TVS Diodes Surface Mount – 4000W > 4.0SMDJ24A 4.0SMDJ24A RoHS Pb e3 Description Uni-directional The 4.0SMDJ24A is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2) PPPM 4000 W Power Dissipation on Infinite Heat Sink at TA=50OC PM(AV) 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM 300 A Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only VF 3.5 V TJ , TSTG -55 to 150 °C Typical Thermal Resistance Junction to Lead RuJL 15 °C/W Typical Thermal Resistance Junction to Ambient RuJA 75 °C/W Operating Junction and Storage Temperature Range • 4000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • Fast response time: typically less than 1.0ps from 0V to BV min • Excellent clamping capability • Low incremental surge resistance • High temperature soldering guaranteed: 260°C/40 seconds at terminals • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 • For surface mounted applications in order to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2) • EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4) • Built-in strain relief • VBR @TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient) • Glass passivated chip junction Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TA = 25OC per Fig. 3. 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. Functional Diagram Applications TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Bi-directional Cathode Anode Uni-directional Electrical Characteristics (T =25°C unless otherwise noted) A Part Number 4.0SMDJ24A 4.0SMDJ24A Reverse Stand off Marking Voltage VR (Volts) 4PEZ 24.0 Breakdown Voltage VBR (Volts) @ IT MIN MAX Test Current IT (mA) 26.70 29.50 1 Maximum Clamping Voltage VC @ Ipp (10/1000µS) (V) Maximum Clamping Voltage VC @ Ipp (8/20µS) (V) Maximum Peak Pulse CurrentIpp (10/1000µS) (A) Maximum Peak Pulse Current Ipp (8/20µS) (A) Maximum Reverse Leakage IR @ VR (µA) 38.9 51.0 103.0 650.0 2 1 186 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount – 4000W > 4.0SMDJ24A I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating 1000 PPPM-Peak Pulse Power (KW) Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS 100 10 0.31x0.31" (8.0x8.0mm) 1 Copper Pad Area 0.001 0.01 0.1 1 td-Pulse Width (ms) 10 Time continues on next page. 4.0SMDJ24A 2 187 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount – 4000W > 4.0SMDJ24A Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Figure 3 - Peak Pulse Power or Current Derating Curve vs Initial Junction Temperature Figure 4 - Pulse Waveform 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 0 tr=10µsec Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 10/1000µsec. Waveform as defined by R.E.A td 0 0 25 50 75 100 125 150 TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 0 175 1.0 2.0 3.0 4.0 t-Time (ms) TA-Ambient temperature (ºC) Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional only 6.5 6 5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 350 IFSM - Peak Forward Surge Current (A) PM(AV), Steady Sate Power Dissipation (W) Figure 5 - Steady State Power Derating Curve 0 25 50 75 100 125 150 250 200 150 100 50 0 175 1 TA - Ambient Temperature(ºC) 4.0SMDJ24A 300 10 100 Number of Cycles at 60 Hz 3 188 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount – 4000W > 4.0SMDJ24A Soldering Parameters Pre Heat Lead–free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C tp TP Ramp-up TL Temperature (T) Reflow Condition tL Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications Physical Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Weight 0.007 ounce, 0.21 grams Temperature Cycling JESD22-A104 Case JEDEC DO214AB. Molded plastic body over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity Color band denotes positive end (cathode) except Bidirectional. H3TRB JESD22-A101 Terminal Matte Tin-plated leads, Solderable per JESD22-B102 RSH JESD22-B106 Dimensions DO-214AB (SMC J-Bend) Dimensions Cathode Band (for Uni-directional products only) C A B H D F E G J K L I Inches Min Millimeters Max Min Max A 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7.110 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.305 0.320 7.750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - J 0.094 - 2.400 - K - 0.165 L 0.094 - 4.200 2.400 - Solder Pads 4.0SMDJ24A (all dimensions in mm) 4 189 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14 TVS Diodes Surface Mount – 4000W > 4.0SMDJ24A Part Numbering System Part Marking System 4.0SMDJ 24 A Cathode Band F (for Uni-directional products only) 5% VBR VOLTAGE TOLERANCE Littelfuse Logo XXX 4PEZ YMXXX VR VOLTAGE SERIES Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Options Part number Component Package 4.0SMDJ24A DO-214AB Packaging Option Quantity 3000 Tape & Reel - 16mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) 0.63 (16.0) Cathode 0.315 (8.0) Optional 7” 7.0 (187) 13” 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.65 (16.4) 4.0SMDJ24A 0.059 DIA (1.5) Cover tape Dimensions are in inches (and millimeters). Direction of Feed 5 190 ©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/09/14