RENESAS R5F21264KFP

To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
2.
3.
4.
5.
6.
7.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
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of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
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laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
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incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
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consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
8.
9.
10.
11.
12.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
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specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
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(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
R8C/26 Group, R8C/27 Group
SINGLE-CHIP 16-BIT CMOS MCU
1.
REJ03B0168-0210
Rev.2.10
Sep 26, 2008
Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and
are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction
efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash.
Their peripheral functions are the same.
1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 1 of 69
R8C/26 Group, R8C/27 Group
1.2
1. Overview
Performance Overview
Table 1.1 outlines the Functions and Specifications for R8C/26 Group and Table 1.2 outlines the Functions and
Specifications for R8C/27 Group.
Table 1.1
CPU
Peripheral
Functions
Functions and Specifications for R8C/26 Group
Item
Number of
fundamental
instructions
Minimum instruction
execution time
Operating mode
Address space
Memory capacity
Ports
LED drive ports
Timers
Serial interfaces
Clock synchronous
serial interface
LIN module
A/D converter
Watchdog timer
Interrupts
Clock generation
circuits
Electrical
Characteristics
Oscillation-stopped
detector
Voltage detection
circuit
Power-on reset circuit
Supply voltage
Current consumption
(N, D version)
Flash Memory
Programming and
erasure voltage
Programming and
erasure endurance
Operating Ambient Temperature
Package
Specification
89 instructions
50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)
62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)
100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)
Single-chip
1 Mbyte
Refer to Table 1.3 Product Information for R8C/26 Group
I/O ports: 25 pins, Input port: 3 pins
I/O ports: 8 pins (N, D version)
Timer RA: 8 bits × 1 channel
Timer RB: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer RC: 16 bits × 1 channel
(Input capture and output compare circuits)
Timer RE: With real-time clock and compare match function
(For J, K version, compare match function only.)
2 channels (UART0, UART1)
Clock synchronous serial I/O, UART
1 channel
I2C bus Interface(1)
Clock synchronous serial I/O with chip select
Hardware LIN: 1 channel (timer RA, UART0)
10-bit A/D converter: 1 circuit, 12 channels
15 bits × 1 channel (with prescaler)
Start-on-reset selectable
Internal: 15 sources, External: 4 sources,
Software: 4 sources, Priority levels: 7 levels
3 circuits
• XIN clock generation circuit (with on-chip feedback resistor)
• On-chip oscillator (high speed, low speed)
High-speed on-chip oscillator has a frequency adjustment function
• XCIN clock generation circuit (32 kHz) (N, D version)
• Real-time clock (timer RE) (N, D version)
XIN clock oscillation stop detection function
On-chip
On-chip
VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)
VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)
VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)
VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)
Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 2.0 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)
Typ. 0.7 µA (VCC = 3.0 V, stop mode)
VCC = 2.7 to 5.5 V
100 times
-20 to 85°C (N version)
-40 to 85°C (D, J version)(2), -40 to 125°C (K version)(2)
32-pin molded-plastic LQFP
NOTES:
1. I2C bus is a trademark of Koninklijke Philips Electronics N. V.
2. Specify the D, K version if D, K version functions are to be used.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 2 of 69
R8C/26 Group, R8C/27 Group
Table 1.2
1. Overview
Functions and Specifications for R8C/27 Group
Item
Specification
Number of fundamental 89 instructions
instructions
Minimum instruction
50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)
execution time
62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)
100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)
Operating mode
Single-chip
Address space
1 Mbyte
Memory capacity
Refer to Table 1.4 Product Information of R8C/27 Group
Peripheral
Ports
I/O ports: 25 pins, Input port: 3 pins
Functions
LED drive ports
I/O ports: 8 pins (N, D version)
Timers
Timer RA: 8 bits × 1 channel
Timer RB: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer RC: 16 bits × 1 channel
(Input capture and output compare circuits)
Timer RE: With real-time clock and compare match function
(For J, K version, compare match function only.)
Serial interfaces
2 channels (UART0, UART1)
Clock synchronous serial I/O, UART
Clock synchronous
1 channel
serial interface
I2C bus Interface(1)
Clock synchronous serial I/O with chip select
LIN module
Hardware LIN: 1 channel (timer RA, UART0)
A/D converter
10-bit A/D converter: 1 circuit, 12 channels
Watchdog timer
15 bits × 1 channel (with prescaler)
Start-on-reset selectable
Interrupts
Internal: 15 sources, External: 4 sources,
Software: 4 sources, Priority levels: 7 levels
Clock generation
3 circuits
circuits
• XIN clock generation circuit (with on-chip feedback resistor)
• On-chip oscillator (high speed, low speed)
High-speed on-chip oscillator has a frequency adjustment function
• XCIN clock generation circuit (32 kHz) (N, D version)
• Real-time clock (timer RE) (N, D version)
Oscillation-stopped
XIN clock oscillation stop detection function
detector
Voltage detection circuit On-chip
Power-on reset circuit
On-chip
Electrical
Supply voltage
VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)
Characteristics
VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)
VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)
VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)
Current consumption
Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
(N, D version)
Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 2.0 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)
Typ. 0.7 µA (VCC = 3.0 V, stop mode)
Flash Memory
Programming and
VCC = 2.7 to 5.5 V
erasure voltage
Programming and
10,000 times (data flash)
erasure endurance
1,000 times (program ROM)
Operating Ambient Temperature
-20 to 85°C (N version)
-40 to 85°C (D, J version)(2), -40 to 125°C (K version)(2)
Package
32-pin molded-plastic LQFP
CPU
NOTES:
