Temperature Compensated Crystal Oscillators TCXO, M53T Series, CMOS Output MERCURY Since 1973 Features: 5x3.2x2.2 mm ceramic SMD TCXOs with CMOS square wave output 0.01 uF decoupling capacitor built-in Wide frequency range: 1.0 MHz to 200.0 MHz Ideal for cellular phone, GPS. General Specifications (at+25°C and specified input voltage Product Series M53T Frequency Range 1.0 MHz ~ 200.0 MHz NOTE: 32.768 KHz is also available Output Wave From Square wave. Wave form code is “T” ±2 ppm at +25°C±2°c and Vcon = +1.5 V D.C. Initial Calibration Tolerance (1) 10.0, 12.8, 13.0, 14.4, 16.0, 16.384, 19.2, 19.440, 19.680, 20.0, 38.880 , 77.760 , Standard Frequencies (partial list) 155.520 MHz Ð Frequency Stability (ppm) ±0.5 pppm ± 1 ppm ±1.5 ppm ±2.0 ppm ±2.5 ppm Temperature 0 to +50°C √ √ √ √ √ √: Available Range -10 to +60°C √ √ √ √ : Call us U -20 to +70°C √ √ √ √ U: Not available U -30 to +75°C √ √ √ √ Standard Î -40 to +85°C Frequency Stability vs Aging vs Voltage Change vs Load Change vs Reflow U √ √ √ ±1.0 ppm max. first year at +25°C ±2 ppm max. for a ±10% input voltage change ±0.3 ppm max. for a ±10% loading condition change ±1 ppm max. 1 reflow and measured 24 hours afterwards +2.8 V (voltage code is +3.0 V (voltage code is +3.3 V (voltage code is “28”) “3”) “33”) 2 mA @ 8.192MHz; 4 mA @ 10 MHz; 17 mA @77.760 MHz; 35 mA @ 155.520 MHz Supply Voltage (VDD) Current Consumption (typical) Output Voltage Level √ Logic “1” 90% VDD min. Logic “0” 10% VDD max. Rise Time and Fall Time 1.5 ns typical; 2.0 nano.max. 10% ↔ 90% of VDD Duty Cycle (Symmetry) 50%±10% measured at 50% VDD Start-up Time 5 ms typical; 10 m. sec. max. Output Load SSB Phase Noise at +25°C 15 pF 10 Hz -72 dBc/Hz Offset M53T33-100.000 100 Hz -110 dBc/Hz 1 kHz -125 dBc/Hz 10 kHz -132 dBc/Hz 100 kHz -125 dBc/Hz MERCURY www.mercury-crystal.com Taiwan: TEL (886)-2-2406-2779, FAX (886)-2-2496-0769, e-mail: [email protected] U.S.A.: TEL (1)-909-466-0427, FAX (1)-909-466-0762, e-mail: [email protected] MERCURY Page 1 of 3 Date: May 1, 2008 Revision: 0 Temperature Compensated Crystal Oscillators TCXO, M53T Series, CMOS Output MERCURY Since 1973 Part Number Format and Example: Part number example: " M53T 3 — M53T3-20.000-2.5/-30+75 " " 20.000 — 2.5 "= Please specify " -30+75 ⁄ c d e f g c: Product Series. Use “M53T” for TCXO product. d: Voltage code; Use”28” for +2.8 V; use “3” for +3.0 V; use “33” for +3.3 V; e: Frequency in MHz f: Frequency stability in ppm g: Operating Temperature range in °C CMOS Square Wave TCXO Test Circuit and Output Wave Form: T2 Clock Out + + - V - 4 0.1uF A 1 M53T MEC 3 15 pF * T1 80% 50% 2 * Include all the 20% probe and stray capacitances Tr Tf Duty Cycle = T1 *100% T2 Environment Performance Specifications Green Requirement MSL Level Humidity Hermeticity Solderability Vibration Shock Storage temp. range MERCURY RoHS compliant, Pb (lead) free MSL 1 per IPC/JEDEC-STD-020C 85% RH, 85°C, 48 hours. Crystal part only. Leak rate 2x10-8 ATM-cm3/sec max. Crystal part only. MIL-STD-202F method 208E MIL-STD-202F method 204, 35G, 50 to 2000 Hz MIL-STD-202F method 213B, test condi. E, 1000GG ½ sine wave -55 to +125°C Page 2 of 3 Date: May 1, 2008 Revision: 0 Temperature Compensated Crystal Oscillators TCXO, M53T Series, CMOS Output Package Dimensions and Suggested Land Pattern: Since 1973 Unit: mm bottom view 2 1 4 1 3 0.1 2.2 max. 0.1 3.2±0.2 0.8 5.0±0.2 1.2 1.1 No Connection Ground Output Supply Voltage 1.2 1.4 Pad 1 Pad 2 Pad 3 Pad 4 MERCURY 2.4 Recommended Solder Reflow Profiles 240°C liquidus 235°C solidus temperature alloy is used in the assembly of M53T products. Do not exceed the reflow conditions given below. Temperature (°C) Profile A (low temperature solder reflow): For Sn62 Pb36 Ag2 and Sn63 Pb37 alloy. 250 230 200 183 150 Peak Temperature. Topside temperature of board to be 220°C min; 230°C max. Liquidus Temperature Flux Activation Temperature 100 50 Pre-heat 1 30 60 90 at Time above 183°C p up Ram ec max. 30~60 sec. max. Ramp s 4°C dow / 2°C / se n at cm ax. Soaking Zone Reflow Pre-heat 2 Zone Cooling 120 150 180 210 240 270 300 330 Time (sec) Soaking temp: 140°C~180°C Soaking time: 60~90 sec. Profile B (high temperature solder reflow): For Sn96.5% Ag 3.5% Cu 0.5% alloy. Temperature (°C) 250 217 200 150 Peak Temperature. Topside temperature of board to be 230°C min; 248°C max. Liquidus Temperature Flux Activation Temperature at . p up Ram ec max /s C ° 2 100 50 Soaking Zone Pre-heat 2 Pre-heat 1 30 60 Time above 217°C 30~60 sec. max. Ram 4°C p dow / se n at cm ax. 90 120 150 180 Reflow Zone Cooling 210 240 270 300 330 Time (sec) Soaking temp: 140°C~200°C Soaking time: 90~120 sec. MERCURY Page 3 of 3 Date: May 1, 2008 Revision: 0