IXD_630 30-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • 30A Peak Source/Sink Drive Current • High Operating Voltage Capability: 35V • -40°C to +125°C Extended Operating Temperature Range • Under-Voltage Lockout Protection • Logic Input Withstands Negative Swing of up to 5V • Fast Rise and Fall Times: < 20ns • Low Propagation Delay Time • Low 10A Supply Current • Low Output Impedance The IXDD630/IXDI630/IXDN630 high-speed gate drivers are especially well suited for driving the latest IXYS power MOSFETs and IGBTs. The IXD_630 output can source and sink 30A of peak current while producing voltage rise and fall times of less than 20ns. Internal circuitry eliminates cross conduction and current "shoot-through," and the driver is virtually immune to latch up. Under-voltage lockout (UVLO) circuitry holds the output LOW until sufficient supply voltage is applied (12.5V for the IXD_630 versions, and 9V for the IXD_630M versions). Low propagation delays and fast, matched rise and fall times make the IXD_630 family ideal for very high frequency and high-power applications. Applications • • • • • • Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver e3 Pb The IXDD630 is configured as a non-inverting driver with an enable. The IXDN630 is configured as a non-inverting driver, and the IXDI630 is configured as an inverting driver. The IXD_630 family is available in a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package. Ordering Information Part Number IXDD630CI IXDD630MCI IXDD630YI IXDD630MYI IXDI630CI IXDI630MCI IXDI630YI IXDI630MYI IXDN630CI IXDN630MCI IXDN630YI IXDN630MYI DS-IXD_630-R03 Logic Configuration IN OUT EN IN OUT IN OUT UVLO Package Type Packing Method Quantity 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 12.5V 9V 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 5-Pin TO-220 5-Pin TO-220 5-Pin TO-263 5-Pin TO-263 Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube Tube 50 50 50 50 50 50 50 50 50 50 50 50 www.ixysic.com 1 IXD_630 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 5 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 IXDD630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 IXDI630 Block Diagram & Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 IXDN630 Block Diagram & Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 3. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 10 11 R03 IXD_630 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Lead Configurations 1.2 Lead Definitions IXDD630 CI / YI Lead Name VCC 1 OUT 2 GND 3 IN 4 EN 5 IN Logic Input EN Output Enable - Drive lead low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI630 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 Description NC Not connected IXDN630 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Range Output Current Symbol Minimum Maximum Units VCC -0.3 40 V VIN , VEN -5 VCC+0.3 V IOUT - ±30 A Junction Temperature TJ -55 +150 °C Storage Temperature TSTG -65 +150 °C Unless stated otherwise, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R03 www.ixysic.com 3 IXD_630 INTEGRATED CIRCUITS DIVISION 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol Range Units VCC UVLO to 35 V TA -40 to +125 °C 1.5 Electrical Characteristics: TA = 25°C Test Conditions: UVLO < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High UVLO < VCC < 18V VIH 3.5 - - Input Voltage, Low UVLO < VCC < 18V VIL - - 0.8 Input Current 0V < VIN < VCC IIN - - ±10 EN Input Voltage, High IXDD630 only VENH 2/3VCC - - EN Input Voltage, Low IXDD630 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT= -100mA ROH - 0.17 0.4 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.16 0.3 IDC - - ±8 tr - 11 20 Units V A V V Rise Time Limited by package power dissipation CLOAD=5.6nF, VCC=18V Fall Time CLOAD=5.6nF, VCC=18V tf - 11 18 On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly - 46 65 Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly - 46 65 Output Enable Time IXDD630 only tPZL, tPZH - 34 65 Output Disable Time IXDD630 only tPLZ, tPHZ - 65 125 IXDD630 only REN - 400 - k - 2.5 4 mA - - 0.75 - - 0.75 7 9 9.9 10 12.5 13.5 Output Current, Continuous Enable Pull-Up Resistor VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V ICC VCC=18V, VIN=VCC Under-Voltage Lockout