1. I2C bus is a trademark of Koninklijke Philips Electronics N. V.
2. Specify the D, K version if D, K version functions are to be used.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 3 of 69
R8C/26 Group, R8C/27 Group
1.3
1. Overview
Block Diagram
Figure 1.1 shows a Block Diagram.
I/O ports
8
8
6
Port P0
Port P1
Port P3
1
3
2
Port P4
Port P5
Peripheral functions
System clock
generation circuit
A/D converter
(10 bits × 12 channels)
Timers
Timer RA (8 bits)
Timer RB (8 bits)
Timer RC
(16 bits × 1 channel)
Timer RE (8 bits)
XIN-XOUT
High-speed on-chip oscillator
Low-Speed on-chip oscillator
XCIN-XCOUT(3)
UART or
clock synchronous serial I/O
(8 bits × 2 channels)
I2C bus interface or clock synchronous
serial I/O with chip select
(8 bits × 1 channel)
LIN module
(1 channel)
Watchdog timer
(15 bits)
Memory
R8C CPU core
R0H
R1H
R0L
R1L
R2
R3
SB
USP
ISP
INTB
A0
A1
FB
ROM(1)
RAM(2)
PC
FLG
Multiplier
NOTES:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
3. XCIN, XCOUT can be used only for N or D version.
Figure 1.1
Block Diagram
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 4 of 69
R8C/26 Group, R8C/27 Group
1.4
1. Overview
Product Information
Table 1.3 lists the Product Information for R8C/26 Group and Table 1.4 lists the Product Information for R8C/27
Group.
Table 1.3
Product Information for R8C/26 Group
Part No.
R5F21262SNFP
R5F21264SNFP
R5F21265SNFP
R5F21266SNFP
R5F21262SDFP
R5F21264SDFP
R5F21265SDFP
R5F21266SDFP
R5F21264JFP
R5F21266JFP
R5F21264KFP
R5F21266KFP
R5F21262SNXXXFP
R5F21264SNXXXFP
R5F21265SNXXXFP
R5F21266SNXXXFP
R5F21262SDXXXFP
R5F21264SDXXXFP
R5F21265SDXXXFP
R5F21266SDXXXFP
R5F21264JXXXFP
R5F21266JXXXFP
R5F21264KXXXFP
R5F21266KXXXFP
ROM
Capacity
8 Kbytes
16 Kbytes
24 Kbytes
32 Kbytes
8 Kbytes
16 Kbytes
24 Kbytes
32 Kbytes
16 Kbytes
32 Kbytes
16 Kbytes
32 Kbytes
8 Kbytes
16 Kbytes
24 Kbytes
32 Kbytes
8 Kbytes
16 Kbytes
24 Kbytes
32 Kbytes
16 Kbytes
32 Kbytes
16 Kbytes
32 Kbytes
RAM
Capacity
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
1 Kbyte
1.5 Kbytes
1 Kbyte
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
1 Kbyte
1.5 Kbytes
1 Kbyte
1.5 Kbytes
NOTE:
1. The user ROM is programmed before shipment.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 5 of 69
Current of Sep. 2008
Package Type
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
Remarks
N version
D version
J version
K version
N version
D version
J version
K version
Factory
programming
product(1)
R8C/26 Group, R8C/27 Group
Part No.
1. Overview
R 5 F 21 26 6 S N XXX FP
Package type:
FP: PLQP0032GB-A
ROM number
Classification
N: Operating ambient temperature -20 to 85°C (N version)
D: Operating ambient temperature -40 to 85°C (D version)
J: Operating ambient temperature -40 to 85°C (J version)
K: Operating ambient temperature -40 to 125°C (K version)
S: Low-voltage version (other no symbols)
ROM capacity
2: 8 KB
4: 16 KB
5: 24 KB
6: 32 KB
R8C/26 Group
R8C/2x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.2
Part Number, Memory Size, and Package of R8C/26 Group
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 6 of 69
R8C/26 Group, R8C/27 Group
Table 1.4
1. Overview
Product Information for R8C/27 Group
Part No.
