Le58QL02/021/031 Quad Low Voltage Subscriber Line Audio-Processing Circuit VE580 Series APPLICATIONS ORDERING INFORMATION Codec function on telephone switch line cards FEATURES Low-power, 3.3 V CMOS technology with 5-V tolerant digital inputs Software and coefficient compatible to the Le79Q02/ 021/031 QSLAC™ device Performs the functions of four codec/filters Software programmable: — — — — — — — — SLIC device input impedance Transhybrid balance Transmit and receive gains Equalization (frequency response) Digital I/O pins Programmable debouncing on one input Time slot assigner Programmable clock slot and PCM transmit clock edge options Standard microprocessor interface A-law, µ-law, or linear coding Single or Dual PCM ports available — Up to 128 channels (PCLK at 8.192 MHz) per PCM port — Optional supervision on the PCM highway 1.536, 1.544, 2.048, 3.072, 3.088, 4.096, 6.144, 6.176, or 8.192 MHz master clock derived from MCLK or PCLK Built-in test modes with loopback, tone generation, and µP access to PCM data Mixed state (analog and digital) impedance scaling Performance guaranteed over a 12 dB gain range Real Time Data register with interrupt (open drain or Package (Green)1 Device Packing2 Le58QL02FJC 44-pin PLCC Tube Le58QL021FJC 44-pin PLCC Tube Le58QL021BVC 44-pin TQFP Tray Le58QL031DJC 32-pin PLCC Tube 1. The green package meets RoHS Directive 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. 2. For delivery using a tape and reel packing system, add a "T" suffix to the OPN (Ordering Part Number) when placing an order. DESCRIPTION The Le58QL02/021/031 Quad Low Voltage Subscriber Line Audio-Processing Circuit (QLSLAC™) devices integrate the key functions of analog line cards into high-performance, veryprogrammable, four-channel codec-filter devices. The QLSLAC devices are based on the proven design of Legerity’s reliable SLAC™ device families. The advanced architecture of the QLSLAC devices implements four independent channels and employs digital filters to allow software control of transmission, thus providing a cost-effective solution for the audio-processing function of programmable line cards. The QLSLAC devices are software and coefficient compatible to the QSLAC devices. Advanced submicron CMOS technology makes the Le58QL02/ 021/031 QLSLAC devices economical, with both the functionality and the low power consumption needed in line card designs to maximize line card density at minimum cost. When used with four Legerity SLIC devices, a QLSLAC device provides a complete software-configurable solution to the BORSCHT functions. BLOCK DIAGRAM TTL output) Dual/Single PCM Highway Analog Supports multiplexed SLIC device outputs Broadcast state 256 kHz or 293 kHz chopper clock for Legerity SLIC devices with switching regulator Maximum channel bandwidth for V.90 modems VIN 1 VOUT 1 VIN 2 VOUT 2 DXA Signal Processing Channel 1 (CH 1) DRA Time Slot Assigner (TSA) Signal Processing Channel 2 (CH 2) TSCA DXB DRB VIN 3 VOUT 3 VIN 4 VOUT 4 Signal Processing Channel 3 (CH 3) TSCB Signal Processing Channel 4 (CH 4) VREF SLIC Clock & Reference Circuits CD1 1 CD2 1 C31 C41 C51 FS PCLK CD1 2 RELATED LITERATURE CD2 2 C32 C42 C52 CD1 3 080754 Le58QL061/063 QLSLAC™ Device Data Sheet 080761 QSLAC™ to QLSLAC™ Device Design Conversion Guide 080758 QSLAC™ to QLSLAC™ Guide to New Designs MCLK/E1 SLIC Interface (SLI) CD2 3 C33 C43 C53 CD1 4 CD2 4 C34 C44 C54 Microprocessor Interface (MPI) RST CHCLK INT CS DIO DCLK Microprocessor Document ID# 080753 Date: Version: 9 Distribution: Public Document April 09, 2009 Le58QL02/021/031 Data Sheet TABLE OF CONTENTS APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 RELATED LITERATURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 TABLE OF CONTENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 LIST OF FIGURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 LIST OF TABLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 BLOCK DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Clock and Reference Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Microprocessor Interface (MPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Time Slot Assigner (TSA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Signal Processing Channels (CHx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 SLIC Device Interface (SLI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 CONNECTION DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 PIN DESCRIPTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 OPERATING RANGES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Environmental Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Electrical Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Transmission Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Attenuation Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Group Delay Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Gain Linearity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Total Distortion Including Quantizing Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Discrimination Against Out-of-Band Input Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Discrimination Against 12- and 16-kHz Metering Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Spurious Out-of-Band Signals at the Analog Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Overload Compression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 SWITCHING CHARACTERISTICS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 SWITCHING WAVEFORMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 OPERATING THE QLSLAC DEVICE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Channel Enable (EC) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 SLIC Device Control and Data Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Clock Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 E1 Multiplex Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Debounce Filters Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Real-Time Data Register Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Interrupt Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Active State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Inactive State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Chopper Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 SIGNAL PROCESSING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 2 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Overview of Digital Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Two-Wire Impedance Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Frequency Response Correction and Equalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Transhybrid Balancing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Gain Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Transmit Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Transmit PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Receive Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Receive PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Analog Impedance Scaling Network (AISN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Speech Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Signaling on the PCM Highway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Robbed-Bit Signaling Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Default Filter Coefficients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 COMMAND DESCRIPTION AND FORMATS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Command Field Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Microprocessor Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 SUMMARY OF MPI COMMANDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 MPI COMMAND STRUCTURE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 00h Deactivate (Standby State) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 02h Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 04h Hardware Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 06h No Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 0Eh Activate Channel (Operational State) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 40/41h Write/Read Transmit Time Slot and PCM Highway Selection . . . . . . . . . . . . . . . . . . . . . .42 42/43h Write/Read Receive Time Slot and PCM Highway Selection . . . . . . . . . . . . . . . . . . . . . .42 44/45h Write/Read Transmit Clock Slot, Receive Clock Slot, and Transmit Clock Edge . . . . . . .42 46/47h Write/Read Chip Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 4A/4Bh Write/Read Channel Enable and Operating Mode Register . . . . . . . . . . . . . . . . . . . . . . .44 4D/4Fh Read Real-Time Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 50/51h Write/Read AISN and Analog Gains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 52/53h Write/Read SLIC Device Input/Output Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 54/55h Write/Read SLIC Input/Output Direction, Read Status Bits . . . . . . . . . . . . . . . . . . . . . . . .45 60/61h Write/Read Operating Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 6C/6Dh Write/Read Interrupt Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 70/71h Write/Read Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 73h Read Revision Code Number (RCN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 80/81h Write/Read GX Filter Coefficients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 82/83h Write/Read GR Filter Coefficients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 84/85h Write/Read Z Filter Coefficients (FIR and IIR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 86/87h Write/Read B1 Filter Coefficients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 88/89h Write/Read X Filter Coefficients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 8A/8Bh Write/Read R Filter Coefficients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 96/97h Write/Read B2 Filter Coefficients (IIR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 98/99h Write/Read FIR Z Filter Coefficients (FIR only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 9A/9Bh Write/Read IIR Z Filter Coefficients (IIR only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 C8/C9h Write/Read Debounce Time Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 CDh Read Transmit PCM Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 E8/E9h Write/Read Ground Key Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 PROGRAMMABLE FILTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 General Description of CSD Coefficients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 User Test States and Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 A-Law and µ-Law Companding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Controlling the SLIC Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Calculating Coefficients with WinSLAC Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 3 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet APPLICATION CIRCUIT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 LINE CARD PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 PHYSICAL DIMENSIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 32-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 44-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision A1 to A2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision A2 to B1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision B1 to C1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision C1 to D1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision D1 to E1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision E1 to F1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision F1 to F2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision F2 to Version 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 4 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet LIST OF FIGURES Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Le58QL02JC 44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Le58QL021JC 44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Le58QL031JC 32-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Le58QL021VC 44-Pin PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Transmit Path Attenuation vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Receive Path Attenuation vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Group Delay Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 A-law Gain Linearity with Tone Input (Both Paths). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 µ-law Gain Linearity with Tone Input (Both Paths). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Total Distortion with Tone Input (Both Paths). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Discrimination Against Out-of-Band Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Spurious Out-of-Band Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Analog-to-Analog Overload Compression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Input and Output Waveforms for AC Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Microprocessor Interface (Input Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Microprocessor Interface (Output Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 PCM Highway Timing for XE = 0 (Transmit on Negative PCLK Edge) . . . . . . . . . . . . . . . . . . .25 PCM Highway Timing for XE = 1 (Transmit on Positive PCLK Edge) . . . . . . . . . . . . . . . . . . . .26 Master Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Clock Mode Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 SLIC Device I/O E1 Multiplex and Real-Time Data Register Operation. . . . . . . . . . . . . . . . . . .29 E1 Multiplex Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 MPI Real-Time Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 QLSLAC Device Transmission Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Robbed-Bit Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Le7920 SLIC/QLSLAC Device Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 LIST OF TABLES Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. QLSLAC Device Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 0 dBm0 Voltage Definitions with Unity Gain in X, R, GX, GR, AX, and AR . . . . . . . . . . . . . . . . .14 Channel Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Channel Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Global Chip Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Global Chip Status Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 A-Law: Positive Input Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 µ-Law: Positive Input Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 5 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet PRODUCT DESCRIPTION The QLSLAC device performs the codec/filter and two-to-four-wire conversion functions required of the subscriber line interface circuitry in telecommunications equipment. These functions involve converting audio signals into digital PCM samples and converting digital PCM samples back into audio signals. During conversion, digital filters are used to band limit the voice signals. All of the digital filtering is performed in digital signal processors operating from a master clock, which can be derived either from PCLK or MCLK. Four independent channels allow the QLSLAC device to function as four SLAC™ devices. For programming information, each channel has its own enable bit (EC1, EC2, EC3, and EC4) to allow individual channel programming. If more than one Channel Enable bit is High or if all Channel Enable bits are High, all channels enabled will receive the programming information written; therefore, a Broadcast mode can be implemented by simply enabling all channels in the device to receive the information. The Channel Enable bits are contained in the Channel Enable (EC) register, which is written and read using Command 4A/4Bh. The Broadcast mode is useful in initializing QLSLAC devices in a large system. The user-programmable filters set the receive and transmit gain, perform the transhybrid balancing function, permit adjustment of the two-wire termination impedance, and provide equalization of the receive and transmit paths. All programmable digital filter coefficients can be calculated using the WinSLAC™ software. Data transmitted or received on the PCM highway can be 8-bit companded code (with an optional 8-bit signaling byte in the transmit direction) or 16-bit linear code. The 8-bit codes appear 1 byte per time slot, while the 16-bit code appears in two consecutive time slots. The compressed PCM codes can be either 8-bit companded A-law or µ-law. The PCM data is read from and written to the PCM highway in user-programmable time slots at rates of 128 kHz to 8.192 MHz. The transmit clock edge and clock slot can be selected for compatibility with other devices that can be connected to the PCM highway. Three configurations of the QLSLAC device are offered with single or dual PCM highways. The Le58QL02 and Le58QL021 QLSLAC devices with dual and single PCM highways respectively are available in the 44-pin packages. The Le58QL031JC QLSLAC device is a single PCM highway version in a 32-pin PLCC package. Table 1. QLSLAC Device Configurations PCM Highway Programmable I/O per Channel Chopper Clock Dual Four I/O Yes Single Five I/O Single Two I/O Package Part Number 44 PLCC Le58QL02JC No 44 PLCC/TQFP Le58QL021JC (or VC) No 32 PLCC Le58QL031JC BLOCK DESCRIPTIONS Clock and Reference Circuits This block generates a master clock and a frame sync signal for the digital circuits. It also generates an analog reference voltage for the analog circuits. Microprocessor Interface (MPI) This block communicates with the external control microprocessor over a serial interface. It passes user control information to the other blocks, and it passes status information from the blocks to the user. In addition, this block contains the reset circuitry. Time Slot Assigner (TSA) This block communicates with the PCM highway, where the PCM highway is a time division mutiplexed bus carrying the digitized voice samples. The block implements programmable time slots and clocking arrangements in order to achieve a first layer of switching. Internally, this block communicates with the Signal Processing Channels (CHx). Signal Processing Channels (CHx) These blocks do the transmission processing for the voice channels. Part of the processing is analog and is interfaced to the VIN and VOUT pins. The remainder of the processing is digital and is interfaced to the Time Slot Assigner (TSA) block. SLIC Device Interface (SLI) This block communicates digitally with the SLIC device circuits. It sends control bits to the SLIC devices to control modes and to operate LEDs and optocouplers. It also accepts supervision information from the SLIC devices and performs some filtering. 