Threshold Under-Voltage Lockout Hysteresis 4 VCC Rising, IXD_630M VCC Rising, IXD_630 IXD_630M IXD_630 www.ixysic.com UVLO - - 1 - - 1.5 - A ns mA V V R03 IXD_630 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: UVLO < VCC < 35V, TJ<150°C. Parameter Conditions Symbol Minimum Maximum Input Voltage, High UVLO < VCC < 18V VIH 4 - Input Voltage, Low UVLO < VCC < 18V VIL - 0.8 Output Resistance, High State VCC=18V, IOUT= -100mA ROH - 0.6 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.45 Rise Time CLOAD=5.6nF, VCC=18V tr - 35 Fall Time CLOAD=5.6nF, VCC=18V tf - 35 On-Time Propagation Delay CLOAD=5.6nF, VCC=18V tondly - 100 Off-Time Propagation Delay CLOAD=5.6nF, VCC=18V toffdly - 100 Units V ns 1.7 Thermal Characteristics Package IXD_630CI (5-Lead TO-220) IXD_630YI (5-Lead TO-263) IXD_630CI (5-Lead TO-220) IXD_630YI (5-Lead TO-263) R03 Parameter Symbol Rating Thermal Resistance, Junction-to-Ambient JA 36 Thermal Resistance, Junction-to-Case JC 3 www.ixysic.com 46 2 Units °C/W °C/W 5 IXD_630 INTEGRATED CIRCUITS DIVISION 2 Functional Description 2.1 IXDD630 Block Diagram & Truth Table 2.3 IXDN630 Block Diagram & Truth Table IXDD630 IXDN630 VCC VCC IN IN OUT UVLO OUT UVLO GND GND EN IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 0 0 Z 1 0 Z 2.2 IXDI630 Block Diagram & Truth Table IXDI630 VCC IN OUT UVLO GND 6 IN OUT 0 1 1 0 www.ixysic.com R03 IXD_630 INTEGRATED CIRCUITS DIVISION CLOAD=200nF CLOAD=100nF CLOAD=50nF CLOAD=25nF CLOAD=10nF 10 15 20 25 Supply Voltage (V) 30 110 100 90 80 70 60 50 40 30 20 10 0 27 26 CLOAD=50nF CLOAD=25nF 20 25 Supply Voltage (V) Fall Time (ns) Rise Time (ns) 60 40 60 70 tondly toffdly 30 50 100 150 Load Capacitance (nF) 80 60 toffdly 40 tondly 20 5 10 15 20 Input Voltage (V) 25 70 60 Max VIL 2.6 2.4 2.2 toffdly 40 30 -50 -30 -10 Input Threshold vs. Supply Voltage 10 30 50 70 Temperature (ºC) 90 110 130 Enable Thresholds vs. Supply Voltage 4.0 22 Enable Threshold (V) 2.8 tondly 50 30 3.5 Min VIH 3.0 Max VIL 2.5 2.0 18 16 14 VENH VENL 12 10 8 6 1.8 2.0 -50 -30 -10 R03 Propagation Delay vs. Junction Temperature (VIN=0-5V, CLOAD= 5.6nF, VCC=18V, f=1kHz) 20 Min VIH 3.0 200 20 0 35 Input Threshold vs. Temperature (VCC=18V, CLOAD=5.6nF) 3.2 Input Threshold (V) 15 20 25 Supply Voltage (V) Input Threshold (V) 3.4 0 200 0 20 10 110 130 40 Propagation Delay vs. Input Voltage (VCC=25V, CLOAD=5.6nF, f=1kHz) 100 Propagation Delay (ns) Propagation Delay (ns) 80 5 90 0 50 100 150 Load Capacitance (nF) Propagation Delay vs. Supply Voltage (VIN=0-5V, CLOAD=5.6nF, f=1KHz) 30 10 30 50 70 Temperature (ºC) 20 0 40 -50 -30 -10 35 VCC=10V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 80 0 50 30 Fall Time vs. Load Capacitance 20 60 tr 100 80 90 tf 23 20 15 VCC=10V VCC=12V,18V,25V,30V,35V 24 21 Rise Time vs. Load Capacitance 100 25 22 CLOAD=10nF 10 35 Rise & Fall Times vs. Temperature (VIN=0-5V, VCC=18V, CLOAD=25nF) 28 CLOAD=200nF CLOAD=100nF Propagation Delay (ns) 110 100 90 80 70 60 50 40 30 20 10 0 Fall Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) Time (ns) Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) Fall Time (ns) Rise Time (ns) 3 Typical Performance Characteristics 10 30 50 70 Temperature (ºC) 90 110 130 4 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 10 12 14 16 18 20 22 24 26 28 30 32 34 36 Supply Voltage (V) 7 IXD_630 INTEGRATED CIRCUITS DIVISION f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz 1 Supply Current vs. Load Capacitance (VCC=10V) f=1MHz f=500kHz f=100kHz f=50kHz 100 10 f=10kHz 1 5000 1 0.1 1 0.1 10 100 Frequency (kHz) Output Source Current (A) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -30 -10 10 30 50 70 Temperature (ºC) 90 110 130 1 0.1 10 1 0.1 10 100 Frequency (kHz) 1000 Quiesent Supply Current vs. Temperature (VCC=18V) 3.0 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF VIN=3.5V VIN=5V VIN=10V VIN=0V & 18V 2.5 2.0 1.5 1.0 0.5 0.0 1 Dynamic Supply Current vs. Temperature (VCC=18V, VIN=0-5V, f =1kHz, CLOAD=5.6nF) 10 Supply Current vs. Frequency (VCC=10V) 100 1000 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 1 10 100 Frequency (kHz) 1000 -50 -30 -10 Output Source Current vs. Supply Voltage (VIN=7V, CLOAD=1μF) -65 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 Output Sink Current (A) 10 100 