R5F21272SNFP
R5F21274SNFP
R5F21275SNFP
R5F21276SNFP
R5F21272SDFP
R5F21274SDFP
R5F21275SDFP
R5F21276SDFP
R5F21274JFP
R5F21276JFP
R5F21274KFP
R5F21276KFP
R5F21272SNXXXFP
R5F21274SNXXXFP
R5F21275SNXXXFP
R5F21276SNXXXFP
R5F21272SDXXXFP
R5F21274SDXXXFP
R5F21275SDXXXFP
R5F21276SDXXXFP
R5F21274JXXXFP
R5F21276JXXXFP
R5F21274KXXXFP
R5F21276KXXXFP
ROM Capacity
Program
Data flash
ROM
8 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
24 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
8 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
24 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
8 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
24 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
8 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
24 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
16 Kbytes 1 Kbyte × 2
32 Kbytes 1 Kbyte × 2
NOTE:
1. The user ROM is programmed before shipment.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 7 of 69
Current of Sep. 2008
RAM
Capacity
Package Type
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
1 Kbyte
1.5 Kbytes
1 Kbyte
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
1.5 Kbytes
1 Kbyte
1.5 Kbytes
1 Kbyte
1.5 Kbytes
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
Remarks
N version
D version
J version
K version
N version Factory
programming
product(1)
D version
J version
K version
R8C/26 Group, R8C/27 Group
1. Overview
Part No. R 5 F 21 27 6 S N XXX FP
Package type:
FP: PLQP0032GB-A
ROM number
Classification
N: Operating ambient temperature -20 to 85°C (N version)
D: Operating ambient temperature -40 to 85°C (D version)
J: Operating ambient temperature -40 to 85°C (J version)
K: Operating ambient temperature -40 to 125°C (K version)
S: Low-voltage version (other no symbols)
ROM capacity
2: 8 KB
4: 16 KB
5: 24 KB
6: 32 KB
R8C/27 Group
R8C/2x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.3
Part Number, Memory Size, and Package of R8C/27 Group
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 8 of 69
R8C/26 Group, R8C/27 Group
1.5
1. Overview
Pin Assignments
P1_4/TXD0
P1_3/KI3/AN11/(TRBO)
P1_1/KI1/AN9/TRCIOA/TRCTRG
VREF/P4_2
P1_2/KI2/AN10/TRCIOB
P1_0/KI0/AN8
P3_4/SDA/SCS/(TRCIOC)(2)
P3_3/INT3/SSI/TRCCLK
Figure 1.4 shows Pin Assignments (Top View).
24 23 22 21 20 19 18 17
16
26
15
27
14
R8C/26 Group
R8C/27 Group
28
29
30
13
12
11
PLQP0032GB-A
(32P6U-A)
(top view)
2
P3_5/SCL/SSCK/(TRCIOD)(2)
P3_7/TRAO/SSO/RXD1/(TXD1)(2)
1
3
4
5
6
10
9
7
8
MODE
32
VCC/AVCC
31
VSS/AVSS
XIN/XCIN/P4_6 (3)
P0_6/AN1
P0_5/AN2/CLK1
P0_4/AN3/TREO
P0_3/AN4
P0_2/AN5
P0_1/AN6
P0_0/AN7/(TXD1)(2)
25
RESET
XOUT/XCOUT/P4_7 (1, 3)
P0_7/AN0
P1_5/RXD0/(TRAIO)/(INT1)(2)
P1_6/CLK0/(SSI)(2)
P5_3/TRCIOC
P5_4/TRCIOD
P3_1/TRBO
P3_6/(TXD1)/(RXD1)/(INT1)(2)
P1_7/TRAIO/INT1
P4_5/INT0/(RXD1)(2)
NOTES:
1. P4_7 is an input-only port.
2. Can be assigned to the pin in parentheses by a program.
3. XCIN, XCOUT can be used only for N or D version.
4. Confirm the pin 1 position on the package by referring to the package dimensions.
Figure 1.4
Pin Assignments (Top View)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 9 of 69
R8C/26 Group, R8C/27 Group
1.6
1. Overview
Pin Functions
Table 1.5 lists Pin Functions.
Table 1.5
Pin Functions
Type
Symbol
I/O Type
Description
Power supply input VCC, VSS
I
Apply 2.2 to 5.5 V (J, K version are 2.7 to 5.5 V) to the VCC
pin. Apply 0 V to the VSS pin.
Analog power
supply input
AVCC, AVSS
I
Power supply for the A/D converter.
Connect a capacitor between AVCC and AVSS.
Reset input
RESET
I
Input “L” on this pin resets the MCU.
MODE
MODE
I
Connect this pin to VCC via a resistor.
XIN clock input
XIN
I
XIN clock output
XOUT
O
These pins are provided for XIN clock generation circuit I/O.
Connect a ceramic resonator or a crystal oscillator between the
XIN and XOUT pins. To use an external clock, input it to the
XIN pin and leave the XOUT pin open.
