LT5517 ® ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 5V BPF LNA VCC RF + 20 LT5517 IOUT+ LPF 0 VGA 0° RF – IOUT– DSP 2xLO INPUT 2xLO QOUT+ VGA 90° ENABLE EN LPF ÷2 POUT, IM3, IM2 (dBm/TONE) BPF POUT –20 TA = 25°C P2XLO = –10dBm –40 f2XLO = 1602MHz fRF1 = 799.9MHz fRF2 = 800.1MHz –60 IM3 IM2 –80 QOUT– 5517 F01 –100 –18 –14 –10 –6 –2 RF INPUT POWER (dBm) 2 5517 F01b 5517f 1 LT5517 ORDER PART NUMBER QOUT – QOUT + IOUT – IOUT + TOP VIEW 16 15 14 13 GNDRF 1 RF + 2 RF – LT5517EUF 12 VCC 11 GND 17 3 10 2XLO GNDRF 4 6 7 8 EN VCC VCC VCC 9 5 GND UF PART MARKING UF PACKAGE 16-LEAD (4mm × 4mm) PLASTIC QFN EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB 5517 TJMAX = 125°C, θJA = 37°C/W PARAMETER CONDITIONS MIN TYP MAX UNITS RF Frequency Range 40 to 900 MHz 2XLO Frequency Range 80 to 1800 MHz –15 to 0 dBm 2XLO Power 2XLO Port Return Loss Internally Matched to a 50Ω Source Conversion Gain Voltage Gain, Load Impedance = 1kΩ Gain Variation vs Temperature –40°C to 85°C 0 Noise Figure 20 dB 3.3 dB 0.01 dB/°C 12.4 dB Input 3rd Order Intercept 2-Tone, –10dBm/Tone, ∆f = 200kHz 21 dBm Input 2nd Order Intercept 2-Tone, –10dBm/Tone, ∆f = 200kHz 58 dBm Input 1dB Compression 10 dBm Baseband Bandwidth 130 MHz I/Q Gain Mismatch (Note 4) –0.3 I/Q Phase Mismatch (Note 4) –3.5 Output Impedance Differential 0.03 0.3 dB 0.7 3.5 deg 120 Ω 2XLO to RF Leakage –69 dBm LO to RF Leakage –80 dBm RF to 2XLO Isolation 63 dB 5517f 2 LT5517 PARAMETER CONDITIONS MIN Supply Voltage 4.5 Supply Current 70 Shutdown Current EN = LOW TYP MAX UNITS 5.25 V 90 110 mA 0.1 20 µA Turn-On Time (Note 5) 200 ns Turn-Off Time (Note 5) 300 ns EN = HIGH (On) 1.6 V EN = LOW (Off) 1.3 EN Input Current VENABLE = 5V Output DC Offset Voltage (IOUT+ – IOUT–, QOUT+ – QOUT–) fLO = 1602MHz, PLO = –10dBm Output DC Offset Variation vs Temperature – 40°C to 85°C 110 2 0.5 7 80 25 IIP3 80 TA = 25°C TA = –40°C 70 60 4.5 20 15 70 P2XLO = –10dBm VCC = 5V TA = 25°C IIP2 (dBm) 90 TA = 85°C GAIN (dB), NF (dB), IIP3 (dBm) SUPPLY CURRENT (mA) 100 NF 10 5 CONV GAIN 5.5 5517 G01 30 mV µV/°C P2XLO = –10dBm VCC = 5V TA = 25°C 60 50 40 30 0 5 4.75 5.25 SUPPLY VOLTAGE (V) V µA 0 100 200 300 400 500 600 700 800 900 RF INPUT FREQUENCY (MHz) 5517 G02 0 100 200 300 400 500 600 700 800 900 RF INPUT FREQUENCY (MHz) 5517 G03 5517f 3 LT5517 f2XLO = 1602MHz VCC = 5V P2XLO = –10dBm 0.60 fBB = 1MHz VCC = 5V GAIN MISMATCH (dB) 0 OUTPUT POWER –20 –40 IM3 –60 0.40 0.20 0 –0.20 –0.40 TA = 85°C TA = 25°C TA = –40°C –80 –100 –18 –14 TA = 85°C TA = 25°C TA = –40°C –0.60 2 –10 –6 –2 RF INPUT POWER (dBm) –0.80 5517 G04 28 14 f2XLO = 1602MHz fRF1 = 799.9MHz VCC = 5V fRF2 = 800.1MHz TA = 25°C VCC = 5V TA = 85°C TA = 25°C TA = –40°C 10 fRF = 200MHz 8 fRF = 40MHz 6 CONV GAIN 0 4.5 4.75 5 5.25 SUPPLY VOLTAGE (V) 4 –15 5.5 70 65 –60 –70 TA = 85°C LO-RF LEAKAGE (dBm) TA = 25°C 55 TA = –40°C 50 45 –12 –6 –3 –9 2XLO INPUT POWER (dBm) 30 –15 –12 –9 –3 –6 2XLO INPUT POWER (dBm) 0 5517 G10 CONV GAIN –12 –9 –6 –3 2XLO INPUT POWER (dBm) –60 –70 f2XLO = 1600MHz –80 f2XLO = 800MHz –90 –120 –15 TA = 25°C VCC = 5V –80 –12 –9 –6 –3 2XLO INPUT POWER (dBm) f2XLO = 1600MHz f2XLO = 800MHz –90 –100 f2XLO = 80MHz 0 5517 G09 TA = 25°C VCC = 5V –110 35 TA = 85°C TA = 25°C TA = –40°C 8 0 –15 0 –100 40 12 5517 G08 f2XLO = 1602MHz VCC = 5V 60 16 IIP3 f2XLO = 1602MHz VCC = 5V fRF1 = 799.9MHz fRF2 = 800.1MHz 4 5517 G07 IIP2 (dBm) 20 8 4 TA = 85°C TA = 25°C TA = –40°C –4 5517 G06 CONV GAIN (dB), IIP3 (dBm) IIP3 12 –2 0 100 200 300 400 500 600 700 800 900 RF INPUT FREQUENCY (MHz) fRF = 800MHz fRF = 400MHz 16 0 24 12 20 2 5517 G05 NF (dB) CONV GAIN (dB), IIP3 (dBm) 24 P2XLO = –10dBm fBB = 1MHz 4 VCC = 5V –6 100 200 300 400 500 600 700 800 900 RF INPUT FREQUENCY (MHz) 0 2XLO-RF LEAKAGE (dBm) POUT, IM3 (dBm/TONE) 6 0.80 fRF1 = 799.9MHz fRF2 = 800.1MHz PHASE MISMATCH (DEGREE) 20 f2XLO = 80MHz –110 0 5517 G11 –120 –15 –12 –9 –6 –3 2XLO INPUT POWER (dBm) 0 5517 G12 5517f 4 LT5517 4 fRF = 40MHz 100 CONV GAIN (dB) RF-LO ISOLATION (dB) 110 90 80 fRF = 400MHz 0 f2XLO = 1602MHz VCC = 5V TA = –40°C 2 TA = 25°C –5 RETURN LOSS (dB) 6 120 TA = 85°C 0 70 fRF = 800MHz –2 –10 RF –15 LO –20 60 TA = 25°C VCC = 5V 50 –10 –5 0 –15 5 RF INPUT POWER (dBm) 10 5517 G13 –4 0.1 1 10 100 BASEBAND FREQUENCY (MHz) 1000 5517 G14 –25 0 0.40 1.20 1.60 0.80 FREQUENCY (GHz) 2 5517 G15 µ 5517f 5 LT5517 VCC VCC VCC VCC 6 7 8 12 I-MIXER RF 16 IOUT+ 15 IOUT– 0° RF AMP + LPF 