6 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet CONNECTION DIAGRAMS C4 2 CD1 1 CD2 1 C3 1 C4 1 4 3 2 1 44 43 42 MCLK/E1 C3 2 5 CS CD2 2 6 CHCLK CD1 2 Figure 1. Le58QL02JC 44-Pin PLCC 41 40 VOUT 1 7 39 DCLK VIN 1 8 38 DIO VOUT 2 9 37 TSCA VIN 2 10 36 TSCB VCCA 11 35 DGND 34 PCLK 33 VCCD Le58QL02JC 44-Pin PLCC DXB VIN 4 16 30 FS VOUT 4 17 29 RST 21 22 23 24 25 7 Zarlink Semiconductor Inc. 26 27 28 INT 20 DRA 19 DRB 18 C44 VOUT 3 31 C34 DXA 15 CD24 32 C43 14 CD14 VIN 3 C33 13 CD23 12 CD13 VREF AGND Le58QL02/021/031 Data Sheet C3 2 C4 2 C5 2 CD1 1 CD2 1 C3 1 C4 1 5 4 3 2 1 44 43 42 MCLK/E1 CD2 2 6 C51 CD1 2 Figure 2. Le58QL021JC 44-Pin PLCC 41 40 VOUT 1 7 39 CS VIN 1 8 38 DCLK VOUT 2 9 37 DIO VIN 2 10 36 TSCA VCCA 11 35 DGND 34 PCLK 33 VCCD VREF 12 AGND 13 Le58QL021JC 44-Pin PLCC 30 RST VOUT 4 17 29 INT 22 23 24 25 26 27 28 DRA 21 C54 20 C33 CD23 19 CD13 18 C44 16 C34 FS VIN 4 CD24 DXA 31 C53 32 15 CD14 14 C43 VIN 3 VOUT 3 VOUT1 CD12 CD22 CD11 CD21 MCLK/E1 CS Figure 3. Le58QL031JC 32-Pin PLCC 4 3 2 1 32 31 30 VIN 1 5 29 DCLK VOUT 2 6 28 DIO VIN 2 7 27 TSCA VCCA 8 26 DGND VREF 9 25 PCLK AGND 10 24 VCCD VIN 3 11 23 DXA VOUT 3 12 22 FS VIN 4 13 21 RST 14 15 16 17 18 19 20 VOUT4 CD1 3 CD2 3 CD1 4 CD2 4 DRA INT Le58QL031JC 32-Pin PLCC 8 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet MCLK/E1 C5 1 C4 1 C3 1 CD2 1 CD1 1 C5 2 C3 2 C4 2 CD2 2 CD1 2 Figure 4. Le58QL021VC 44-Pin PLCC 44 43 42 41 40 39 38 37 36 35 34 VOUT 1 1 33 CS VIN 1 2 32 DCLK VOUT 2 3 31 DIO VIN 2 4 30 TSCA VCCA 5 29 DGND VREF 6 28 PCLK AGND 7 27 VCCD VIN 3 8 26 DXA VOUT 3 9 25 FS VIN 4 10 24 RST VOUT 4 11 23 INT Le58QL021VC 44-Pin TQFP 9 Zarlink Semiconductor Inc. DRA C5 4 C4 4 C3 4 CD2 4 CD1 4 C5 3 C4 3 C3 3 CD2 3 CD1 3 12 13 14 15 16 17 18 19 20 21 22 Le58QL02/021/031 Data Sheet PIN DESCRIPTIONS Pin Names AGND, DGND Type Power Description Separate analog and digital grounds are provided to allow noise isolation; however, the two grounds are connected inside the part, and the grounds must also be connected together on the circuit board. Control and Data. CD1 and CD2 are TTL compatible programmable Input or Output (I/O) ports. They can be used to monitor or control the state of the SLIC drivce or any other device associated with the subscriber line interface. The direction, input or output, is programmed using MPI Command 54/55h. As outputs, CD1 and CD2 can be used to control relays, illuminate LEDs, or perform any other function requiring a latched TTL compatible signal for control. The output state of CD1 and CD2 is written using MPI Command 52h. As inputs, CD1 and CD2 can be processed by the QLSLAC device (if programmed to do so). CD1 can be debounced before it is made available to the system. The debounce time is programmable from 0 to 15 ms in 1 ms increments using MPI Command C8/C9h. CD2 can be filtered using the up/down counter facility and programming the sampling interval using MPI Command E8/ E9h. CD11–CD14, CD21–CD24 Inputs/Outputs Additionally, CD1 can be demultiplexed into two separate inputs using the E1 demultiplexing function. The E1 demultiplexing function of the QLSLAC device was designed to interface directly to Legerity SLIC devices supporting the ground key function. With the proper Legerity SLIC device and the E1 function of the QLSLAC device enabled, the CD1 bit can be demultiplexed into an Off-Hook/Ring Trip signal and Ground Key signal. In the demultiplex mode, the second bit, Ground Key, takes the place of the CD2 as an input. The demultiplexed bits can be debounced (CD1) or filtered (CD2) as explained previously. A more complete description of CD1, CD2, debouncing, and filtering functions is contained in Operating the QLSLAC Device, on page 27. Once the CD1 and CD2 inputs are processed (Debounced, Filtered and/or Demultiplexed) by the QLSLAC device, the information can be accessed by the system in two ways: 1) on a per channel basis along with C3, C4, and C5 of the specific channel using MPI Command 53h, or 2) by using MPI Command 4D/4Fh, which obtain the CD1 and CD2 bits from all four channels simultaneously. This feature reduces the processor overhead and the time required to retrieve time-critical signals from the line circuits, such as off-hook and ring trip. With this feature, hookswitch status and ring trip information, for example, can be obtained from all four channels of a QLSLAC device with one read command. Control. C3, C4, and C5 are TTL-compatible programmable Input or Output (I/O) ports. They can be used to monitor or control the state of the SLIC device or any other device associated with subscriber line interface. The direction, input or output, is programmed using MPI Command 54/55h. As outputs, C3, C4, and C5 can be used to control relays, illuminate LEDs, or perform any other function requiring a latched TTL compatible signal for control. The output state of C3, C4, and C5 is written using MPI Command 52h. As inputs, C3, C4, and C5 can be accessed by the system by using MPI Command 53h. C31–C34, C41–C44, C51–C54 Inputs/Outputs CHCLK Output Chopper Clock. This output provides a 256 kHz or a 292.57 kHz, 50% duty cycle, TTLcompatible clock for use by up to four SLIC devices with built-in switching regulators. The CHCLK frequency is synchronous to the master clock, but the phase relationship to the master clock is random. The chopper clock is not available in all package types. CS Input Chip Select. The Chip Select input (active Low) enables the device so that control data can be written to or read from the part. The channels selected for the write or read operation are enabled by writing 1 s to the appropriate bits in the Channel Enable Register of the QLSLAC device prior to the command. See EC1, EC2, EC3, and EC4 of the Command 4A/4Bh Write/ Read Channel Enable and Operating Mode Register, on page 44 for more information. If Chip Select is held Low for 16 rising edges of DCLK, a hardware reset is executed when Chip Select returns High. DCLK Input Data Clock. The Data Clock input shifts data into and out of the microprocessor interface of the QLSLAC device. The maximum clock rate is 8.192 MHz. DIO Input/Output Data. Control data is serially written into and read out of the QLSLAC device via the DIO pin, with the most significant bit first. The Data Clock determines the data rate. DIO is high impedance except when data is being transmitted from the QLSLAC device. The Le58QL021 QLSLAC device contains a single PCM highway and five programmable I/ Os per channel (CD1, CD2, C3, C4, and C5) in a 44-pin PLCC or TQFP package. In the Le58QL02 QLSLAC device, the C51, C52, C53, and C54 I/Os are eliminated, enabling dual PCM highways and a chopper clock output in a 44-pin PLCC or TQFP package. In the Le58QL031 QLSLAC device, the C31–C51, C32–C52, C33–C53, and C34–C54 I/Os are eliminated, enabling a single PCM highway and two control and data I/Os (CD1, CD2) per channel in a 32-pin PLCC package. 10 Zarlink Semiconductor Inc. Le58QL02/021/031 Pin Names Type Data Sheet Description Inputs PCM Data Receive A/B. The PCM data for channels 1, 2, 3, and 4 is serially received on either the DRA or DRB port during user-programmed time slots. Data is always received with the most significant bit first. For compressed signals, 1 byte of data for each channel is received every 125 µs at the PCLK rate. In the Linear state, two consecutive bytes of data for each channel are received every 125 µs at the PCLK rate. DRB is not available on all package types. DXA, DXB Outputs PCM Data Transmit. The transmit data from channels 1, 2, 3, and 4 is sent serially out on either the DXA or DXB port or both ports during user-programmed time slots. Data is always transmitted with the most significant bit first. The output is available every 125 µs and the data is shifted out in 8-bit (16-bit in Linear or PCM Signaling state) bursts at the PCLK rate. DXA and DXB are High impedance between time slots, while the device is in the Inactive state with no PCM signaling, or while the Cutoff Transmit Path bit (CTP) is on. DXB is not available on all package types. FS Input Frame Sync. The Frame Sync pulse is an 8 kHz signal that identifies Time Slot 0, Clock Slot 0 of a system’s PCM frame. The QLSLAC device references individual time slots with respect to this input, which must be synchronized to PCLK. DRA, DRB INT Output Interrupt. INT is an active Low output signal which is programmable as either TTL compatible or open drain. The INT output goes Low any time one of the input bits in the Real Time Data register changes state and is not masked. It also goes Low any time new transmit data appears if this interrupt is armed. INT remains Low until the appropriate register is read via the microprocessor interface, or the QLSLAC device receives either a software or hardware reset. The individual CDxy bits in the Real Time Data register can be masked from causing an interrupt by using MPI Command 6C/6Dh. The transmit data interrupt must be armed with a bit in the Operating Conditions register. Input/Output Master Clock (Input)/Enable CD1 Multiplex (Output). The Master Clock can be a 1.536 MHz, 1.544 MHz, or 2.048 MHz (times 1, 2, or 4) clock for use by the digital signal processor. If the internal clock is derived from the PCM Clock Input (PCLK), this pin can be used as an E1 output to control Legerity SLIC devices having multiplexed hookswitch and ground-key detector outputs. PCLK Input PCM Clock. The PCM clock determines the rate at which PCM data is serially shifted into or out of the PCM ports. PCLK is an integer multiple of the frame sync frequency. The maximum clock frequency is 8.192 MHz and the minimum clock frequency is 128 kHz for dual PCM highway versions and 256 kHz for single PCM highway versions. The minimum clock rate must be doubled if Linear state or PCM signaling is used. PCLK frequencies between 1.03 MHz and 1.53 MHz are not allowed. Optionally, the digital signal processor clock can be derived from PCLK rather than MCLK. RST Input Reset. A logic Low signal at this pin resets the QLSLAC device to its default state. The RST pin may be tied to VCCD if it is not needed in the system. TSCA, TSCB Outputs Time Slot Control. The Time Slot Control outputs are open drain outputs (requiring pull-up resistors to VCCD) and are normally inactive (High impedance). TSCA or TSCB is active (Low) when PCM data is transmitted on the DXA or DXB pin respectively. VCCA, VCCD Power Analog and digital power supply inputs. VCCA and VCCD are provided to allow for noise isolation and proper power supply decoupling techniques. For best performance, all of the VCC power supply pins should be connected together at the connector of the printed circuit board. Inputs Analog Input. The analog voice band signal is applied to the VIN input of the QLSLAC device. The VIN input is biased at VREF by a large internal resistor. The audio signal is sampled, digitally processed and encoded, and then made available at the TTL-compatible PCM output (DXA or DXB). If the digitizer saturates in the positive or negative direction, VIN is pulled by a reduced resistance toward AGND or VCCD, respectively. VIN1 is the input for channel 1, VIN2 is the input for channel 2, VIN3 is the input for channel 3, and VIN4 is the input for channel 4. Outputs Analog Output. The received digital data at DRA or DRB is processed and converted to an analog signal at the VOUT pin. VOUT1 is the output from channel 1, VOUT2 is the output for channel 2, VOUT3 is the output from channel 3, and VOUT4 is the output for channel 4. The VOUT voltages are referenced to VREF. Output Analog Voltage Reference. The VREF output is provided in order for an external capacitor to be connected from VREF to ground, filtering noise present on the internal voltage reference. VREF is buffered before it is used by internal circuitry. The voltage on VREF and the output resistance are given in Electrical Characteristics, on page 13. The leakage current in the capacitor must be low. MCLK/E1 VIN1–VIN4 VOUT1– VOUT4 VREF 11 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet ABSOLUTE MAXIMUM RATINGS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. Storage Temperature –60° C < TA < +125° C Ambient Temperature, under Bias Ambient relative humidity (non condensing) VCCA with respect to AGND 5 to 95% –0.4 to + 4.0 V VCCA with respect to VCCD ±0.4 V VCCD with respect to DGND –0.4 to + 4.0 V –0.4 V to (VCCA + 0.4 V) VIN with respect to AGND AGND with respect to DGND –40° C < TA < +85° C ±50 mV –0.4 to 5.5 V or VCCD + 2.37 V, whichever is smaller Digital pins with respect to DGND Total combined CD1–C5 current per device: Source from VCCD Sink into DGND Latch up immunity (any pin) Total VCC current if rise rate of VCC > 0.4 V/µs 40 mA 40 mA ± 100 mA 0.5 A Package Assembly The green package devices are assembled with enhanced environmental compatible lead (Pb), halogen, and antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer leadfree board assembly processes. Refer to IPC/JEDEC J-Std-020 Table 4-2 for recommended peak soldering temperature and Table 5-2 for the recommended solder reflow temperature profile. OPERATING RANGES Legerity guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component Reliability Assurance Requirements for Telecommunications Equipment. Environmental Ranges Ambient Temperature –40° C < TA < +85° C Ambient Relative Humidity 15 to 85% Electrical Ranges +3.3 V ± 5% Analog Supply VCCA VCCD ± 50 mV Digital Supply VCCD +3.3 V ± 5% DGND 0V AGND ±10 mV CFIL Capacitance: VREF to AGND 0.1 µF ± 20% Digital Pins DGND to +5.25 V 12 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet ELECTRICAL CHARACTERISTICS Typical values are for TA = 25º C and nominal supply voltages. Minimum and maximum values are over the temperature and supply voltage ranges shown in Operating Ranges, except where noted. Symbol Parameter Descriptions VIL Digital Input Low voltage VIH Digital Input High voltage Min Typ Max 0.8 2.0 Unit Note V Digital Input leakage current IIL 0 < V < VCCD VHYS Digital Input hysteresis VOL Digital Output Low voltage CD1–C5 (IOL = 4 mA) CD1–C5 (IOL = 8 mA) TSCA, TSCB (IOL =14 mA) Other digital outputs (IOL = 2 mA) VOH Digital Output High voltage CD1–C5 (IOH = 4 mA) CD1–C5 (IOH = 8 mA) Other digital outputs (IOH = 400 µA) –7 Otherwise +7 –120 0.16 µA +180 0.25 0.34 0.4 0.8 0.4 0.4 VCCD – 0.4 V VCCD – 0.8 V 2.4 V V 1 V 1 Digital Output leakage current (HI Z state) IOL 0 < V < VCCD Otherwise –7 +7 –120 +180 GIN Input attenuator gain DGIN = 0 DGIN = 1 0.6438 1 VIR Analog input voltage range (Relative to VREF) AX = 0 dB, attenuator on (DGIN = 0) AX = 6.02 dB, attenuator on (DGIN = 0) AX = 0 dB, attenuator off (DGIN = 1) AX = 6.02 dB, attenuator off (DGIN = 1) ±1.584 ±0.792 ±1.02 ±0.51 VIOS µA V/V Vpk Offset voltage allowed on VIN –50 50 mV ZIN Analog input impedance to VREF, 300 to 3400 Hz 600 1400 kΩ IIP Current into analog input for an input voltage of 3.3 V 50 115 IIN Current out of analog input for an input voltage of –0.3 V 50 ZOUT CLOUT VOUT output impedance 130 1 Allowable capacitance, VOUT to AGND 10 Ω 500 pF IOUT VOUT output current (F< 3400 Hz) VREF VREF output open circuit voltage (leakage < 20 nA) ZREF VREF output impedance (F < 3400 Hz) VOR VOUT voltage range(AR = 0 dB) (Relative to VREF)(AR = 6.02 dB) VOOS VOUT offset voltage (AISN off) –40 40 VOOSA VOUT offset voltage (AISN on) –80 80 GAISN AISN gain - expected gain (input = 0 dBm0, 1014 Hz) Attenuator on (DGIN = 0) Attenuator off (DGIN = 1) –0.016 –0.024 0.016 0.024 –4 1.43 1.5 70 4 mApk 1.57 V 130 kΩ ±1.02 ±0.51 Power dissipation All channels active 1 channel active All channels inactive CI Digital Input capacitance 10 CO Digital Output capacitance 10 PSRR Power supply rejection ratio (1.02 kHz, 100 mVRMS, either path, GX = GR = 0 dB) 13 Zarlink Semiconductor Inc. 40 2 2 3 Vpk PD 130 40 13 µA 170 80 18 mV V/V mW pF dB 4 Le58QL02/021/031 Data Sheet Notes: 1. The CD1, CD2, C3–C5 outputs are resistive for less than a 0.8 V drop. Total current must not exceed absolute maximum ratings. 2. When the digitizer saturates, a resistor of 50 kΩ ±20 kΩ is connected either to AGND or to VCCA as appropriate to discharge the coupling capacitor. 3. When the QLSLAC device is in the Inactive state, the analog output will present either a VREF DC output level through a 15 kΩ resistor (VMODE = 0) or a high impedance (VMODE = 1). 