XCIN clock input
(N, D version)
XCIN
I
XCIN clock output
(N, D version)
XCOUT
O
INT interrupt input
INT0, INT1, INT3
I
INT interrupt input pins
Key input interrupt
KI0 to KI3
I
Key input interrupt input pins
Timer RA
These pins are provided for XCIN clock generation circuit I/O.
Connect a crystal oscillator between the XCIN and XCOUT
pins. To use an external clock, input it to the XCIN pin and
leave the XCOUT pin open.
TRAO
O
Timer RA output pin
TRAIO
I/O
Timer RA I/O pin
Timer RB
TRBO
O
Timer RB output pin
Timer RC
TRCCLK
I
External clock input pin
TRCTRG
Timer RE
Serial interface
I2C
bus interface
I
External trigger input pin
TRCIOA, TRCIOB,
TRCIOC, TRCIOD
I/O
Sharing output-compare output / input-capture input / PWM /
PWM2 output pins
TREO
O
Timer RE output pin
CLK0, CLK1
I/O
RXD0, RXD1
I
Receive data input pin
TXD0, TXD1
O
Transmit data output pin
SCL
I/O
Clock I/O pin
SDA
I/O
Data I/O pin
Clock synchronous SSI
serial I/O with chip SCS
select
SSCK
Clock I/O pin
I/O
Data I/O pin
I/O
Chip-select signal I/O pin
I/O
Clock I/O pin
SSO
I/O
Data I/O pin
Reference voltage
input
VREF
I
Reference voltage input pin to A/D converter
A/D converter
AN0 to AN11
I
Analog input pins to A/D converter
I/O port
P0_0 to P0_7,
P1_0 to P1_7,
P3_1, P3_3 to
P3_7,
P4_5,
P5_3, P5_4
I/O
Input port
P4_2, P4_6, P4_7
I: Input
O: Output
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
I
I/O: Input and output
Page 10 of 69
CMOS I/O ports. Each port has an I/O select direction register,
allowing each pin in the port to be directed for input or output
individually.
Any port set to input can be set to use a pull-up resistor or not
by a program.
P1_0 to P1_7 also function as LED drive ports (N, D version).
Input-only ports
R8C/26 Group, R8C/27 Group
Table 1.6
Pin
Number
1. Overview
Pin Name Information by Pin Number
Control Pin
Port
1
P3_5
2
P3_7
3
RESET
4
XOUT/XCOUT(2)
VSS/AVSS
P4_7
XIN/XCIN(2)
VCC/AVCC
MODE
P4_6
5
6
7
8
9
10
11
P4_5
INT0
P1_7
INT1
P3_6
(INT1)(1)
12
13
14
15
P1_6
16
P1_5
17
18
P3_1
P5_4
P5_3
(RXD1)(1, 3)
TRAIO
(TXD1)/
(RXD1)(1, 3)
TRBO
TRCIOD
TRCIOC
CLK0
VRFF
22
(SSI)(1)
(INT1)(1)
(TRAIO)(1)
P1_3
KI3
(TRBO)
AN11
RXD0
P1_4
19
20
21
Interrupt
I/O Pin Functions for of Peripheral Modules
Clock
A/D
Serial
Synchronous I2C bus
Timer
Interface
Serial I/O with Interface Converter
Chip Select
(1)
SSCK
SCL
(TRCIOD)
RXD1/
TRAO
SSO
(TXD1)(1, 3)
TXD0
P1_2
KI2
TRCIOB
AN10
P4_2
P1_1
KI1
TRCIOA/
TRCTRG
AN9
P1_0
KI0
23
P3_3
INT3
24
P3_4
25
26
27
28
29
30
31
32
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
AN8
TRCCLK
SSI
(TRCIOC)(1)
SCS
CLK1
TREO
(TXD1)(1, 3)
SDA
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
NOTES:
1. This can be assigned to the pin in parentheses by a program.
2. XCIN, XCOUT can be used only for N or D version.
3. For the combination of using pins TXD1 and RXD1, refer to Figure 15.7 Registers PINSR1 and
PMR of Hardware Manual (REJ09B0278).
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 11 of 69
R8C/26 Group, R8C/27 Group
2.
2. Central Processing Unit (CPU)
Central Processing Unit (CPU)
Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a
register bank. There are two sets of register bank.
b31
b15
R2
R3
b8b7
b0
R0H (high-order of R0) R0L (low-order of R0)
R1H (high-order of R1) R1L (low-order of R1)
Data registers(1)
R2
R3
A0
A1
FB
b19
b15
Address registers(1)
Frame base register(1)
b0
Interrupt table register
INTBL
INTBH
The 4 high order bits of INTB are INTBH and
the 16 low order bits of INTB are INTBL.
b19
b0
Program counter
PC
b15
b0
USP
User stack pointer
ISP
Interrupt stack pointer
SB
Static base register
b15
b0
FLG
b15
b8
IPL
b7
Flag register
b0
U I O B S Z D C
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bit
Processor interrupt priority level
Reserved bit
NOTE:
1. These registers comprise a register bank. There are two register banks.
Figure 2.1
CPU Registers
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 12 of 69
R8C/26 Group, R8C/27 Group
2.1
2. Central Processing Unit (CPU)
Data Registers (R0, R1, R2, and R3)
R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split
into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are
analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is
analogous to R2R0.
