NS9W153AMT

NICHIA STS-DA1-1396A <Cat.No.120308>
NICHIA CORPORATION
SPECIFICATIONS FOR WHITE LED
NS9W153AMT
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-1396A <Cat.No.120308>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
400
mA
Pulse Forward Current
IFP
500
mA
Allowable Reverse Current
IR
85
mA
Power Dissipation
PD
4.40
W
Operating Temperature
Topr
-40~100
°C
Storage Temperature
Tstg
-40~100
°C
Junction Temperature
TJ
150
°C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Condition
Typ
Max
IF=120mA
8.8
-
IF=350mA
10
-
IF=120mA
140
-
IF=350mA
350
-
IF=120mA
46
-
IF=350mA
114
-
-
IF=120mA
0.344
-
-
IF=120mA
0.355
-
-
RθJS
-
10
13
°C/W
Forward Voltage
VF
Luminous Flux
Φv
Luminous Intensity
Iv
Chromaticity Coordinate
Thermal Resistance
x
y
Unit
V
lm
cd
-
* Characteristics at TS=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
* RθJS is Thermal Resistance from junction to TS measuring point.
1
NICHIA STS-DA1-1396A <Cat.No.120308>
RANKS
Item
Forward Voltage
Luminous Flux
Rank
Condition
Min
Max
K
9.5
10.0
J
9.0
9.5
8.5
9.0
IF=120mA
Z
Y
8.0
8.5
B15
150
160
140
150
130
140
120
130
B14
IF=120mA
B13
B12
Unit
V
lm
Color Ranks
Rank b3
Rank b4
x
0.287
0.283
0.304
0.307
x
0.307
0.304
0.330
0.330
y
0.295
0.305
0.330
0.315
y
0.315
0.330
0.360
0.339
Rank b5
Rank b6
x
0.296
0.287
0.307
0.311
x
0.311
0.307
0.330
0.330
y
0.276
0.295
0.315
0.294
y
0.294
0.315
0.339
0.318
x
0.330
0.330
0.361
0.357
x
0.330
0.330
0.357
0.356
y
0.339
0.360
0.385
0.361
y
0.318
0.339
0.361
0.351
Rank c1
Rank c2
* Ranking at TS=25°C.
* Tolerance of measurements of the Forward Voltage is ±0.11V.
* Tolerance of measurements of the Luminous Flux is ±7%.
* Tolerance of measurements of the Chromaticity Coordinate is ±0.01.
* A shipment shall consist of LEDs in a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2
NICHIA STS-DA1-1396A <Cat.No.120308>
CHROMATICITY DIAGRAM
0.45
0.40
c1
0.35
c2
y
b4
b3
0.30
b6
b5
0.25
0.20
0.20
0.25
0.30
0.35
0.40
0.45
x
3
NICHIA STS-DA1-1396A <Cat.No.120308>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
管理番号 No.
NS9W153AM
STS-DA7-0512
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
4
1
4
(3.2)
(3.2)
0.15
Cathode Mark
0.85
3.2
3.2
0.8
Cathode
K
Anode
項目 Item
内容 Description
パッケージ材質
Package Materials
セラミックス
Ceramics
封止樹脂材質
Encapsulating Resin
Materials
シリコーン樹脂
（拡散剤+蛍光体入り）
Silicone Resin
(with diffuser and phosphor)
電極材質
Electrodes Materials
金メッキ
Au-plated
質量
Weight
0.039g(TYP)
A
保護素子
Protection Device
4
NICHIA STS-DA1-1396A <Cat.No.120308>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
260°C Max
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
● Recommended Soldering Pad Pattern
4.1
3.5
0.6
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
5
NICHIA STS-DA1-1396A <Cat.No.120308>
TAPE AND REEL DIMENSIONS
テーピング部 Tape
2±0.05 4±0.1
5.5±0.05
12+0.3
-0.1
Cathode Mark
0.2±0.05
(単位 Unit: mm)
4.35±0.1
8±0.1
1.75±0.1
Φ1.5+0.1
-0
Nxxx153x
STS-DA7-0153
管理番号 No.
Φ1.5+0.2
-0
1.1±0.1
4.35±0.1
エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
LED装着部
Loaded Pockets
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
180+0
-3
15.4±1
13+1
-0
* 数量は1リールにつき 2000個入りです。
Quantity per reel=2000pcs
Φ
* JIS C 0806電子部品テーピングに準拠しています。
±
21
ラベル
Label
Φ
13 ±
0
.2
Φ60+1
-0
8
0.
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
6
NICHIA STS-DA1-1396A <Cat.No.120308>
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
管理番号 No.
Nxxxxxxx
STS-DA7-0006B
ラベル Label
リール
Reel
シリカゲル
Desiccants
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
熱シール
Seal
アルミ防湿袋
Moisture-proof Bag
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it is not indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING SCHEME"
in this document.
* ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or shock the box. It may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water, the box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using an original packaging material or equivalent in transit is recommended.
7
NICHIA STS-DA1-1396A <Cat.No.120308>
LOT NUMBERING SCHEME
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2009
9
2010
A
2011
B
2012
C
2013
D
2014
E
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage
8
NICHIA STS-DA1-1396A <Cat.No.120308>
DERATING CHARACTERISTICS
管理番号 No.
