.1
5.5±0.05 7.5±.05
D0
D1
1.55±0.05 1.55±0.05 1.55±0.05
1.5±0.1
1.55±0.05 1.55±0.05
P0
4±0.1
4±0.1
4±0.1
P2
2±0.05
2±0.05
2±0.05
10P0
40±0.2
40±0.2
40±0.2
A0
2.79±0.1
3.8±0.1
6.05±0.1
B0
5.33±0.1
5.4±0.1
8.31±0.1
K0
2.36±0.1
T
2.45±0.1 2.54±0.1
0.25±0.05 0.25±0.05 0.25±0.05
2、SMD产品通用包装规范 General spec of SMD
5.2.1国内客户domestic
A. 7"卷盘reel
所有标签贴在卷盘负极 all the label on cathode side
B
A
C
C
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签 HF label
B. 13"卷盘 所有标签贴在卷盘负极 all the label on
(无卤产品才贴HF
cathode side only)
A
B
C
B
C
A
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签(无卤产品才贴HF only)
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
5
页
C. 标签要求label spec:
LRC标签label
******
LRC产品型号 type
******
产品数量 quantity
******
产品批号 LOT
******
产品生产日期
ROHS标签
date
无卤标签 HF label
Green
2.2 国外客户
overseas
所有标签贴在卷盘负极 all the label on cathode side
A
B
C
7"卷盘盒 inner box
13"卷盘内盒inner box
B
C
C
A
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签HF label
(无卤产品才贴HF only)
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
6
页
LRC标签label
TYPE:******
MARK:******
Q'TY:******
DATE:******
LRC产品型号
印字型号
产品数量
产品生产日期
ROHS标签
无卤标签 HF label
Green
注意事项NOTE:
1. 13"卷盘内盒装好产品,需用热缩膜包装;13"reel’inner box must be packed by shrink film
2. 所有编带产品卷装完成后,用白色胶带将编带粘牢;
every tape after packing,must be fixed by white adhesive tape
3.1产品出厂检验报告 testing report of the OQC
每批出货时,需要附上出厂检验报告 every lot must with test report
3.2尾箱
同一编码每批次只允许出现一个尾数箱,对于尾数物料,须用缓冲材料对空余部分填充好,
保证物料在受到一定的外作用力下不发生明显移动,且物料间无碰撞。
The same coding is only one ending for each batch box materials for the mantissa to
be good filled with cushioning material.
RS1A thru RS1MA
4. Update Record
版次
更新记录
更新作者
更新日期
1
第一版
周杰
2007.02.02
2
1.调整版面;2.增加包装规范;3.增加焊板尺寸
周杰
2012.02.06