NFSW157AT

NICHIA STS-DA1-1300B <Cat.No.110406>
NICHIA CORPORATION
SPECIFICATIONS FOR WHITE LED
NFSW157AT
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-1300B <Cat.No.110406>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
200
mA
Pulse Forward Current
IFP
400
mA
Allowable Reverse Current
IR
85
mA
Power Dissipation
PD
720
mW
Operating Temperature
Topr
-40~100
°C
Storage Temperature
Tstg
-40~100
°C
Junction Temperature
TJ
120
°C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Symbol
Condition
Typ
Max
Unit
Forward Voltage
Item
VF
IF=150mA
3.2
-
V
Luminous Flux
Φv
IF=150mA
55
-
lm
Iv
IF=150mA
18.5
-
cd
-
IF=150mA
0.344
-
-
-
IF=150mA
0.355
-
-
RθJS
-
17
24
°C/W
Luminous Intensity
Chromaticity Coordinate
x
y
Thermal Resistance
* Characteristics at TS=25°C.
* Luminous Flux value is traceable to the CIE 127:2007-compliant national standards.
* The Chromaticity Coordinates are derived from the CIE 1931 Chromaticity Diagram.
* RθJS is Thermal Resistance from junction to TS measuring point.
1
NICHIA STS-DA1-1300B <Cat.No.110406>
RANKS
Item
Forward Voltage
Luminous Flux
Rank
Min
-
Max
Unit
V
2.8
3.6
P14
51.0
60.5
P13
42.8
51.0
P12
36.0
42.8
lm
Color Ranks
Rank b3
Rank b4
x
0.287
0.283
0.304
0.307
x
0.307
0.304
0.330
0.330
y
0.295
0.305
0.330
0.315
y
0.315
0.330
0.360
0.339
x
0.296
0.287
0.307
0.311
x
0.311
0.307
0.330
0.330
y
0.276
0.295
0.315
0.294
y
0.294
0.315
0.339
0.318
Rank b5
Rank b6
Rank c1
Rank c2
x
0.330
0.330
0.361
0.357
x
0.330
0.330
0.357
0.356
y
0.339
0.360
0.385
0.361
y
0.318
0.339
0.361
0.351
* Ranking at TS=25°C.
* Tolerance of measurements of the Forward Voltage is ±0.05V.
* Tolerance of measurements of the Luminous Flux is ±7%.
* Tolerance of measurements of the Chromaticity Coordinate is ±0.005.
* Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
Correspondence table of Color Coordinates - Luminous Flux ranks
Ranking by
Luminous Flux
Ranking by
P12
P13
P14
Color Coordinates
b3
b4,b5,b6,c1,c2
2
NICHIA STS-DA1-1300B <Cat.No.110406>
CHROMATICITY DIAGRAM
0.45
0.40
c1
0.35
c2
y
b4
b3
0.30
b6
b5
0.25
0.20
0.20
0.25
0.30
0.35
0.40
0.45
x
3
NICHIA STS-DA1-1300B <Cat.No.110406>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
管理番号 No.
NxSW157A
STS-DA7-0296A
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
0.52
3
(2.6)
1.4
(1)
(0.2)
Cathode
1.56
0.86
(0.6)
(0.3)
2.6
Anode
0.54
項目 Item
内容 Description
パッケージ材質
Package Materials
電極材質
Electrodes Materials
耐熱性ポリマー
Heat-Resistant Polymer
シリコーン樹脂
（拡散剤+蛍光体入り）
Silicone Resin
(with diffuser and phosphor)
銅合金+銀メッキ
Ag-plated Copper Alloy
質量
Weight
0.0074g(TYP)
封止樹脂材質
Encapsulating Resin
Materials
* バリは寸法に含まないものとします。
Dimensions do not include mold flash or metal burr.
K
A
保護素子
Protection Device
4
NICHIA STS-DA1-1300B <Cat.No.110406>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
260°C Max
10sec Max
Pre-heat
180 to 200°C
• Recommended Manual Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
60sec Max
Above 220°C
120sec Max
• Recommended Metal Solder Stencil Aperture
2.4
0.6
1.66
0.5
0.64
0.6
0.6
1.56
0.7
0.54
1 .5 5
0 .6 6
0.8
1 .5 5
0 .8 6
0.8
0 .8 6
• Recommended Soldering Pad Pattern
0.6
(単位 Unit: mm)
* The product is designed to be reflow soldered to a PCB. If you use dip soldering for the products,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
due to the heat and atmosphere of reflow soldering.
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, wire breakage
and an adverse effect on product reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, avoid applying any stress to the LED package while heated.
5
NICHIA STS-DA1-1300B <Cat.No.110406>
TAPE AND REEL DIMENSIONS
3.5 ±0.05
Cathode
4±0.1
(単位 Unit: mm)
0.2±0.05
3.25 ±0.1
2±0.05
Nxxx157x
STS-DA7-0071B
8 +0.3
-0.1
4±0.1
Φ1.5+0.1
-0
管理番号 No.