2.2
Address Registers (A0 and A1)
A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also
used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 to be used
as a 32-bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register that indicates the start address of an interrupt vector table.
2.5
Program Counter (PC)
PC is 20 bits wide and indicates the address of the next instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointers (SP), USP, and ISP, are each 16 bits wide. The U flag of FLG is used to switch between
USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register for SB relative addressing.
2.8
Flag Register (FLG)
FLG is an 11-bit register indicating the CPU state.
2.8.1
Carry Flag (C)
The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit.
2.8.2
Debug Flag (D)
The D flag is for debugging only. Set it to 0.
2.8.3
Zero Flag (Z)
The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0.
2.8.4
Sign Flag (S)
The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0.
2.8.5
Register Bank Select Flag (B)
Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1.
2.8.6
Overflow Flag (O)
The O flag is set to 1 when an operation results in an overflow; otherwise to 0.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
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R8C/26 Group, R8C/27 Group
2.8.7
2. Central Processing Unit (CPU)
Interrupt Enable Flag (I)
The I flag enables maskable interrupts.
Interrupt are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0
when an interrupt request is acknowledged.
2.8.8
Stack Pointer Select Flag (U)
ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.
The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software
interrupt numbers 0 to 31 is executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7.
If a requested interrupt has higher priority than IPL, the interrupt is enabled.
2.8.10
Reserved Bit
If necessary, set to 0. When read, the content is undefined.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 14 of 69
R8C/26 Group, R8C/27 Group
3.
3. Memory
Memory
3.1
R8C/26 Group
Figure 3.1 is a Memory Map of R8C/26 Group. The R8C/26 group has 1 Mbyte of address space from addresses
00000h to FFFFFh.
The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal
ROM area is allocated addresses 0C000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each
interrupt routine.
The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 1-Kbyte internal
RAM area is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also for
calling subroutines and as stacks when interrupt requests are acknowledged.
Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control
registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use
and cannot be accessed by users.
00000h
002FFh
SFR
(Refer to 4. Special
Function Registers
(SFRs))
00400h
Internal RAM
0XXXh
0FFDCh
Undefined instruction
Overflow
BRK instruction
Address match
Single step
Watchdog timer/oscillation stop detection/voltage monitor
0YYYYh
(Reserved)
(Reserved)
Reset
Internal ROM
(program ROM)
0FFFFh
0FFFFh
FFFFFh
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Internal ROM
Part Number
R5F21262SNFP, R5F21262SDFP,
R5F21262SNXXXFP, R5F21262SDXXXFP
Internal RAM
Size
Address 0YYYYh
Size
Address 0XXXXh
8 Kbytes
0E000h
512 bytes
005FFh
16 Kbytes
0C000h
1 Kbyte
007FFh
24 Kbytes
0A000h
1.5 Kbytes
009FFh
32 Kbytes
08000h
1.5 Kbytes
009FFh
R5F21264SNFP, R5F21264SDFP,
R5F21264JFP, R5F21264KFP,
R5F21264SNXXXFP, R5F21264SDXXXFP,
R5F21264JXXXFP, R5F21264KXXXFP
R5F21265SNFP, R5F21265SDFP
R5F21265SNXXXFP, R5F21265SDXXXFP
R5F21266SNFP, R5F21266SDFP,
R5F21266JFP, R5F21266KFP,
R5F21266SNXXXFP, R5F21266SDXXXFP,
R5F21266JXXXFP, R5F21266KXXXFP
Figure 3.1
Memory Map of R8C/26 Group
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 15 of 69
R8C/26 Group, R8C/27 Group
3.2
3. Memory
R8C/27 Group
Figure 3.2 is a Memory Map of R8C/27 Group. The R8C/27 group has 1 Mbyte of address space from addresses
00000h to FFFFFh.
The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a
16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each
interrupt routine.
The internal ROM (data flash) is allocated addresses 02400h to 02BFFh.
The internal RAM area is allocated higher addresses, beginning with address 00400h. For example, a 1-Kbyte
internal RAM is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also
for calling subroutines and as stacks when interrupt requests are acknowledged.
Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control
registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use
and cannot be accessed by users.