4. If there is an external DC path from VOUT to VIN with a gain of GDC and the AISN has a gain of hAISN, then the output offset will be multiplied by 1 / [1 – (hAISN • GDC)]. 5. Power dissipation in the Inactive state is measured with all digital inputs at VIH = VCCD and VIL = DGND and with no load connected to VOUT1, VOUT2, VOUT3, or VOUT4. Transmission Characteristics Table 2. 0 dBm0 Voltage Definitions with Unity Gain in X, R, GX, GR, AX, and AR Signal at Digital Interface Transmit (DGIN = 0) Transmit (DGIN = 1) Receive A-law digital mW or equivalent (0 dBm0) 0.7804 0.5024 0.5024 µ-law digital mW or equivalent (0 dBm0) 0.7746 0.4987 0.4987 ±22,827 peak linear coded sine wave 0.7804 0.5024 0.5024 Unit Vrms When relative levels (dBm0) are used in any of the following transmission specifications, the specification holds for any setting of the GX gain from 0 dB to 12 dB, the GR loss from 0 dB to 12 dB, and the input attenuator (GIN) on or off. Description Gain accuracy, D/A or A/D Test Conditions 0 dBm0, 1014 Hz AX = AR = 0 dB 0 to 85° C –40° C AX = +6.02 dB and/or AR = –6.02 dB 0 to 85° C –40° C Min Typ Max –0.25 –0.30 +0.25 +0.30 –0.30 –0.40 +0.30 +0.40 Unit Note dB Gain accuracy digital-to-digital –0.25 +0.25 Gain accuracy analog-to-analog –0.25 +0.25 –0.125 +0.125 1 –46 2 Attenuation distortion 300 Hz to 3 kHz Single frequency distortion Second harmonic distortion, D-A GR = 0 dB Idle channel noise Analog out Digital looped back Digital input = 0 Digital input = 0 Analog VIN = 0 VAC Analog VIN = 0 VAC Digital out Crosstalk same channel –55 TX to RX RX to TX 0 dBm0 0 dBm0 weighted unweighted A-law µ-law A-law µ-law 300 to 3400 Hz 300 to 3400 Hz 0 0 –68 –55 –78 12 –68 16 dBm0p dBm0 dBm0p dBrnc0 dBm0p dBrnc0 –75 –75 dBm0 3 3 3 3, 6 3 3, 6 0 dBm0 Crosstalk between channels SLIC imped. < 300 Ω TX or RX to TX TX or RX to RX End-to-end group delay 1014 Hz, Average 1014 Hz, Average B = Z = 0; X = R = 1 –76 –78 678 dBm0 4 µs 5 Notes: 1. See Figure 5 and Figure 6. 2. 0 dBm0 input signal, 300 Hz to 3400 Hz; measurement at any other frequency, 300 Hz to 3400 Hz. 3. No single frequency component in the range above 3800 Hz may exceed a level of –55 dBm0. 4. The weighted average of the crosstalk is defined by the following equation, where C(f) is the crosstalk in dB as a function of frequency, fN = 3300 Hz, f1 = 300 Hz, and the frequency points (fj , j = 2..N) are closely spaced: 14 Zarlink Semiconductor Inc. Le58QL02/021/031 1 ------ • C ( f j ) 20 Data Sheet 1 ------ • C ( f j – 1 ) 20 ⎛ fj ⎞ ⎜ ----------⎟ ⎝ f j – 1⎠ j Average = 20 • log --------------------------------------------------------------------------------------------------------⎛ f N⎞ log ⎜ -----⎟ ⎝ f1 ⎠ 10 + 10 - • log ∑ --------------------------------------------------------------2 5. The End-to-End Group Delay is the sum of the transmit and receive group delays (both measured using the same time and clock slot). 6. Typical values not tested in production. Attenuation Distortion The signal attenuation in either path is nominally independent of the frequency. The deviations from nominal attenuation will stay within the limits shown in Figure 5 and Figure 6. The reference frequency is 1014 Hz and the signal level is –10 dBm0. Figure 5. Transmit Path Attenuation vs. Frequency Attenuation (dB) 1.8 0.75 0.125 0 -0.125 Acceptable Region 3400 3000 Frequency (Hz) 200 300 0 0 Figure 6. Receive Path Attenuation vs. Frequency Attenuation (dB) 2 1 0.80 0.65 0.6 0.2 0.125 0 -0.125 15 Zarlink Semiconductor Inc. 3400 3200 Frequency (Hz) 3000 600 0 200 300 Acceptable Region Le58QL02/021/031 Data Sheet Group Delay Distortion For either transmission path, the group delay distortion is within the limits shown in Figure 7. The minimum value of the group delay is taken as the reference. The signal level should be 0 dBm0. Figure 7. Group Delay Distortion 420 Delay (µS) 150 Acceptable Region 16 Zarlink Semiconductor Inc. 2800 Frequency (Hz) 2600 1000 500 0 600 90 Le58QL02/021/031 Data Sheet Gain Linearity The gain deviation relative to the gain at –10 dBm0 is within the limits shown in Figure 8 (A-law) and Figure 9 (µ-law) for either transmission path when the input is a sine wave signal of 1014 Hz. Figure 8. A-law Gain Linearity with Tone Input (Both Paths) 1.5 Gain (dB) 0.55 0.25 Input Level +3 (dBm0) Acceptable Region 0 -0.25 -55 -50 -40 -10 0 -0.55 -1.5 Figure 9. µ-law Gain Linearity with Tone Input (Both Paths) 1.4 Gain (dB) 0.45 0.25 Acceptable Region 0 -55 -50 -37 -10 -0.25 -0.45 -1.4 17 Zarlink Semiconductor Inc. 0 Input Level +3 (dBm0) Le58QL02/021/031 Data Sheet Total Distortion Including Quantizing Distortion The signal to total distortion ratio will exceed the limits shown in Figure 10 for either path when the input signal is a sine wave signal of frequency 1014 Hz. Figure 10. Total Distortion with Tone Input (Both Paths) Acceptable Region B A A B C D C D A-Law 35.5dB 35.5dB 30dB 25dB Signal-to-Total Distortion (dB) -45 -40 -30 0 Input Level (dBm0) 18 Zarlink Semiconductor Inc. µ-Law 35.5dB 35.5dB 31dB 27dB Le58QL02/021/031 Data Sheet Discrimination Against Out-of-Band Input Signals When an out-of-band sine wave signal of frequency f, and level A is applied to the analog input, there may be frequency components below 4 kHz at the digital output which are caused by the out-of-band signal. These components are at least the specified dB level below the level of a signal at the same output originating from a 1014 Hz sine wave signal with a level of A dBm0 also applied to the analog input. The minimum specifications are shown in the following table. Frequency of Out-of-Band Signal Amplitude of Out-of-Band Signal Level below A 16.6 Hz < f < 45 Hz –25 dBm0 < A ≤ 0 dBm0 18 dB 25 dB 45 Hz < f < 65 Hz –25 dBm0 < A ≤ 0 dBm0 65 Hz < f < 100 Hz –25 dBm0 < A ≤ 0 dBm0 10 dB 3400 Hz < f < 4600 Hz –25 dBm0 < A ≤ 0 dBm0 see Figure 11 4600 Hz < f < 100 kHz –25 dBm0 < A ≤ 0 dBm0 32 dB Figure 11. Discrimination Against Out-of-Band Signals 0 -10 -20 Level below A (dB) -28 dB -32 dB -30 -40 -50 3.4 4.0 4.6 Frequency (kHz) Note: The attenuation of the waveform below amplitude A, between 3400 Hz and 4600 Hz, is given by the formula: π ( 4000 – f ) Attenuation (db) = 14 – 14 sin ⎛ -----------------------------⎞ ⎝ ⎠ 1200 Discrimination Against 12- and 16-kHz Metering Signals If the QLSLAC device is used in a metering application where 12 kHz or 16 kHz tone bursts are injected onto the telephone line toward the subscriber, a portion of these tones also may appear at the VIN terminal. These out-of-band signals may cause frequency components to appear below 4 kHz at the digital output. For a 12 kHz or 16 kHz tone, the frequency components below 4 kHz are reduced from the input by at least 70 dB. The sum of the peak metering and signal voltages must be within the analog input voltage range. 19 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Spurious Out-of-Band Signals at the Analog Output With PCM code words representing a sine wave signal in the range of 300 Hz to 3400 Hz at a level of 0 dBm0 applied to the digital input, the level of the spurious out-of-band signals at the analog output is less than the limits shown below. Frequency Level 4.6 kHz to 40 kHz –32 dBm0 40 kHz to 240 kHz –46 dBm0 240 kHz to 1 MHz –36 dBm0 With code words representing any sine wave signal in the range 3.4 kHz to 4.0 kHz at a level of 0 dBm0 applied to the digital input, the level of the signals at the analog output are below the limits in Figure 12. The amplitude of the spurious out-of-band signals between 3400 Hz and 4600 Hz is given by the formula: π ( f – 4000 ) Level = – 14 – 14 sin ⎛⎝ -----------------------------⎞⎠ dBm0 1200 Figure 12. Spurious Out-of-Band Signals 0 -10 Level (dBm0) -20 -28 dBm0 -30 -32 dBm0 -40 -50 3.4 4.0 4.6 Frequency (kHz) 20 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Overload Compression Figure 13 shows the acceptable region of operation for input signal levels above the reference input power (0 dBm0). The conditions for this figure are: 1. 2. 3. 4. 1.2 dB < GX ≤ + 12 dB –12 dB ≤ GR < –1.2 dB Digital voice output connected to digital voice input. Measurement analog-to-analog. Figure 13. Analog-to-Analog Overload Compression 9 8 7 Fundamental Output Power (dBm0) 6 Acceptable Region 5 4 3 2.6 2 1 1 7 2 3 4 5 6 Fundamental Input Power (dBm0) 21 Zarlink Semiconductor Inc. 8 9 Le58QL02/021/031 Data Sheet SWITCHING CHARACTERISTICS The following are the switching characteristics over operating range (unless otherwise noted). Min and max values are valid for all digital outputs with a 115 pF load, except CD1–C5 with a 30 pF load. (See Figure 15 and Figure 16 for the microprocessor interface timing diagrams.) Microprocessor Interface No. Symbol 1 tDCY Data clock period Parameter Min 122 Typ Max 2 tDCH Data clock HIGH pulse width 48 3 tDCL Data clock LOW pulse width 48 4 tDCR Rise time of clock 5 tDCF Fall time of clock 6 tICSS Chip select setup time, Input mode 30 tDCY–10 7 tICSH Chip select hold time, Input mode 0 tDCH–20 Unit Note 25 25 8 tICSL Chip select pulse width, Input mode 9 tICSO Chip select off time, Input mode 10 tIDS Input data setup time 25 11 tIDH Input data hold time 30 12 tOLH SLIC device output latch valid 8tDCY 2500 1 ns 2500 13 tOCSS Chip select setup time, Output mode 30 tDCY–10 14 tOCSH Chip select hold time, Output mode 0 tDCH–20 15 tOCSL Chip select pulse width, Output mode 8tDCY 16 tOCSO Chip select off time, Output mode 17 tODD Output data turn on delay 18 tODH Output data hold time 19 tODOF Output data turn off delay 50 20 tODC Output data valid 50 21 tRST Reset pulse width 2500 1 50 2 3 50 µs PCM Interface PCLK not to exceed 8.192 MHz. Pull-up resistors to VCCD of 240 Ω are attached to TSCA and TSCB. (See Figure 17 and Figure 18 for the PCM interface timing diagrams.) No. Symbol 22 tPCY PCM clock period Parameter Min. 122 Typ Max 23 tPCH PCM clock HIGH pulse width 48 24 tPCL PCM clock LOW pulse width 48 25 tPCF Fall time of clock 26 tPCR Rise time of clock 27 tFSS FS setup time 25 28 tFSH FS hold time 50 30 tTSD Delay to TSC valid 5 80 31 tTSO Delay to TSC off 5 80 32 tDXD PCM data output delay 5 70 33 tDXH PCM data output hold time 5 70 34 tDXZ PCM data output delay to High-Z 5 70 35 tDRS PCM data input setup time 25 36 tDRH PCM data input hold time 5 Unit Note 3 15 15 22 Zarlink Semiconductor Inc. tPCY–30 ns 4 4, 5 Le58QL02/021/031 Data Sheet Master Clock (See Figure 19, Master Clock Timing, on page 26.) No. Symbol Parameter Min Typ Max Unit 37 JMCY Master clock jitter 50 38 tMCR Rise time of clock 15 39 tMCF Fall time of clock 15 ns 40 tMCH MCLK HIGH pulse width 48 41 tMCL MCLK LOW pulse width 48 Max Notes 6 Auxiliary Output Clocks No. Symbol Parameter Chopper clock frequency Min CHP = 0 CHP = 1 Typ Unit Notes 256 292.57 kHz 7 50 % 7 42 fCHP 42A DCCHP 43 fE1 E1 output frequency (CMODE = EE1 = 1) 4.923 kHz 7 44 tE1 E1 pulse width (CMODE = EE1 = 1) 31.25 µs 7 Chopper click duty cycle Notes: 1. If CFAIL = 1 (Command 55h), GX, GR, Z, B1, X, R, and B2 coefficients must not be written or read without first deactivating all channels or switching them to default coefficients; otherwise, a chip select off time of 25 µs is required. 2. The first data bit is enabled on the falling edge of CS or on the falling edge of DCLK, whichever occurs last. 3. The PCM clock frequency must be an integer multiple of the frame sync frequency. The maximum allowable PCM clock frequency is 8.192 MHz. The actual PCM clock rate is dependent on the number of channels allocated within a frame. The minimum clock frequency is 128 kHz in Companded state and 256 kHz in Linear state, PCM Signaling state, or double PCLK state. The minimum PCM clock rates should be doubled for parts with only one PCM highway in order to allow simultaneous access to all four channels. 4. TSC is delayed from FS by a typical value of N • tPCY, where N is the value stored in the time/clock-slot register. 5. tTSO is defined as the time at which the output achieves the Open Circuit state. 6. PCLK and MCLK are required to be integer multiples of the frame sync (FS) frequency. Frame sync is expected to be an accurate 8 kHz pulse train. If PCLK or MCLK has jitter, care must be taken to ensure that all setup, hold, and pulse width requirements are met. 7. Phase jumps of 81 nS will be present when the master clock frequency is a multiple of 1.544 MHz. 23 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet SWITCHING WAVEFORMS Figure 14. Input and Output Waveforms for AC Tests 2.4 V 2.0 V 2.0 V TEST POINTS 0.8 V 0.8 V 0.45 V Figure 15. Microprocessor Interface (Input Mode) 1 2 5 V IH VIH DCLK V IL V IL 3 7 9 4 CS 6 8 10 DI/O Data Valid 11 Data Valid Data Valid 12 Outputs C5 - C1 Data Valid Data Valid 24 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Figure 16. Microprocessor Interface (Output Mode) VIH VIL DCLK 14 13 16 15 CS 20 18 17 DI/O Three-State VOH Data Valid VOL 19 Data Valid Data Valid Three-State Figure 17. PCM Highway Timing for XE = 0 (Transmit on Negative PCLK Edge) Time Slot Zero Clock Slot Zero 22 26 25 VIH PCLK VIL 23 24 27 28 FS 30 31 TSCA/ TSCB 32 33 34 VOH DXA/DXB First Bit VOL 35 DRA/DRB First Bit VIH Second Bit VIL 25 Zarlink Semiconductor Inc. 36 Le58QL02/021/031 Data Sheet Figure 18. PCM Highway Timing for XE = 1 (Transmit on Positive PCLK Edge) Time Slot Zero Clock Slot Zero 22 26 25 VIH VIL PCLK 23 24 27 28 FS 30 31 TSCA/ TSCB 32 33 34 VOH DXA/DXB First Bit VOL 35 36 VIH First Bit DRA/DRB Figure 19. Second Bit VIL Master Clock Timing 37 40 V V IH IL 41 39 26 Zarlink Semiconductor Inc. 38 Le58QL02/021/031 Data Sheet OPERATING THE QLSLAC DEVICE The following sections describe the operation of the four independent channels of the QLSLAC device. The description is valid for channel 1, 2, 3, or 4; consequently, the channel subscripts have been dropped. For example, VOUT refers to either VOUT1, VOUT2, VOUT3, or VOUT4. Power-Up Sequence The recommended QLSLAC device power-up sequence is to apply: 1. 2. 3. Analog and digital ground VCC, signal connections, and Low on RST High on RST The software initialization should then include: 1. 2. 3. 4. Wait 1 ms. Select master clock frequency and source (Command 46/47h). This should turn off the CFAIL bit (Command 55h) within 400 µs. Program filter coefficients and other parameters as required. Activate (Command 0Eh). If the power supply (VCCD) falls below an internal threshold, the device is reset and will require complete reprogramming with the above sequence. A reset may be initiated by connection of a logic Low to the RST pin, or if chip select (CS) is held low for 16 rising edges of DCLK, a hardware reset is generated when CS returns high. The RST pin may be tied to VCCD if it is not used in the system. Channel Enable (EC) Register A channel enable register has been implemented in the QLSLAC device in order to reduce the effort required to address individual or multiple channels of the QLSLAC device. The register is written using MPI Command 4A/4Bh. Each bit of the register is assigned to one unique channel, bit 0 for channel 1, bit 1 for channel 2, bit 2 for channel 3, and bit 3 for channel 4. The channel or channels are enabled when their corresponding enable bits are High. All enabled channels will receive the data written to the QLSLAC device. This enables a Broadcast mode (all channels enabled) to be implemented simply and efficiently, and multiple channel addressing is accomplished without increasing the number of I/O pins on the device. The Broadcast mode can be further enhanced by providing the ability to select many chips at once; however, care must be taken not to enable more than one chip in the Read state. This can lead to an internal bus contention, in which excess power is dissipated. (Bus contention will not damage the device.) SLIC Device Control and Data Lines The QLSLAC device has up to five SLIC device programmable digital input/output pins per channel (CD1–C5). Each of these pins can be programmed as either an input or an output using the I/O Direction register, Command 54/55h (see Figure 21). The output latches can be written with Command 52h; however, only those bits programmed as outputs will actually drive the pins. The inputs can be read with Command 53h. If a pin is programmed as an output, the data read from it will be the contents of the output latch. It is recommended that any of the SLIC device input/output control and data pins, which are to be programmed as outputs, be written to their desired state via Command 52h before writing the data which configures them as outputs with the I/ O direction register Command 54/55h. This ensures that when the output is activated, it is already in the correct state, and will prevent unwanted data from being driven from the SLIC device output pins. It is possible to make a SLIC device control output pull up to a non-standard voltage (V < 5.25 V) by connecting a resistor from the output to the desired voltage, sending zero to the output, and using the DIO bit to tri-state the output. Clock Mode Operation The QLSLAC device operates with multiple clock signals. The master clock is used for internal timing including operation of the digital signal processing and may be derived from either the MCLK or PCLK source. When MCLK is used as the master clock, it should be synchronous to FS. The allowed frequencies are listed under Command 46/47h. The PCM clock (PCLK) is used for PCM timing and is an integer multiple of the frame sync frequency. The internal master clock can be optionally derived from the PCLK source by setting the CMODE bit (bit 4, Command 46/47h) to one. In this mode, the MCLK/E1 pin is free to be used as an E1 signal output. Clock mode options and E1 output functions are shown in Figure 20. 