Frequency (kHz) 25000 Supply Current vs. Frequency (VCC=18V) 100 1000 0.01 1 10000 15000 20000 Load Capacitance (pF) 0.01 1 1000 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 10 Supply Current (mA) 10 25000 0.01 8 1 5000 1000 CLOAD=25nF CLOAD=10nF CLOAD=5.6nF 100 f=100kHz f=50kHz f=10kHz 10 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 Load Capacitance (nF) Supply Current vs. Frequency (VCC=35V) 1000 Supply Current (mA) Supply Current (mA) 100 5.0 0.01 10000 15000 20000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=12V) 1000 f=100kHz f=50kHz f=10kHz 1 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 Load Capacitance (nF) Supply Current (mA) Supply Current (mA) 1000 10 100 Supply Current (mA) 5.0 f=1MHz f=500kHz 100 Supply Current vs. Load Capacitance (VCC=12V) f=1MHz f=500kHz Supply Current (mA) 10 1000 Supply Current (mA) 100 Supply Current vs. Load Capacitance (VCC=18V) 1000 Supply Current (mA) Supply Current (mA) 1000 Supply Current vs. Load Capacitance (VCC=35V) 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 10 30 50 70 Temperature (ºC) 90 110 130 Output Sink Current vs. Supply Voltage (VIN=7V, CLOAD=1μF) 65 60 55 50 45 40 35 30 25 20 15 10 10 15 20 25 Supply Voltage (V) 30 35 R03 IXD_630 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (VCC=18V, CLOAD=1μF) -34 -32 -30 -28 -26 -24 10 30 50 70 Temperature (ºC) 90 110 130 34 32 30 28 10 30 50 70 Temperature (ºC) 90 0.16 0.14 ROL @ +100mA 35 10 15 20 25 Supply Voltage (V) 30 35 13.0 8.5 8.0 VCC Falling 7.5 7.0 0.10 30 0.12 Under-Voltage Lockout Threshold vs. Temperature - IXD_630 UVLO Threshold (V) UVLO Threshold (V) 0.18 15 20 25 Supply Voltage (V) 0.14 5 9.0 0.20 10 ROH @ -100mA 0.16 110 130 VCC Rising 5 0.18 Under Voltage Lockout Threshold vs. Temperature - IXD_630M 0.22 0.12 0.20 0.10 -50 -30 -10 Low-State Output Resistance vs. Supply Voltage Output Resistance (Ω) 0.22 26 -50 -30 -10 R03 High-State Output Resistance vs. Supply Voltage Output Resistance (Ω) 36 Output Sink Current (A) Output Source Current (A) -36 Output Sink Current vs. Temperature (VCC=18V, CLOAD=1μF) 12.5 VCC Rising 12.0 11.5 11.0 VCC Falling 10.5 10.0 -50 -30 -10 10 30 50 70 Temperature (ºC) www.ixysic.com 90 110 130 -50 -30 -10 10 30 50 70 Temperature (ºC) 90 110 130 9 IXD_630 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI MSL1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time IXD_630YI / IXD_630MYI / IXD_630CI / IXD_630MCI 245°C for 30 seconds 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 10 e3 www.ixysic.com R03 IXD_630 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 4.5.1 IXD_630YI (5-Lead TO-263) 14.605 / 15.875 (0.575 / 0.625) 1.143 / 1.651 (0.045 / 0.065) 1.143 / 1.397 (0.045 / 0.055) 9.652 / 10.312 (0.380 / 0.406) 4.318 / 4.597 (0.170 / 0.181) Recommended PCB Pattern 10.40 (0.409) 8.636 / 9.144 (0.340 / 0.360) 9.30 (0.366) 3.65 (0.144) 1 2 3 4 5 6.35 (0.250) 3.95 (0.156) 0º - 8º 1.70 BSC (0.067 BSC) 0.737 / 0.889 (0.029 / 0.035) 1.70 (0.067) 1.00 (0.039) 2.286 / 2.794 (0.090 / 0.110) 6.223 MIN (0.245 MIN) 0.000 / 0.305 (0.000 / 0.012) 6.858 MIN (0.270 MIN) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 6 NOTES: 1. All metal surfaces are solder-plated except trimmed area. 2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally. 4.5.2 IXD_630CI (5-Lead TO-220) 1.14 / 1.40 (0.045 / 0.055) 4.32 / 4.83 (0.170 / 0.190) 9.91 / 10.54 (0.390 / 0.415) 14.73 / 15.75 (0.580 / 0.620) 11.94 / 12.95 (0.470 / 0.510) 7.823 (0.308) 12.387 (0.487) 8.64 / 9.40 (0.340 / 0.370) 6.299 (0.248) 3 1 2 3 4 5 6.502 (0.256) 25.27 / 26.54 (0.995 / 1.045) 0.64 / 1.02 (0.025 / 0.040) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 1.70 BSC (0.067 BSC) NOTES: 1. This drawing will meet all dimensions requirement of JEDEC outlines TS-001AA and 5-lead version TO-220AB. 2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156) 3. The metal tab is connected to pin 3 (GND). R03 0.38 / 0.64 (0.015 / 0.025) 2.29 / 2.92 (0.090 / 0.115) 7.620 (0.300) 12.70 / 14.73 (0.50 / 0.58) Recommended Hole Pattern Finished Hole Diameter = 1.45mm (0.057 in.) 1.70mm (0.067 in.) www.ixysic.com 11 IXD_630 INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_630-R03 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/15/2012 12 www.ixysic.com R03