CPC1998

CPC1998
AC Power Switch
INTEGRATED CIRCUITS DIVISION
Characteristics
Description
Parameter
Rating
Units
AC Operating Voltage
20-240
Vrms
CPC1998J is an AC Solid State Switch utilizing dual
power SCR outputs. This device also includes
zero-cross turn-on circuitry and is specified with an
800VP blocking voltage.
Load Current
With 5°C/W Heat Sink
20
No Heat Sink
5
Arms
On-State Voltage Drop
1.1
VP (at IL=2AP)
Blocking Voltage
800
VP
Thermal Resistance,
Junction-to-Case, JC
0.35
°C/W
Features
•
•
•
•
•
•
•
•
•
•
•
•
Load Current up to 20Arms with 5°C/W Heat Sink
800VP Blocking Voltage
5mA Control Current
Zero-Cross Switching
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
2500Vrms Isolation, Input to Output
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
•
•
•
•
•
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500Vrms of isolation between the control and the
output. As a result, the CPC1998 is well suited for
industrial environments where electromagnetic
interference would disrupt the operation of plant facility
communications and control systems.
The unique i4-PAC package pioneered by IXYS allows
Solid State Relays to achieve the highest load current
and power ratings. This package features a unique
IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
Description
CPC1998J
i4-PAC Package (25 per tube)
Pin Configuration
ZC
Approvals
1
2
AC Load
• UL 508 Recognized Component: File E69938
3
4
+ LED – LED
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CPC1998
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
I2t for Fusing
(1/2 Sine Wave, 60Hz)
Isolation Voltage, Input to Output
ESD, Human Body Model
Operational Temperature
Storage Temperature
1
2
Min
-
Max
800
5
50
1
150
3.5
Units
-
200
A2s
- 40
- 40
2500
8
+85
+125
Vrms
kV
VP
V
mA
A
mW
W
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
°C
°C
Derate linearly 1.33mW / °C.
Free air, no heat sink.
1.2 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
Continuous
Continuous
Maximum Surge Current
Off-State Leakage Current
On-State Voltage Drop 1
Off-State dV/dt
Switching Speeds
Turn-On
Turn-Off
Zero-Cross Turn-On Voltage 2
Holding Current
Latching Current
Operating Frequency
Load Power Factor for Guaranteed Turn-On 3
Input Characteristics
Input Control Current to Activate 4
Input Dropout Voltage
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
1
2
3
4
Conditions
Symbol
No Heat Sink, VL=20-240Vrms
TC=25°C
1/2 Sine Wave, 60Hz
VL=800V
IL=2AP
IF=0mA
IP
ILEAK
IF=5mA
ton
toff
IL
-
dV/dt
Minimum
Typical
Maximum
0.1
0.1
1000
0.85
-
5
50
150
100
1.1
-
5
44
48
-
0.5
0.5
20
5
50
75
500
-
Units
Arms
A
AP
VP
V/s
1st half-cycle
subsequent half-cycle
f=60Hz
PF
20
0.25
IL=1A Resistive, f=60Hz
IF=5mA
VR=5V
IF
VF
IR
0.8
0.9
-
1.2
-
5
1.4
10
mA
V
V
A
-
CI/O
-
-
3
pF
-
IH
IL
cycles
V
mA
mA
Hz
-
Tested at a peak value equivalent.
Zero-cross first half-cycle @ < 100Hz.
Snubber circuits may be required at low power factors.
For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use IF 10mA.
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CPC1998
INTEGRATED CIRCUITS DIVISION
2 Thermal Characteristics
Parameter
Conditions
Symbol
Rating
Units
-
JC
0.35
°C/W
Free Air
JA
33
°C/W
-
TJ
-40 to +125
°C
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
(TJ - TA)
θCA =
PD
- θJC
TJ = Junction Temperature (°C), TJ ≤ 125°C *
TA = Ambient Temperature (°C)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD = On-State Voltage (Vrms) • Load Current (Arms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
2.3 Thermal Performance Data
Output Power
vs. Load Current
Output Power
vs. Ambient Temperature
40
Output Power (W)
35
30
25
20
40
35
30
25
20
15
15
10
10
5
5
0
0
0
3
Output Power (W)
Heat Sink
1ºC/W
2ºC/W
5ºC/W
10ºC/W
15ºC/W
Free Air
5
10
15
20
25
30
Load Current (Arms)
35
40 0
25
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50
75
Temperature (ºC)
100
125
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CPC1998
INTEGRATED CIRCUITS DIVISION
3 Performance Data @ 25°C (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
Device Count (N)
30
25
20
15
10
5
20
15
10
1.25
1.26
1.27
1.28
1.29
LED Forward Voltage (V)
5
20