2 LO BUFFERS RF – 3 ÷2 90° LPF 14 QOUT+ 13 QOUT– Q-MIXER BIAS 5 EN 9 11 17 GND GND EXPOSED PAD 10 5517 BD 2XLO 5517f 6 LT5517 J3 J5 IOUT– C15 10pF QOUT+ C14 10pF J4 J6 3 4 RF + RF QOUT – GNDRF LT5517 – 2XLO GNDRF C2 1nF VCC GND GND VCC 2 VCC C10 3.3pF VCC 1 RF QOUT + C1 T1 MABAES0054 1nF IOUT + R2 0Ω QOUT– C13 10pF 16 15 14 13 EN J1 C16 10pF IOUT – IOUT+ 5 6 7 8 12 C12 1nF 11 10 J2 2XLO 9 C11 1nF 17 VCC EN R1 100k REFERENCE DESIGNATION C1,C2,C5,C11,C12 C3 C4 C10 C13 TO C16 R1 R2 T1 VALUE 1nF 0.1µF 2.2µF 3.3pF 10pF 100k 0Ω 1:4 SIZE 0603 0603 0603 0603 0805 0603 0603 C5 1nF C3 0.1µF C4 2.2µF PART NUMBER AVX 06033A102JAT1A TAIYO YUDEN EMK107B TAIYO YUDEN JMK107B AVX 06033A3R3KAT2A AVX 08055A100ZAT1A OPTIONAL JUMPER, OPTIONAL M/A COM MABAES0054 5517 F02 5517f 7 LT5517 FREQUENCY (MHz) LSH (nH) CS1, CS2 (pF) 40 437 71.1 100 169 28.6 200 80.8 14.3 300 51.5 9.6 400 37 7.2 500 28.3 5.8 600 22.6 4.9 700 18.5 4.2 800 15.6 3.7 900 13.5 3.3 MATCHING NETWORK CS1 3.7pF RF INPUT TO RF+ CS2 3.7pF LSH 15.6nH TO RF– 5517 F05 5517f 8 LT5517 DIFFERENTIAL S11 FREQUENCY (MHz) DIFFERENTIAL INPUT IMPEDANCE (Ω) MAG ANGLE(°) 40 240.1-j10.3 0.665 –0.8 100 245.5-j25.9 0.664 –2.5 200 236.8-j50.0 0.664 –5.1 300 223.6-j70.5 0.663 –7.6 400 207.9-j86.3 0.662 –10.2 500 190.6-j98.1 0.660 –12.7 600 173.2-j105.8 0.657 –15.3 700 156.2-j110.2 0.655 –17.9 800 141.2-j111.8 0.651 –20.4 900 129.5-j114.5 0.650 –22.9 • LT5517 VCC J1 RF T1 MABAES0054 5 C10 3.3pF 4 C1 1nF 1 2 RF+ 2 250Ω 3 3 RF– 2.30V C2 1nF 5517 F06 5517f 9 LT5517 VCC 60Ω 60Ω 60Ω 60Ω IOUT+ IOUT– 10pF QOUT+ QOUT– 16 15 14 13 10pF 5517 F07 5517f 10 LT5517 (Reference LTC DWG # 05-08-1692) 0.72 ±0.05 4.35 ± 0.05 2.15 ± 0.05 2.90 ± 0.05 (4 SIDES) PACKAGE OUTLINE 0.30 ±0.05 0.65 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW—EXPOSED PAD 4.00 ± 0.10 (4 SIDES) R = 0.115 TYP 0.75 ± 0.05 0.55 ± 0.20 15 16 PIN 1 TOP MARK 1 2.15 ± 0.10 (4-SIDES) 2 (UF) QFN 0503 0.200 REF 0.00 – 0.05 0.30 ± 0.05 0.65 BSC NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC) 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 4. EXPOSED PAD SHALL BE SOLDER PLATED 5517f 11 LT5517 ® 5517f 12 0104 0.2K • PRINTED IN JAPAN • • LINEAR TECHNOLOGY CORPORATION 2004