Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Overview KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices. Use of capacitor arrays also saves board space which translates into increased board density and more functions per board. Arrays consume only a portion of the space required for standard chips resulting in savings in inventory and pick/place machine positions. time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30 ppm/ºC from -55°C to +125°C. KEMET automotive grade array capacitors meet the demanding Automotive Electronics Council's AEC–Q200 qualification requirements. KEMET’s C0G dielectric features a 125°C maximum operating temperature and is considered “stable.”The Electronics Industries Alliance (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information CA 06 4 C Ceramic Case Size Number of Specification/ Array (L" x W")1 Capacitors Series 05 = 0508 06 = 0612 2=2 4=4 C = Standard X = Flexible Termination 104 K 4 G Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric 2 significant digits + number of zeros J = ±5% K = ±10% M = ±20% 8 = 10 V G = C0G 4 = 16 V 3 = 25 V 5 = 50 V 1 = 100 V 2 = 200 V A C TU Failure Rate/ Termination Design Finish2 A = N/A Packaging/Grade (C-Spec)3 C = 100% Matte Sn L = SnPb (5% minimum) Blank = Bulk Bag (Commercial Grade) TU = 7" Tape & Reel (Commercial Grade) AUTO = 7" Reel (Automotive Grade) AUTO 7411 = 13" Reel/Punched Paper (Automotive Grade) AUTO 7210 = 13" Reel/ Embossed Plastic (Automotive Grade) All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code. 2 Additional termination finish options may be available. Contact KEMET for details. 2,3 SnPb termination finish option is not available on automotive grade product. 3 Additional reeling or packaging options may be available. Contact KEMET for details. 3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L"x W") and thickness dimension. See "Chip Thickness/Packaging Quantities" and "Tape & Reel Packaging Information" sections of this document. 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information" section of this document. 1 One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notification (PCN) The KEMET Product Change Notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit , function, and /or reliability • Changes in manufacturing site • Product obsolescence Customer Notification due to: KEMET Automotive C-Spec 1 Process/Product change Obsolescence* Days prior to implementation KEMET assigned1 Yes (with approval and sign off) Yes 180 days Minimum AUTO Yes (without approval) Yes 90 days Minimum KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part KEMET Automotive C-Spec 1 PPAP (Product Part Approval Process) Level 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part Number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) 0508 (2-CAP) 0612 (4-CAP) Top View L BW T CL P Ref T BL W P EIA Size Code Metric Size Code L Length W Width BW Bandwidth BL Bandlength 0508 1220 1.30 (0.051) ±0.15 (0.006) 2.10 (0.083) ±0.15 (0.006) 0.53 (0.021) ±0.08 (0.003) 0.30 (0.012) ±0.20 (0.008) 1632 1.60 (0.063) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 0.40 (0.016) ±0.20 (0.008) 0.30 (0.012) ±0.20 (0.008) 0612 L W BL CL Profile View BW P P Ref Top View Profile View T Thickness See Table 2 for Thickness P Pitch P Reference 1.00 (0.039) ±0.10 (0.004) 0.50 (0.020) ±0.10 (0.004) 0.80 (0.031) ±0.10 (0.004) 0.40 (0.016) ±0.05 (0.002) Benefits • • • • • • • • -55°C to +125°C operating temperature range Saves both circuit board and inventory space Reduces placement costs and increases throughput Lead (Pb)-Free, RoHS and REACH compliant EIA 0508 (2-element) and 0612 (4-element) case sizes DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V Capacitance offerings ranging from 10 pF to 2,200 pF Available capacitance tolerances of ±5%, ±10%, and ±20% • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • SnPb termination finish option available upon request (5% minimum) • Flexible termination option available upon request • Commercial and Automotive (AEC–Q200) grades available Applications Typical applications include those that can benefit from board area savings, cost savings and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit @ 25ºC Insulation Resistance (IR) Limit @ 25°C -55°C to +125°C ±30 ppm/ºC 0% 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 0.1% 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120 ±5 seconds @ 25°C) To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) C0G All All 0.5 Capacitance Shift Insulation Resistance 0.3% or ±0.25 pF 10% of Initial Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 1 – Capacitance Range/Selection Waterfall (0508 – 0612 Case Sizes) Case Size/Series C0508C/X (CA052C/X 2-Cap Case Size) Capacitance Capacitance Code Voltage Code 8 4 3 5 1 8 4 3 5 1 2 Rated Voltage (VDC) 10 16 25 50 100 10 16 25 50 100 200 Capacitance Tolerance 10 pF 12 pF 15 pF 18 pF 22 pF 27 pF 33 pF 39 pF 47 pF 56 pF 68 pF 82 pF 100 pF 120 pF 150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 112 122 132 152 162 182 202 222 Capacitance Capacitance Code C0612C/X (CA064C/X 4-Cap Case Size) J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA PA Rated Voltage (VDC) 10 16 25 50 Voltage Code 8 4 3 5 Case Size/Series MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA 100 10 16 25 50 100 200 1 8 4 3 5 1 2 C0508C/X (CA052C/X 2-Cap Case Size) C0612C/X (CA064C/X 4-Cap Case Size) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. Table 2 – Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel PA MA 0508 0612 0.80 ± 0.10 0.80 ± 0.10 0 0 0 0 4,000 4,000 10,000 10,000 Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC-7351 EIA SIZE CODE METRIC SIZE CODE Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X P V1 V2 C Y X P V1 V2 C Y X P V1 V2 0508/CA052 1220 1.60 1.00 0.55 1.00 3.50 3.30 1.50 0.90 0.50 1.00 2.90 2.80 1.40 0.75 0.45 1.00 2.40 2.50 0612/CA064 1632 1.80 1.10 0.50 0.80 3.90 4.40 1.80 0.95 0.50 0.80 3.30 3.90 1.70 0.85 0.40 0.80 2.80 3.60 Density Level A: For low-density product applications. Provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 0612 case size. V2 P X Y V1 C Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Ramp-Up Rate (TL to TP) Termination Finish SnPb 100% Matte Sn 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Time 25°C to Peak Temperature TL tP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec tL Tsmax Tsmin tS 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) Ramp-Down Rate (TP to TL) TP Temperature Profile Feature 25 25° C to Peak Time 6°C/second maximum 6°C/second maximum 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C Temperature Cycling JESD22 Method JA–104 Biased Humidity MIL–STD–202 Method 103 Moisture Resistance MIL–STD–202 Method 106 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell time – 15 minutes. Air – Air. Thermal Shock MIL–STD–202 Method 107 High Temperature Life MIL–STD–202 Method 108 /EIA–198 Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours. Vibration MIL–STD–202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Construction Detailed Cross Section Inner Electrodes (Ni) Termination Finish (100% Matte Sn) Barrier Layer (Ni) Epoxy Layer (Ag) Base Metal (Cu) Dielectric Material (CaZrO3) Base Metal (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • • • • C0G, Ultra Stable X8R and Y5V dielectric devices EIA 0402 case size devices EIA 0603 case size devices with Flexible Termination option. KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) Embossed Plastic EIA Case Size Tape size (W)* 7" Reel 13" Reel Punched Paper 7" Reel Pitch (P1)* 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 4 4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 ±0.05 0.600 (0.079 ±0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 (0.138 ±0.002) 5.5 ±0.05 (0.217 ±0.002) 7.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 8.0 ±0.10 (0.315 ±0.004) 12.0 ±0.10 (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 ±0.05 (0.138 ±0.002) P1 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 5 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1016_C0G_ARRAY_SMD • 3/2/2015 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Harlow, United Kingdom Tel: 44-1279-460122 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-306-9353 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 3/2/2015 17