BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 677 SERIES Standard P/N High-Performance, High-Power Heat Sinks for Vertical Board Mounting Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) 677-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 677-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 677-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 677 SERIES 677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm) 2 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected] TO-218, TO-220, TO-247 15-LEAD Multiwatt Thermal Performance at Typical Load Natural Forced Convection Convection 52°C @ 6W 46°C @ 6W 40°C @ 6W 35°C @ 6W 3.1°C/W @ 200 LFM 2.8°C/W @ 200 LFM 2.5°C/W @ 200 LFM 2.2°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS