NICHIA STS-DA1-2412 <Cat.No.120330> NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NSSW088AT ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant NICHIA STS-DA1-2412 <Cat.No.120330> SPECIFICATIONS (1) Absolute Maximum Ratings Symbol Absolute Maximum Rating Unit Forward Current Item IF 35 mA Pulse Forward Current IFP 100 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 123 mW Operating Temperature Topr -40~110 °C Storage Temperature Tstg -40~110 °C Junction Temperature TJ 125 °C * Absolute Maximum Ratings at TA=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%. (2) Initial Electrical/Optical Characteristics Item Symbol Condition Typ Unit VF IF=20mA 3.2 V Iv IF=20mA 1.6 cd x - IF=20mA 0.31 - y - IF=20mA 0.32 - Iv IF=20mA 1.5 cd x - IF=20mA 0.28 - y - IF=20mA 0.27 - Thermal Resistance RθJS - 190 °C/W Thermal Resistance RθJA - 380 °C/W Forward Voltage Luminous Intensity (Chromaticity Coordinate1) Chromaticity Coordinate1 Luminous Intensity (Chromaticity Coordinate2) Chromaticity Coordinate2 * Characteristics at TA=25°C. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RθJS is Thermal Resistance from junction to TS measuring point. * RθJA is Thermal Resistance from junction to ambient（Test board: FR4 board thickness=1.6mm, copper layer thickness=35µm）. 1 NICHIA STS-DA1-2412 <Cat.No.120330> RANKS Item Forward Voltage Luminous Intensity Rank Min - Max Unit V 2.8 3.5 W2 2.40 2.88 W1 2.00 2.40 V2 1.72 2.00 V1 1.44 1.72 U2 1.20 1.44 U1 1.00 1.20 cd Color Ranks Rank a3 Rank b5 x 0.280 0.264 0.287 0.296 x 0.296 0.287 0.307 0.311 y 0.248 0.267 0.295 0.276 y 0.276 0.295 0.315 0.294 x 0.311 0.307 0.330 0.330 x 0.291 0.279 0.302 0.308 y 0.294 0.315 0.339 0.318 y 0.257 0.276 0.302 0.279 Rank b6 Rank b7 Rank b8 x 0.308 0.302 0.319 0.321 y 0.279 0.302 0.318 0.294 * Ranking at TA=25°C. * Tolerance of measurements of the Forward Voltage is ±3%. * Tolerance of measurements of the Luminous Intensity is ±10%. * Tolerance of measurements of the Chromaticity Coordinate is ±0.01. * A shipment shall consist of LEDs in a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2 NICHIA STS-DA1-2412 <Cat.No.120330> CHROMATICITY DIAGRAM 0.45 0.40 0.35 y b6 b5 0.30 a3 b8 b7 0.25 0.20 0.20 0.25 0.30 0.35 0.40 0.45 x 3 NICHIA STS-DA1-2412 <Cat.No.120330> OUTLINE DIMENSIONS * 本製品はRoHS指令に適合しております。 This product complies with RoHS Directive. 管理番号 No. NSSx088A STS-DA7-2643 (単位 Unit:±0.1) mm) (単位 Unit: mm, 公差 Tolerance: Cathode Mark 1.4 3.5 3.2 (0.75) 0.65 0.65 0.3 Cathode Anode 0.75 1.2 (0.1) (0.95) (2.8) 項目 Item 内容 Description パッケージ材質 Package Materials 電極材質 Electrodes Materials 耐熱性ポリマー Heat-Resistant Polymer シリコーン樹脂 （拡散剤+蛍光体入り） Silicone Resin (with diffuser and phosphor) 銅合金+銀メッキ Ag-plated Copper Alloy 質量 Weight 0.010g(TYP) 封止樹脂材質 Encapsulating Resin Materials * バリは寸法に含まないものとします。 Dimensions do not include mold flash or metal burr. K A 保護素子 Protection Device 4 NICHIA STS-DA1-2412 <Cat.No.120330> SOLDERING • Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec • Recommended Hand Soldering Condition 260°C Max 10sec Max Pre-heat 180 to 200°C Temperature 350°C Max Soldering Time 3sec Max 60sec Max Above 220°C 120sec Max • Recommended Soldering Pad Pattern 9.8 4 4 1.4 4 0.9 1.4 (単位 Unit: mm) Blank boxes: Solder resist opening , Shaded areas: Footprint * This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * When soldering, do not apply stress to the LED while the LED is hot. 5 NICHIA STS-DA1-2412 <Cat.No.120330> TAPE AND REEL DIMENSIONS テーピング部 Tape 1.75 ±0.1 Cathode Mark 4±0.1 0.25±0.05 Φ1±0.1 (単位 Unit: mm) 3.7 ±0.1 5.5 ±0.05 2±0.05 12 +0.3 -0.1 4±0.1 Φ1.5+0.1 -0 Nxxx088x STS-DA7-2677 管理番号 No. 1.35±0.1 1.55±0.1 エンボスキャリアテープ Embossed Carrier Tape トレーラ部/リーダ部 Trailer and Leader トップカバーテープ Top Cover Tape 引き出し方向 Feed Direction トレーラ部最小160mm（空部） Trailer 160mm MIN(Empty Pockets) LED装着部 Loaded Pockets 引き出し部最小100mm（空部） Leader with Top Cover Tape 100mm MIN(Empty Pocket) リーダ部最小400mm Leader without Top Cover Tape 400mm MIN リール部 Reel 180+0 -3 15.4±1 13+1 -0 * 数量は1リールにつき 3000個入りです。 Reel Size: 3000pcs Φ * JIS C 0806電子部品テーピングに準拠しています。 ± 21 ラベル Label Φ 13 ± 0. 2 Φ60 +1 -0 8 0. The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes). 6 NICHIA STS-DA1-2412 <Cat.No.120330> PACKAGING - TAPE & REEL シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。 Reels are shipped with desiccants in heat-sealed moisture-proof bags. 管理番号 No. Nxxxxxxx STS-DA7-0006B ラベル Label リール Reel シリカゲル Desiccants XXXX LED TYPE Nxxxxxxx ******* LOT YMxxxx-RRR QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN 熱シール Seal アルミ防湿袋 Moisture-proof Bag アルミ防湿袋を並べて入れ、ダンボールで仕切ります。 Moisture-proof bags are packed in cardboard boxes with corrugated partitions. ラベル Label XXXX LED TYPE Nxxxxxxx ******* RANK RRR PCS QTY. RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Nichia LED * 客先型名を*******で示します。 客先型名が設定されていない場合は空白です。 ******* is the customer part number. If not provided, it is not indicated on the label. * ロット表記方法についてはロット番号の項を 参照して下さい。 For details, see "LOT NUMBERING SCHEME" in this document. * ランク分けがない場合はランク表記はありません。 The label does not have the RANK field for un-ranked products. * 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。 Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation. * 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。 Do not drop or shock the box. It may damage the products. * ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。 Do not expose to water, the box is not water-resistant. * 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。 Using an original packaging material or equivalent in transit is recommended. 7 NICHIA STS-DA1-2412 <Cat.No.120330> LOT NUMBERING SCHEME Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR Y - Year Year Y 2009 9 2010 A 2011 B 2012 C 2013 D 2014 E M - Month Month M Month M 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 A 5 5 11 B 6 6 12 C xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Intensity 8 NICHIA STS-DA1-2412 <Cat.No.120330> DERATING CHARACTERISTICS 管理番号 No. NSSx088A STS-DA7-2706 周囲温度-許容順電流特性 Ambient Temperature vs Allowable Forward Current Derating1 許容順電流 Allowable Forward Current(mA) 50 40 (68, 35.0) 30 20 10 (110, 10.0) 0 0 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) デューティー比-許容順電流特性 Duty Ratio vs Allowable Forward Current Duty TA =25°C 許容順電流 Allowable Forward Current(mA) 1000 100 35 10 1 10 100 デューティー比 Duty Ratio(%) 9 NICHIA STS-DA1-2412 <Cat.No.120330> OPTICAL CHARACTERISTICS * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 管理番号 No. 発光スペクトル Spectrum NSSW088A STS-DA7-2710 T A=25°C IF=20mA Spectrum 1.0 相対発光強度 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 波長 Wavelength(nm) Directivity1 指向特性 Directivity T A=25°C IFP=20mA -20° -10° 0° 10° 20° 30° -30° 40° -40° 50° 放射角度 Radiation Angle -50° -60° 60° 70° -70° 80° -80° -90° 90° 1 0.5 0 0.5 1 相対光度 Relative Luminosity(a.u.) 10 NICHIA STS-DA1-2412 <Cat.No.120330> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電圧-順電流特性 Forward Voltage vs Forward Current 管理番号 No. 周囲温度-順電圧特性 Ambient Temperature vs Forward Voltage VfIf T A=25°C 100 NSSW088A STS-DA7-2711 IFP= 5mA IFP=20mA IFP= 60mA TaVf 5.0 順電圧 Forward Voltage(V) 順電流 Forward Current(mA) 4.5 20 10 4.0 3.5 3.0 2.5 1 2.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -20 順電圧 Forward Voltage(V) 0 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) 周囲温度-相対光度特性 順電流-相対光度特性 Forward Current vs Relative Luminosity Ambient Temperature vs Relative Luminosity IfIv T A=25°C TaIv IFP= 20mA 1.4 4.0 3.0 相対光度 Relative Luminosity(a.u.) 相対光度 Relative Luminosity(a.u.) 3.5 2.5 2.0 1.5 1.0 1.2 1.0 0.8 0.5 0.6 0.0 0 20 40 60 80 順電流 Forward Current(mA) 100 120 -60 -40 -20 0 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) 11 NICHIA STS-DA1-2412 <Cat.No.120330> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電流-色度特性 Forward Current vs Chromaticity Coordinate 管理番号 No. NSSW088A STS-DA7-2712 Ifxy TA =25°C 0.35 0.34 0.33 y 1mA 5mA 20mA 35mA 0.32 100mA 0.31 0.30 0.28 0.29 0.30 0.31 0.32 0.33 x 周囲温度-色度特性 Ambient Temperature vs Chromaticity Coordinate Taxy I FP= 20mA 0.35 0.34 -40°C 0.33 y 0°C 25°C 0.32 50°C 0.31 110°C 0.30 0.28 0.29 0.30 0.31 0.32 0.33 x 12 NICHIA STS-DA1-2412 <Cat.No.120330> RELIABILITY (1) Tests and Results Reference Test Standard Resistance to Test Test Conditions Duration JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Reflow Soldering) 303 303A Lead-free Solder(Sn-3.0Ag-0.5Cu) Soldering Heat (Reflow Soldering) JEITA ED-4701 Thermal Shock 300 307 #3 0/22 100cycles #1 0/100 100cycles #1 0/100 10cycles #1 0/100 TA=110°C 1000hours #1 0/100 TA=60°C, RH=90% 1000hours #1 0/100 TA=-40°C 1000hours #1 0/100 TA=25°C, IF=35mA 1000hours #2 0/100 TA=85°C, IF=25mA 1000hours #2 0/100 60°C, RH=90%, IF=20mA 1000hours #2 0/100 TA=-40°C, IF=20mA 1000hours #2 0/100 1time #1 0/22 48minutes #1 0/10 #1 0/10 #1 0/22 -40°C to 110°C, 1min dwell, 10sec transfer, Precondition: 30°C, 70%RH, 168hr -40°C(30min)~25°C(5min)~ 110°C(30min)~25°C(5min) Moisture Resistance JEITA ED-4701 25°C~65°C~-10°C, 90%RH, (Cyclic) 200 203 24hr per cycle High Temperature JEITA ED-4701 Storage 200 201 Temperature Humidity JEITA ED-4701 Storage 100 103 Low Temperature JEITA ED-4701 Storage 200 202 Room Temperature Operating Life High Temperature Operating Life Temperature Humidity Operating Life Low Temperature Operating Life Vibration JEITA ED-4701 Isopropyl Alcohol, 23±5°C, 500 501 Dipping Time: 5min JEITA ED-4701 200m/s2, 100~2000~100Hz, 400 403 4cycles, 4min, each X, Y, Z JEITA ED-4701 HBM, 2kV, 1.5kΩ, 100pF, 3pulses, 300 304 alternately positive or negative Free Fall 3drops from a height of 75cm Electrostatic Discharges Failed/Tested 0/22 100 105 Permanence of Marking # Units #1 JEITA ED-4701 Temperature Cycle Failure Criteria NOTES: Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # #1 #2 #3 Items Conditions Failure Criteria Forward Voltage(VF) IF=20mA >U.S.L.