15
10
5
6.6
6.8
7.0
7.2
Zero-Cross Voltage (V)
5
1.3
1.2
20
40
60
Temperature (ºC)
80
LED Current to Operate
vs. Load Frequency - Resistive Load
(VP=71V, RL=10Ω, IL=7A)
4.0
3.5
3.0
878 880 882 884
Blocking Voltage (VP)
3.0
-20
0
20
40
60
Temperature (ºC)
80
LED Current to Operate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=400mH/220Ω)
5.15
5.10
5.05
5.00
4.95
4.90
0
100
200
300
400
Load Frequency (Hz)
500
600
6.5
6.0
5.5
5.0
4.5
5.20
-20
0
20
40
60
Temperature (ºC)
80
100
LED Current to Operate
vs. Load Frequency- Inductive Load
(VL=200V, ZL=196mH/110Ω)
5.18
5.16
5.14
5.12
5.10
4.85
2.5
7.0
4.0
-40
100
886
LED Forward Current to Operate
vs. Temperature - Inductive Load
(IL=500mA, fL=60Hz, LL=400mH)
7.5
3.5
5.20
LED Forward Current (mA)
4.5
876
4.0
2.5
-40
100
874
LED Forward Current (mA)
1.4
7.4
LED Forward Current (mA)
1.5
LED Forward Current (mA)
IF=50mA
IF=20mA
IF=10mA
IF=5mA
0
10
LED Forward Current to Operate
vs. Temperature - Resistive Load
(IL=1A, fL=60Hz)
4.5
1.6
-20
15
0
6.4
Typical LED Forward Voltage Drop
vs. Temperature
1.1
-40
0.856 0.859 0.862 0.865 0.868 0.871 0.874
Forward Voltage Drop (V)
2.90
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
Device Count (N)
2.70 2.74 2.78 2.82 2.86
LED Forward Current (mA)
Zero-Cross Voltage
(N=50, IF=5mA)
6.2
LED Forward Voltage (V)
10
0
2.66
0
LED Forward Current (mA)
15
5
1.30
20
Forward Voltage Drop Distribution
(N=50, IF=5mA, IL=2A)
20
0
0
5.0
25
Device Count (N)
35
Typical IF for Switch Operation
with 1A Resistive Load
(N=50, VL=120VAC/60Hz)
0
100
200
300
400
Load Frequency (Hz)
500
600
0
100
200
300
400
Load Frequency (Hz)
500
600
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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CPC1998
INTEGRATED CIRCUITS DIVISION
7.2
6.4
1.00
0
-5
0.95
0.90
0.85
IL=3A
IL=2A
IL=1A
0.80
-10
6.2
0
20
40
60
Temperature (ºC)
80
0.75
-15
-1.5
100
Holding Current vs. Temperature
(RL=1.9Ω)
-1.0
-0.5
0.0
0.5
Voltage (V)
1.0
Total Heat Sinking Required
vs. Temperature
1000
30
60
50
40
30
IL=5Arms
IL=7.5Arms
IL=10Arms
IL=15Arms
IL=20Arms
25
20
15
10
5
0
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30 40 50 60 70
Temperature (ºC)
80
90 100
-20
0
20
40
60
Temperature (ºC)
80
100
Breakdown Voltage vs. Temperature
(IF=0mA)
950
900
850
800
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Maximum Surge Current
Non-Repetitive, Free Air
Leakage Current vs. Temperature
Measured Across Pins 1&2
1000
100
VL=800V
VL=600V
VL=400V
10
Current (A)
Leakage current (μA)
0.70
-40
1.5
Breakdown Voltage (V)
-20
70
20
-40
5
IL=10A
IL=5A
1.05
VON (V)
6.6
80
Holding Current (mA)
Current (A)
6.8
VON vs. Temperature
1.10
TA=-40ºC
TA=25ºC
TA=85ºC
10
7.0
6.0
-40
Output Voltage vs. Output Current
(IF=5mA)
15
Thermal Resistance (ºC/W)
Zero-Cross Voltage (V)
7.4
Zero-Cross Voltage vs. Temperature
(IF=5mA, RL=120Ω)
1
0.1
100
10
0.01
0.001
-40
-20
0
20
40
60
Temperature (ºC)
80
100
1
100μs
1ms
10ms
100ms
Time
1s
10s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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CPC1998
INTEGRATED CIRCUITS DIVISION
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1998J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1998J
245°C for 30 seconds
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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CPC1998
INTEGRATED CIRCUITS DIVISION
4.5 Mechanical Dimensions
5.029 ± 0.127
(0.198 ± 0.005)
19.914 ± 0.254
(0.784 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
1.181 ± 0.076
(0.047 ± 0.003)
15.317 ± 0.254
(0.603 ± 0.010)
20.879 ± 0.254
(0.822 ± 0.010)
DCB Substrate
NOTE: Not to be soldered
2.362 ± 0.381
(0.093 ± 0.015)
20.396 ± 0.508
(0.803 ± 0.020)
DIMENSIONS
mm
(inches)
3.810 ± 0.254
(0.150 ± 0.010)
15.240 ± 0.508
(0.600 ± 0.020)
0.635 ± 0.076
(0.025 ± 0.003)
1.270 TYP
(0.050 TYP)
2.794 ± 0.127
(0.110 ± 0.005)
NOTE: Metallized external surface of DCB substrate maintains 2500Vrms
isolation to device internal structure and all external pins.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1998-R05
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/9/2015
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