Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom “Tip and Ring” X7R Dielectric, 250 VDC (Commercial Grade) Overview KEMET’s 250 V DC Tip and Ring MLCCs in X7R dielectric are designed and rated for telecommunication ringer circuits where the capacitor is used to block -48 V to -52 V DC of line voltage and pass a 16 – 25 Hz AC signal pulse of 70 VRMs to 90 VRMs. Serving as an excellent replacement for high voltage leaded film devices, these smaller surface mount technology footprints save valuable board space which is critical when creating new designs. material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R dielectric exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C. KEMET Tip and Ring capacitors feature a 125°C maximum operating temperature and are considered “temperature stable.” The Electronics Components, Assemblies & Materials Association (EIA) characterizes X7R dielectric as a Class II These devices are able to withstand today’s higher lead-free reflow processing temperatures and offer superior high frequency filtering characteristics and low ESR. Benefits • • • • • • -55°C to +125°C operating temperature range Lead (Pb)-Free, RoHS and REACH compliant EIA 0805, 1206, 1210, 1812, 1825, 2220, and 2225 case sizes DC voltage rating of 250 V Capacitance offerings ranging from 1,000 pF to 6.8 μF Available capacitance tolerances of ±10% and ±20% Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information 1 2 C 1825 C 105 Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) 0805 1206 1210 1812 1825 2220 2225 C = Standard X = Flexible Termination 2 significant digits + number of zeros K A R A C TU Capacitance Rated Voltage Failure Rate/ Packaging/Grade Dielectric Termination Finish1 Tolerance (VDC) Design (C-Spec)2 J = ±5% K = ±10% M = ±20% A = 250 R = X7R A = N/A C = 100% Matte Sn L = SnPb (5% Pb minimum) Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked Additional termination finish options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Dimensions – Millimeters (Inches) – Standard Termination L W B T S EIA Size Code Metric Size Code B Bandwidth S Separation Minimum 0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030) 1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 1812 4532 1825 4564 0.50 (0.02) ± 0.25 (.010) See Table 2 for 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014) Thickness 4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014) 2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014) 2225 5664 5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014) L Length W Width T Thickness N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Dimensions – Millimeters (Inches) – Flexible Termination B Bandwidth S Separation Minimum 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030) 3216 3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010) 1210 3225 3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008) 1812 4532 4.50 (.178) ± 0.40 (.016) 1825 4564 4.60 (.181) ± 0.40 (.016) 2220 5650 5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014) 2225 5664 5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014) EIA Size Code Metric Size Code 0805 2012 1206 L Length W Width T Thickness 0.60 (.024) ± 0.25 (.010) See Table 2 for 3.20 (.126) ± 0.30 (.012) 0.70 (.028) ± 0.35 (.014) Thickness 6.40 (.252) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only C1011_X7R_TIP_RING_SMD • 6/22/2015 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Benefits cont'd • • • • Non-polar device, minimizing installation concerns 100% pure matte tin-plated termination finish that allows for excellent solderability SnPb termination finish option available upon request (5% Pb minimum) Flexible termination option available upon request Applications Typical applications include telecommunication ringing circuits, switch mode power supply snubber circuits, high voltage DC blocking and high voltage coupling. Markets include telephone lines, analog and digital modems, facsimile machines, wireless base stations, cable and digital video recording set-top boxes, satellite dishes, high voltage power supply, DC/DC converters, and Ethernet, POS and ATM hardware. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55°C to +125°C Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit @ 25ºC Insulation Resistance (IR) Limit @ 25°C 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V) See Insulation Resistance Limit Table (Rated voltage applied for 120 ±5 seconds @ 25°C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance >10 µF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value > 25 X7R 16/25 < 16 Dissipation Factor (Maximum %) Capacitance Shift Insulation Resistance ±20% 10% of Initial Limit 3.0 All 5.0 7.5 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Insulation Resistance Limit Table EIA Case Size 1,000 Megohm Microfarads or 100 GΩ 500 Megohm Microfarads or 10 GΩ 0201 N/A ALL 0402 < 0.012 µF ≥ 0.012 µF 0603 < 0.047 µF ≥ 0.047 µF 0805 < 0.15 µF ≥ 0.15 µF 1206 < 0.47 µF ≥ 0.47 µF 1210 < 0.39 µF ≥ 0.39 µF 1808 ALL N/A 1812 < 2.2 µF ≥ 2.2 µF 1825 ALL N/A 2220 < 10 µF ≥ 10 µF 2225 ALL N/A © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes) Capacitance Capacitance Code 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1000 pF 1200 pF 1500 pF 1800 pF 2200 pF 2700 pF 3300 pF 3900 pF 4700 pF 5600 pF 6800 pF 8200 pF 10000 pF 12000 pF 15000 pF 18000 pF 22000 pF 27000 pF 33000 pF 39000 pF 47000 pF 56000 pF 68000 pF 82000 pF 0.1 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.27 µF 0.33 µF 0.39 µF 0.47 µF 0.56 µF 0.68 µF 0.82 µF 1 µF 1.2 µF 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 Capacitance Capacitance Code Case Size/ Series C0805C Voltage Code A A A A A A A Rated Voltage (VDC) 250 250 250 250 250 250 250 Capacitance Tolerance J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K C1206C C1210C C1812C C1825C C2220C C2225C Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN Rated Voltage (VDC) 250 250 250 Voltage Code A A A Case Size/Series C0805C C1206C C1210C EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB ED ED ED ED EM FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG FH FM FK FK GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GE GG GG GG GG GG GJ HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HD HD HD HD HF HF JC JC JC JC JC JC JC JC JC JC JD JD JF JF 250 250 250 250 A A A A C1812C C1825C C2220C C2225C KC KC KC KC KC KC KC KC KD KD KD KE KE KE **Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Table 2 – Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DN EB ED EM FB FC FF FG FH FM FK GB GE GG GJ HB HD HF JC JD JF KC KD KE 0805 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1825 1825 1825 2220 2220 2220 2225 2225 2225 0.78 ± 0.10* 0.78 ± 0.10 1.00 ± 0.10 1.25 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.55 ± 0.15 1.70 ± 0.20 2.10 ± 0.20 1.00 ± 0.10 1.30 ± 0.10 1.55 ± 0.10 1.70 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.50 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.50 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 4,000 