00000h
002FFh
SFR
(Refer to 4. Special
Function Registers
(SFRs))
00400h
Internal RAM
0XXXXh
02400h
0FFDCh
Internal ROM
(data flash)(1)
02BFFh
Undefined instruction
Overflow
BRK instruction
Address match
Single step
0YYYYh
Watchdog timer/oscillation stop detection/voltage monitor
(Reserved)
(Reserved)
Reset
Internal ROM
(program ROM)
0FFFFh
0FFFFh
FFFFFh
NOTES:
1. Data flash block A (1 Kbyte) and B (1 Kbyte) are shown.
2. The blank regions are reserved. Do not access locations in these regions.
Internal ROM
Part Number
R5F21272SNFP, R5F21272SDFP,
R5F21272SNXXXFP, R5F21272SDXXXFP
R5F21274SNFP, R5F21274SDFP,
R5F21274JFP, R5F21274KFP,
R5F21274SNXXXFP, R5F21274SDXXXFP,
Internal RAM
Size
Address 0YYYYh
Size
Address 0XXXXh
8 Kbytes
0E000h
512 bytes
005FFh
16 Kbytes
0C000h
1 Kbyte
007FFh
24 Kbytes
0A000h
1.5 Kbytes
009FFh
32 Kbytes
08000h
1.5 Kbytes
009FFh
R5F21274JXXXFP, R5F21274KXXXFP
R5F21275SNFP, R5F21275SDFP,
R5F21275SNXXXFP, R5F21275SDXXXFP
R5F21276SNFP, R5F21276SDFP,
R5F21276JFP, R5F21276KFP,
R5F21276SNXXXFP, R5F21276SDXXXFP,
R5F21276JXXXFP, R5F21276KXXXFP
Figure 3.2
Memory Map of R8C/27 Group
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 16 of 69
R8C/26 Group, R8C/27 Group
4.
4. Special Function Registers (SFRs)
Special Function Registers (SFRs)
An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.7 list the special
function registers.
Table 4.1
Address
0000h
0001h
0002h
0003h
0004h
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
SFR Information (1)(1)
Register
Symbol
After reset
Processor Mode Register 0
Processor Mode Register 1
System Clock Control Register 0
System Clock Control Register 1
PM0
PM1
CM0
CM1
00h
00h
01101000b
00100000b
Protect Register
PRCR
00h
Oscillation Stop Detection Register
Watchdog Timer Reset Register
Watchdog Timer Start Register
Watchdog Timer Control Register
Address Match Interrupt Register 0
OCD
WDTR
WDTS
WDC
RMAD0
Address Match Interrupt Enable Register
Address Match Interrupt Register 1
AIER
RMAD1
00000100b
XXh
XXh
00X11111b
00h
00h
00h
00h
00h
00h
00h
Count Source Protection Mode Register
CSPR
00h
10000000b(2)
High-Speed On-Chip Oscillator Control Register 0
High-Speed On-Chip Oscillator Control Register 1
High-Speed On-Chip Oscillator Control Register 2
FRA0
FRA1
FRA2
00h
When shipping
00h
Clock Prescaler Reset Flag
High-Speed On-Chip Oscillator Control Register 4(3)
CPSRF
FRA4
00h
When shipping
High-Speed On-Chip Oscillator Control Register 6(3)
High-Speed On-Chip Oscillator Control Register 7(3)
FRA6
FRA7
When shipping
When shipping
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. The CSPROINI bit in the OFS register is set to 0.
3. In J, K version these regions are reserved. Do not access locations in these regions.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
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R8C/26 Group, R8C/27 Group
Table 4.2
Address
0030h
0031h
0032h
4. Special Function Registers (SFRs)
SFR Information (2)(1)
Register
Symbol
After reset
Voltage Detection Register 1 (2)
Voltage Detection Register 2 (2)
VCA1
VCA2
00001000b
0033h
0034h
0035h
0036h
Voltage Monitor 1 Circuit Control Register (5)
VW1C
0037h
0038h
Voltage Monitor 2 Circuit Control Register (5)
Voltage Monitor 0 Circuit Control Register (6)
VW2C
VW0C
Timer RC Interrupt Control Register
TRCIC
XXXXX000b
Timer RE Interrupt Control Register
TREIC
XXXXX000b
Key Input Interrupt Control Register
A/D Conversion Interrupt Control Register
SSU/IIC bus Interrupt Control Register(9)
KUPIC
ADIC
SSUIC/IICIC
XXXXX000b
XXXXX000b
XXXXX000b
UART0 Transmit Interrupt Control Register
UART0 Receive Interrupt Control Register
UART1 Transmit Interrupt Control Register
UART1 Receive Interrupt Control Register
S0TIC
S0RIC
S1TIC
S1RIC
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
Timer RA Interrupt Control Register
TRAIC
XXXXX000b
Timer RB Interrupt Control Register
INT1 Interrupt Control Register
INT3 Interrupt Control Register
TRBIC
INT1IC
INT3IC
XXXXX000b
XX00X000b
XX00X000b
INT0 Interrupt Control Register
INT0IC
XX00X000b
• N, D version 00h(3)
00100000b(4)
• J, K version 00h(7)
01000000b(8)
• N, D version 00001000b
• J, K version 0000X000b(7)
0100X001b(8)
00h
0000X000b(3)
0100X001b(4)
0039h
003Fh
0040h
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
0058h
0059h
005Ah
005Bh
005Ch
005Dh
005Eh
005Fh
0060h
006Fh
0070h
007Fh
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. (N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register.
