diode terminator networks EU features • • • • • • Fast reverse recovery time Fast turn on time Low capacitance SMD packages 16 kV IEC61000-4-2 capable Products with lead-free terminations meet EU RoHS and China RoHS requirements dimensions and construction S03 L S04 P Bonding Wire Die Pad W d Si Wafer Molded Resin S06 L L N08, Q20, Q24 Bonding Wire Si Wafer Molded Resin Molded Resin d Die Si Pad Wafer W d Die Pad 225mw S03 225mw S04 Lead 225mw S06 400mw N08 L Bonding Wire d Lead W Bonding Wire W Lead p p Package Total Code Power Lead p 1000mw Q20 1000mw Q24 Pins 3 Dimensions inches (mm) Ht d ±0.05 L ±0.2 W ±0.2 p ±0.1 Pkg ±0.2 4 6 8 20 24 .115 (2.92) .091 (2.30) .075 (1.91) .037 (0.95) .017 (0.43) .115 (2.92) .091 (2.30) .075 (1.91) .037 (0.95) .017 (0.43) .115 (2.92) .110 (2.80) .037 (0.95) .037 (0.95) .017 (0.43) .190 (4.83) .341 (8.66) .236 (5.99) .236 (5.99) .050 (1.27) .025 (0.635) .063 (1.60) .063 (1.60) .016 (0.41) .010 (0.25) .341 (8.66) .236 (5.99) .025 (0.635) .063 (1.60) .010 (0.25) Die Pad Si Wafer Molded Resin circuit schematic 1 1 DNA: 20 pins DN5: 24 pins DN2: 20 pins 1 1 DN6: 8 pins 1 1 DN3: 6 pins 1 DN4: 4 pins DN7: 24 pins For further information on packaging, please refer to Appendix A. Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 12/28/10 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 111 resistors DN(X) resistors DN(X) diode terminator networks ordering information New Part # DNA Q20 Package Symbol Package type symbol + number of pins S03: 3 pin SOT23 S04: 4 pin SOT23 S06: 6 pin SOT23 N08: 8 pin Narrow SOIC Q20: 20 pin QSOP Q24: 24 pin QSOP Type DNA DN2 DN3 DN4 DN5 DN6 DN7 T Termination Material T: Sn (Other termination styles available, contact factory for options) TEB Packaging TE: 7" embossed plastic (SOT23 only) TEB: 13" embossed plastic application schematic ESD Suppression Signal Conditioning Transient + Rail Signal Ringing Transient Suppressed Driver Ringing Eliminate + Rail Receiver Driver Receiver – Rail or GND – Rail or GND applications and ratings Part Designation DN(X) Forward Voltage 1F=50ma Reverse Breakdown Voltage 1R=1ma Leakage Current @7V Capacitance @1Mhz ESD Voltage Capability IEC 61000-4-2 Operating Temperature Range Continuous Forward Current* 0.4 to 1.2V 7.2V 1uA 2pF 16kV -55°C to +155°C 50mA * One diode conducting Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 112 1/27/14 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com