Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Overview The KEMET T500 Series is a high-temperature product that offers optimum performance characteristics in applications with operating temperatures up to 200°C. This series is classified as MSL (Moisture Sensitivity Level) 1 under J STD 020: unlimited floor life time at ≤30°C / 85% RH. Benefits • • • • • • • • • • Meets or exceeds EIA standard 535BAAC Weibull failure rate to B Level available Standard gold-plated termination RoHS Compliant Operating temperature range of -55˚C to +200˚C 100% steady-state accelerated aging at 200°C Voltage derating is 1/3 at 200°C Qualified at 1,000 hours of life test at 200°C with 0.33 VR Taped and reeled per EIA 481 Meets MSL 1 requirements for Pb-free assembly according to JEDEC J–STD–020 • Surge current options available Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Applications Typical applications include decoupling and filtering in down-hole, military and aerospace industries. SPICE For a detailed analysis of specific part numbers, please visit www.kemet.com for a free download of KEMET's SPICE software. The KEMET SPICE program is freeware intended to aid design engineers in analyzing the performance of these capacitors over frequency, temperature, ripple, and DC bias conditions. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 1 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Ordering Information T Capacitor Class T= Tantalum 500 X 227 M 010 Case Capacitance Code Capacitance Rated Voltage Size (pF) Tolerance (VDC) Series High Temperature 200°C X First two digits represent significant figures. Third digit specifies number of zeros. K = ±10% M = ±20% 010 = 10 016 = 16 035 = 35 A G 61 10 Failure Rate/ Design Termination Finish Performance ESR A = N/A B= 0.1%/1,000 hours G = Gold plated 61 = Surge None 62 = Surge at 25°C after Weibull 63 = Surge -55°C and +85°C after Weibull 10 = Standard ESR Performance Characteristics Item Performance Characteristics Operating Temperature Rated Capacitance Range Capacitance Tolerance Rated Voltage Range -55°C to 200°C 33 – 220 µF at 120 Hz/25°C K Tolerance (10%), M Tolerance (20%) 10 – 35 V DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current ≤ 0.01 CV (µA) at rated voltage after 5 minutes © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 2 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Qualification Test Condition Characteristics Δ C/C Endurance Storage Life Humidity Temperature Stability Mechanical Shock/Vibration 200°C at 1/3 rated voltage, 1,000 hours 200°C at 0 volts, 1,000 hours 85°C, 85% RH, 0 V, 1,000 hours Extreme temperature exposure at a succession of continuous steps at +25°C, -55°C, +25°C, +85°C, +125°C, +25°C Δ C/C Within ±10% of initial value DF Within initial limits DCL 1 mAmp maximum ESR Within initial limits Δ C/C Within ±10% of initial value DF Within initial limits DCL 1 mAmp maximum ESR Within initial limits Δ C/C Within ±10% of initial value DF Within initial limits DCL Within initial limits ESR Within initial limits +25°C -55°C +85°C +150°C IL* ±10% ±10% ±20% DF IL IL 1.5 x IL 1.5 x IL DCL IL N/A 10 x IL 12 x IL MIL–STD–202, Method 213, Condition I, 100 G peak MIL–STD–202, Method 204, 10 Hz to 2,000 Hz, 5G's for 20 minutes, 12 cycles each of 3 orientations Δ C/C Within ±10 of initial value DF Within initial limits DCL Within initial limits *IL = Initial limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 3 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Electrical Characteristics Impedance & ESR vs. Frequency 100 Impedance & ESR (Ohms) T500X107K016 IMP T500X107K016 ESR 10 T500X227K010 IMP T500X227K010 ESR T500X336K035 IMP T500X336K035 ESR 1 0.1 0.01 100 1,000 10,000 100,000 1,000,000 10,000,000 Frequency (Hz) The measurements were taken at room temperature (25°C) Capacitance vs. Frequency 1,000 T500X107K016 T500X227K010 Capacitance (µF) T500X336K035 100 10 1 100 1,000 10,000 100,000 1,000,000 10,000,000 Frequency (Hz) The measurements were taken at room temperature (25°C) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 4 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Dimensions – Millimeters CATHODE (-) END VIEW SIDE VIEW ANODE (+) END VIEW BOTTOM VIEW A B W B H X T S G S Termination cutout at KEMET's option, either end Case Size KEMET X F E P R L Component EIA L W F ±0.1 S ±0.3 B ±0.15 ±(0.004) ±(0.012) (Ref) ±0.006 H 7.3 ±0.3 4.3 ±0.3 4.0 ±0.3 7343–43 (0.287 ±0.012) (0.169 ±0.012) (0.157 ±0.012) 2.4 (0.095) 1.3 (0.051) 0.5 (0.020) X (Ref) P (Ref) 0.10 ±0.10 (0.004 ±0.004) 1.7 (0.067) R (Ref) T (Ref) A (Min) G (Ref) E (Ref) 1.0 (0.039) 0.13 (0.005) 3.8 (0.150) 3.5 (0.138) 3.5 (0.138) Notes: (Ref) – Dimensions provided for reference only. Table 1 – Ratings & Part Number Reference Rated Voltage Rated Cap Case Code/ Case Size KEMET Part Number µF KEMET/EIA (See below for part options) 3.3 220 