(J, K version) Software reset, watchdog timer reset, or voltage monitor 2 reset do not affect this register.
3. The LVD0ON bit in the OFS register is set to 1 and hardware reset.
4. Power-on reset, voltage monitor 0 reset or the LVD0ON bit in the OFS register is set to 0, and hardware reset.
5. (N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect b2 and b3.
(J, K version) Software reset, watchdog timer reset, or voltage monitor 2 reset do not affect b2 and b3.
6. (N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register.
(J, K version) These regions are reserved. Do not access locations in these regions.
7. The LVD1ON bit in the OFS register is set to 1 and hardware reset.
8. Power-on reset, voltage monitor 1 reset, or the LVD1ON bit in the OFS register is set to 0 and hardware reset.
9. Selected by the IICSEL bit in the PMR register.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
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R8C/26 Group, R8C/27 Group
Table 4.3
Address
0080h
0081h
0082h
0083h
0084h
0085h
0086h
0087h
0088h
0089h
008Ah
008Bh
008Ch
008Dh
008Eh
008Fh
0090h
0091h
0092h
0093h
0094h
0095h
0096h
0097h
0098h
0099h
009Ah
009Bh
009Ch
009Dh
009Eh
009Fh
00A0h
00A1h
00A2h
00A3h
00A4h
00A5h
00A6h
00A7h
00A8h
00A9h
00AAh
00ABh
00ACh
00ADh
00AEh
00AFh
00B0h
00B1h
00B2h
00B3h
00B4h
00B5h
00B6h
00B7h
00B8h
00B9h
00BAh
00BBh
00BCh
00BDh
00BEh
00BFh
4. Special Function Registers (SFRs)
SFR Information (3)(1)
Register
Symbol
UART0 Transmit/Receive Mode Register
UART0 Bit Rate Register
UART0 Transmit Buffer Register
U0MR
U0BRG
U0TB
UART0 Transmit/Receive Control Register 0
UART0 Transmit/Receive Control Register 1
UART0 Receive Buffer Register
U0C0
U0C1
U0RB
UART1 Transmit/Receive Mode Register
UART1 Bit Rate Register
UART1 Transmit Buffer Register
U1MR
U1BRG
U1TB
UART1 Transmit/Receive Control Register 0
UART1 Transmit/Receive Control Register 1
UART1 Receive Buffer Register
U1C0
U1C1
U1RB
SS Control Register H / IIC bus Control Register 1(2)
SS Control Register L / IIC bus Control Register 2(2)
SS Mode Register / IIC bus Mode Register(2)
SS Enable Register / IIC bus Interrupt Enable Register(2)
SS Status Register / IIC bus Status Register(2)
SS Mode Register 2 / Slave Address Register(2)
SS Transmit Data Register / IIC bus Transmit Data Register(2)
SS Receive Data Register / IIC bus Receive Data Register(2)
SSCRH / ICCR1
SSCRL / ICCR2
SSMR / ICMR
SSER / ICIER
SSSR / ICSR
SSMR2 / SAR
SSTDR / ICDRT
SSRDR / ICDRR
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. Selected by the IICSEL bit in the PMR register.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 19 of 69
After reset
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
00h
01111101b
00011000b
00h
00h / 0000X000b
00h
FFh
FFh
R8C/26 Group, R8C/27 Group
Table 4.4
Address
00C0h
00C1h
00C2h
00C3h
00C4h
00C5h
00C6h
00C7h
00C8h
00C9h
00CAh
00CBh
00CCh
00CDh
00CEh
00CFh
00D0h
00D1h
00D2h
00D3h
00D4h
00D5h
00D6h
00D7h
00D8h
00D9h
00DAh
00DBh
00DCh
00DDh
00DEh
00DFh
00E0h
00E1h
00E2h
00E3h
00E4h
00E5h
00E6h
00E7h
00E8h
00E9h
00EAh
00EBh
00ECh
00EDh
00EEh
00EFh
00F0h
00F1h
00F2h
00F3h
00F4h
00F5h
00F6h
00F7h
00F8h
00F9h
00FAh
00FBh
00FCh
00FDh
00FEh
00FFh
4. Special Function Registers (SFRs)
SFR Information (4)(1)
Register
Symbol
After reset
A/D Register
AD
XXh
XXh
A/D Control Register 2
ADCON2
00h
A/D Control Register 0
A/D Control Register 1
ADCON0
ADCON1
00h
00h
Port P0 Register
Port P1 Register
Port P0 Direction Register
Port P1 Direction Register
P0
P1
PD0
PD1
00h
00h
00h
00h
Port P3 Register
P3
00h
