Technical Note No.: TN-201 MERCURY www.mercury-crystal.com Revision: A Date: Jan. 22, 2001 Page 1 of 2 Title: Suggested soldering pattern and Reflow temperature profile Products applied: This document can be applied to the following Mercury products VCXO: G42 and G44 Unit: mm. Pad 1: Voltage control Pad 2: Ground Pad 3: Output Pad 4: Supply voltage Electrical connection Pad 4 Pad 3 Top view Pad 1 Pad 2 Technical Note No.: TN-201 Revision: A Date: Jan. 22, 2001 Page 2 of 2 MERCURY www.mercury-crystal.com Recommended soldering reflow profile: TEMP Peak temp: +240°C +240°C +200°C +150°C +100°C +50°C +25°C Preheating More than 30 sec. 60 to 90 sec. at +150°C~+170°C Reflow 20 to 40 sec. at temp. higher than 200°C Precautions: a. Solder dipping or hand soldering is not recommended. b. For solder paste screen printer the recommended stencil thickness is 0.15 mm (0.006”) c. Peak temperature should not exceed +240°C