27 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Figure 20. Clock Mode Options. MCLK/E1 PCLK (= 0) Time Slot Assigner (= 1) E1 (= 1) (= 0) CMODE (= 1) (= 0) EE1 ÷N DSP Engine CSEL E1 Pulses E1P Notes: 1. CMODE = Command 46/47h Bit 4 2. CSEL = Command 46/47h Bits 0–3 3. EE1 = Command C8/C9h Bit 7 4. E1P = Command C8/C9h Bit 6 E1 Multiplex Operation The QLSLAC device can multiplex input data from the CD1 SLIC device I/O pin into two separate status bits per channel (CD1 and CD1B bits in the SLIC Input/Output register, Command 52/53h, and CDA and CDB bits in the Real Time Data register, Command 4D/4Fh) using the E1 multiplex mode. This multiplex mode provides the means to accommodate dual detect states when connected to an Legerity SLIC device, which also supports ground-key detection in addition to loop detect. Legerity SLIC devices that support ground-key detect use their E1 pin as an input to switch the SLIC device’s single detector (DET) output between internal loop detect or ground-key detect comparators. Using the E1 multiplex mode, a single QLSLAC device can monitor both loop detect and ground-key detect states of all four connected SLIC devices without additional hardware. Although normally used for ground key detect, this multiplex function can also be used for monitoring other signal states. The E1 multiplex mode is selected by setting the EE1 bit (bit 7, Command C8/C9h) and the CMODE bit (bit 4, Command 46/47h) in the QLSLAC device. The CMODE bit must be selected (CMODE=1) for the master clock to be derived from PCLK so that the MCLK/E1 pin can be used as an output for the E1 signal. The multiplex mode is then turned on by setting the EE1 bit. With the E1 multiplex mode enabled, the QLSLAC device generates the E1 output signal. This signal is a 31.25 µs (1/32 kHz) duration pulse occurring at a 4.923 kHz (64 kHz/13) rate. If EE1 is reset, MCLK/E1 is programmed as an input and should be connected to ground if it is not connected to a clock source. The polarity of this E1 output is selected by the E1P bit (bit 6, Command C8/C9h) allowing this multiplex mode to accommodate all SLIC devices regardless of their E1 high/low logic definition. Figure 21 shows the SLIC device Input/Output register, I/O pins, E1 multiplex hardware operation for one QLSLAC device channel. It also shows the operation of the Real Time Register. The QLSLAC device E1 output signal connects directly to the E1 inputs of all four connected SLIC devices and is used by those SLIC devices to select an internal comparator to route to the SLIC device DET output. This E1 signal is also used internally by the QLSLAC device for controlling the multiplex operation and timing. The CD1 and CD1B bits of the SLIC device Input/Output register are isolated from the CD1 pin by transparent latches. When the E1 pulse is off, the CD1 pin data is routed directly to the CD1 bit of the SLIC device I/O register and changes to the CD1B bit of that register are disabled by its own latch. When E1 pulses on, the CD1 latch holds the last CD1 state in its register. At the same time, the CD1B latch is enabled, which allows CD1 pin data to be routed directly to the CD1B bit. Therefore, during this multiplexing, the CD1 bit always has loop-detect status and the CD1B bit always has ground-key detect status. This multiplexing state changes almost instantaneously within the QLSLAC device but the SLIC device may require a slightly longer time period to respond to this detect state change before its DET output settles and becomes valid. To accommodate this delay difference, the internal signals within the QLSLAC device are isolated by 15.625 µs before allowing any change to the CD1 bit and CD1B bit latches. This operation is further described by the E1 multiplex timing diagram in Figure 22. In this timing diagram, the E1 signal represents the actual signal presented to the E1 output pin. The GK Enable pulse allows CD1 pin data to 28 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet be routed through the CD1B latch. The LD Enable pulse allows CD1 pin data to be routed through the CD1 latch. The uncertain states of the SLIC device’s DET output, and the masked times where that DET data is ignored are shown in this timing diagram. Using this isolation of masked times, the CD1 and CD1B registers are guaranteed to contain accurate representations of the SLIC device detector output. Figure 21. SLIC Device I/O E1 Multiplex and Real-Time Data Register Operation SLIC Input Register MPI Command 53h D — Q — CD1B C5 C4 C3 CD2 CD1 EN/HOLD * CD1 CD2 C3 C4 C5 D Q EN/HOLD I/O Direction Register MPI Command 54/55h * Output Latch SLIC Output Register MPI Command 52h EE1 Bit MUX Ground Key Filter (time set via Command E8/E9h) GK Enable Debounce (time set via Command C8/C9h) (Channel 1 Shown) { Delay Same for Channels 2, 3, 4 See Figure 22 for details Real Time Data Register (Command 4D/4Fh) E1P INT 0 LD Enable E1 Source (Internal) MCLK/E1 1 CDB4 CDA4 CDB3 CDA3 CDB2 CDA2 CDB1 CDA1 ATI (Command 70/71h) Interrupt Mask Register (Command 6C/6Dh) MCDB4 MCDA4 MCDB3 MCDA3 MCDB2 MCDA2 MCDB1 MCDA1 Note: * Transparent latches: When enable input is high, Q output follows D input. When enable input goes low, Q output is latched at last state. 29 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Figure 22. E1 Multiplex Internal Timing Pulse Period 203.125 µs 4.923 kHz (64 kHz/13) pulse rate 31.25 µs E1 15.625 µs 15.625 µs GK Enable LD Enable 15.625 µs DET Output from SLIC (CD1 Pin Input) CD1 Pin Input Data Contains Valid LD Status CD1 Register Operation Tracks DET State CD1B Register Operation CD1 Pin State Ignored Contains Valid GK Status Hold Last State Hold Last State Tracks DET State CD1 Pin State Ignored Contains Valid LD Status Tracks DET State Hold Last State Debounce Filters Operation Each channel is equipped with two debounce filter circuits to buffer the logic status of the CD1 and CD2/CD1B bits of the SLIC device Input Data Register (Command 53h) before providing filtered bit’s outputs to the Real-Time Data Register (Command 4D/ 4Fh). One filter is used only for the CD1 bit. The other filter acts upon either the CD1B bit if E1 multiplexing is enabled, or on the CD2 bit if the multiplexing is not enabled. The CD1 bit normally contains SLIC device loop detect status. The CD1 debouncing time is programmable with the Debounce Time Register (Command C8/C9h), and even though each channel has its own filter, the programmed value is common to all four channels. This debounce filter is initially clocked at the frame sync rate of 125 µs, and any occurrence of changing data at this sample rate resets a programmable counter. This programmable counter is clocked at a 1 ms rate, and the programmed count value of 0 to 15 ms, as defined by the Debounce Time Register, must be reached before updating the CDA bit of the Real Time Data register with the CD1 state. Refer to Figure 23a for this filter’s operation. The ground-key filter (Figure 23b) provides a buffering of the signal, normally ground key detect, which appears in the CD1B bit of the Real Time Data Register. Each channel has its own filter, and each filter’s time can be individually programmed. The input to the filter comes from either the CD2 bit of the SLIC device I/O Data Register (Command 53h), when E1 multiplexing is not enabled, or from the CD1B bit of that register when E1 multiplexing is enabled. The feature debounces ground-key signals before passing them to the Real Time Data Register, although signals other than ground-key status can be routed to the CD2 pin and then through the registers. The ground-key debounce filter operates as a duty-cycle detector and consists of an up/down counter which can range in value between 0 and 6. This six-state counter is clocked by the GK timer at the sampling period of 1–15 ms, as programmed by the value of the four GK bits (GK3, GK2, GK1, GK0) of the Ground-Key Filter Data register (Command E8/E9h). This sampling period clocks the counter, which buffers the CD2/CD1B bit’s status before it is valid for presenting to the CDB bit of the Real Time Data Register. When the sampled value of the ground-key (or CD2) input is high, the counter is incremented by each clock pulse. When the sampled value is low, the counter is decremented. Once the counter increments to its maximum value of 6, it sets a latch whose output is routed to the corresponding CDB bit. If the counter decrements to its minimum value of 0, this latch is cleared and the output bit is set to zero. All other times, the latch (and the CDB status) remains in its previous state without change. It therefore takes at least six consecutive GK clocks with the debounce input remaining at the same state to effect an output change. If the GK bit value is set to zero, the buffering is bypassed and the input status is passed directly to CDB. 30 Zarlink Semiconductor Inc. Le58QL02/021/031 Figure 23. Data Sheet MPI Real-Time Data Register CD1 D Q D Q D Debounce Counter Q DSH0 – DSH3 Debounce Period (0 – 15 ms) CK 8 FS (8 kHz) D Q CDA EN/HOLD * Q RST a. Loop Detect Debounce Filter Notes: *Transparent latch: Output follows input when EN is high; ouput holds last state when EN is low. Debounce counter: Output is high after counting to programmed (DSH) number of 1 ms clocks; counter is reset for CD1 input changes at 125 µs sample period. DSH0 - DSH3 programmed value is common for all four channels, but debounce counter is separate per channel. MUX CD2 or CD1B GK = 0 CDB UP/DN GK0 – GK3 Ground-Key Sampling Interval 1 – 15 ms Q GK = 0 GK 1 kHz RST Clock Divider (1 – 15 ms clock output) Six-State Up/Down Counter b. Ground-Key Filter Notes: Programmed value of GK0 - GK3 determines clock rate (1 - 15 ms) of six-state counter. If GK value = 0, the counter is bypassed and no buffering occurs. Six-state up/down counter: Counts up when input is high; counts down when input is low. Output goes and stays high when maximum count is reached; output goes and stays low when count is down to zero. Real-Time Data Register Operation To obtain time-critical data such as off/on-hook and ring trip information from the SLIC device with a minimum of processor time and effort, the QLSLAC device contains an 8-bit Real Time Data register. This register contains CDA and CDB bits from all four channels. The CDA bit for each channel is a debounced version of the CD1 input. The CDA bit is normally used for hook switch. The CDB bit for each channel normally contains the debounced value of the CD2 input bit; however, if the E1 multiplex operation is enabled, the CDB bit will contain the debounced value of the CD1B bit. CD1 and CD2 can be assigned to off-hook, ring trip, ground key signals, or other signals. Frame sync is needed for the debounce and the ground key signals. If Frame sync is not provided, the real-time register will not work. The register is read using MPI Command 4D/4Fh, and may be read at any time regardless of the state of the Channel Enable Register. This allows off/on-hook, ring trip, or ground key information for all four channels to be obtained from the QLSLAC device with one read operation versus one read per channel. If these data bits are not used for supervision information, they can be accessed on an individual channel basis in the same way as C3–C5; however, CD1 and CD1B will not be debounced. Interrupt In addition to the Real Time Data register, an interrupt signal has been implemented in the QLSLAC device. The interrupt signal is an active Low output signal which pulls Low whenever the unmasked CD bits change state (Low to High or High to Low); or whenever the transmit PCM data changes on a channel in which the Arm Transmit Interrupt (ATI) bit is on. The interrupt control is shown in Figure 21. The interrupt remains Low until the appropriate register is read. This output can be programmed as TTL or open drain. When an interrupt is generated, all of the unmasked bits in the Real Time Data register latch and remain latched until the interrupt is cleared. The interrupt is cleared by reading the register with Command 4Fh, by writing to the interrupt mask register (Command 6Ch), or by a reset. If any of the inputs to the unmasked bits in the Real Time Data register are different from 31 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet the register bits when the interrupt is cleared by reading the register, a new interrupt is immediately generated with the new data latched into the Real Time Data register. For this reason, the interrupt logic in the controller should be level-sensitive rather than edge-sensitive. Interrupt Mask Register The Real Time Data register data bits can be masked from causing an interrupt to the processor using the interrupt mask register. The mask register can be written or read via the MPI Command 6C/6Dh. Active State Each channel of the QLSLAC device can operate in either the Active (Operational) or Inactive (Standby) state. In the Active state, individual channels of the QLSLAC device can transmit and receive PCM or linear data and analog information. The Active state is required when a telephone call is in progress. The activate command (MPI Command 0Eh), puts the selected channel(s) into this state (see channel enable register). Bringing a channel of the QLSLAC device into the Active state is only possible through the MPI. Inactive State All channels of the QLSLAC device are forced into the Inactive (Standby) state by a power-up or hardware reset. Individual channels can be programmed into this state by the deactivate command (Command 00h) or by the software reset command (Command 02h). Power is disconnected from all nonessential circuitry while the MPI remains active to receive commands. The analog output is tied to VREF through a resistor whose value depends on the VMODE bit. All circuits that contain programmed information retain their data in the Inactive state. Chopper Clock On the Le58QL02JC there is a chopper clock output to drive the switching regulator on some Legerity SLIC devices. The clock frequency is selectable as 256 or 292.57 kHz by the CHP bit (Command 46/47h). The duty cycle is given in the Switching Characteristics section. The chopper output must be turned on with the ECH bit (Command C8/C9h). Reset States The QLSLAC device can be reset by application of power, by an active Low on the hardware Reset pin (RST), by a hardware reset command, or by CS Low for 16 or more rising edges of DCLK. This resets the QLSLAC device to the following state: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. A-law companding is selected. Default B, X, R, and Z filter values from ROM are selected and the AISN is set to zero. Default digital gain blocks (GX, GR) from ROM are selected. The analog gains, AX and AR, are set to 0 dB and the input attenuator is turned on (DGIN = 0). The previously programmed B, Z, X, R, GX, and GR filters in RAM are unchanged. SLIC device I/Os (CD1–C5) are set to the Input state. All of the test states in the Operating Conditions register are turned off (0’s). All four channels are in the Inactive (standby) state. Transmit time slots and receive time slots are set to 0, 1, 2, and 3 for channels 1, 2, 3, and 4, respectively. The clock slots are set to 0, with transmit on the negative edge. DXA port is selected for all channels. DRA port is selected for all channels. The master clock frequency selected is 8.192 MHz and is programmed to come from PCLK. All four channels are selected in the Channel Enable register. Any pending interrupts are cleared, all interrupts are masked, and the Interrupt Output state is set to open drain. The supervision debounce time is set to 8 ms. The chopper clock frequency is set to 256 kHz but the chopper clock is turned off. The E1 Multiplex state is turned off (E1 is Hi-Z) and the polarity is set for high going pulses. No signalling on the PCM highway. 