Thin Film Wire Bondable Single Layer Capacitors Key Benefits: • • • • • • • Die Sizes from 20 x 20 mils Tight Tolerances 2.5% Single Top Contacts available Three Parallel contacts (NCD, NCE) Suitable for Eutectic or Epoxy attach Operating Temperature –55°C to +125°C Max Working voltage 200V Micross are supporting applications that require small size, increased performance and high quality, by working with Vishay on their thin film wire bondable single layer caps. Key Features: • • • • • Wire bondable Silicon Substrates with Au plating MOS (SiO2) or NMOS (Si3N4) dielectrics Capacitance Range from 0.5pF to 1000pF 100% electrically tested & visually inspected to MIL STD 883 Applications: Parameter Value RFI & EMI filters Peak Voltage @ +25°C 1.5 x working voltage Dissipation Factor, 1kHz, Vrms +25°C 0.05 MNOS Q @ 1MHz mVra +25°C 1000 min Bypass Capacitors CMOS Digital Filters Low-pass filters Electronic ID tags Unit % 0.1 MOS +45 ±25 MNOS TCC, -55°C to +150°C ppm/°C +15 ±25 MOS Thermal Shock ±0.25 x 0.25 max. ∆C/C % Short Time Overload, +25°C, 5s, 1.5 x working voltage ±0.25 x 0.25 max. % Life, MIL STD 202, Method 108 Condition D, + 125°C Ambient, ±0.25 + 0.25 max ∆C/C 100hr @ working voltage % For more information & world-wide sales support, visit www.micross.com Email: [email protected] or Tel: +44 (0) 1603 788967