×1.1 Luminous Intensity(IV) IF=20mA <L.S.L.×0.7 Forward Voltage(VF) IF=20mA >U.S.L.×1.1 Luminous Intensity(IV) IF=20mA <L.S.L.×0.5 Solderability - Less than 95% solder coverage U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit 13 NICHIA STS-DA1-2412 <Cat.No.120330> CAUTIONS (1) Storage Conditions Storage Temperature Humidity Time Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours 65±5°C - ≥24hours Baking ● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details. ● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. Products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. Included silica gel desiccants change from blue to red if moisture had penetrated bags. ● After opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture-proof bags for storage. ● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. Baking should only be done once. ● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics. It is also recommended to return the LEDs to the original moisture proof bags and reseal. ● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. Resin materials, in particular, may contain substances which can affect silver plating, such as halogen. ● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur. The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. ● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. (2) Directions for Use ● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating. Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended. If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of the LEDs. (A) (B) ... ... ● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off. Continuous reverse voltage can cause migration and LED damage. ● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current. ● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (3) Handling Precautions ● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics. In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result. ● When handling the product with tweezers, be careful not to apply excessive force to the resin. Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures. ● Dropping the product may cause damage. ● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures. 14 NICHIA STS-DA1-2412 <Cat.No.120330> (4) Design Consideration ● PCB warpage after mounting the products onto a PCB can cause the package to break. The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist. ● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines. The LED should be placed in a way to minimize the stress on the LEDs due to board flexing. ● Board separation must be performed using special jigs, not using hands. (5) Electrostatic Discharge (ESD) ● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wriststrap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials ● Proper grounding is required for all devices, equipment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. ● If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers ● The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA). ● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current. Failure Criteria: VF<2.0V at IF=0.5mA (6) Thermal Management ● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature does not exceed the maximum Junction Temperature (TJ). ● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product. (7) Cleaning ● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs due to the damage to the resin portion. The effects of such solvents should be verified prior to use. In addition, the use of CFCs such as Freon is heavily regulated. ● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs depending on the ultrasonic power and how LED is assembled. If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning. (8) Eye Safety ● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps and lamp systems, which added LEDs in its scope. On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope. However, please be advised that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1. High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2. Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs with optical instruments which may greatly increase the damages to your eyes. ● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. 15 NICHIA STS-DA1-2412 <Cat.No.120330> (9) Others ● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). ● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. ● Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production. ● Specifications and appearance subject to change for improvement without notice. 16