32 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet SIGNAL PROCESSING Overview of Digital Filters Several of the blocks in the signal processing section are user programmable. These allow the user to optimize the performance of the QLSLAC device for the system. Figure 24 shows the QLSLAC device signal processing and indicates the programmable blocks. The advantages of digital filters are: High reliability No drift with time or temperature Unit-to-unit repeatability Superior transmission performance Flexibility Maximum possible bandwidth for V.90 modems Figure 24. QLSLAC Device Transmission Block Diagram Cutoff Transmit Path (CTP) Digital TSA TX High Pass Filter (HPF) V IN * AX GIN ADC Decimator Decimator + GX X * * LPF & HPF Compressor TSA Loopback (TLB) AISN Full Digital Loopback (FDL) * B * * Cutoff Receive Path (CRP) + V OUT Z * AR DAC Interpolator + Interpolator GR VREF * R Expander LPF * Receive Lower Gain (LRG) 0 TSA Digital RX 1 kHz Tone (TON) * programmable blocks Two-Wire Impedance Matching Two feedback paths on the QLSLAC device synthesize the two-wire input impedance of the SLIC device by providing a programmable feedback path from VIN to VOUT. The Analog Impedance Scaling Network (AISN) is a programmable analog gain of −0.9375 • GIN to +0.9375 • GIN from VIN to VOUT. (See GIN in Electrical Characteristics, on page 13.) The Z filter is a programmable digital filter providing an additional path and programming flexibility over the AISN in modifying the transfer function from VIN to VOUT. Together, the AISN and the Z-Filter enable the user to synthesize virtually all required SLIC device input impedances. Frequency Response Correction and Equalization The QLSLAC device contains programmable filters in the receive (R) and transmit (X) directions that may be programmed for line equalization and to correct any attenuation distortion caused by the Z filter. Transhybrid Balancing The QLSLAC device’s programmable B filter is used to adjust transhybrid balance. The filter has a single pole IIR section (BIIR) and an eight-tap FIR section (BFIR), both operating at 16 kHz. (See commands 86/87h and 96/97h.) 33 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Gain Adjustment The QLSLAC device’s transmit path has three programmable gain blocks. Gain block GIN is an attenuator with a gain of GIN (see Electrical Characteristics, on page 13 for the value). Gain block AX is an analog gain of 0 dB or 6.02 dB (unity gain or gain of 2.0), located immediately before the A/D converter. GX is a digital gain block that is programmable from 0 dB to +12 dB, with a worst-case step size of 0.1 dB for gain settings below +10 dB, and a worst-case step size of 0.3 dB for gain settings above +10 dB. The filters provide a net gain in the range of 0 dB to 18 dB. The QLSLAC device receive path has two programmable loss blocks. GR is a digital loss block that is programmable from 0 dB to 12 dB, with a worst-case step size of 0.1 dB. Loss block AR is an analog loss of 0 dB or 6.02 dB (unity gain or gain of 0.5), located immediately after the D/A converter. This provides a net loss in the range of 0 dB to 18 dB. An additional 6 dB attenuation is provided as part of GR, which can be inserted by setting the LRG bit of Command 70/71h. This allows writing of a single bit to introduce 6 dB of attenuation into the receive path without having to reprogram GR. This 6 dB loss is implemented as part of GR and the total receive path attenuation must remain in the specified 0 to –12 dB range. If the LRG bit is set, the programmed value of GR must not introduce more than an additional 6 dB attenuation. Transmit Signal Processing In the transmit path (A/D), the analog input signal (VIN) is A/D converted, filtered, companded (for A-law or µ-law), and made available to the PCM highway in A-law, µ-law, or linear form. If linear form is selected, the 16-bit data will be transmitted in two consecutive time slots starting at the programmed time slot. The signal processor contains an ALU, RAM, ROM, and control logic to implement the filter sections. The B, X, and GX blocks are user-programmable digital filter sections with coefficients stored in the coefficient RAM, while AX is an analog amplifier that can be programmed for 0 dB or 6.02 dB gain. The B, X, and GX filters can also be operated from an alternate set of default coefficients stored in ROM (Command 60/61h). The decimator reduces the high input sampling rate to 16 kHz for input to the B, GX, and X filters. The X filter is a six-tap FIR section which is part of the frequency response correction network. The B filter operates on samples from the receive signal path in order to provide transhybrid balancing in the loop. The high-pass filter rejects low frequencies such as 50 Hz or 60 Hz, and may be disabled. Transmit PCM Interface The transmit PCM interface transmits a 16-bit linear code (when programmed) or an 8-bit compressed code from the digital Alaw/µ-law compressor. Transmit logic controls the transmission of data onto the PCM highway through output port selection and time/clock slot control circuitry. The linear data requires two consecutive time slots, while a single time slot is required for A-law/ µ-law data. In the PCM Signaling state (SMODE = 1), the transmit time slot following the A-law or µ-law data is used for signaling information. The two time slots form a single 16-bit data block. The frame sync (FS) pulse identifies time slot 0 of the transmit frame and all channels (time slots) are referenced to it. The logic contains user-programmable Transmit Time Slot and Transmit Clock Slot registers. The Time Slot register is 7 bits wide and allows up to 128 8-bit channels (using a PCLK of 8.192 MHz) in each frame. This feature allows any clock frequency between 128 kHz and 8.192 MHz (2 to 128 channels) in a system. The data is transmitted in bytes, with the most significant bit first. The Clock Slot register is 3 bits wide and may be programmed to offset the time slot assignment by 0 to 7 PCLK periods to eliminate any clock skew in the system. An exception occurs when division of the PCLK frequency by 64 kHz produces a nonzero remainder, R, and when the transmit clock slot is greater than R. In that case, the R-bit fractional time slot after the last full time slot in the frame will contain random information and will have the TSC output turned on. For example, if the PCLK frequency is 1.544 MHz (R = 1) and the transmit clock slot is greater than 1, the 1-bit fractional time slot after the last full time slot in the frame will contain random information, and the TSC output will remain active during the fractional time slot. In such cases, problems can be avoided by not using the last time slot. The PCM data may be user programmed for output onto either the DXA or DXB port or both ports simultaneously. Correspondingly, either TSCA or TSCB or both are Low during transmission. The DXA/DXB and TSCA/TSCB outputs can be programmed to change either on the negative or positive edge of PCLK. Transmit data can also be read through the microprocessor interface using Command CDh. Receive Signal Processing In the receive path (D/A), the digital signal is expanded (for A-law or µ-law), filtered, converted to analog, and passed to the VOUT pin. The signal processor contains an ALU, RAM, ROM, and Control logic to implement the filter sections. The Z, R, and GR blocks are user-programmable filter sections with their coefficients stored in the coefficient RAM, while AR is an analog amplifier which can be programmed for a 0 dB or 6.02 dB loss. The Z, R, and GR filters can also be operated from an alternate set of default coefficients stored in ROM (Command 60/61h). 34 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet The low-pass filter band limits the signal. The R filter is composed of a six-tap FIR section operating at a 16 kHz sampling rate and a one-tap IIR section operating at 8 kHz. It is part of the frequency response correction network. The Analog Impedance Scaling Network (AISN) is a user-programmable gain block providing feedback from VIN to VOUT to emulate different SLIC device input impedances from a single external SLIC device impedance. The Z filter provides feedback from the transmit signal path to the receive path and is used to modify the effective input impedance to the system. The interpolator increases the sampling rate prior to D/A conversion. Receive PCM Interface The receive PCM interface logic controls the reception of data bytes from the PCM highway, transfers the data to the A-law/µ-law expansion logic for compressed signals, and then passes the data to the receive path of the signal processor. If the data received from the PCM highway is programmed for linear code, the A-law/µ-law expansion logic is bypassed and the data is presented to the receive path of the signal processor directly. The linear data requires two consecutive time slots, while the A-law or µ-law data requires a single time slot. The frame sync (FS) pulse identifies time slot 0 of the receive frame, and all channels (time slots) are referenced to it. The logic contains user-programmable Receive Time Slot and Receive Clock Slot registers. The Time Slot register is 7 bits wide and allows up to 128 8-bit channels (using a PCLK of 8.192 MHz) in each frame. This feature allows any clock frequency between 128 kHz and 8.192 MHz (2 to 128 channels) in a system. The Clock Slot register is 3 bits wide and can be programmed to offset the time slot assignment by 0 to 7 PCLK periods to eliminate any clock skews in the system. An exception occurs when division of the PCLK frequency by 64 kHz produces a nonzero remainder (R), and when the receive clock slot is greater than R. In that case, the last full receive time slot in the frame is not usable. If the PCLK frequency is 1.544 MHz (R=1), the receive clock slot can be only 0 or 1 if the last time slot is to be used. The PCM data can be programmed for input from the DRA or DRB port. Analog Impedance Scaling Network (AISN) The AISN is in the QLSLAC device to scale the value of the external SLIC device impedance. Scaling this external impedance with the AISN (along with the Z filter) allows matching of many different line conditions using a single impedance value. Line cards can meet many different specifications without any hardware changes. The AISN is a programmable transfer function connected from VIN to VOUT of each QLSLAC device channel. The AISN transfer function can be used to alter the input impedance of the SLIC device to a new value (ZIN) given by: Z IN = Z SL • ( 1 – G 44 • h AISN ) ⁄ ( 1 – G 440 • h AISN ) where G440 is the SLIC device echo gain into an open circuit, G44 is the SLIC device echo gain into a short circuit, and ZSL is the SLIC device input impedance without the QLSLAC device. The gain can be varied from −0.9375 • GIN to +0.9375 • GIN in 31 steps of 0.0625 • GIN. The AISN gain is determined by the following equation: h AISN ⎛ 4 ⎞ i = 0.0625 • GIN ⎜⎜ ∑ AISN i • 2 ⎟⎟ – 16 ⎝i = 0 ⎠ where each AISNi = 0 or 1 There are two special cases to the formula for hAISN: 1) a value of AISN = 00000 specifies a gain of 0 (or cutoff), and 2) a value of AISN = 10000 is a special case where the AISN circuitry is disabled and VOUT is connected internally to VIN after the input attenuator with a gain of 0 dB. This allows a Full Digital Loopback state where an input digital PCM signal is completely processed through the receive section, looped back, processed through the transmit section, and output as digital PCM data. During this test, the VIN input is ignored and the VOUT output is connected to VREF. Speech Coding The A/D and D/A conversion follows either the A-law or the µ-law standard as defined in ITU-T Recommendation G.711. A-law or µ-law operation is programmed using MPI Command 60/61h. Alternate bit inversion is performed as part of the A-law coding. The QLSLAC device provides linear code as an option on both the transmit and receive sides of the device. Linear code is selected using MPI Command 60/61h. Two successive time slots are required for linear code operation. The linear code is a 16bit two’s-complement number which appears sign bit first on the PCM highway. Linear code occupies two time slots. 35 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Signaling on the PCM Highway If the SMODE bit is set in the Configuration register (Command 46/47h), each data point occupies two consecutive time slots. The first time slot contains A-law or µ-law data and the second time slot contains the following information: Bit 7: Debounced CD1 bit (usually hook switch) Bit 6: CD2 bit or CD1B bit Bits 5–3: Reserved Bit 2: CFAIL Bits 1–0: Reserved Bit 7 of the signaling byte appears immediately after bit 0 of the data byte. A-law or µ-law Companded state must be specified in order to put signaling information on the PCM highway. The signaling time slot remains active, even when the channel is inactive. Robbed-Bit Signaling Compatibility The QLSLAC device supports robbed bit signaling compatibility. Robbed bit signaling allows periodic use of the least significant bit (LSB) of the receive path PCM data to be used to carry signaling information. In this scheme, separate circuitry within the line card or system intercepts this bit out of the PCM data stream and uses this bit to control signaling functions within the system. The QLSLAC device does not perform any processing of any of the robbed bits during this operation; it simply allows for the robbed bit presence by performing the LSB substitution. If the RBE bit is set in the Channel Enable and Operating Mode register (Command 4A/4Bh), then the robbed-bit signaling compatibility mode is enabled. Robbed-bit signaling is only available in the µ-law companding mode of the device. Also, only the receive (digital-to-analog) path is involved. There is no change of operation to the transmit path and PCM data coming out of the QLSLAC device will always contain complete PCM byte data for each time slot, regardless of robbed-bit signaling selection. In the absence of actual PCM data for the affected time slots, there is an uncertainty of the legitimate value of this bit to accurately reconstruct the analog signal. This bit can always be assumed to be a 1 or 0; hence, the reconstructed signal is correct half the time. However, the other half of the time, there is an unacceptable reconstruction error of a significance equal to the value weighting of the LSB. To reduce this error and provide compatibility with the robbed bit signaling scheme, when in the robbed-bit signaling mode, the QLSLAC device ignores the LSB of each received PCM byte and replaces its value in the expander with a value of half the LSB’s weight. This then guarantees the reconstruction is in error by only half this LSB weight. In the expander, the eight bits of the companded PCM byte are expanded into linear PCM data of several more bits within the internal signal processing path of the device. Therefore, accuracy is not limited to the weight of the LSB, and a weight of half this value is realizable. When this robbed-bit mode is selected, not every frame contains bits for signaling, and therefore not every byte requires its LSB substituted with the half-LSB weight. This substitution only occurs for valid PCM time slots within frames for which this robbed bit has been designated. To determine which time slots are affected, the device monitors the frame sync (FS) pulse. The current frame is a robbed-bit frame and this half-LSB value is used only when this criteria is met: The RBE bit is set, and The device is in the µ-law companding mode, and The current frame sync pulse (FS) is two PCLK cycles long, and The previous frame sync pulse (FS) was not two PCLK cycles long. The frame sync pulse is sampled on the falling edge of PCLK. As shown in Figure 25, if the above criteria is met, and if FS is high for two consecutive falling edges of PCLK then low for the third falling edge, it is considered a robbed-bit frame. Otherwise, it is a normal frame. 36 Zarlink Semiconductor Inc. Le58QL02/021/031 Figure 25. Data Sheet Robbed-Bit Frame PCLK FS Normal Frame (Not Robbed-Bit) PCLK FS Robbed-Bit Frame Default Filter Coefficients The QLSLAC device contains an internal set of default coefficients for the programmable filters. The default filter gains are calculated based on the application circuit shown on page 61. This SLIC device has a transmit gain of 0.5 (GTX) and a current gain of 500 (K1). The transmit relative level is set to +0.28 dBr, and the receive relative level is set to –4.39 dBr. The equalization filters (X and R) are not optimized and the Z and B filters are set to zero. The nominal input impedance was set to 812 Ω. If the SLIC device circuit differs significantly from this design, the default gains cannot be used and must be replaced by programmed coefficients. The balance filter (B) must always be programmed to an appropriate value. To obtain this above-system response, the default filter coefficients are set to produce these values: GX gain = +6 dB, GR gain = –8.984 dB AX gain = 0 dB, AR gain = 0 dB, input attenuator on (DGIN = 0) R filter: H(z) = 1, X filter: H(z) = 1 Z filter: H(z) = 0 B filter: H(z) = 0 AISN = cutoff Notice that these default coefficient values are retained in a read-only memory area within the QLSLAC device, and those values cannot be read back using any data commands. When the device is selected to use default coefficients, it obtains those values directly from the read-only memory area, where the coefficient read operations access the programmable random access data memory only. If an attempt is made to read back any filter values without those values first being written with known programmed data, the values read back are totally random and do not represent the default or any other values. 