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15,000 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4,000 2,500 2,500 4,000 4,000 2,500 2,500 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1812 4532 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X C V2 X C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Ramp-Up Rate (TL to TP) Termination Finish SnPb 100% Matte Sn 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Time 25°C to Peak Temperature TL tP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec tL Tsmax Tsmin tS 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) Ramp-Down Rate (TP to TL) TP Temperature Profile Feature 25 25° C to Peak Time 6°C/second maximum 6°C/second maximum 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C Temperature Cycling JESD22 Method JA–104 Biased Humidity MIL–STD–202 Method 103 Moisture Resistance MIL–STD–202 Method 106 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell time – 15 minutes. Air – Air. Thermal Shock MIL–STD–202 Method 107 High Temperature Life MIL–STD–202 Method 108 /EIA–198 Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours. Vibration MIL–STD–202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Construction – Standard Termination Detailed Cross Section Dielectric Material (BaTiO3) Dielectric Material Barrier Layer (BaTiO3) (Ni) Termination Finish (100% Matte Sn / Base Metal SnPb - 5% min) (Cu) Inner Electrodes (Ni) Base Metal (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% min) Inner Electrodes (Ni) Construction – Flexible Termination Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer Base Metal (Ni) (Cu) Termination Finish (100% Matte Sn / Epoxy Layer SnPb - 5% min) (Ag) Dielectric Material (BaTiO3) Inner Electrodes (Ni) Base Metal (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com Termination Finish (100% Matte Sn / SnPb - 5% min) C1011_X7R_TIP_RING_SMD • 6/22/2015 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Capacitor Marking (Optional): Thesesurfacemountmultilayerceramiccapacitorsare normallysuppliedunmarked.Ifrequired,theycanbemarked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering codeidentifier(s).Ifthisoptionisrequested,twosidesofthe ceramicbodywillbelasermarkedwitha“K”toidentifyKEMET, followedbytwocharacters(perEIA–198-seetablebelow)to identifythecapacitancevalue.EIA0603casesizedevicesare limitedtothe“K”characteronly. Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive Grade stacked devices. • X7R dielectric products in capacitance values outlined below EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 ≤170pF ≤150pF ≤910pF ≤2,000pF ≤3,900pF ≤6,700pF ≤0.018µF ≤0.027µF ≤0.033µF Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional. KEMET ID © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com 2-Digit Capacitance Code C1011_X7R_TIP_RING_SMD • 6/22/2015 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Capacitor Marking (Optional) cont’d Alpha Character 9 A Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 0.1 10 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 12 12 120 1,200 12,000 D 0.13 13 13 130 1,300 E 0.15 15 15 150 1,500 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 16 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 18 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 20 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 22 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 30 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 33 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 36 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 39 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 43 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 56 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 62 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 68 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 75 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 82 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 25 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 35 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 40 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 45 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 50 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 60 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 70 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 80 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 90 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Tape & Reel Packaging Information KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewithEIA Standard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2fordetailson reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) Embossed Plastic EIA Case Size Tape size (W)* 7" Reel 13" Reel Punched Paper 7" Reel Pitch (P1)* 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 4 4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array0508&0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 ±0.05 0.600 (0.079 ±0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 (0.138 ±0.002) 5.5 ±0.05 (0.217 ±0.002) 7.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 8.0 ±0.10 (0.315 ±0.004) 12.0 ±0.10 (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 ±0.05 (0.138 ±0.002) P1 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof300±10mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 5 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1011_X7R_TIP_RING_SMD • 6/22/2015 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe SassoMarconi,Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg,Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen,Germany Tel: 49-2307-438110 North America Northern Europe Wyboston,UnitedKingdom Tel: 44-1480-273082 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835KEMETWay Simpsonville, SC 29681 Southeast LakeMary,FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-994-1030 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Penang,Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 21 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade) Disclaimer Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforcheckingand verifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced. AllInformationgivenhereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied. StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butare notintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.TheInformationisintendedforuseonly bycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.AnytechnicaladviceinferredfromthisInformationorotherwise providedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesnoobligationorliabilityfortheadvicegivenorresultsobtained. AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponentfailuresmaystill occur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards(suchasinstallationofprotective circuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryorpropertydamage. Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatothermeasuresmaynot be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 6/22/2015 22