IXD_614SI Automotive Grade 14-Ampere, Low-Side, Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • • • • The IXD_614SI is an automotive grade, high-speed gate driver that is qualified according to AEC Q100 standards. The IXD_614SI output can source and sink 14A of peak current, while producing rise and fall times of less than 35ns. Both the output and input are rated to 35V. The input is virtually immune to latch-up, and proprietary circuitry eliminates cross conduction and "shoot-through." The IXD_614SI has a Grade 1, -40°C to +125°C ambient operating temperature range. • • • • • AEC Q100 Qualified 14A Peak Source/Sink Drive Current Wide Operating Voltage Range: 4.5V to 35V AEC Q100 Grade 1 -40°C to +125°C Operating Temperature Range Logic Input Withstands Negative Swing of up to 5V Matched Rise and Fall Times Low Propagation Delay Time Low, 10A Supply Current Low Output Impedance Applications • • • • Automotive DC/DC Regulators Electronic Power Steering Electric Vehicle Power Train Drives Brushless DC Motors The IXDD614SI is configured as a non-inverting driver with an enable, the IXDN614SI is configured as a non-inverting driver, and the IXDI614SI is configured as an inverting driver. The AEC Q100 qualified IXD_614SI is available in an 8-pin Power SOIC package with an exposed metal back. Ordering Information Logic Configuration Part Number Package Type IXDD614SI IN IXDD614SITR IXDI614SI IXDI614SITR OUT 8-Pin Power SOIC with Exposed Metal Back IXDN614SI IXDN614SITR DS-IXD_614SI-R01 IN Quantity Tube 100 Tape & Reel 2000 Tube 100 Tape & Reel 2000 Tube 100 Tape & Reel 2000 OUT EN IN Packing Method OUT www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IXD_614SI 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 5 5 2. IXD_614SI Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD614SI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI614SI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDN614SI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 7 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 11 11 11 11 12 R01 IXD_614SI INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD614SI Pin Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT GND 4 5 GND Description IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI614SI VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT GND 4 5 GND NC Not connected IXDN614SI VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT GND 4 5 GND 1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Current Junction Temperature Storage Temperature Symbol Minimum Maximum Units VCC -0.3 40 V VIN, VEN -5 VCC+0.3 V IOUT TJ TSTG - ±14 -55 +150 A °C -65 +150 °C Unless stated otherwise, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range R01 Symbol Range Units VCC TA 4.5 to 35 V -40 to +125 °C www.ixysic.com 3 IXD_614SI INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 Input Current 0V < VIN < VCC IIN - - ±10 EN Input Voltage, High IXDD614SI only VENH 2/3VCC - - EN Input Voltage, Low IXDD614SI only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.4 0.8 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.3 0.6 IDC - - ±4 tR Units V A V V Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V - 25 35 Fall Time CLOAD=15nF, VCC=18V tF - 18 25 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 50 70 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 50 70 Enable to Output-High Delay Time IXDD614SI only tENOH - 31 60 Disable to High Impedance State Delay Time IXDD614SI only tDOLD - 44 70 Enable Pull-Up Resistor IXDD614SI only REN - 200 - k - 1 2 mA - <1 10 - <1 10 Output Current, Continuous VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC 4 www.ixysic.com ICC A ns A R01 IXD_614SI INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: 4.5V < VCC < 35V. Parameter Conditions Symbol Minimum Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 0V < VIN < VCC IIN - ±10 Output Voltage, High - VOH VCC-0.025 - Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 1.5 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.2 IDC - ±1 tR - 50 Input Current Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V Fall Time CLOAD=15nF, VCC=18V tF - 40 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 90 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 90 IXDD614SI only tENOH - 75 IXDD614SI only tDOLD - 85 - 3 - 150 - 150 Output Current, Continuous Enable to Output-High Delay Time Disable to High Impedance State Delay Time VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V ICC VCC=18V, VIN=VCC Units V A V A ns mA A 1.7 Thermal Characteristics Package SI (8-Pin Power SOIC) R01 Parameter Symbol Rating Thermal Resistance, Junction-to-Ambient JA 85 Thermal Resistance, Junction-to-Case JC 10 www.ixysic.com Units °C/W 5 IXD_614SI INTEGRATED CIRCUITS DIVISION 2 IXD_614SI Performance 2.1 Timing Diagrams VIH IN VIH IN VIL tondly VIL toffdly toffdly tondly 90% OUT OUT 10% 90% 10% tf tr tf tr 2.2 Characteristics Test Diagram + 0.1μF 10μF OUT VCC EN VIN 6 VCC IN VCC - GND CLOAD www.ixysic.com Tektronix Current Probe 6302 R01 IXD_614SI INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IXDD614SI 3.3 IXDN614SI VCC VCC IN OUT OUT IN GND EN GND IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 x 0 Z 3.2 IXDI614SI VCC OUT IN GND R01 IN OUT 0 1 1 0 www.ixysic.com 7 IXD_614SI INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) 60 50 CL=15nF CL=7.5nF CL=3.6nF 60 50 Fall Time (ns) 40 30 20 CL=15nF CL=7.5nF CL=3.6nF 40 30 20 10 10 0 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 30 25 40 20 35 30 25 15 10 10 6 8 10 12 Load Capacitance (nF) tOFFDLY 150 tONDLY 50 14 2 16 4 6 8 10 12 Load Capacitance (nF) Propagation Delay vs. Input Voltage (VIN=0-5V, f=1kHz, CL=15nF, VCC=12V) 160 Propagation Delay (ns) Propagation Delay (ns) 4 Propagation Delay vs. Supply Voltage (VIN=0-5V, f=1kHz, CL=15nF) 100 140 120 100 80 tOFFDLY 60 tONDLY 5 10 15 20 25 30 Supply Voltage (V) 35 Input Threshold vs. Temperature (CL=3.6nF, VCC=18V) 3.0 Min VIH 2.5 Max VIL 2.0 1.5 4 6 8 10 Input Voltage (V) 12 0 100 120 140 20 40 60 80 Temperature (ºC) 100 120 140 16 Propogation Delay vs. Junction Temperature (VIN=0-5V, f=1kHz, CL=15nF, VCC=18V) tOFFDLY 65 60 tONDLY 55 50 45 14 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 140 Enable Threshold vs. Supply Voltage 25 3.5 3.0 Min VIH 2.5 Max VIL 2.0 20 Min VENH 15 Max VENL 10 5 0 1.5 -40 -20 20 40 60 80 Temperature (ºC) 14 Input Threshold vs. Supply Voltage Input Threshold (V) 3.5 0 40 2 40 Enable Threshold (V) 0 Input Threshold (V) 70 40 0 8 -40 -20 5 2 200 tF 20 15 5 250 40 tR VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 45 Fall Time (ns) 40 Rise Time (ns) 50 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 45 15 14 13 12 11 10 9 8 7 6 5 Rise & Fall Time vs. Temperature (VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V) Fall Time vs. Load Capacitance Rise Time vs. Load Capacitance 50 35 Propagation Delay (ns) Rise Time (ns) 70 Time (ns) 80 Fall Time vs. Supply Voltage (VIN=0V-5V, f=10kHz, TA=25ºC) 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 R01 IXD_614SI INTEGRATED CIRCUITS DIVISION f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1000 Supply Current vs. Load Capacitance (VCC=18V) f=2MHz f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1 f=1kHz 1000 Supply Current (mA) Supply Current (mA) f=2MHz Supply Current (mA) 1000 Supply Current vs. Load Capacitance (VCC=35V) Supply Current vs. Load Capacitance (VCC=12V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz f=10kHz 1 f=1kHz f=1kHz 0.1 6 8 10 12 14 Load Capacitance (nF) 16 Supply Current vs. Load Capacitance (VCC=8V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz 1 f=10kHz f=1kHz 0.1 2 18 18 2 10 1 16 100 10 1 10 100 1000 Frequency (kHz) 1 10 100 1000 Frequency (kHz) 1 0.1 1.0 0.8 0.6 0.4 0.2 0.0 100 1000 Frequency (kHz) 0 20 40 60 80 Temperature (ºC) 100 120 140 10000 3.5V 5V 10V 0V & 18V 1.0 0.5 0.0 -25 -20 -15 -10 -5 0 20 40 60 80 Temperature (ºC) 100 120 140 Output Sink Current vs. Supply Voltage (CL=330nF) 45 -30 40 35 30 25 20 15 10 5 0 0 -40 -20 100 1000 Frequency (kHz) 1.5 -0.5 -40 -20 10000 Output Source Current vs. Supply Voltage (CL=330nF) -35 Output Source Current (A) 1.2 10 10 2.0 10 1 Dynamic Supply Current vs. Temperature (VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V) 1 Quiescent Supply Current vs. Temperature CL=15nF CL=7.5nF CL=3.6nF 100 10000 18 10 1 0.01 0.1 16 CL=15nF CL=7.5nF CL=3.6nF 100 10000 Supply Current vs. Frequency (VCC=8V) 1000 CL=15nF CL=7.5nF CL=3.6nF 6 8 10 12 14 Load Capacitance (nF) 0.1 1 18 Supply Current (mA) 6 8 10 12 14 Load Capacitance (nF) 4 Supply Current vs. Frequency (VCC=18V) 1000 CL=15nF CL=7.5nF CL=3.6nF 100 Supply Current (mA) Supply Current (mA) 4 Supply Current vs. Frequency (VCC=12V) 1000 Supply Current (mA) 16 0.1 2 R01 6 8 10 12 14 Load Capacitance (nF) Supply Current vs. Frequency (VCC=35V) 1000 0.01 1.4 4 Output Sink Current (A) Supply Current (mA) 1000 4 Supply Current (mA) 2 0.1 Supply Current (mA) 1 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IXD_614SI INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (CL=330nF, VCC=18V) 24 Output Sink Current (A) Output Source Current (A) -22 -20 -18 -16 -14 -12 -10 0 20 40 60 80 Temperature (ºC) 100 120 140 22 21 20 19 18 17 -40 -20 High-State Output Resistance @ -10mA vs. Supply Voltage 0 20 40 60 80 Temperature (ºC) 100 120 140 Low-State Output Resistance @ +10mA vs. Supply Voltage 1.0 0.7 0.9 Output Resistance (Ω) Output Resistance (Ω) 23 16 -40 -20 0.8 0.7 0.6 0.5 0.4 0.3 0.6 0.5 0.4 0.3 0.2 0.1 0 10 Output Sink Current vs. Temperature (CL=330nF, VCC=18V) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 www.ixysic.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 R01 IXD_614SI INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating of 1, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. R01 Device Maximum Temperature x Time Maximum Reflow Cycles IXD_614SI All Versions 260°C for 30 seconds 3 www.ixysic.com 11 IXD_614SI INTEGRATED CIRCUITS DIVISION 5.4 Mechanical Dimensions 5.4.1 IXD_614SI Package (8-Pin Power SOIC with Exposed Metal Back) 3.80 (0.150) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 1.55 (0.061) 5.40 2.75 (0.209) (0.108) Pin 1 0.406 ± 0.076 (0.016 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 0.60 (0.024) 1.27 (0.050) 1.270 REF (0.050) Recommended PCB Land Pattern 1.346 ± 0.076 (0.053 ± 0.003) 2.540 ± 0.254 (0.100 ± 0.010) 7º 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) Dimensions mm (inches) 3.556 ± 0.254 (0.140 ±0.010) Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for carrying current. 5.4.2 IXD_614SITR Tape & Reel Information 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_614SI-R01 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/28/2015 12 www.ixysic.com R01