37 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet COMMAND DESCRIPTION AND FORMATS Command Field Summary A microprocessor can program and control the QLSLAC device using the MPI. Data programmed previously can be read out for verification. See the tables below for the channel and global chip parameters assigned. Commands are provided to assign values to the following channel parameters: Table 3. Channel Parameters Parameter Description MPI TTS Transmit time slot 40/41h RTS Receive time slot 42/43h 80/81h GX Transmit gain GR Receive loss 82/83h B1 B1 filter coefficients 86/87h B2 B2 filter coefficients 96/97h X X filter coefficients 88/89h R R filter coefficients 8A/8Bh ZFIR Z-FIR filter coefficients 98/99h ZIIR Z-IIR filter coefficients 9A/9Bh Z filter coefficients (both FIR and IIR) 84/85h AISN coefficient 50/51h Z AISN CD1–C5 Write SLIC device Outputs IOD1–5 SLIC device Input/Output Direction 54/55h A/µ Select A-law or µ-law 60/61h C/L Compressed/linear 60/61h Select Transmit PCM highway A or B 40/41h Select Transmit PCM on highway selected by TPCM, or on both ports A and B 44/45h Select Receive PCM Port A or B 42/43h TPCM TAB RPCM 52h EB Programmed/Default B filter 60/61h EZ Programmed/Default Z filter 60/61h EX Programmed/Default X filter 60/61h ER Programmed/Default R filter 60/61h EGX Programmed/Default GX filter 60/61h EGR Programmed/Default GR filter 60/61h DGIN Disable input attenuator 50/51h AX Enable/disable AX amplifier 50/51h AR Enable/disable AR amplifier 50/51h Cutoff Transmit Path 70/71h CRP Cutoff Receive Path 70/71h HPF Disable High Pass Filter 70/71h LRG Lower Receive Gain 70/71h ATI Arm Transmit Interrupt 70/71h 70/71h CTP ILB Interface Loopback FDL Full Digital Loopback 70/71h TON 1 kHz Tone On 70/71h Ground-Key Filter E8/E9h GK CSTAT Select Active or Inactive (Standby) state Commands are provided to read values from the following channel monitors: 38 Zarlink Semiconductor Inc. 55h, 00h, 0Eh Le58QL02/021/031 Data Sheet Table 4. Channel Monitors Monitor CD1–C5 Description Read SLIC device inputs MPI 53h CD1B Multiplexed SLIC device Input 53h XDAT Transmit PCM data CDh Commands are provided to assign values to the following global chip parameters: Table 5. Global Chip Parameters Parameter XE RCS Description MPI Transmit PCM Clock Edge 44/45h Receive clock slot 44/45h 44/45h TCS Transmit clock slot INTM Interrupt Output Drive Mode 46/47h CHP Chopper Clock Frequency 46/47h ECH Enable Chopper Clock Output C8/C9h SMODE Select Signaling on the PCM Highway 46/47h CMODE Select Master Clock Mode 46/47h CSEL Select Master Clock Frequency 46/47h RBE Robbed Bit Enable 4A/4Bh VMODE EC VOUT Mode 4A/4Bh Channel Enable Register 4A/4Bh DSH Debounce Time for CD1 C8/C9h EE1 Enable E1 Output C8/C9h E1P E1 Polarity C8/C9h Interrupt Mask Register 6C/6Dh MCDxC Commands are provided to read values from the following global chip status monitors: Table 6. Global Chip Status Monitors Monitor Description MPI CDxC Real Time Data Register 4D/4Fh CFAIL Clock Failure Bit 54/55h RCN Revision Code Number 73h Microprocessor Interface Description The following description of the MPI (Microprocessor Interface) is valid for channels 1 – 4. If desired, multiple channels can be programmed simultaneously with identical information by setting multiple Channel Enable bits. Channel enables are contained in the Channel Enable register and written or read using MPI Command 4A/4Bh. If multiple Channel Enable bits are set for a read operation, only data from the first enabled channel will be read. The MPI physically consists of a serial data input/output (DIO), a data clock (DCLK), and a chip select (CS). Individual Channel Enable bits EC1, EC2, EC3, and EC4 are stored internally in the Channel Enable register of the QLSLAC device. The serial input consists of 8-bit commands that can be followed with additional bytes of input data, or can be followed by the QLSLAC device sending out bytes of data. All data input and output is MSB (D7) first and LSB (D0) last. All data bytes are read or written one at a time, with CS going High for at least a minimum off period before the next byte is read or written. Only a single channel should be enabled during read commands. All commands that require additional input data to the device must have the input data as the next N words written into the device (for example, framed by the next N transitions of CS). All unused bits must be programmed as 0 to ensure compatibility with future parts. All commands that are followed by output data will cause the device to output data for the next N transitions of CS going Low. The QLSLAC device will not accept any commands until all the data has been shifted out. The output values of unused bits are not specified. An MPI cycle is defined by transitions of CS and DCLK. If the CS lines are held in the High state between accesses, the DCLK may run continuously with no change to the internal control data. Using this method, the same DCLK can be run to a number of 39 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet QLSLAC devices and the individual CS lines will select the appropriate device to access. Between command sequences, DCLK can stay in the High state indefinitely with no loss of internal control information regardless of any transitions on the CS lines. Between bytes of a multibyte read or write command sequence, DCLK can also stay in the High state indefinitely. DCLK can stay in the Low state indefinitely with no loss of internal control information, provided the CS lines remain at a High level. If a low period of CS contains less than 8 positive DCLK transitions, it is ignored. If it contains 8 to 15 positive transitions, only the last 8 transitions matter. If it contains 16 or more positive transitions, a hardware reset in the part occurs. If the chip is in the middle of a read sequence when CS goes Low, data will be present at the DIO pin even if DCLK has no activity. SUMMARY OF MPI COMMANDS Hex* Description 00h Deactivate (Standby state) 02h Software Reset 04h Hardware Reset 06h No Operation 0Eh Activate (Operational state) 40/41h Write/Read Transmit Time Slot and PCM Highway Selection 42/43h Write/Read Receive Time Slot and PCM Highway Selection 44/45h Write/Read REC & TX Clock Slot and TX Edge 46/47h Write/Read Configuration Register 4A/4Bh Write/Read Channel Enable & Operating Mode Register 4Dh Read Real Time Data Register 4Fh Read Real Time Data Register and Clear Interrupt 50/51h Write/Read AISN and Analog Gains 52/53h Write/Read SLIC device Input/Output Register 54/55h Write/Read SLIC device Input/Output Direction and Status Bits 60/61h Write/Read Operating Functions 6C/6Dh Write/Read Interrupt Mask Register 70/71h Write/Read Operating Conditions 73h Read Revision Code Number (RCN) 80/81h Write/Read GX Filter Coefficients 82/83h Write/Read GR Filter Coefficients 84/85h Write/Read Z Filter Coefficients (FIR and IIR) 86/87h Write/Read B1 Filter Coefficients (FIR) 88/89h Write/Read X Filter Coefficients 8A/8Bh Write/Read R Filter Coefficients 96/97h Write/Read B2 Filter Coefficients (IIR) 98/99h Write/Read Z Filter Coefficients (FIR only) 9A/9Bh Write/Read Z Filter Coefficients (IIR only) C8/C9h CDh E8/E9h Write/Read Debounce Time Register Read Transmit PCM Data Write/Read Ground Key Filter Sampling Interval Note: *All codes not listed are reserved by Legerity and should not be used. MPI COMMAND STRUCTURE This section details each MPI command. Each command is shown along with the format of any additional data bytes that follow. For details of the filter coefficients of the form Cxymxy, refer to the General Description of CSD Coefficients section page 56. Unused bits are indicated by “RSVD”; 0’s should be written to them, but 0’s are not guaranteed when they are read. *Default field values are marked by an asterisk. A hardware reset forces the default values. 40 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 00h Deactivate (Standby State) Command D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 0 0 In the Deactivate (Standby) state: All programmed information is retained. The Microprocessor Interface (MPI) remains active. The PCM inputs are disabled and the PCM outputs are high impedance unless signaling on the PCM high way is programmed (SMODE = 1). The analog output (VOUT) is disabled and biased at VREF. The channel status (CSTAT) bit in the SLIC device I/O Direction and Channel Status Register is set to 0. 02h Software Reset Command D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 1 0 The action of this command is identical to that of the RST pin except that it only operates on the channels selected by the Channel Enable Register and it does not change clock slots, time slots, PCM highways ground key sampling interval, or global chip parameters. See the note under the hardware reset command that follows. 04h Hardware Reset Command D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 1 0 0 Hardware reset is equivalent to pulling the RST on the device Low. This command does not depend on the state of the Channel Enable Register. Note: The action of a hardware reset is described in Reset States on page 32 of the section Operating the QLSLAC Device. 06h No Operation Command D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 1 1 0 0Eh Activate Channel (Operational State) Command D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 1 1 1 0 This command places the device in the Active state and sets CSTAT = 1. No valid PCM data is transmitted until after the third FS pulse is received following the execution of the Activate command. 41 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 40/41h Write/Read Transmit Time Slot and PCM Highway Selection R/W = 0: Write R/W = 1: Read Command I/O Data Transmit PCM Highway TPCM = 0* TPCM = 1 D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 0 0 0 R/W TPCM TTS6 TTS5 TTS4 TTS3 TTS2 TTS1 TTS0 Transmit on Highway A (see TAB in Command 44/45h) Transmit on Highway B (see TAB in Command 44/45h) Transmit Time Slot TTS = 0–127 Time Slot Number (TTS0 is LSB, TTS6 is MSB) PCM Highway B is not available on the Le58QL021/031 QLSLAC devices. * Power Up and Hardware Reset (RST) Value = 00h, 01h, 02h, 03h for Channels 1, 2, 3, and 4, respectively. 42/43h Write/Read Receive Time Slot and PCM Highway Selection R/W = 0: Write R/W = 1: Read Command I/O Data Receive PCM Highway RPCM = 0* RPCM = 1 D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 0 0 1 R/W RPCM RTS6 RTS5 RTS4 RTS3 RTS2 RTS1 RTS0 Receive on Highway A Receive on Highway B Receive Time Slot RTS = 0–127 Time Slot Number (RTS0 is LSB, RTS6 is MSB) PCM Highway B is not available on the Le58QL021 and the Le58QL031 QLSLAC devices. * Power Up and Hardware Reset (RST) Value = 00h, 01h, 02h, 03h for channels 1, 2, 3, and 4, respectively. 44/45h Write/Read Transmit Clock Slot, Receive Clock Slot, and Transmit Clock Edge R/W = 0: Write R/W = 1: Read Command I/O Data Transmit on A and B TAB = 0* TAB = 1 D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 0 1 0 R/W TAB XE RCS2 RCS1 RCS0 TCS2 TCS1 TCS0 Transmit data on highway selected by TPCM (See Command 40/41h on page 42). Transmit data on both highways A and B Transmit Edge XE = 0* XE = 1 Transmit changes on negative edge of PCLK Transmit changes on positive edge of PCLK RCS = 0*–7 Receive Clock Slot number Receive Clock Slot Transmit Clock Slot TCS = 0*–7 Transmit Clock Slot number The XE bit and the clock slots apply to all four channels; however, they cannot be written or read unless at least one channel is selected in the Channel Enable Register. * Power Up and Hardware Reset (RST) Value = 00h. 42 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 46/47h Write/Read Chip Configuration Register R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 0 1 1 R/W INTM CHP SMODE CMODE CSEL3 CSEL2 CSEL1 CSEL0 Interrupt Mode INTM = 0 INTM = 1* TTL-compatible output Open drain output Chopper Clock Control CHP = 0* CHP = 1 Chopper Clock is 256 kHz (2048/8 kHz) Chopper Clock is 292.57 kHz (2048/7 kHz) PCM Signaling Mode SMODE = 0* SMODE = 1 No signaling on PCM highway Signaling on PCM highway Clock Source Mode CMODE = 0 CMODE = 1* MCLK used as master clock; no E1 multiplexing allowed PCLK used as master clock; E1 multiplexing allowed if enabled in commands C8/C9h. The master clock frequency can be selected by CSEL. The master clock frequency selection affects all channels. Master Clock Frequency CSEL = 0000 1.536 MHz CSEL = 0001 1.544 MHz CSEL = 0010 2.048 MHz CSEL = 0011 Reserved CSEL = 01xx Two times frequency specified above (2 x 1.536 MHz, 2 x 1.544 MHz, or 2 x 2.048 MHz) CSEL = 10xx Four times frequency specified above (4 x 1.536 MHz, 4 x 1.544 MHz, or 4 x 2.048 MHz) CSEL = 11xx Reserved CSEL = 1010* 8.192 MHz is the default These commands do not depend on the state of the Channel Enable Register. * Power Up and Hardware Reset (RST) Value = 9Ah. 43 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 4A/4Bh Write/Read Channel Enable and Operating Mode Register R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 1 0 1 R/W RSVD RBE VMODE LPM EC4 EC3 EC2 EC1 RSVD Reserved for future use. Always write as 0, but 0 is not guaranteed when read. RBE = 0* RBE = 1 Robbed-bit Signaling mode is disabled. Robbed-bit Signaling mode is enabled on PCM receiver if µ-law is selected. VMODE = 0* VMODE = 1 VOUT = VREF through a resistor when channel is deactivated VOUT high impedance when channel is deactivated. LPM LPM reduced the power in the QSLAC device, but it is not needed and not used in the QLSLAC device EC4 = 0 EC4 = 1* Disabled, channel 4 cannot receive commands Enabled, channel 4 can receive commands EC3 = 0 EC3 = 1* Disabled, channel 3 cannot receive commands Enabled, channel 3 can receive commands EC2 = 0 EC2 = 1* Disabled, channel 2 cannot receive commands Enabled, channel 2 can receive commands EC1 = 0 EC1 = 1* Disabled, channel 1 cannot receive commands Enabled, channel 1 can receive commands Robbed-bit Mode VOUT Mode Low Power Mode Channel Enable 4 Channel Enable 3 Channel Enable 2 Channel Enable 1 * Power Up and Hardware Reset (RST) Value = 0Fh. 4D/4Fh Read Real-Time Data Register C = 0: Do not clear interrupt C = 1: Clear interrupt This register reads real-time data with or without clearing the interrupt. Command Output Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 1 1 C 1 CDB4 CDA4 CDB3 CDA3 CDB2 CDA2 CDB1 CDA1 Real Time Data CDA1 CDB1 CDA2 CDB2 CDA3 CDB3 CDA4 CDB4 Debounced data bit 1 on channel 1 Data bit 2 or multiplexed data bit 1 on channel 1 Debounced data bit 1 on channel 2 Data bit 2 or multiplexed data bit 1 on channel 2 Debounced data bit 1 on channel 3 Data bit 2 or multiplexed data bit 1 on channel 3 Debounced data bit 1 on channel 4 Data bit 2 or multiplexed data bit 1 on channel 4 This command does not depend on the state of the Channel Enable Register. 44 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 50/51h Write/Read AISN and Analog Gains R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 1 0 0 0 R/W DGIN AX AR AISN4 AISN3 AISN2 AISN1 AISN0 Disable Input Attenuator (GIN) DGIN = 0* DGIN = 1 Input attenuator on Input attenuator off Transmit Analog Gain AX = 0* AX = 1 0 dB gain 6.02 dB gain Receive Analog Loss AR = 0* AR = 1 0 dB loss 6.02 dB loss AISN coefficient AISN = 0* – 31 See below (Default value = 0) The Impedance Scaling Network (AISN) gain can be varied from −0.9375 • GIN to +0.9375 • GIN in multiples of 0.0625 • GIN. The gain coefficient is decoded using the following equation: h AISN = 0.0625 • GIN [ ( 16 • AISN4 + 8 • AISN3 + 4 • AISN2 + 2 • AISN1 + AISN0 ) – 16 ] where hAISN is the gain of the AISN. A value of AISN = 10000 turns on the Full Digital Loopback mode and a value of AISN = 0000* indicates a gain of 0 (cutoff). * Power Up and Hardware Reset (RST) Value = 00h. 52/53h Write/Read SLIC Device Input/Output Register R/W = 0: Write R/W = 1: Read Command I/O Data RSVD D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 1 0 0 1 R/W RSVD RSVD CD1B C5 C4 C3 CD2 CD1 Reserved for future use. Always write as 0, but 0 is not guaranteed when read. Pins CD1, CD2, and C3 through C5 are set to 1 or 0. The data appears latched on the CD1, CD2, and C3 through C5 SLIC device I/O pins, provided they were set in the Output mode (see Command 54/55h on page page 45). The data sent to any of the pins set to the Input mode is latched, but does not appear at the pins. The CD1B bit is only valid if the E1 Multiplex mode is enabled (EE1 = 1). * Power Up and Hardware Reset (RST) Value = 00h 54/55h Write/Read SLIC Input/Output Direction, Read Status Bits R/W = 0: Write R/W = 1: Read RSVD D7 D6 D5 D4 D3 D2 D1 D0 Command 0 1 0 1 0 1 0 R/W Input Data RSVD CSTAT CFAIL IOD5 IOD4 IOD3 IOD2 IOD1 Reserved for future use. Always write as 0, but 0 is not guaranteed when read. 45 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Channel Status (Read status only, write as 0) CSTAT = 0 Channel is inactive (Standby state). CSTAT = 1 Channel is active. Clock Fail (Read status only, write as 0) CFAIL* = 0 The internal clock is synchronized to frame synch. CFAIL = 1 The internal clock is not synchronized to frame synch. * The CFAIL bit is independent of the Channel Enable Register. I/O Direction (Read/Write) IOD5 = 0* IOD5 = 1 IOD4 = 0* IOD4 = 1 IOD3 = 0* IOD3 = 1 IOD2 = 0* IOD2 = 1 IOD1 = 0* IOD1 = 1 C5 is an input C5 is an output C4 is an input C4 is an output C3 is an input C3 is an output CD2 is an input CD2 is an output CD1 is an input CD1 is an output Pins CD1, CD2, and C3 through C5 are set to Input or Output modes individually. Pins C3–C5 are not available on the Le58QL031 QLSLAC device, and C5 is available only on the Le58QL021 QLSLAC device. * Power Up and Hardware Reset (RST) Value = 00h 60/61h Write/Read Operating Functions R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 0 0 0 0 R/W C/L A/µ EGR EGX EX ER EZ EB Linear Code C/L = 0* C/L = 1 Compressed coding Linear coding A/µ = 0* A/µ = 1 A-law coding µ-law coding EGR = 0* EGR = 1 Default GR filter enabled Programmed GR filter enabled EGX = 0* EGX = 1 Default GX filter enabled Programmed GX filter enabled EX = 0* EX = 1 Default X filter enabled Programmed X filter enabled ER = 0* ER = 1 Default R filter enabled Programmed R filter enabled EZ = 0* EZ = 1 Default Z filter enabled Programmed Z filter enabled EB = 0* EB = 1 Default B filter enabled Programmed B filter enabled A-law or µ-law GR Filter GX Filter X Filter R Filter Z Filter B Filter * Power Up and Hardware Reset (RST) Value = 00h. 46 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 6C/6Dh Write/Read Interrupt Mask Register R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 0 1 1 0 R/W MCDB4 MCDA4 MCDB3 MCDA3 MCDB2 MCDA2 MCDB1 MCDA1 Mask CD Interrupt CDxC bit is NOT MASKED MCDxC = 0 MCDxC = 1* CDxC bit is MASKED x Bit number (A or B) C Channel number (1 through 4) Masked: A change does not cause the Interrupt Pin to go Low. This command does not depend on the state of the Channel Enable Register. * Power Up and Hardware Reset (RST) Value = FFh. 70/71h Write/Read Operating Conditions R/W = 0: Write R/W = 1: Read Command I/O Data Cutoff Transmit Path CTP = 0* CTP = 1 D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 1 0 0 0 R/W CTP CRP HPF LRG ATI ILB FDL TON Transmit path connected Transmit path cut off Cutoff Receive Path CRP = 0* CRP = 1 Receive path connected Receive path cutoff (see note) HPF = 0* HPF = 1 Transmit Highpass filter enabled Transmit Highpass filter disabled LRG = 0* LRG = 1 6 dB loss not inserted 6 dB loss inserted High Pass Filter Lower Receive Gain Arm Transmit Interrupt ATI = 0* ATI = 1 Transmit Interrupt not Armed Transmit Interrupt Armed Interface Loopback ILB = 0* ILB = 1 Full Digital Loopback FDL = 0* FDL = 1 TSA loopback disabled TSA loopback enabled Full digital loopback disabled Full digital loopback enabled 1 kHz Receive Tone TON = 0* TON = 1 1 kHz receive tone off 1 kHz receive tone on * Power Up and Hardware Reset (RST) Value = 00h. The B Filter is disabled during receive cutoff. 