X/7343-43 T500X227(1)010(2)G(3)10 Working Voltage VDC at VDC at VDC at 85ºC +125°C +200°C 10 6.6 DC Leakage DF ESR Maximum Maximum Operating MSL Allowable Temp Ripple Current at 200°C, % at 20ºC mΩ at 20ºC mA at mA at mA at µA at 20°C µA0.33 120 Hz 100 kHz +25°C +125°C +200°C R Max/5 Min. Max/5 VMin Max Max 100 kHz 100 kHz 100 kHz 22 220 10 250 812 325 81 °C Reflow Temp ≤ 260ºC 200 1 16 10.6 5.3 100 X/7343-43 T500X107(1)016(2)G(3)10 16 160 8 250 812 325 81 200 1 35 23.1 11.6 10 X/7343-43 T500X106(1)035(2)G(3)10 3.5 35 6 700 486 194 49 200 1 35 23.1 11.6 33 X/7343-43 T500X336(1)035(2)G(3)10 11.6 116 8 600 524 210 52 200 1 (1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours) or A = N/A. Designates reliability level. (3) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C after Weibull, 63 = 10 cycles -55°C +85°C after Weibull. Designates surge current option. Refer to Ordering Information for additional detail. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 5 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Recommended Voltage Derating Guidelines Recommended Application Voltage (for maximum reliability) Working Voltage +25°C +85°C +125°C +200°C 25°C 85°C 125°C 200°C 10 10 10 6.6 3.3 5 5 3.3 1.7 16 16 16 10.6 5.3 8 8 5.3 2.6 35 35 35 23.1 11.6 17.5 17.5 11.6 5.8 Note: Additional reliability can be obtained through the derating of voltage 100% % Working Voltage Rated Voltage 120% 80% % Change in Working DC Voltage with Temperature 66% 60% 50% 40% Recommended Maximum Application Voltage 20% 0% -55 25 33% 85 125 175 200 Temperature (°C) Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to equivalent series resistance (ESR) and the power dissipation capabilities of the device. Permissible AC ripple voltage which may be applied is limited by two criteria: 1. The positive peak AC voltage plus the DC bias voltage, if any, must not exceed the DC voltage rating of the capacitor. 2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits specified for reverse voltage. See the Reverse Voltage section for allowable limits. The maximum power dissipation by case size can be determined using the table at right. The maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. Refer to the table below for temperature compensation requirements. T ≤ 25°C 1.00 Temperature Compensation Multipliers for Maximum Ripple Current T ≤ 85°C 0.90 T ≤ 125°C T ≤ 150°C T ≤ 175°C T ≤ 200°C 0.40 0.30 0.20 0.10 KEMET Case Code EIA Case Code X 7343–43 Maximum Power Dissipation (P max) mWatts at 25°C w/+20°C Rise 165 The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details. Using the P max of the device, the maximum allowable rms ripple current or voltage may be determined. I(max) = √P max/R E(max) = Z √P max/R I = rms ripple current (amperes) E = rms ripple voltage (volts) P max = maximum power dissipation (watts) R = ESR at specified frequency (ohms) Z = Impedance at specified frequency (ohms) T = Environmental Temperature © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 6 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 85°C 125°C 15% of Rated Voltage 5% of Rated Voltage 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 X 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 1 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). ¹ Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. V1 L L W W V2 S Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 7 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Soldering Process Note that although the X/7343–43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. During typical reflow operations, a slight darkening of the goldcolored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds 3°C/seconds maximum Ramp-up Rate (TL to TP) 3°C/seconds maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 220°C* 235°C** 60 – 150 seconds 250°C* 260°C** Peak Temperature (TP) Time within 5°C of Maximum Peak Temperature (tP) Ramp-down Rate (TP to TL) 20 seconds maximum 30 seconds maximum 6°C/seconds maximum 6°C/seconds maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z TP TL Temperature KEMET’s families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. tP Maximum Ramp Up Rate = 3ºC/seconds Maximum Ramp Down Rate = 6ºC/seconds tL Tsmax Tsmin 25 tS 25ºC to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 8 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Construction Detailed Cross Section Polarity Stripe (+) Molded Epoxy Case Nickel Plating (Fourth Layer) Polarity Bevel (+) Tantalum Wire Leadframe (- Cathode) Washer Tantalum Wire Weld (to attach wire) Carbon (Third Layer) Silver Adhesive Leadframe (+ Anode) Molded Epoxy Case MnO2 (Second Layer) Washer Ta2O5 Dielectric (First Layer) Tantalum Capacitor Marking Date Code * KEMET High Temperature MnO2 Polarity Indicator (+) 1 digit = Last number of Year 9 = 2009 0 = 2010 1 = 2011 2 = 2012 3 = 2013 4 = 2014 2nd and 3rd digit = Week of the Year 01 = 1st week of the Year to 52 = 52nd week of the Year st Picofarad Code KEMET ID Rated Voltage Date Code* * 230 = 30th week of 2012 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 9 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Tape & Reel Packaging Information KEMET’smoldedchipcapacitorfamiliesarepackagedin8and12mmplastictapeon7"and13"reelsinaccordancewithEIA Standard 481:EmbossedCarrierTapingofSurfaceMountComponentsforAutomaticHandling.Thispackagingsystemiscompatible withalltape-fedautomaticpick-and-placesystems. 