IX4423-IX4424-IX4425 3-Ampere Dual Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • • • • • • The IX4423, IX4424, and IX4425 are dual high-speed, low-side gate drivers. Each of the two outputs can source and sink 3A of peak current with rise and fall times of less than 10ns. The inputs of each driver are TTL and CMOS compatible, and are virtually immune to latch-up. Low propagation delay times and fast, matched rise and fall times make the IX4423, IX4424, and IX4425 ideal for high-frequency and high-power applications. 3A Peak Output Current Wide Operating Voltage Range: 4.5V to 35V -40°C to +125°C Operating Temperature Range Latch-up Protected to 3A Fast Rise and Fall Times Low Power Consumption Applications • • • • • MOSFET Driver Switching Power Supplies Motor Controls DC to DC Converters Pulse Transformer Driver The IX4423 is configured as a dual inverting driver; the IX4424 is configured as a dual non-inverting driver; and the IX4425 is configured with one inverting driver and one non-inverting driver. All three devices are available in a standard 8-pin SOIC package. e3 Pb Ordering Information Logic Configuration INA A B OUTB INA A OUTA INB B OUTB INA A OUTA B Package Type Packing Method Quantity IX4423N IX4423NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 IX4424N IX4424NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 IX4425N IX4425NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 OUTA INB INB Part Number OUTB DS-IX4423-24-25_R01 www.ixysic.com 1 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 5 6 2. IX4423-24-25 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IX4423 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IX4425 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IX4424 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 7 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 11 11 11 11 12 R01 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IX4423 Pin Name NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB IX4424 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB Description INA Channel A Logic Input INB Channel B Logic Input OUTA OUTA Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output - Sources or sinks current to turn on or turn off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device NC No Connection IX4425 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC Input Voltage VIN -0.3 35 V -5.0 VCC+0.3 Output Current IOUT V - ±3 A Junction Temperature TJ -55 +150 °C Storage Temperature TSTG -65 +150 °C Unless otherwise specified, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Symbol Minimum Maximum Units VCC 4.5 30 V Operating Temperature Range TA -40 +125 °C R01 www.ixysic.com Supply Voltage 3 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 18V. Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High - VIH 3 - - Input Voltage, Low - VIL - - 0.8 0V < VIN < VCC IIN - - ±10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 2.5 4 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.5 3 Rise Time VCC=18V, CLOAD=1000pF tR - 18 35 Fall Time VCC=18V, CLOAD=1000pF tF - 18 35 On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton - 35 75 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff - 38 75 VINA=VINB=3.5V VINA=VINB=0V ICC - 1 3 - 0.001 0.01 Input Current Power Supply Current 4 www.ixysic.com Units V A V ns mA R01 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: 4.5V < VCC < 18V. Parameter Conditions Symbol Minimum Maximum Input Voltage, High - VIH 3.3 - Input Voltage, Low - VIL - 0.65 0V < VIN < VCC IIN - ±10 Output Voltage, High - VOH VCC-0.025 - Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 6 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 5 Rise Time VCC=18V, CLOAD=1000pF tR - 60 Fall Time VCC=18V, CLOAD=1000pF tF - 60 On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton - 100 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff - 100 - 3.5 - 0.15 Input Current Power Supply Current R01 VINA=VINB=3.5V VINA=VINB=0V www.ixysic.com ICC Units V A V ns mA 5 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.7 Thermal Characteristics Package Parameter 8-Pin SOIC Thermal Resistance, Junction-to-Ambient Symbol Rating Units JA 120 °C/W 2 IX4423-24-25 Performance 2.1 Timing Diagrams VIH INx VIH INx VIL ton VIL toff toff ton 90% OUTx OUTx 10% 90% 10% tF tR tR tF Non-Inverting Driver Waveforms Inverting Driver Waveforms 2.2 Characteristics Test Diagram VCC + 0.1μF 10μF VCC - INA OUTA INB OUTB GND 1000pF Tektronix Current Probe 6302 VIN 1000pF 6 www.ixysic.com Tektronix Current Probe 6302 R01 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IX4423 3.3 IX4424 VCC VCC OUTA INA OUTA INA GND GND VCC VCC OUTB INB OUTB INB INX OUTX INX OUTX 0 1 0 0 1 0 1 1 3.2 IX4425 VCC OUTA INA GND VCC OUTB INB R01 INA OUTA 0 1 1 0 INB OUTB 0 0 1 1 www.ixysic.com 7 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) 120 120 11 60 40 80 CL=4.7nF CL=1nF CL=470pF 60 40 tr 9 8 tf 7 6 20 20 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 5 4 0 