47 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 73h Read Revision Code Number (RCN) Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 1 0 0 1 1 RCN7 RCN6 RCN5 RCN4 RCN3 RCN2 RCN1 RCN0 This command returns an 8-bit number (RCN) describing the revision number of the QLSLAC device. The revision code of the QLSLAC device will be 14h or higher. This command does not depend on the state of the Channel Enable Register. 80/81h Write/Read GX Filter Coefficients R/W = 0: Write R/W = 1: Read Command D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 R/W I/O Data Byte 1 C40 m40 C30 m30 I/O Data Byte 2 C20 m20 C10 m10 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The coefficient for the GX filter is defined as: H GX = 1 + ( C10 • 2 – m10 { 1 + C20 • 2 – m20 [ 1 + C30 • 2 – m30 ( 1 + C40 • 2 – m40 ) ]} Power Up and Hardware Reset (RST) Values = A9F0 (Hex) (HGX = 1.995 (6 dB)). Note: The default value is contained in a ROM register separate from the programmable coefficient RAM. There is a filter enable bit in Operating Functions Register to switch between the default and programmed values. 82/83h Write/Read GR Filter Coefficients R/W = 0: Write R/W = 1: Read Command: D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 1 R/W I/O Data Byte 1 C40 m40 C30 m30 I/O Data Byte 2 C20 m20 C10 m10 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The coefficient for the GR filter is defined as: H GR = C10 • 2 – m10 { 1 + C20 • 2 – m20 [ 1 + C30 • 2 – m30 ( 1 + C40 • 2 – m40 Power Up and Hardware Reset (RST) Values = 23A1 (Hex) (HGR = 0.35547 (–8.984 dB)). See note under Command 80/81h, above. 48 Zarlink Semiconductor Inc. )]} Le58QL02/021/031 Data Sheet 84/85h Write/Read Z Filter Coefficients (FIR and IIR) R/W = 0: Write R/W = 1: Read This command writes and reads both the FIR and IIR filter sections simultaneously. D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 1 0 R/W Command I/O Data Byte 1 C40 m40 C30 m30 I/O Data Byte 2 C20 m20 C10 m10 I/O Data Byte 3 C41 m41 C31 m31 I/O Data Byte 4 C21 m21 C11 m11 I/O Data Byte 5 C42 m42 C32 m32 I/O Data Byte 6 C22 m22 C12 m12 I/O Data Byte 7 C43 m43 C33 m33 I/O Data Byte 8 C23 m23 C13 m13 I/O Data Byte 9 C44 m44 C34 m34 I/O Data Byte 10 C24 m24 C14 m14 I/O Data Byte 11 C45 m45 C35 m35 I/O Data Byte 12 C25 m25 C15 m15 I/O Data Byte 13 C26 m26 C16 m16 I/O Data Byte 14 C47 m47 C37 m37 I/O Data Byte 15 C27 m27 C17 m17 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. –1 The Z-transform equation for the Z filter is defined as: H z ( z ) = z 0 + z 1 • z –1 + z2 • z –2 + z3 • z –3 + z4 • z –4 z5 • z6 • z7 • z + ------------------------------------------–1 1 – z7 • z Sample rate = 32 kHz For i = 0 to 5 and 7 z i = C1i • 2 – m1i { 1 + C2i • 2 z 6 = C16 • 2 – m16 – m2i [ 1 + C3i • 2 { 1 + C26 • 2 – m26 – m3i ( 1 + C4i • 2 – m4i )]} } Power Up and Hardware Reset (RST) Values = 0190 0190 0190 0190 0190 0190 01 0190 (Hex) (Hz(z) = 0) See note under Command 80/81h on page 48. Note: Z6 is used for IIR filter scaling only. Its value is typically greater than zero but less than or equal to one. The input to the IIR filter section is first increased by a gain of 1/Z6, improving dynamic range and avoiding truncation limitations through processing within this filter. The IIR filter output is then multiplied by Z6 to normalize the overall gain. Z5 is the actual IIR filter gain value defined by the programmed coefficients, but it also includes the initial 1/Z6 gain. The theoretical effective IIR gain, without the Z6 gain and normalization, is actually Z5/Z6. 49 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 86/87h Write/Read B1 Filter Coefficients R/W = 0: Write R/W = 1: Read D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 1 1 R/W Command I/O Input Data Byte 1 C32 m32 C22 m22 I/O Input Data Byte 2 C12 m12 C33 m33 I/O Input Data Byte 3 C23 m23 C13 m13 I/O Input Data Byte 4 C34 m34 C24 m24 I/O Input Data Byte 5 C14 m14 C35 m35 I/O Input Data Byte 6 C25 m25 C15 m15 I/O Input Data Byte 7 C36 m36 C26 m26 I/O Input Data Byte 8 C16 m16 C37 m37 I/O Input Data Byte 9 C27 m27 C17 m17 I/O Input Data Byte 10 C38 m38 C28 m28 I/O Input Data Byte 11 C18 m18 C39 m39 I/O Input Data Byte 12 C29 m29 C19 m19 I/O Input Data Byte 13 C310 m310 C210 m210 I/O Input Data Byte 14 C110 m110 RSVD RSVD Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The Z-transform equation for the B filter is defined as: – 10 HB ( z ) = B2 • z –2 + … + B9 • z –9 B 10 • z + -------------------------------–1 1 – B 11 • z Sample rate = 16 kHz The coefficients for the FIR B section and the gain of the IIR B section are defined as: For i = 2 to 10, B i = C1i • 2 – mli [ 1 + C2i • 2 – m2i ( 1 + C3i • 2 – m3i )] The feedback coefficient of the IIR B section is defined as – m111 – m211 – m311 B = C111 • 2 { 1 + C211 • 2 [ 1 + C311 • 2 ( 1 + C411 • 2 : 11 Refer to Command 96/97h for programming of the B11 coefficients. Power Up and Hardware Reset (RST) Values = 09 00 90 09 00 90 09 00 90 09 00 90 09 00 (Hex) HB ( z ) = 0 See note under Command 80/81h on page 48. RSVD Reserved for future use. Always write as 0, but 0 is not guaranteed when read. 50 Zarlink Semiconductor Inc. – m411 )]} Le58QL02/021/031 Data Sheet 88/89h Write/Read X Filter Coefficients R/W = 0: Write R/W = 1: Read Command D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 1 0 0 R/W I/O Input Data Byte 1 C40 m40 C30 m30 I/O Input Data Byte 2 C20 m20 C10 m10 I/O Input Data Byte 3 C41 m41 C31 m31 I/O Input Data Byte 4 C21 m21 C11 m11 I/O Input Data Byte 5 C42 m42 C32 m32 I/O Input Data Byte 6 C22 m22 C12 m12 I/O Input Data Byte 7 C43 m43 C33 m33 I/O Input Data Byte 8 C23 m23 C13 m13 I/O Input Data Byte 9 C44 m44 C34 m34 I/O Input Data Byte 10 C24 m24 C14 m14 I/O Input Data Byte 11 C45 m45 C35 m35 I/O Input Data Byte 12 C25 m25 C15 m15 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The Z-transform equation for the X filter is defined as: Hx ( z ) = x0 + x1 z –1 + x2 z –2 + x3 z –3 + x4 z –4 + x5 z –5 Sample rate = 16 kHz For i = 0 to 5, the coefficients for the X filter are defined as: Xi = C1i • 2 – m1i { 1 + C2i • 2 – m2i [ 1 + C3i • 2 – m3i ( 1 + C4i • 2 Power Up and Hardware Reset (RST) Values = 0111 0190 0190 0190 0190 0190 (Hex) (Hx(z) = 1) See note under Command 80/81h on page 48. 51 Zarlink Semiconductor Inc. – m4i )]} Le58QL02/021/031 Data Sheet 8A/8Bh Write/Read R Filter Coefficients R/W = 0: Write R/W = 1: Read Command D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 1 0 1 R/W I/O Input Data Byte 1 C46 m46 C36 m36 I/O Input Data Byte 2 C26 m26 C16 m16 I/O Input Data Byte 3 C40 m40 C30 m30 I/O Input Data Byte 4 C20 m20 C10 m10 I/O Input Data Byte 5 C41 m41 C31 m31 I/O Input Data Byte 6 C21 m21 C11 m11 I/O Input Data Byte 7 C42 m42 C32 m32 I/O Input Data Byte 8 C22 m22 C12 m12 I/O Input Data Byte 9 C43 m43 C33 m33 I/O Input Data Byte 10 C23 m23 C13 m13 I/O Input Data Byte 11 C44 m44 C34 m34 I/O Input Data Byte 12 C24 m24 C14 m14 I/O Input Data Byte 13 C45 m45 C35 m35 I/O Input Data Byte 14 C25 m25 C15 m15 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. HR = H IIR • H FIR The Z-transform equation for the IIR filter is defined as: –1 1–z H IIR = -----------------------------------–1 1 – ⎛⎝ R 6 • z ⎞⎠ Sample rate = 8 kHz The coefficient for the IIR filter is defined as: R 6 = C16 • 2 – ml6 { 1 + C26 • 2 – m26 [ 1 + C36 • 2 – m36 ( 1 + C46 • 2 – m46 The Z-transform equation for the FIR filter is defined as: H FIR ( z ) = R 0 + R 1 z –1 + R2 z –2 + R3 z –3 + R4 z –4 + R5 z –5 Sample rate = 16 kHz For i = 0 to 5, the coefficients for the R2 filter are defined as: R i = C1i • 2 – m1i { 1 + C2i • 2 – m2i [ 1 + C3i • 2 – m3i ( 1 + C4i • 2 Power Up and Hardware Reset (RST) Values = 2E01 0111 0190 0190 0190 0190 0190 (Hex) (HFIR (z) = 1, R6 = 0.9902) See note under Command 80/81h on page 48. 52 Zarlink Semiconductor Inc. – m4i )]} )]} Le58QL02/021/031 Data Sheet 96/97h Write/Read B2 Filter Coefficients (IIR) R/W = 0: Write R/W = 1: Read D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 1 0 1 1 R/W Command I/O Data Byte 1 C411 m411 C311 m311 I/O Data Byte 2 C211 m211 C111 m111 This function is described in Write/Read B1 Filter Coefficients (FIR) on page 50. Power Up and Hardware Reset (RST) Values = 0190 (Hex) (B11 = 0) See note under Command 80/81h on page 48. 98/99h Write/Read FIR Z Filter Coefficients (FIR only) R/W = 0: Write R/W = 1: Read This command writes and reads only the FIR filter section without affecting the IIR. D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 1 1 0 0 R/W Command I/O Data Byte 1 C40 m40 C30 m30 I/O Data Byte 2 C20 m20 C10 m10 I/O Data Byte 3 C41 m41 C31 m31 I/O Data Byte 4 C21 m21 C11 m11 I/O Data Byte 5 C42 m42 C32 m32 I/O Data Byte 6 C22 m22 C12 m12 I/O Data Byte 7 C43 m43 C33 m33 I/O Data Byte 8 C23 m23 C13 m13 I/O Data Byte 9 C44 m44 C34 m34 I/O Data Byte 10 C24 m24 C14 m14 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The Z-transform equation for the Z filter is defined as: –1 Hz ( z ) = z0 + z1 • z –1 + z2 • z –2 + z3 • z –3 + z4 • z –4 z5 • z6 • z7 • z + ------------------------------------------–1 1 – z7 • z Sample rate = 32 kHz For i = 0 to 5 and 7 z i = C1i • 2 – m1i z 6 = C16 • 2 { 1 + C2i • 2 – m16 – m2i { 1 + C26 • 2 [ 1 + C3i • 2 – m26 – m3i ( 1 + C4i • 2 – m4i ) ]} } Power Up and Hardware Reset (RST) Values = 0190 0190 0190 0190 0190 0190 01 0190 (Hex) (Hz(z) = 0) See note under Command 80/81h on page 48. Note: Z6 is used for IIR filter scaling only. Its value is typically greater than zero but less than or equal to one. The input to the IIR filter section is first increased by a gain of 1/Z6, improving dynamic range and avoiding truncation limitations through processing within this filter. The IIR filter output 53 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet is then multiplied by Z6 to normalize the overall gain. Z5 is the actual IIR filter gain value defined by the programmed coefficients, but it also includes the initial 1/Z6 gain. The theoretical effective IIR gain, without the Z6 gain and normalization, is actually Z5/Z6. 9A/9Bh Write/Read IIR Z Filter Coefficients (IIR only) R/W = 0: Write R/W = 1: Read This command writes/reads the IIR filter section only, without affecting the FIR. D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 1 1 0 1 R/W Command I/O Data Byte 1 C45 m45 C35 m35 I/O Data Byte 2 C25 m25 C15 m15 I/O Data Byte 3 C26 m26 C16 m16 I/O Data Byte 4 C47 m47 C37 m37 I/O Data Byte 5 C27 m27 C17 m17 Cxy = 0 or 1 in the command above corresponds to Cxy = +1 or −1, respectively, in the equation below. The Z-transform equation for the Z filter is defined as: –1 Hz ( z ) = z0 + z1 • z –1 + z2 • z –2 + z3 • z –3 + z4 • z –4 z5 • z6 • z7 • z + ------------------------------------------–1 1 – z7 • z Sample rate = 32 kHz For i = 0 to 5 and 7 z i = C1i • 2 – m1i z 6 = C16 • 2 { 1 + C2i • 2 – m16 – m2i { 1 + C26 • 2 [ 1 + C3i • 2 – m26 – m3i ( 1 + C4i • 2 – m4i )]} } Power Up and Hardware Reset (RST) Values = 0190 0190 0190 0190 0190 0190 01 0190 (Hex) (Hz(z) = 0) See note under Command 80/81h on page 48. Note: Z6 is used for IIR filter scaling only. Its value is typically greater than zero but less than or equal to one. The input to the IIR filter section is first increased by a gain of 1/Z6, improving dynamic range and avoiding truncation limitations through processing within this filter. The IIR filter output is then multiplied by Z6 to normalize the overall gain. Z5 is the actual IIR filter gain value defined by the programmed coefficients, but it also includes the initial 1/Z6 gain. The theoretical effective IIR gain, without the Z6 gain and normalization, is actually Z5/Z6. C8/C9h Write/Read Debounce Time Register This command applies to all channels and does not depend on the state of the Channel Enable Register. R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 1 0 0 R/W EE1 E1P DSH3 DSH2 DSH1 DSH0 RSVD ECH Enable E1 EE1 = 0* EE1 = 1 E1 multiplexing turned off E1 multiplexing turned on E1P = 0* E1P = 1 E1 is a high-going pulse E1 is a low-going pulse E1 Polarity 54 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet There is no E1 output unless CMODE = 1. Debounce for hook switch DSH = 0–15 Debounce period in ms DSH contains the debouncing time (in ms) of the CD1 data (usually hook switch) entering the Real Time Data register described earlier. The input data must remain stable for the debouncing time in order to change the appropriate real time bit. Default = 8 ms RSVD Reserved for future use. Always write as 0, but 0 is not guaranteed when read. Enable Chopper ECH = 0* ECH = 1 Chopper output (CHCLK) turned off Chopper output (CHCLK) turned on * Power Up and Hardware Reset (RST) Value = 20h. CDh Read Transmit PCM Data D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 1 1 0 1 Output Data Byte 1 XDAT7 XDAT6 XDAT5 XDAT4 XDAT3 XDAT2 XDAT1 XDAT0 Output Data Byte 2 RSVD RSVD RSVD RSVD RSVD RSVD RSVD RSVD Command RSVD Reserved for future use. Always write as 0, but 0 is not guaranteed when read. Upper Transmit Data XDAT contains A-law or µ-law transmit data in Companded mode. XDAT contains upper data byte in Linear mode with sign in XDAT7. E8/E9h Write/Read Ground Key Filter R/W = 0: Write R/W = 1: Read Command I/O Data D7 D6 D5 D4 D3 D2 D1 D0 1 1 1 0 1 0 0 R/W RSVD RSVD RSVD RSVD GK3 GK2 GK1 GK0 Filter Ground Key GK = 0–15 Filter sampling period in 1 ms GK contains the filter sampling time (in ms) of the CD1B data (usually Ground Key) or CD2 entering the Real Time Data register described earlier. A value of 0 disables the Ground Key filter for that particular channel. Power Up and Hardware Reset (RST) Value = x0h. RSVD Reserved for future use. Always write as 0, but 0 is not guaranteed when read. 55 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet PROGRAMMABLE FILTERS General Description of CSD Coefficients The filter functions are performed by a series of multiplications and accumulations. A multiplication occurs by repeatedly shifting the multiplicand and summing the result with the previous value at that summation node. The method used in the QLSLAC device is known as Canonic Signed Digit (CSD) multiplication and splits each coefficient into a series of CSD coefficients. Each programmable FIR filter section has the following general transfer function: HF ( z ) = h 0 + h 1 z –1 + h2 z –2 + … + hn z –n Equation 1 where the number of taps in the filter = n + 1. The transfer function for the IIR part of Z and B filters: 1 HI ( z ) = ----------------------------------–1 1 – h( n + 1 ) z Equation 2 The transfer function of the IIR part of the R filter is: –1 1–z HI ( z ) = ----------------------------------–1 1 – h( n + 1 ) z Equation 3 The values of the user-defined coefficients (hi) are assigned via the MPI. Each of the coefficients (hi) is defined in the following general equation: hi = B1 2 – M1 + B2 2 – M2 + … + BN 2 – MN Equation 4 where: Mi = the number of shifts = Mi ≤ Mi + 1 Bi = sign = ±1 N = number of CSD coefficients. hi in Equation 4 represents a decimal number, broken down into a sum of successive values of: 1) ±1.0 multiplied by 2–0, or 2–1, or 2–2 … 2–7 … 2) ±1.0 multiplied by 1, or 1/2, or 1/4 … 1/128 … The limit on the negative powers of 2 is determined by the length of the registers in the ALU. The coefficient hi in Equation 4 is a value made up of N binary 1s in a binary register where the left part represents whole numbers, the right part decimal fractions, and a decimal point separates them. The first binary 1 is shifted M1 bits to the right of the decimal point; the second binary 1 is shifted M2 bits to the right of the decimal point; the third binary 1 is shifted M3 bits to the right of the decimal point, and so on. When M1 is 0, the value is a binary 1 in front of the decimal point, that is, no shift. If M2 is also 0, the result is another binary 1 in front of the decimal point, giving a total value of binary 10 in front of the decimal point (i.e., a decimal value of 2.0). The value of N, therefore, determines the range of values the coefficient hi can take (e.g., if N = 3 the maximum and minimum values are ±3, and if N = 4 the values are between ±4). Detailed Description of QLSLAC Device Coefficients The CSD coding scheme in the QLSLAC device uses a value called mi, where m1 represents the distance shifted right of the decimal point for the first binary 1. m2 represents the distance shifted to the right of the previous binary 1, and m3 represents the number of shifts to the right of the second binary 1. Note that the range of values