NEXCW224Z5.5V10.7X8.5TRF

V-Chip Memory Back-Up Capacitors
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
NEXCW Series
RoHS Compliant
High Temperature Reflow
+260°C
CHARACTERISTICS
Rated Voltage Range
Rated Capacitance Range
Operating Temp. Range
Capacitance Tolerance
Load Life Test
+85°C 240 hours
Temperature Cycling
(5 cycles, -25 ~ +70°C
Humidity Resistance
(240 hours @ 40°C/90% RH)
3.5 & 5.5VDC
0.047F ~ 0.47F (47,000μF ~ 470,000μF)
-40°C ~ +85°C
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Super Capacitor
Application Guide
Current at 30 minutes
Within ±30% of initial measured value
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Within +80%/-20% of specified value
Less than specified maximum value
Less than specified maximum value
Within ±20% of initial measured value
Less than 120% of the specified maximum value
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
Capacitance
Value (F)
Discharge
Working
Voltage
(VDC)
Max. Current
@ 30 minutes
(mA)
Max. ESR
@ 1KHz
(Ω)
NEXCW104Z3.5V10.7X5.5TRF
0.10
3.5
0.090
100
NEXCW224Z3.5V10.7X5.5TRF
0.22
3.5
0.200
50
NIC P/N
NEXCW474Z3.5V10.7X8.5TRF
0.47
3.5
0.420
50
NEXCW473Z5.5V10.7X5.5TRF
0.047
5.5
0.071
100
NEXCW104Z5.5V10.7X5.5TRF
0.10
5.5
0.150
50
NEXCW224Z5.5V10.7X8.5TRF
0.22
5.5
0.330
50
Temperature - Deg. C
HIGH TEMPERATURE REFLOW PROFILE
Peak Temperature
(260°C)
250
200
Time above
217°C
70 sec. max.
150
100
Cool Down
Time above 170°C
50 sec. max.
50
25
0
Pre-heat
150°C ~ 200°C 150 sec. max.
Peak Temperature
+260°C
Time above +255°C
10 sec. max.
Time above +230°C
45 sec. max.
Time above +220°C
60 sec. max.
Time above +217°C
70 sec. max.
150°C ~ +200°C
(with time above +170°C
50 sec. max.)
150 sec. max.
Time
1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process.
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: [email protected]
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
www.SMTmagnetics.com
1
V-Chip Memory Back-Up Capacitors
NEXCW Series
+
CASE DIMENSIONS (mm)
Case Size
10.7 x 5.5
10.7 x 8.5
Dφ ±
10.7
10.7
L max.
5.5
8.5
A/B ±0.2
10.8
10.8
I
3.9 ±0.5
3.9 ±0.5
W
1.2 ± 0.1
1.2 ± 0.1
P
5.0
5.0
I
I
I
-
w
Dφ
A
0.3mm max.
L
P
B
LAND PATTERN DIMENSIONS (mm)
Case
Diameter
10.7
R
S
T
5.0
4.9
2.5
COMPONENT OUTLINE
T
S
S
R
CARRIER TAPE DIMENSIONS (mm)
Case Size
10.7 x 5.5
10.7 x 8.5
A
11.4
11.4
B
13.0
13.0
D
1.55
1.55
E
1.75
1.75
F
11.5
11.5
P
4.0
4.0
P
P1
16.0
16.0
T1
0.4
0.4
T2
6.0
8.4
1.5∅
D +0.1/-
W
24.0
24.0
Quantity/Reel
1,000
500
1.75 ±
T1
E
-
W
F
B
+
P1
A
T2
Feeding
REEL DIMENSIONS (mm)
Case Size
10.7 x 5.5
10.7 x 8.5
A ± 2.0
380
380
B ± 1.0
80.0
100.0
C ± 0.5
13.0
13.0
D ± 0.8
21.0
21.0
E ± 0.5
2.0
2.0
W
25.5 ± 0.5
25.5 ± 1.0
t
2.0
2.0
t
C
E
A
B
W
2
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
www.SMTmagnetics.com