1.75 ±0.1
テーピング部 Tape
Φ1+0.1
-0
0.65±0.1
1.6±0.1
エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
LED装着部
Loaded Pockets
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
180+0
-3
11.4±1
9±0.3
* 数量は1リールにつき 5000個入りです。
Quantity per reel=5000pcs
Φ
* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
±
21
±0.2
ラベル
Label
Φ
13 ±
0.
2
f 13
.8
Φ60 +1
-0
8
0.
f2
1 ±0
6
NICHIA STS-DA1-1300B <Cat.No.110406>
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
The reel is placed in the moisture proof bag with a moisture absorbent
material. The bag is heat sealed.
管理番号 No.
Nxxxxxxx
STS-DA7-0006A
ラベル Label
シリカゲル
Moisture Absorbent Material
リール
Reel
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
熱シール
Seal
アルミ防湿袋
Moisture Proof Foil Bag
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
The moisture proof foil bags are packed in a cardboard box
with corrugated partition.
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
PCS
QTY.
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it is not indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING SCHEME"
in this document.
* ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
The products are taped and reeled, and then packed in moisture-proof bags.
The moisture-proof bags are packed in cardboard boxes to prevent damage during shipment.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop the cardboard box or expose it to shock. If the box falls, the products could be damaged.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
The cardboard box is not water-resistant. Do not expose to water.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Customer is advised to pack the products in the original packaging or equivalent in transit.
7
NICHIA STS-DA1-1300B <Cat.No.110406>
LOT NUMBERING SCHEME
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2009
9
2010
A
2011
B
2012
C
2013
D
2014
E
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux
8
NICHIA STS-DA1-1300B <Cat.No.110406>
DERATING CHARACTERISTICS
管理番号 No.
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
カソード側はんだ接合部温度-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
RθJA =88°C/W
Derating2
250
250
150
100
(100, 66.0)
50
Allowable Forward Current(mA)
200
許容順電流
許容順電流
(60, 200)
Allowable Forward Current(mA)
NFSW157A
STS-DA7-0385
(100, 200)
200
150
100
50
0
0
0
20
40
60
80
100
120
0
20
40
60
80
100
周囲温度
カソード側はんだ接合部温度
Ambient Temperature(°C)
Solder Temperature(Cathode Side)(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
120
TA =25°C
許容順電流
Allowable Forward Current(mA)
1000
400
200
100
10
1
10
100
デューティー比
Duty Ratio(%)
9
NICHIA STS-DA1-1300B <Cat.No.110406>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
管理番号 No.
NFSW157A
STS-DA7-0310
発光スペクトル
Spectrum
T A=25°C
IFP=150mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
T A=25°C
IFP=150mA
-20°
-10°
0°
10°
20°
30°
-30°
40°
-40°
50°
放射角度
Radiation Angle
-50°
-60°
60°
70°
-70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
10
NICHIA STS-DA1-1300B <Cat.No.110406>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSW157A
管理番号 No. STS-DA7-0311A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
VfIf
T A=25°C
1000
TaVf
IFP= 150 mA
4.0
順電圧
Forward Voltage(V)
順電流
Forward Current(mA)
400
150
100
10
2.5
3.5
3.0
2.5
3.0
3.5
4.0
-60 -40 -20
順電圧
Forward Voltage(V)
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
周囲温度-相対光束特性
Ambient Temperature vs
Relative Luminous Flux
IfIv
T A=25°C
TaIv
IFP= 150 mA
1.4
3.0
相対光束
Relative Luminous Flux(a.u.)
相対光束
Relative Luminous Flux(a.u.)
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.6
0.0
0
100
200
300
順電流
Forward Current(mA)
400
500
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
11
NICHIA STS-DA1-1300B <Cat.No.110406>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSW157A
管理番号 No. STS-DA7-0312A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-色度特性
Forward Current vs
Chromaticity Coordinate
Ifxy
TA =25°C
0.37
20mA
0.36
y
100mA
150mA
200mA
0.35
400mA
0.34
0.33
0.32
0.33
0.34
0.35
0.36
x
周囲温度-色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
I FP= 150 mA
0.37
-40°C
0.36
0°C
y
25°C
50°C
0.35
100°C
0.34
0.33
0.32
0.33
0.34
0.35
0.36
x
12
NICHIA STS-DA1-1300B <Cat.No.110406>
RELIABILITY
(1) Tests and Results
Reference
Test
Standard
Resistance to
Soldering Heat
(Reflow Soldering)
Test
Test Conditions
Duration
JEITA ED-4701
Tsld=260°C, 10sec, 2reflows,
300 301
Precondition: 30°C, 70%RH, 168hr
#2
0/22
100cycles
#1
0/50
10cycles
#1
0/22
TA=100°C
1000hours
#1
0/22
TA=60°C, RH=90%
1000hours
#1
0/22
TA=-40°C
1000hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
48minutes
#1
0/22
#1
0/22
#1
0/22
JEITA ED-4701
Tsld=245±5°C, 5sec,
303 303A
Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
Moisture Resistance
JEITA ED-4701
25°C~65°C~-10°C, 90%RH,
(Cyclic)
200 203
24hr per cycle
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
TA=25°C, IF=150mA
Operating Life
Test board: See NOTES below
Condition 1
Room Temperature
TA=25°C, IF=200mA
Operating Life
Test board: See NOTES below
Condition 2
High Temperature
TA=100°C, IF=65mA
Operating Life
Test board: See NOTES below
Temperature Humidity
60°C, RH=90%, IF=130mA
Operating Life
Test board: See NOTES below
Low Temperature
TA=-40°C, IF=150mA
Operating Life
Test board: See NOTES below
Vibration
Electrostatic Discharges
JEITA ED-4701
200m/s2, 100~2000~100Hz,
400 403
4cycles, 4min, each X, Y, Z
JEITA ED-4701
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
300 304
alternately positive or negative
Soldering Joint Shear
JEITA ED-4702B
Strength
002 3
Failed/Tested
0/22
(Reflow Soldering)
Room Temperature
#
Units
#1
Solderability
Temperature Cycle
Failure
Criteria
5N, 10±1sec
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈88°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
#1
#2
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=150mA
>U.S.L.×1.1
Luminous Flux(ΦV)