determined by N is unchanged. Equation 4 is now modified (in the case of N = 4) to: hi = B1 2 – m1 h i = C1 • 2 + B2 2 – m1 – m2 + B3 2 – m3 + C1 • C 2 • 2 + B4 2 – ( m1 + m2 ) – m4 Equation 5 + C1 • C 2 • C 3 • 2 – ( m1 + m2 + m3 ) + C1 • C2 • C3 • C4 • 2 – ( m1 + m2 + m3 + m4 Equation 6 h i = C1 • 2 – m1 { 1 + C2 • 2 – m2 [ 1 + C3 • 2 – m3 ( 1 + C4 • 2 – m4 )]} where: M1 = m1 M2 = m1 + m2 B1 = C1 B2 = C1 • C2 56 Zarlink Semiconductor Inc. Equation 7 Le58QL02/021/031 M3 = m1 + m2 + m3 M4 = m1 + m2 + m3 + m4 Data Sheet B3 = C1 • C2 • C3 B4 = C1 • C2 • C3 • C4 In the QLSLAC device, a coefficient, hi, consists of N CSD coefficients, each being made up of 4 bits and formatted as Cxymxy, where Cxy is 1 bit (MSB) and mxy is 3 bits. Each CSD coefficient is broken down as follows: Cxy is the sign bit (0 = positive, 1 = negative). mxy is the 3-bit shift code. It is encoded as a binary number as follows: 000: 0 shifts 001: 1 shifts 010: 2 shifts 011: 3 shifts 100: 4 shifts 101: 5 shifts 110: 6 shifts 111: 7 shifts y is the coefficient number (the i in hi). x is the position of this CSD coefficient within the hi coefficient. The most significant binary 1 is represented by x = 1. The next most significant binary 1 is represented by x = 2, and so on. Thus, C13 m13 represents the sign and the relative shift position for the first (most significant) binary 1 in the 4th (h3) coefficient. The number of CSD coefficients, N, is limited to 4 in the GR, GX, R, X, and Z filters; 4 in the IIR part of the B filter; 3 in the FIR part of the B filter; and 2 in the post-gain factor of the Z-IIR filter. The GX filter coefficient equation is slightly different from the other filters. h iGX = 1 + h i Equation 8 Please refer to the Summary of MPI Commands on page 40 for complete details on programming the coefficients. User Test States and Operating Conditions The QLSLAC device supports testing by providing test states and special operating conditions as shown in Figure 21 (see Operating Conditions register). Cutoff Transmit Path (CTP): When CTP = 1, DX and TSC are High impedance and the transmit time slot does not exist. This state takes precedence over the TSA Loopback (TLB) and Full Digital Loopback (FDL) states. Cutoff Receive Path (CRP): When CRP = 1, the receive signal is forced to 0 just ahead of the low pass filter (LPF) block. This state also blocks Full Digital Loopback (FDL), the 1 kHz receive tone, and the B-filter path. High Pass Filter Disable (HPF): When HPF = 1, all of the High pass and notch filters in the transmit path are disabled. Lower Receive Gain (LRG): When LRG = 1, an extra 6.02 dB of loss is inserted into the receive path. Arm Transmit Interrupt (ATI) and Read Transmit PCM Data: The read transmit PCM data command, Command CDh, can be used to read transmit PCM data through the microprocessor interface. If the ATI bit is set, an interrupt will be generated whenever new transmit data appears in the channel and will be cleared when the data is read. When combined with Tone Generation and Loopback states, this allows the microprocessor to test channel integrity. TSA Loopback (TLB): When TLB = 1, data from the TSA receive path is looped back to the TSA transmit path. Any other data in the transmit path is overwritten. Full Digital Loopback (FDL): When FDL = 1, the VOUT output is turned off and the analog output voltage is routed to the input of the transmit path, replacing the voltage from VIN. The AISN path is temporarily turned off. This test mode can also be entered by writing the code 10000 into the AISN register. 1 kHz Receive Tone (TON): When TON = 1, a 1 kHz digital mW is injected into the receive path, replacing any receive signal from the TSA. A-Law and µ-Law Companding Table Table 7 and Table Table 8 show the companding definitions used for A-law and µ-law PCM encoding. 57 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Table 7. A-Law: Positive Input Values 1 Segment Number 2 3 # Intervals Value at x Interval Segment Size End Points 4 Decision Value Number n 5 6 7 Character Signal pre Quantized Decision Inversion of Value (at Even Bits Value xn Decoder (See Note 1) Output) yn Bit No. 8 Decoder Output Value No. 12345678 4096 7 (128) (4096) 127 3968 113 2176 112 2048 11111111 16 x 128 4032 128 2112 113 1056 97 528 81 264 65 132 49 66 33 1 1 See Note 2 2048 11110000 See Note 2 6 16 x 64 1024 97 1088 96 1024 11100000 See Note 2 5 16 x 32 512 81 544 80 512 11010000 See Note 2 4 16 x 16 256 65 272 64 256 11000000 See Note 2 3 16 x 8 128 49 136 48 128 10110000 See Note 2 2 16 x 4 64 33 68 32 64 10100000 See Note 2 1 32 x 2 1 2 0 0 10000000 Notes: 1. 4096 normalized value units correspond to TMAX = 3.14 dBm0. 2. The character signals are obtained by inverting the even bits of the signals of column 6. Before this inversion, the character signal corresponding to positive input values between two successive decision values numbered n and n+1 (see column 4) is 128+n, expressed as a binary number. 3. The value at the decoder output is y n = ------------------------- , for n = 1,...127, 128. 4. x128 is a virtual decision value. 5. Bit 1 is a 0 for negative input values. xn – 1 + xn 2 58 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet Table 8. µ-Law: Positive Input Values 1 Segment Number 2 3 # Intervals Value at x Interval Segment Size End Points 4 5 Decision Value Number n 6 7 Character Signal pre Quantized Decision Inversion of Value (at Even Bits Value xn Decoder (See Note 1) Output) yn Bit No. 8 Decoder Output Value No. 12345678 8159 8 (128) (8159) 127 7903 113 4319 112 4063 10000000 8031 127 4191 112 2079 96 1023 80 495 64 231 48 99 32 33 16 11111110 2 1 11111111 0 0 16 x 256 See Note 2 4063 10001111 See Note 2 7 16 x 128 2015 97 2143 96 2015 10011111 See Note 2 6 16 x 64 991 81 1055 80 991 10101111 See Note 2 5 16 x 32 479 65 511 64 479 10111111 See Note 2 4 16 x 16 223 49 239 48 223 11001111 See Note 2 3 16 x 8 95 33 103 32 95 11011111 See Note 2 2 16 x 4 31 17 35 16 31 11101111 See Note 2 1 15 x 2 2 3 1 1 0 0 1x1 Notes: 1. 8159 normalized value units correspond to TMAX = 3.17 dBm0. 2. The character signal corresponding to positive input values between two successive decision values numbered n and n+1 (see column 4) is 255-n, expressed as a binary number. 3. The value at the decoder is y0 = x0 = 0 for n = 0, and y n = ------------------------- , for n = 1, 2,...127. 2 4. x128 is a virtual decision value. 5. Bit 1 is a 0 for negative input values. xn + 1 + xn 59 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet APPLICATIONS The QLSLAC device performs a programmable codec/filter function for four telephone lines. It interfaces to the telephone lines through a Legerity SLIC device or a transformer with external buffering. The QLSLAC device provides latched digital I/O to control and monitor four SLIC devices and provides access to time-critical information, such as off/on-hook and ring trip, for all four channels via a single read operation. When various country or transmission requirements must be met, the QLSLAC device enables a single SLIC device design for multiple applications. The line characteristics (such as apparent impedance, attenuation, and hybrid balance) can be modified by programming each QLSLAC device channel’s coefficients to meet desired performance. The QLSLAC device may require an external buffer to drive transformer SLIC devices. Connection to a PCM back plane is implemented by means of a simple buffer chip. Several QLSLAC devices can be tied together in one bus interfacing the back plane through a single buffer. An intelligent bus interface chip is not required because each QLSLAC device provides its own buffer control (TSXA/B). The QLSLAC device is controlled through the microprocessor interface, either by a microprocessor on the line card or by a central processor. Controlling the SLIC Device The Le58QL021 QLSLAC device has five TTL-compatible I/O pins (CD1, CD2, C3 to C5) for each channel. The Le58QL031 QLSLAC device has only CD1 and CD2 available. The outputs are programmed using Command 52h, and the status is read back using Command 53h. CD1 and CD2 for all four channels can be read back using Command 4D/4Fh. The direction of the I/O pins (input or output) is specified by programming the SLIC device I/O direction register (Command 54/55h). Calculating Coefficients with WinSLAC Software The WinSLAC software is a program that models the QLSLAC device, the line conditions, the SLIC device, and the line card components to obtain the coefficients of the programmable filters of the QLSLAC device and some of the transmission performance plots. The following parameters relating to the desired line conditions and the components/circuits used in the line card are to be provided as input to the program: 1. 2. 3. 4. 5. 6. 7. Line impedance or the balance impedance of the line is specified by the local telephone system. Desired two-wire impedance that is to appear at the line card terminals of the exchange. Tabular data for templates describing the frequency response and attenuation distortion of the design. Relative analog signal levels for both the transmit and receive two-wire signals. Component values and SLIC device selection for the analog portion of the line circuits. Two-wire return loss template is usually specified by the local telephone system. Four-wire return loss template is usually specified by the local telephone system. The output from the WinSLAC program includes the coefficients of the GR, GX, Z, R, X, and B filters as well as transmission performance plots of two-wire return loss, receive and transmit path frequency responses, and four-wire return loss. The software supports the use of the Legerity SLIC devices or allows entry of a SPICE netlist describing the behavior of any type of SLIC device circuit. 60 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet APPLICATION CIRCUIT Figure 26. Le7920 SLIC/QLSLAC Device Application Circuit Shared Ring Threshold +5.0 V C TH C RT +3.3 V R SR4 C BPD R RTH2 RING BUS DA R R1 U1 Le7920 SLIC R SR1 DB C AD R FA TIP RR C HP U3 TO R FB TEST BGND IN AGND VIN1 C VTX R RX VOUT1 R DC1 C VRX R DC2 RDC C DC BGND C1, C2 D0 D1 DET VBAT CAS RYOUT1, RYOUT2 RYOUT3 3 U2 Le58QL021 QLSLAC C BPA AGND VTX RT C BD TEST OUT CD RD BX TI VCCD VCCA RSN HPB VBAT RR RING AX HPA VCC RD 2 CD21, C31 C41 C51 CD11 CBAT K RR + 5V VBAT D1 K TI R TMG TMG VREF C AS C FIL K TO PCM/MPI MLCK/E1 PCLK FS DXA DRA TSCA DIO DCLK CS RST INT MCLK/E1 PCLK FS DXA DRA TSCA DIO DCLK CS RST INT TIP SLIC 2 5 RING ANALOG GROUND TIP SLIC 3 5 RING DIGITAL GROUND TIP DGND 5 SLIC 4 RING LINE CARD PARTS LIST The following list defines the parts and part values required to meet target specification limits for one channel. Item Quantity Type Value Tol. Rating Comments CBPA 1 Capacitor 0.1 µF 20% 10 V Bypass capacitor CBPD 1 Capacitor 0.1 µF 20% 10 V Bypass capacitor CFIL 1 Capacitor 0.1 µF 20% 10 V Bypass capacitor Coupling capacitor CVTX 1 Capacitor RRX 1 CVRX RT RFA RFB 0.1 µF 20% 10 V Resistor 57.6 kΩ 1% 0.01 W 1 Capacitor 0.15 µF 20% 10 V 1 Resistor 178 kΩ 1% 0.01 W 1 Fuse resistor 50 Ω 1 Fuse resistor 50 Ω See Note Note: For all other components, please refer to the Le7920 Data Sheet, document ID #080146. 61 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet PHYSICAL DIMENSIONS 32-Pin PLCC NOTES: 32-Pin PLCC JEDEC # MS-016 Min Nom Symbol A 0.125 -A1 0.075 0.090 D 0.485 0.490 D1 0.447 0.450 D2 0.205 REF E 0.585 0.590 E1 0.547 0.550 E2 0.255 REF Ԧ 0 deg -- 1 Dimensioning and tolerancing conform to ASME Y14,5M-1994. 2 To be measured at seating plan - C - contact point. 3 Dimensions “D1” and “E1” do not include mold protrusion. Allowable mold protrusion is 0.010 inch per side. Dimensions “D” and “E” include mold mismatch and determined at the parting line; that is “D1” and “E1” are measured at the extreme material condition at the upper or lower parting line. 0.595 0.553 4 Exact shape of this feature is optional. 10 deg 5 Details of pin 1 identifier are optional but must be located within the zone indicated. 6 Sum of DAM bar protrusions to be 0.007 max per lead. 7 Controlling dimension : Inch. 8 Reference document : JEDEC MS-016 Max 0.140 0.095 0.495 0.453 32-Pin PLCC Note: Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the device. Markings will vary with the mold tool used in manufacturing. 62 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 44-Pin PLCC Dwg rev. AN; 8/00 44-Pin PLCC JEDEC # MS-018(A)AC Min Symbol A 0.165 A1 0.090 A2 0.062 D 0.685 D1 0.650 D2 0.590 D3 0.500 E 0.685 E1 0.650 E2 0.590 E3 0.500 C 0.009 NOTES: (Unless otherwise specified) Max 0.180 0.120 0.083 0.695 0.656 0.630 REF 0.695 0.656 0.630 REF 0.015 1 All dimensions are in inches. 2 Dimensions “D” and “E” are measured from outermost point. 3 Dimensions “D1” and “E1” do not include corner mold flash. Allowable corner mold flash is 0.010 inch. 4 Dimensions “A”, “A1”, “D2” and “E2” are measured at the points of contact to base plane. 5 Lead spacing as measured from centerline to centerline shall be within ±0.005 inch. 6 J-lead tips should be located inside the “Pocket.” 7 Lead complanarity shall be within 0.004 inch as measured from seating plane. 8 Lead tweeze shall be within 0.0045 inch on each side as measured from a vertical flat plane. Tweeze is measured per AMD 06-500. 9 Lead pocket may be rectangular (as shown) or oval. If corner If corner lead pockets are connected then 5 mils minimum corner lead spacing is required. 44-Pin PLCC Note: Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the device. Markings will vary with the mold tool used in manufacturing. 63 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet 44-Pin TQFP Min Nom Max Symbol A 1.20 A1 0.05 0.15 A2 0.95 1.00 1.05 D 12 BSC D1 10 BSC E 12 BSC E1 10 BSC L 0.45 0.60 0.75 N 44 e 0.80 BSC b 0.30 0.37 0.45 b1 0.30 0.35 0.40 ccc 0.10 ddd 0.20 aaa 0.20 JEDEC #: MS-026 (C) ACB Notes: 1. All dimensions and toleerances conform to ANSI Y14.5-1982. 2. Datum plane -H- is located at the mold parting line and is coincident with the bottom of the lead where the lead exits the plastic body. 3. Dimensions “D1” and “E1” do not include mold protrusion. Allowable protrusion is 0.254mm per side. Dimensions “D1” and “E1” include mold mismatch and are determined at Datum plane -H- . 4. Dimension “B” does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the “b” dimension at maximum material condition. Dambar can not be located on the lower radius or the foot. 5. Controlling dimensions: Millimeter. 6. Dimensions “D” and “E” are measured from both innermost and outermost points. 7. Deviation from lead-tip true position shall be within ±0.076mm for pitch !PPDQGZLWKLQIRUSLWFKPP 8. Lead coplanarity shall be within: (Refer to 06-500) 1- 0.10mm for devices with lead pitch of 0.65-0.80mm. 2- 0.076mm for devices with lead pitch of 0.50mm. Coplanarity is measured per specification 06-500. 9. Half span (center of package to lead tip) shall be 15.30 ± 0.165mm {.602”±.0065”}. 10. “N” is the total number of terminals. 11. The top of package is smaller than the bottom of the package by 0.15mm. 12. This outline conforms to Jedec publication 95 registration MS-026 13. The 160 lead is a compliant depopulation of the 176 lead MS-026 variation BGA. 44-Pin TQFP Note: Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the device. Markings will vary with the mold tool used in manufacturing. 64 Zarlink Semiconductor Inc. Le58QL02/021/031 Data Sheet REVISION HISTORY Revision A1 to A2 • Changed titles for physical dimensions graphics to more industry-standard names Revision A2 to B1 • • • Added information regarding the input attenuator gain (GIN) throughout document Made minor edits to the "Product Description" section Removed references to resistors ROUT1 and ROUT2 from "Application Circuit" and "Line card Parts List" Revision B1 to C1 • • • • • • • • • • Added a maximum VCC current limit of 0.5 A to the Absolute Maximum Ratings if the rise rate of VCC is greater than 0.4 V/µs Decreased the digital leakage allowed from 15 to 7 µA Increased the standby power to 13 mW typical and 18 mW maximum In Transmission Characteristics, Second Harmonic Distortion, added GR=0 dB; added D-A in Description field Added a nominal spec on the chopper clock duty cycle Added a note warning the user of 81 ns phase jumps on CHCLK and E1 when the master clock is a multiple of 1.544 MHz Modified the power-up sequence At E1 Multiplex Operation, added "If EE1 is reset, MCLK/E1 is programmed as an input and should be connected to ground if it is not connected to a clock source" Clarified Interrupt section wording by adding a phrase At Reset States, when E1 Multiplex state is turned off, added "(E1 is Hi-Z)" Revision C1 to D1 • • Added green package OPNs to Description, on page 1 Added Package Assembly, on page 12 Revision D1 to E1 • Added "Packing" column and Note 2 to Ordering Information, on page 1 Revision E1 to F1 • Modified GAISN specification in Electrical Characteristics, on page 13. Revision F1 to F2 • • Enhanced format of package drawings in Physical Dimensions, on page 62 Added new headers/footers due to Zarlink purchase of Legerity on August 3, 2007. Revision F2 to Version 9 • Modified the content in Package Assembly, on page 12 65 Zarlink Semiconductor Inc. For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a license under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL, the Zarlink Semiconductor logo and the Legerity logo and combinations thereof, VoiceEdge, VoicePort, SLAC, ISLIC, ISLAC and VoicePath are trademarks of Zarlink Semiconductor Inc. TECHNICAL DOCUMENTATION - NOT FOR RESALE