CPC1777J

CPC1777
600V Single-Pole, Normally Open
DC-Only Power Relay
INTEGRATED CIRCUITS DIVISION
Characteristics
Description
Parameter
Blocking Voltage
Rating
Units
600
VP
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of High Power Solid
State Relays. As part of this new family, the CPC1777
single-pole normally open (1-Form-A) DC Solid State
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
Load Current, TA=25°C:
With 5°C/W Heat Sink
4.6
No Heat Sink
1.5
On-Resistance (max)
ADC

0.5
Thermal Resistance,
Junction-to-Case, JC
0.35
°C/W
Features
•
•
•
•
•
•
•
•
•
•
4.6ADC Load Current with 5°C/W Heat Sink
Low 0.5On-Resistance
600VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance: JC = 0.35 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low junction-to-case thermal resistance
(0.35°C/W).
Ordering Information
Part
Description
CPC1777J
i4-PAC Package (25 per tube)
Switching Characteristics
Approvals
Form-A
• UL 508 Certified Component: File E69938
Pin Configuration
IF
90%
1
2
+
3
-
-
10%
ILOAD
4
ton
toff
+
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DS-CPC1777-R08
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CPC1777
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Ratings
Units
600
VP
Reverse Input Voltage
5
V
Input Control Current
50
mA
1
A
150
mW
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
2500
Vrms
Operational Temperature
-40 to +85
°C
Storage Temperature
-40 to +125
°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
20
AP
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
2
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Dropout Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
t10ms
No Heat Sink
TC=25°C
IL
TC=99°C
IL(99)
IF=10mA, IL=1A
RON
-
0.35
0.5

VL=600VP
ILEAK
-
-
1
A
ton
-
8
20
toff
-
0.15
5
VL=25V, f=1MHz
Cout
-
3500
-
pF
IL=1A
IF
-
-
10
mA
IF=5mA
IF
0.6
-
-
mA
VF
0.9
1.2
1.4
V
VR=5V
IR
-
-
10
A
-
CI/O
-
1
-
pF
IF=20mA, VL=10V
-
-
1.5
15
ADC
2
ms
1
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended.
C
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CPC1777
INTEGRATED CIRCUITS DIVISION
2 Thermal Characteristics
Parameter
Conditions
Symbol
Rating
Units
-
JC
0.35
°C/W
Free Air
JA
40
°C/W
-
TJ
-40 to +100
°C
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θCA =
(TJ - TA) IL(99)2
IL2 • PD(99)
- θJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
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CPC1777
INTEGRATED CIRCUITS DIVISION
3 Performance Data @25°C (Unless Otherwise Noted)
Typical Turn-On Time
(N=50, IF=10mA, IL=1ADC)
Device Count (N)
Device Count (N)
30
25
20
15
10
5
25
25
20
20
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=10mA, IL=1ADC)
15
10
5
0
0
1.30
1.31
1.32
1.33
7.0
7.5
8.0
9.0
25
20
15
10
0.36
1.4
IF=50mA
IF=20mA
IF=10mA
1.2
1.0
15
10
0.38
0.40
815
0.42
820
825
830
60
80
100
18
0.17
16
0.16
14
0.15
12
10
8
6
0.08
5
10
20
25
30
35
40
45
Temperature (ºC)
60
80
100
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
Typical Turn-On Time vs. Temperature
(IF=10mA, IL=1ADC)
Typical Turn-Off Time vs. Temperature
(IF=10mA, IL=1ADC)
0.35
12
0.30
10
0.25
8
6
4
0.20
0.15
0.10
0.05
0
0
40
0
50
Turn-Off (ms)
Turn-On (ms)
15
2
20
0.11
0.09
Temperature (ºC)
0
0.12
0.10
14
Typical Turn-Off Time
vs. LED Forward Current
(IL=1ADC)
0.13
2
0
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
840
0.14
4
120
835
Blocking Voltage (VP)
0
0.8
-20
0.11
20
Turn-Off (ms)
Turn-On (ms)
LED Forward Voltage Drop (V)
1.6
-40
0.10
25
Typical Turn-On Time
vs. LED Forward Current
(IL=1ADC)
1.8
20
18
16
14
12
10
8
6
4
2
0
0.09
0
0.34
Typical LED Forward Voltage Drop
vs. Temperature
40
0.08
Turn-Off (ms)
On-Resistance (Ω)
20
0.06
5
0.32
LED Current (mA)
0.04
30
Device Count (N)
Device Count (N)
8.5
35
0
0
5
Typical Blocking Voltage Distribution
(N=50)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC)
5
-20
10
Turn-On (ms)
30
-40
15
0
6.5
1.34
LED Forward Voltage (V)
35
Typical Turn-Off Time
(N=50, IF=10mA, IL=1ADC)
-40
-20
0
20
40
60
80
100
-40
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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CPC1777
INTEGRATED CIRCUITS DIVISION
1.8
1.4
Load Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
0
-20
0
20
40
60
80
100
0
-0.35
0.35
0.70
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=600VP)
0.014
0.012
835
0.010
830
825
820
815
-20
0
20
40
60
Temperature (ºC)
80
100
5ºC/W
4
10ºC/W
Free Air
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
Free Air, No Heat Sink
24
20
0.008
0.006
0.004
0
-40
6
1.05
16
12
8
4
0.002
810
8
0
-0.70
Typical Blocking Voltage
vs. Temperature
840
1ºC/W
10
2
Load Voltage (V)
845
805
-40
12
Temperature (ºC)
Leakage (μA)
Blocking Voltage (VP)
-40
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.05
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
Load Current (A)
On-Resistance (Ω)
1.6
Typical Load Current
vs. Load Voltage
(IF=10mA)
Load Current (ADC)
Typical On-Resistance
vs. Temperature
(IL=Max Rated)
-20
0
20
40
60
80
100
0
10µs 100µs 1ms 10ms 100ms
Temperature (ºC)
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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CPC1777
INTEGRATED CIRCUITS DIVISION
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1777J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1777J
245°C for 30 seconds
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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CPC1777
INTEGRATED CIRCUITS DIVISION
4.5 Mechanical Dimensions
5.029 ± 0.127
(0.198 ± 0.005)
19.914 ± 0.254
(0.784 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
1.181 ± 0.076
(0.047 ± 0.003)
15.317 ± 0.254
(0.603 ± 0.010)
20.879 ± 0.254
(0.822 ± 0.010)
DCB Substrate
NOTE: Not to be soldered
2.362 ± 0.381
(0.093 ± 0.015)
20.396 ± 0.508
(0.803 ± 0.020)
DIMENSIONS
mm
(inches)
3.810 ± 0.254
(0.150 ± 0.010)
15.240 ± 0.508
(0.600 ± 0.020)
0.635 ± 0.076
(0.025 ± 0.003)
1.270 TYP
(0.050 TYP)
2.794 ± 0.127
(0.110 ± 0.005)
NOTE: Metallized external surface of DCB substrate maintains 2500Vrms
isolation to device internal structure and all external pins.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1777-R08
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/9/2015
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