TVS Diodes Surface Mount > 3.0SMC series 3.0SMC Series RoHS Pb e3 Description Uni-directional The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features • For surface mounted applications in order to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact) • IPP is specified @ 8/20µS surge waveform • Built-in strain relief • VBR @TJ= VBR@25°C x (1+αT Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit PM(AV) 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 1) IFSM 300 A Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only VF 3.5 V TJ , TSTG -55 to 150 °C Typical Thermal Resistance Junction to Lead RuJL 15 Typical Thermal Resistance Junction to Ambient RuJA Power Dissipation on Infinite Heat Sink at TA=50OC Operating Junction and Storage Temperature Range x (TJ - 25)) 75 (αT:Temperature Coefficient) °C/W • Excellent clamping capability • Low incremental surge resistance • Typical IR less than 1µA above 30V • High temperature soldering guaranteed: 260°C/40 seconds at terminals • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 • Glass passivated chip junction • Fast response time: typically less than 1.0ps from 0V to BV min °C/W Notes: 1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. Applications Functional Diagram Bi-directional Cathode TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Anode Uni-directional 3.0SMC Series 78 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount > 3.0SMC series Electrical Characteristics (T =25°C unless otherwise noted) A ™ TVS DiodeBreakdown Arrays (SPATest FamilyMaximum of Products) Voltage V Maximum Peak Reverse Part Number (Uni) Marking 3.0SMC20A 3.0SMC24A 3.0SMC28A 3.0SMC30A 3.0SMC33A YLA YLC YLE YLF YLG Stand off Voltage VR (Volts) 20.0 24.0 28.0 30.0 33.0 BR MIN MAX Current IT (mA) 22.20 26.70 31.10 33.30 36.70 24.50 29.50 34.40 36.80 40.60 1 1 1 1 1 (Volts) @ IT Clamping Voltage VC @ 8/20µS Ipp (V) Pulse Current Ipp @ 8/20µS (A) 42 51 59 62 70 740 520 470 420 365 Maximum Reverse Leakage IR @ VR (µA) 1 1 1 1 1 I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating 1000 PPPM-Peak Pulse Power (KW) Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS 100 10 1 0.31x0.31" (8.0x8.0mm) 0.1 Copper Pad Area 0.001 Time 0.01 0.1 1 td-Pulse Width (ms) 10 continues on next page. 3.0SMC Series 79 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount > 3.0SMC series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Diode Arrays Figure 3 - Peak Pulse PowerTVS or Current Derating Curve vs Initial Junction Temperature (SPA™Figure Family4 of Products) - Pulse Waveform IPP- Peak Pulse Current, % IPP Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 Waveform = tr x td 50 0 0 0 25 50 75 100 125 150 Peak Value 100 175 Half Value 0 tr=8µS td=20µS t-Time (µS) TA-Ambient temperature (ºC) Figure 5 - Typical Junction Capacitance Figure 6 - Steady State Power Derating Curve 100000 PM(AV), Steady Sate Power Dissipation (W) Cj (pF) 10000 Uni-directional V= OV 1000 Uni-directional @ VR 100 10 1 1.0 tr= rise time to peak value td= decaytime to half value 10.0 100.0 1000.0 VBR - Reverse Breakdown Voltage (V) 6.5 6 5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 25 50 75 100 125 150 175 TA - Ambient Temperature(ºC) Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional only IFSM - Peak Forward Surge Current (A) 350 300 250 200 150 100 50 0 1 10 100 Number of Cycles at 60 Hz 3.0SMC Series 80 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount > 3.0SMC series Soldering Parameters TVS Diode Arrays (SPA™ Family of Products) Pre Heat Lead–free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Ramp-up TL Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds tL 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C Peak Temperature (TP) +0/-5 tp TP Temperature (T) Reflow Condition t 25˚C to Peak Time (t) °C Environmental Specifications Physical Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Weight 0.007 ounce, 0.21 grams Temperature Cycling JESD22-A104 Case JEDEC DO214AB. Molded plastic body over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity Color band denotes positive end (cathode) except Bidirectional. H3TRB JESD22-A101 Terminal Matte Tin-plated leads, Solderable per JESD22-B102 RSH JESD22-B106 Dimensions DO-214AB (SMC J-Bend) Dimensions Cathode Band C A B H D F E J G K L I Inches Min Millimeters Max Min Max A 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7.110 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.305 0.320 7.750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - J 0.094 - 2.400 - K - 0.165 L 0.094 - 4.200 2.400 - Solder Pads (all dimensions in mm) 3.0SMC Series 81 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount > 3.0SMC series Part Numbering System Part Marking System 3.0SMC XX A F Cathode Band 5% VBR VOLTAGE TOLERANCE XXX VR VOLTAGE YMXXX SERIES Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Options Part number Component Package 3.0SMCxxX DO-214AB Packaging Option Quantity 3000 Tape & Reel - 16mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) 0.47 (12.0) Cathode 0.157 (4.0) 0.059 DIA (1.5) Cover tape 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.49 (12.5) 3.0SMC Series Dimensions are in inches (and millimeters). Direction of Feed 82 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14