40 5 10 15 20 25 30 Supply Voltage (V) 0 Rise Time (ns) Fall Time (ns) 1000 2000 3000 4000 0 1000 2000 3000 4000 Load Capacitance (pF) 100 toffdly tondly Propagation Delay vs. Input Voltage (VCC=18V, CL=1nF) 70 Propagation Delay (ns) 150 60 50 toffdly 40 30 tondly 20 0 10 15 20 25 30 Supply Voltage (V) Input Threshold (V) 2.8 35 100 120 140 55 5000 Propagation Delay vs. Temperature (VCC=18V, CL=1nF) toffdly 50 45 tondly 40 35 30 25 20 0 40 5 10 15 Input Voltage (V) Input Threshold vs. Temperature (VCC=18V, CL=1nF) 2.6 Min VIH 2.4 2.2 Max VIL 2.0 1.8 20 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 140 Input Threshold vs. Supply Voltage 3.5 Input Threshold (V) 5 20 40 60 80 Temperature (ºC) 0 5000 Propagation Delay (ns) Propagation Delay vs. Supply Voltage (VIN=0-5V, CL=1nF, f=1kHz) 0 0 VCC=4.5V VCC=8V 100 VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 Load Capacitance (pF) 50 -40 -20 20 20 200 40 120 VCC=4.5V 100 VCC=8V VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 0 35 Fall Time vs. Load Capacitance Rise Time vs. Load Capacitance 120 Propagation Delay (ns) Time (ns) CL=4.7nF CL=1nF CL=470pF Rise & Fall Time vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF) 10 Fall Time (ns) 80 0 3.0 2.5 Min VIH 2.0 Max VIL 1.5 1.0 -40 -20 8 12 100 100 Rise Time (ns) Fall Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) 0 20 40 60 80 Temperature (ºC) 100 120 140 0 www.ixysic.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 R01 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 50 0 100 Supply Current (mA) 350 300 250 200 150 1000 Load Capacitance (pF) 200 150 100 50 0 100 10000 Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 100 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 250 1000 Load Capacitance (pF) Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V) 200 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 150 100 50 0 100 10000 Supply Current vs. Frequency Both Outputs Active (VCC=8V) 1000 10 1 0.1 1000 Load Capacitance (pF) 10000 Supply Current vs. Frequency Both Outputs Active (VCC=12V) 1000 CL=4.7nF CL=1nF 100 CL=470pF Supply Current (mA) 400 300 Supply Current (mA) 100 Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V) Supply Current (mA) 150 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Supply Current (mA) Supply Current (mA) 200 Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V) CL=4.7nF CL=1nF CL=470pF 100 10 1 0.1 50 1 0.1 0.1 10000 1 10 1 0.1 10 100 Frequency (kHz) 1000 10000 Quiescent Supply Current vs. Temperature (VCC=18V) 3.0 CL=4.7nF CL=1nF 100 CL=470pF VIN=3.5V 2.5 2.0 VIN=5V 1.5 VIN=10V 1.0 0.5 0.0 0.01 1 10 100 Frequency (kHz) 1000 10000 0.1 Dynamic Supply Current vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF, f=1kHz) 1.0 0.9 0.8 0.7 10 100 Frequency (kHz) 1000 7 -6 6 -5 -4 -3 -2 0 20 40 60 80 Temperature (ºC) 100 120 140 20 40 60 80 Temperature (ºC) 100 120 140 5 4 3 2 1 0 -40 -20 0 Output Sink Current vs. Supply Voltage (CL=27nF) 8 -7 -1 0.6 -40 -20 10000 Output Source Current vs. Supply Voltage (CL=27nF) -8 Source Current (A) 1.1 1 Sink Current (A) 0.1 Supply Current (mA) 1000 VIN=0V & 18V 0.01 R01 10 100 Frequency (kHz) Supply Current (mA) 10 1 Supply Current vs. Frequency Both Outputs Active (VCC=35V) 1000 CL=4.7nF CL=1nF 100 CL=470pF 1.2 0.1 10000 Supply Current (mA) Supply Current (mA) 1000 Load Capacitance (pF) Supply Current vs. Frequency Both Outputs Active (VCC=18V) 1000 0.01 0.01 0 100 0 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IX4423-24-25 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (VCC=18V, CL=27nF) 5.0 -4.5 4.5 -4.0 4.0 Sink Current (A) Source Current (A) -5.0 -3.5 -3.0 -2.5 -2.0 3.0 2.5 2.0 1.0 -1.0 -40 -20 0 20 40 60 80 Temperature (ºC) -40 -20 100 120 140 High-State Output Resistance vs. Supply Voltage (IOUT= -10mA) 8 6 4 2 0 0 20 40 60 80 Temperature (ºC) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA) 10 Output Resistance (Ω) 10 Output Resistance (Ω) 3.5 1.5 -1.5 8 6 4 2 0 0 10 Output Sink Current vs. Temperature (VCC=18V, CL=27nF) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 5 www.ixysic.com 10 15 20 25 30 Supply Voltage (V) 35 40 R01 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IX4423N / IX4424N / IX4425N MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Pb R01 Device Maximum Temperature x Time IX4423N / IX4424N / IX4425N 260°C for 30 seconds e3 www.ixysic.com 11 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 5.4 Mechanical Dimensions 5.4.1 “N” Package (8-Pin SOIC) 1.270 REF (0.050) Pin 8 PCB Land Pattern 0.60 (0.024) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 5.40 (0.213) Pin 1 1.55 (0.061) 0.406 ± 0.076 (0.016 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 0.559 ± 0.254 (0.022 ± 0.010) 1.346 ± 0.076 (0.053 ± 0.003) 1.27 (0.050) Dimensions mm (inches) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 5.4.2 “N” Package Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX4423-24-25_R01 ©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 4/4/2013 12 www.ixysic.com R01