OKI Semiconductor MBF9041BB FEDW9041BB-02 Issue Date: May 20. 2002 SAW Antenna Duplexer (700 to 1000 MHz) GENERAL DESCRIPTION The MBF9041BB is the SAW antenna duplexer for the frequency range of 700 to 1000 MHz. This SAW Duplexer integrates RF filters at Tx and Rx side, and matching circuit into PKG. This helps to save the space and weight greatly in the target application such as mobile telephone. This SAW Duplexer has very low insertion loss by using high quality package. Due to high harmonics characteristics, total number of components at RF circuit can be minimized. Thanks to high isolation performance, high sensitivity can be expected. Low insertion loss at Tx saves the power consumption of mobile telephone which prolong the battery life. FEATURES • Complying Standard AMPS, IS-95, IS-136 • Thin package: less than 1.5 mm in height • PKG I/O Impedance: 50 Ω PRODUCT DESCRIPTION Package Type MBF9041BB OKI Rx 041BB Tx YZZZ ANT 1/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB PIN ASSIGNMENT & DESCRIPTION Top view (12) (11) (10) OKI (13) (14) YZZZ (1) (2) (8) (7) 041BB (15) (16) (9) (6) (5) (3) (4) Bottom view (16) (1) (2) (3) (15) (5) (14) This number is for OKI production purpose only. (6) (17) (7) (13) (12) (4) (11) (10) (9) (8) Pin No. 1 Name GND Description Ground Pin 2 3 4 ANT GND GND Antenna Pin Ground Pin No Connection * 5 GND Ground Pin 6 7 Tx GND Transmitting Terminal Pin Ground Pin 8 9 GND GND No Connection * Ground Pin 10 11 12 GND GND GND Ground Pin Ground Pin No Connection * 13 14 GND Rx Ground Pin Receiving Terminal Pin 15 GND Ground Pin 16 17 GND GND No Connection * Ground Pin Note) Pin No. 4, 8, 12 and 16 are for manufacturer’s internal use. Do not solder to the PCB. 2/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Min. Max. Ta –30 +85 °C Storage Temperature TSTG –40 +85 °C Maximum Input Power PIN — 2.0 W Operating Temperature RECOMMENDED OPERATING CONDITIONS Parameter Operating Temperature Symbol Ta Rating Min. Max. –30 +85 Unit °C 3/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB ELECTRICAL CHARACTERISTICS Parameter Condition Mini. Typ. 824 to 849 MHz — 2.4 (Ta = –30 to +85°C) Max. Unit/Notes Tx → Antenna a) Insertion loss 2.8 dB dB b) Passband ripple 824 to 849 MHz — 1.0 1.5 c) VSWR 824 to 849 MHz — 1.7 2.0 869 to 894 MHz 40 42 — d) Absolute attenuation dB 1648 to 1698 MHz 30 33 — dB 2472 to 2547 MHz 30 33 — dB Antenna → Rx a) Insertion loss 869 to 894 MHz — 3.4 3.8 dB b) Passband ripple 869 to 894 MHz — 1.4 2.0 dB c) VSWR 869 to 894 MHz — 1.8 2.1 824 to 849 MHz 50 53 — dB 930 to 1200 MHz 33 38 — dB 1200 to 1500 MHz 40 45 — dB 1500 to 1800 MHz 40 45 — dB 824 to 849 MHz 55 — — dB — — — 2 W d) Absolute attenuation Isolation TX → RX a) Absolute attenuation Input Power a) Average power Note: Electrical characteristics described above is guaranteed by the following measurement and equipment condition. 1) Test board: See next page 2) Measurement machine : Network analyzer 4/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB Test Board 5/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB MARKING Company Logo OKI Part Symbol 041BB Lot Number YZZZ Antenna Index Note) Lot Number Y: ZZZ: Last number of year Serial number 6/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB REFLOW TEMPERATURE PROFILE The figure below shows recommended temperature profile of infrared reflow and air reflow. Other type of reflow is not recommended. The maximum reflow count is 2 times. Washing of this device after reflow process is prohibited. 250 235 to 240°C, 20 sec. max. Package surface Temperature (°C) 1 to 4°C/sec. 200 Preheat temperature: 120 to 150°C 20 sec.max 1 to 4°C/sec. 150 40 to 60 sec. 100 50 2 to 5°C/sec. Time (sec.) 7/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB PACKAGE DIMENTION Unit: mm General tolerance: ±0.15 9.5 ±0.2 ±0.2 OKI 7.5 041BB (2.21) 2.54 (1.3 typ.) TYP. 5.08 (0.8) TYP. (0.8) 1.5max YZZZ (2.48) 0.6 4.9 4 - R0.15 1.1 11-0.8 1.5 1.27 3.0 2.54 2.45 12 - R0.2 8/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB RECOMMENDATION FOR SOLDER PAD PATTERN The solder pad pattern should be designed by customers because it depends on the electrical performance of the customers’ system. Following is an example of solder pad pattern which is used in OKI’s package evaluation board. Please be noted that this is for reference purpose only. 25 µm 0.1 mm 0.1 mm 25 µm 0.5 mm 0.1 mm PCB pad pattern Metal mask pattern Pad of Device Please pay attention to the following items to maintain electrical performance. (1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in thickness. (2) As the impedance of Tx, Rx, ANT is designed for 50 Ω, please consider this for the design of mother board. (3) The performance of these devices is assured when GND pad (Pin 17) is connected. GND pad (Pin 17) should be soldered in the same way as above. 9/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB REVISION HISTORY Document No. Date FEDW9041BB-01 April 2000 FEDW9041BB-02 May20, 2002 Page Previous Current Edition Edition Description – – Final edition 1 – – Final edition 2 1 1 Partially changed the content of “PRODUCT DESCRIPTION”. 10/11 FEDW9041BB-02 OKI Semiconductor MBF9041BB NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd. 11/11