PLA110

PLA110
Single Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
400
Units
VP
150
22
mArms / mADC

Description
PLA110 is a normally open (1-Form-A) solid
state relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation. Its optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
Features
• 3750Vrms Input to Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• FCC Compatible
• VDE Compatible
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
The PLA110 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or thru-hole
package.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, PocketSize)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Ordering Information
Part #
PLA110
PLA110S
PLA110STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
- Control
NC
1
6
2
5
3
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-PLA110-R07
toff
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1
INTEGRATED CIRCUITS DIVISION
PLA110
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Min
3750
-40
-40
Max
400
5
50
1
150
800
+85
+125
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
2
Conditions
Min
Typ
Max
Units
-
-
150
250
±400
mArms / mADC
mADC
mAP
-
22
7
1

ILEAK
-
VL=50V, f=1MHz
ton
toff
COUT
-
25
1
0.5
-
IL=150mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
t=10ms
IL=150mA
IL=250mA
VL=400VP
IF=5mA, VL=10V
Symbol
IL
ILPK
RON
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A
ms
pF
R07
INTEGRATED CIRCUITS DIVISION
PLA110
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Device Count (N)
Device Count (N)
30
25
20
15
10
25
25
20
20
Device Count (N)
35
15
10
5
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
15
10
5
5
0
0
1.17
1.21
1.23
0
0.23
1.25
0.26
0.29
0.32
0.35
0.38
0.12
0.17
0.22
0.27
0.32
0.37
LED Forward Voltage Drop (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=150mADC)
Typical IF for Switch Dropout
(N=50)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mADC)
25
15
10
5
35
30
20
Device Count (N)
20
Device Count (N)
Device Count (N)
25
1.19
15
10
5
0.75
1.05
1.35
1.65
1.95
20
15
10
5
0
0
25
0
0.75
2.25
1.05
1.35
1.65
1.95
2.25
15
16
LED Current (mA)
LED Current (mA)
17
18
19
20
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
441.5 450.5
459.5
468.5
477.5
486.5
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=150mADC)
1.8
0.40
1.4
IF=50mA
1.2
IF=10mA
IF=5mA
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
Turn-Off Time (ms)
1.6
Typical Turn-Off Time
vs. LED Forward Current
(IL=150mADC)
0.12
0.35
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0.30
0.25
0.20
0.15
0.10
0.10
0.08
0.06
0.04
0.02
0.05
0
0
0
5
10
15
20
25
30
35
Forward Current (mA)
40
45
50
0
5
10
15
20
25
30
35
40
45
50
Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
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3
INTEGRATED CIRCUITS DIVISION
PLA110
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IL=150mADC)
0.6
IF=5mA
IF=10mA
15
10
5
-20
0
20
40
60
80
0.3
0.2
100
0.2
0.15
0.1
0
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical On-Resistance
vs. Temperature - DC Configuration
(IL=150mADC)
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
3.0
IF=5mA
IF=10mA
6
2.0
1.5
1.0
-20
0
20
40
60
80
-40
1.0
-20
0
20
40
60
80
-40
100
0
20
40
60
80
Temperature (ºC)
Temperature (ºC)
Typical On Resistance
vs. Temperature
(IF=5mA; IL=100mA Instantaneous)
Typical Load Current vs. Load Voltage
(IF=5mA)
Maximum Load Current
vs. Temperature
(N=50)
150
Load Current (mA)
20
15
10
5
100
50
0
-50
-20
0
20
40
60
80
100
-150
-2.5 -2.0 -1.5 -1.0 -0.5
120
Temperature (ºC)
250
150
0
0
-40
0.5 1.0 1.5 2.0 2.5
1.0
Load Current (A)
0.030
Leakage (PA)
475
0.025
0.020
0.015
0.010
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
20
40
60
80
100
120
0.8
0.6
0.4
0.2
0.005
450
0
Energy Rating Curve
1.2
455
-20
Temperature (ºC)
0.035
460
IF=10mA
IF=5mA
50
480
465
IF=10mA
IF=5mA
AC/DC Configuration
100
Typical Leakage vs. Temperature
Measured across Pins 4&6
470
DC Configuration
200
Load Voltage (V)
Typical Blocking Voltage
vs. Temperature
100
300
-100
0
-40
-20
Temperature (ºC)
25
-40
1.5
0
0
100
Load Current (mA)
-40
2.0
0.5
0.5
0
100
2.5
2.5
8
7
3.0
LED Current (mA)
9
5
Blocking Voltage (VP)
0.25
0.05
-40
LED Current (mA)
On-Resistance (:)
IF=10mA
0
-40
On-Resistance (:)
0.4
0.1
0
10
0.3
0.5
Turn-Off Time (ms)
20
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
0.35
IF=5mA
Turn-On Time (ms)
On-Resistance (:)
25
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
-20
0
20
40
60
Temperature (ºC)
80
100
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R07
INTEGRATED CIRCUITS DIVISION
PLA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA110 / PLA110S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PLA110 / PLA110S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R07
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5
INTEGRATED CIRCUITS DIVISION
PLA110
Mechanical Dimensions
PLA110
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA110S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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R07
INTEGRATED CIRCUITS DIVISION
PLA110
PLA110STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PLA110-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012