KEMET Surface Mount Ceramic Revision M, 31 March 2015 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer as a result of the reader's ignoring this warning. Characteristics and Typical Construction • • • • • • • • Ceramic Dielectric Standard EIA Chip Sizes C0G, X7R, X5R, Y5V, Z5U, X8L & Ultra Stable X8R Dielectrics Termination code 'C' products support manufacture of RoHS-compliant EEE 4 - 3000 Volts Tape & Reel Packaging Bulk Cassette packaging available Matte Tin finish terminations standard SnPb terminations available beginning August, 2005 Termination Internal Electrode RoHS Restricted Substance Content 1 Key for Determining Adherence to China RoHS and 2011/65/EU Content Criteria O = ≤ MCV, X = > MCV, X = > MCV, but EU RoHS Compliant with Exemption(s) Restricted Substance Substance and MCV1 KEMET Product Series Termination Code CxxxxC C Ceramic Chip / Standard Ceramic Chip / High Voltage High Temperature (200ºC) C0G CxxxxF CxxxxG CxxxxR CxxxxH KEMET Commercial-Off-The-Shelf (COTS) CxxxxT C Low Profile Ceramic Chip / Standard Floating Electrode CxxxxL CxxxxS C C Floating Electrode w/ Flexible Termination CxxxxY C Flexible Termination CxxxxX C Ceramic Chip / Standard Ceramic Chip / High Voltage CxxxxC Ceramic Open Mode Capacitors High Temperature (200ºC) C0G CxxxxF CxxxxH KEMET Commercial-Off-The-Shelf (KCOTS) CxxxxT Low Profile Ceramic Chip / Standard Floating Electrode CxxxxL CxxxxS Floating Electrode w/ Flexible Termination CxxxxY Flexible Termination CxxxxX Ceramic Open Mode Capacitors High Temperature (175ºC) X7R 6+ Cr Pb Hg PBB PBDE Voltage < 0.01% Cd < 0.1% < 0.1% < 0.1% < 0.1% < 0.1% <250 V DC O O O O O O ≥ 250 V DC O O X O O O O O O O O O O O X O O O 3 China RoHS Symbol C C C C All L (not available for 0201 products) All 1 MCV = Maximum Concentration Values per 2011/65/EU and China RoHS criteria. 2 A limited group of these components contain a small portion of lead (Pb) that is exempt per Annex III, 7c-II of 2011/65/EU. These components are in transition to a completely lead-free material set. 3 China RoHS Symbol based on current manufacturing. Soldering Capability Characteristics Termination Material Termination Plating (Barrier) Peak Temperature Capability Soldering Process Compatibility MSL Rating per J-STD-020C Tin Whisker Test Results based on JESD22-A121 and JESD201 4 Matte Tin Termination SnPb Termination Silver or Copper 100% Matte Tin (Nickel) 260°C Backward & Forward Compatible Not Classified4 Silver or Copper 90Sn10 Pb (Nickel) 260°C Backward & Forward Compatible Not Classified4 Class 2 Class 2 5 MSL not classified for ceramic capacitors. J-STD-020 is applicable to non-hermetic surface mount devices, and is intended for plastic package components. KEMET ceramic chips are not encapsulated in a plastic package, so they are not susceptible to these effects. If an MSL were required, the rating this product would be considered MSL 1 or better. 5 Ordering Per EIA/ECA component bulletin CB19, tin whiskering is not considered a reliability risk within the capacitor industry for non-Military / Hi-Rel applications. Note: Refer to the online KEMET product catalog for part numbering of KEMET MIL Part Number equivalents. MIL-PRF- and