IF=150mA
<L.S.L.×0.7
Solderability
-
Less than 95% solder coverage
U.S.L. : Upper Specification Limit
L.S.L. : Lower Specification Limit
13
NICHIA STS-DA1-1300B <Cat.No.110406>
CAUTIONS
(1) Storage
Conditions
Storage
Temperature
Humidity
Time
Before Opening Aluminum Bag
≤30°C
≤90%RH
Within 1 Year from Delivery Date
After Opening Aluminum Bag
≤30°C
≤70%RH
≤168hours
65±5°C
-
≥24hours
Baking
● This product is compliant to JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for the details of the moisture sensitivity levels.
● Interface delamination can occur due to vaporization and expansion of absorbed moisture
in the LED packages caused by soldering heat, which may result in degradation in optical performance.
To minimize moisture absorption into the products during the transportation and storage, the products are packed
in a moisture-proof aluminum bag. Desiccants (silica gel) inside the packing turn from blue to red as it absorbs moisture.
● After opening the moisture-proof aluminum bag, the products should be completed soldering process
within the range of the conditions above. If unused LEDs remain, they should be stored with desiccants (silica gel)
in hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage.
● After the "Period After Opening" specified above, or if the desiccants (silica gel) are no longer blue, the products need to be baked.
Note that baking must only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use as exposure to a corrosive environment
might cause the plated metal parts of the product to tarnish, which might lead to difficulties in soldering and/or adverse effects
on optical characteristics. It is also recommended to return the LEDs to the original moisture proof bag
and seal the moisture proof bag again.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing. After assembly and during use,
silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs
within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing. Resin materials, in particular, may contain substances
which affects on silver plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended
as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts
inside the products, caused by low molecular weight volatile siloxane.
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
(2) Directions for Use
● In designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating specified for each LED.
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● This product should be operated in forward bias. A driving circuit must be designed
so that the product is not subjected to either forward or reverse voltage while it is off. In particular,
if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
14
NICHIA STS-DA1-1300B <Cat.No.110406>
(3) Handling Precautions
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
● When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,
and wire to be broken, and thus resulting in catastrophic failure.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not with hands.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die
or reduce its reliability performance. When handling the products, measures against electro static discharge,
including the followings, are strongly recommended.
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
Also note that surge protection should be considered in the design of customer products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
including the followings, are strongly recommended.
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement or light up test
at low current. (the recommended current is 1mA or lower)
● ESD-damaged LEDs may have a current flow at low voltage, or no longer light up at low current.
Failure Criteria: VF<2.0V at IF=0.5mA
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NICHIA STS-DA1-1300B <Cat.No.110406>
(6) Thermal Management
● Thermal management is an important factor when designing your product by using the LEDs.
The rise in LED die temperature can be affected by PCB thermal resistance or/and LED spacing as mounted on the board.
Customer is advised to design the product to ensure that the LED die temperature
does not exceed the required maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature(Cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measuring point: °C/W
W=Input power(IFxVF): W
Ts Point
(7) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended for the LEDs since it may adversely effect on the LEDs
by the ultrasonic power and LED assembled condition.
If it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the LEDs.
(8) Eye Safety
● The International Electrical Commission (IEC) published in 2006, IEC 62471:2006 Photobiological safety of lamps
and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope
of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope.
However, keep it mind that some countries and regions have adopted standards based on the IEC laser safety standard
IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006, most of Nichia LEDs can be classified
as belonging to either Exempt Group or Risk Group 1. Especially a high-power LED, that emits light containing blue wavelengths,
may be in Risk Group 2. Great care should be taken when viewing directly the LED driven at high current or the LED
with optical instruments, which greatly increase the hazard to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
precaution should be taken to avoid adverse effect on human body caused by the light stimulus.
(9) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● Customer and Nichia shall agree the official specification of supplied products prior to the start of a customer’s volume production.
● The appearance and specifications of the product may be modified for improvement without notice.
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