8 mm (0.315") or 12 mm (0.472") Top Tape Thickness 0.10 mm (0.004") Maximum Thickness 180 mm (7.0") or 330 mm (13.0") Table 3 – Packaging Quantity Case Code KEMET S T M U L W Z V A B C D Q Y X E/T428P H EIA 3216-12 3528-12 3528-15 6032-15 6032-19 7343-15 7343-17 7343-20 3216-18 3528-21 6032-28 7343-31 7343-12 7343-40 7343-43 7360-38 7360-20 Tape Width (mm) 7" Reel* 13" Reel* 8 8 8 12 12 12 12 12 8 8 12 12 12 12 12 12 12 2,500 2,500 2,000 1,000 1,000 1,000 1,000 1,000 2,000 2,000 500 500 1,000 500 500 500 1,000 10,000 10,000 8,000 5,000 3,000 3,000 3,000 3,000 9,000 8,000 3,000 2,500 3,000 2,000 2,000 2,000 2,500 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 10 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo Po [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 Ao F Ko B1 S1 W E2 Bo P1 T1 Center Lines of Cavity B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 ØD 1 Cover Tape User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) TapeSize D0 8 mm 12 mm 1.5+0.10/-0.0 (0.059+0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) B1 Maximum Note 4 4.35 (0.171) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) P2 2.0 ±0.05 (0.079 ±0.002) 2.0 ±0.1 (0.079 ±0.059) R Reference Note 2 25.0 (0.984) 30 (1.181) S1 Minimum T Maximum T1 Maximum Note 3 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) TapeSize Pitch E2 Minimum F 8 mm Single (4 mm) 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 12 mm Single (4 mm) & Double (8 mm) 8.2 (0.323) 10.25 (0.404) 16 mm Triple (12 mm) 12.1 (0.476) 14.25 (0.561) P1 2.0 ±0.05 or 4.0 ±0.10 (0.079 ±0.002 or 0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) or 4.0 5.5 ±0.05 ±0.10 (0.157 ±0.004) or 8.0 ±0.10 (0.217 ±0.002) (0.315 ±0.004) 7.5±0.10 4.0 ±0.10 (0.157 ±0.004) to 12.0 (0.295 ±0.004) ±0.10 (0.472 ±0.004) T2 Maximum W Maximum A0, B0 & K0 2.5 (0.098) 8.3 (0.327) 4.6 (0.181) 12.3 (0.484) 8.0 (0.315) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 11 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe165°to180° fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof300±10mm/minute. 3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 4 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R T2063_T500 • 6/17/2015 12 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) TapeSize A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0+0.5/-0.2 (0.521+0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) TapeSize N Minimum W1 W2 Maximum W3 50 (1.969) 8.4+1.5/-0.0 (0.331+0.059/-0.0) 12.4+2.0/-0.0 (0.488+0.078/-0.0) 16.4+2.0/-0.0 (0.646+0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shallaccommodatetapewidth withoutinterference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 13 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 7 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 14 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen,China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Wyboston, United Kingdom Tel: 44-1480-273082 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-994-1030 Beijing,China Tel: 86-10-5877-1075 Shanghai,China Tel: 86-21-6447-0707 Seoul,SouthKorea Tel: 82-2-6294-0550 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 15 Tantalum Surface Mount Capacitors – High Temperature T500 Series MnO2 200°C Disclaimer Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforcheckingand verifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced. AllInformationgivenhereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied. StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butare notintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.TheInformationisintendedforuseonly bycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.AnytechnicaladviceinferredfromthisInformationorotherwise providedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesnoobligationorliabilityfortheadvicegivenorresultsobtained. AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponentfailuresmaystill occur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards(suchasinstallationofprotective circuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryorpropertydamage. Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatothermeasuresmaynot be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2063_T500 • 6/17/2015 16