RθJA =15°C/W
RθJA =20°C/W
RθJA =25°C/W
RθJA =30°C/W
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
カソード側はんだ接合部温度-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Cu rrent
Derating2
500
(18, 400) (40, 400) (62, 400) (84, 400)
400
(100, 303)
許容順電流
300
(100, 227)
200
(100, 181)
(100, 151)
100
Allowable Forward Current(mA)
許容順電流
500
Allowable Forward Current(mA)
NS9W153AM
STS-DA7-0508
(100, 400)
400
300
200
100
0
0
0
20
40
60
80
100
120
0
20
40
60
80
100
周囲温度
カソード側はんだ接合部温度
Ambient Temperature(°C)
Solder Temperature(Cathode Side)(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
120
TA=25°C
許容順電流
Allowable Forward Current(mA)
1000
500
400
100
10
1
10
100
デューティー比
Duty Ratio(%)
9
NICHIA STS-DA1-1396A <Cat.No.120308>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
管理番号 No.
発光スペクトル
Spectrum
NS9W153AM
STS-DA7-0509
T A=25°C
IFP=120mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
T A=25°C
IFP=120mA
-20°
-10°
0°
10°
20°
30°
-30°
40°
放射角度
Radiation Angle
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
10
NICHIA STS-DA1-1396A <Cat.No.120308>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
管理番号 No.
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
VfIf
T A=25°C
1000
NS9W153AM
STS-DA7-0510
TaVf
IFP=120 mA
12
500
順電圧
Forward Voltage(V)
順電流
Forward Current(mA)
11
120
100
10
9
8
10
7
7
8
9
10
11
12
-60
-40 -20
順電圧
Forward Voltage(V)
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
周囲温度-相対光束特性
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
Ambient Temperature vs
Relative Luminous Flux
IfIv
T A=25°C
4.0
TaIv
IFP= 120 mA
1.4
相対光束
Relative Luminous Flux(a.u.)
相対光束
Relative Luminous Flux(a.u.)
3.5
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.6
0.0
0
100
200
300
400
順電流
Forward Current(mA)
500
600
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
11
NICHIA STS-DA1-1396A <Cat.No.120308>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-色度特性
Forward Current vs
Chromaticity Coordinate
管理番号 No.
NS9W153AM
STS-DA7-0511
Ifxy
TA=25°C
0.37
0.36
20mA
y
100mA
120mA
350mA
400mA
500mA
0.35
0.34
0.33
0.32
0.33
0.34
0.35
0.36
x
周囲温度-色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
I FP= 120 mA
0.37
-40°C
0.36
0°C
y
25°C
50°C
0.35
100°C
0.34
0.33
0.32
0.33
0.34
0.35
0.36
x
12
NICHIA STS-DA1-1396A <Cat.No.120308>
RELIABILITY
(1) Tests and Results
Reference
Test
Standard
Resistance to
Test
Test Conditions
Duration
JEITA ED-4701
Tsld=260°C, 10sec, 2reflows,
300 301
Precondition: 30°C, 70%RH, 168hr
Solderability
JEITA ED-4701
Tsld=245±5°C, 5sec,
(Reflow Soldering)
303 303A
Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
Moisture Resistance
JEITA ED-4701
25°C~65°C~-10°C, 90%RH,
(Cyclic)
200 203
24hr per cycle
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Soldering Heat
(Reflow Soldering)
Temperature Cycle
#2
0/22
100cycles
#1
0/22
10cycles
#1
0/22
TA=100°C
1000hours
#1
0/22
TA=60°C, RH=90%
1000hours
#1
0/22
TA=-40°C
1000hours
#1
0/22
1000hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
1time
#1
0/22
48minutes
#1
0/22
#1
0/22
Operating Life
Test board: See NOTES below
High Temperature
TA=100°C, IF=150mA
Operating Life
Test board: See NOTES below
Temperature Humidity
60°C, RH=90%, IF=300mA
Operating Life
Test board: See NOTES below
Low Temperature
TA=-40°C, IF=350mA
Operating Life
Test board: See NOTES below
Electrostatic Discharges
Failed/Tested
0/22
TA=25°C, IF=400mA
Vibration
#
Units
#1
Room Temperature
Permanence of Marking
Failure
Criteria
JEITA ED-4701
Isopropyl Alcohol, 23±5°C,
500 501
Dipping Time: 5min
JEITA ED-4701
200m/s2, 100~2000~100Hz,
400 403
4cycles, 4min, each X, Y, Z
JEITA ED-4701
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
300 304
alternately positive or negative
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈28°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
#1
#2
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=120mA,350mA
>Initial value×1.1
Luminous Flux(ΦV)
IF=120mA,350mA
<Initial value×0.7
Solderability
-
Less than 95% solder coverage
13
NICHIA STS-DA1-1396A <Cat.No.120308>
CAUTIONS
(1) Storage
Conditions
Storage
Temperature
Humidity
Time
Before Opening Aluminum Bag
≤30°C
≤90%RH
Within 1 Year from Delivery Date
After Opening Aluminum Bag
≤30°C
≤70%RH
≤168hours
65±5°C
-
≥24hours
Baking
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment
may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics.
It is also recommended to return the LEDs to the original moisture proof bags and reseal.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing.
Resin materials, in particular, may contain substances which can affect silver plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended
as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts
inside the products, caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
(2) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
Continuous reverse voltage can cause migration and LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(3) Handling Precautions
● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result.
● When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
14
NICHIA STS-DA1-1396A <Cat.No.120308>
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
Thermal stress during use can cause the solder joints to crack.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement at low current (≤3mA).
● ESD damaged LEDs may have current flow at a low voltage.
Failure Criteria: VF<6.0V at IF=1.5mA
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measuring point: °C/W
W=Input power(IF×VF): W
3.5
Ts Point
R1
0.6
4.1
15
NICHIA STS-DA1-1396A <Cat.No.120308>
(7) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
(8) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.
(9) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production.
● Specifications and appearance subject to change for improvement without notice.
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