1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:44 PM Page 5 PMS 300 neg. Black neg. DN(X) diode terminator network EU features circuit protection • • • • Fast reverse recovery time • Fast turn on time Low capacitance • SMD packages 16 kV IEC61000-4-2 capable Products with lead-free terminations meet EU RoHS and China RoHS requirements applications • Signal termination • Signal conditioning • ESD suppression • Transient suppression dimensions and construction S03 S04 L L P p Bonding Wire Bonding Wire d Lead Si Wafer W d Molded Resin Molded Resin N08, Q20, Q24 S06 L p Die Si Pad Wafer L Bonding Wire Bonding Wire d Lead Si Wafer Molded Resin Dimensions inches (mm) Ht d ±0.05 L ±0.2 W ±0.2 p ±0.1 Pkg ±0.2 S03 225mw 3 .115 (2.92) .091 (2.30) .075 (1.91) .037 (0.95) .017 (0.43) S04 225mw 4 .115 (2.92) .091 (2.30) .075 (1.91) .037 (0.95) .017 (0.43) S06 225mw 6 .115 (2.92) .110 (2.80) .037 (0.95) .037 (0.95) .017 (0.43) N08 400mw 8 Q20 1000mw 20 .190 (4.83) .341 (8.66) .236 (5.99) .236 (5.99) .050 (1.27) .025 (0.635) .063 (1.60) .063 (1.60) .016 (0.41) .010 (0.25) Q24 1000mw 24 .341 (8.66) .236 (5.99) .025 (0.635) .063 (1.60) .010 (0.25) p W W Pins Lead Die Pad W Package Total Code Power d Die Pad Lead Die Pad Si Wafer Molded Resin circuit schematic 1 1 1 1 1 DN5: 24 pins 1 DN3: 6 pins DN2: 20 pins DNA: 20 pins DN4: 4 pins 1 DN6: 8 pins DN7: 24 pins For further information on packaging, please refer to Appendix A. Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 200 11/21/08 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:44 PM Page 6 DN(X) diode terminator network ordering information DNA Q20 T Package Symbol Package type symbol + number of pins S03: 3 pin SOT23 S04: 4 pin SOT23 S06: 6 pin SOT23 N08: 8 pin Narrow SOIC Q20: 20 pin QSOP Q24: 24 pin QSOP Type DNA DN2 DN3 DN4 DN5 DN6 DN7 Termination Material T: Sn (Other termination styles available, contact factory for options) TEB Packaging TE: 7" embossed plastic TEB: 13" embossed plastic tape application schematic ESD Suppression Signal Conditioning Transient + Rail Signal Ringing Transient Suppressed Driver Ringing Eliminate + Rail Receiver Driver Receiver – Rail or GND – Rail or GND applications and ratings Part Designation Forward Voltage 1F=50ma Reverse Breakdown Voltage 1R=1ma Leakage Current @7V Capacitance @1Mhz ESD Voltage Capability IEC 61000-4-2 Operating Temperature Range Continuous Forward Current* DN(X) 0.4 to 1.2V 7.2V 1uA 2pF 16kV -55°C to +125°C 50mA * One diode conducting Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 11/21/08 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 201 circuit protection New Part #