Port P3 Direction Register
Port P4 Register
Port P5 Register
Port P4 Direction Register
Port P5 Direction Register
PD3
P4
P5
PD4
PD5
00h
00h
00h
00h
00h
Pin Select Register 1
Pin Select Register 2
Pin Select Register 3
Port Mode Register
External Input Enable Register
INT Input Filter Select Register
Key Input Enable Register
Pull-Up Control Register 0
Pull-Up Control Register 1
Port P1 Drive Capacity Control Register(2)
PINSR1
PINSR2
PINSR3
PMR
INTEN
INTF
KIEN
PUR0
PUR1
P1DRR
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. In J, K version these regions are reserved. Do not access locations in these regions.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 20 of 69
R8C/26 Group, R8C/27 Group
Table 4.5
Address
0100h
0101h
0102h
0103h
0104h
0105h
0106h
0107h
0108h
0109h
010Ah
010Bh
010Ch
010Dh
010Eh
010Fh
0110h
0111h
0112h
0113h
0114h
0115h
0116h
0117h
0118h
0119h
011Ah
011Bh
011Ch
011Dh
011Eh
011Fh
0120h
0121h
0122h
0123h
0124h
0125h
0126h
0127h
0128h
0129h
012Ah
012Bh
012Ch
012Dh
012Eh
012Fh
0130h
0131h
0132h
0133h
0134h
0135h
0136h
0137h
0138h
0139h
013Ah
013Bh
013Ch
013Dh
013Eh
013Fh
4. Special Function Registers (SFRs)
SFR Information (5)(1)
Timer RA Control Register
Timer RA I/O Control Register
Timer RA Mode Register
Timer RA Prescaler Register
Timer RA Register
Register
Symbol
TRACR
TRAIOC
TRAMR
TRAPRE
TRA
00h
00h
00h
FFh
FFh
LIN Control Register
LIN Status Register
Timer RB Control Register
Timer RB One-Shot Control Register
Timer RB I/O Control Register
Timer RB Mode Register
Timer RB Prescaler Register
Timer RB Secondary Register
Timer RB Primary Register
LINCR
LINST
TRBCR
TRBOCR
TRBIOC
TRBMR
TRBPRE
TRBSC
TRBPR
00h
00h
00h
00h
00h
00h
FFh
FFh
FFh
Timer RE Second Data Register / Counter Data Register
Timer RE Minute Data Register / Compare Data Register
Timer RE Hour Data Register(2)
Timer RE Day of Week Data Register(2)
Timer RE Control Register 1
Timer RE Control Register 2
Timer RE Count Source Select Register
TRESEC
TREMIN
TREHR
TREWK
TRECR1
TRECR2
TRECSR
00h
00h
00h
00h
00h
00h
00001000b
Timer RC Mode Register
Timer RC Control Register 1
Timer RC Interrupt Enable Register
Timer RC Status Register
Timer RC I/O Control Register 0
Timer RC I/O Control Register 1
Timer RC Counter
TRCMR
TRCCR1
TRCIER
TRCSR
TRCIOR0
TRCIOR1
TRC
Timer RC General Register A
TRCGRA
Timer RC General Register B
TRCGRB
Timer RC General Register C
TRCGRC
Timer RC General Register D
TRCGRD
Timer RC Control Register 2
Timer RC Digital Filter Function Select Register
Timer RC Output Master Enable Register
TRCCR2
TRCDF
TRCOER
01001000b
00h
01110000b
01110000b
10001000b
10001000b
00h
00h
FFh
FFh
FFh
FFh
FFh
FFh
FFh
FFh
00011111b
00h
01111111b
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. In J, K version these regions are reserved. Do not access locations in these regions.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 21 of 69
After reset
R8C/26 Group, R8C/27 Group
Table 4.6
4. Special Function Registers (SFRs)
SFR Information (6)(1)
Address
0140h
0141h
0142h
0143h
0144h
0145h
0146h
0147h
0148h
0149h
014Ah
014Bh
014Ch
014Dh
014Eh
014Fh
0150h
0151h
0152h
0153h
0154h
0155h
0156h
0157h
0158h
0159h
015Ah
015Bh
015Ch
015Dh
015Eh
015Fh
0160h
0161h
0162h
0163h
0164h
0165h
0166h
0167h
0168h
0169h
016Ah
016Bh
016Ch
016Dh
016Eh
016Fh
0170h
0171h
0172h
0173h
0174h
0175h
0176h
0177h
0178h
0179h
017Ah
017Bh
017Ch
017Dh
017Eh
017Fh
Register
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 22 of 69
Symbol
After reset
R8C/26 Group, R8C/27 Group
Table 4.7
Address
0180h
0181h
0182h
0183h
0184h
0185h
0186h
0187h
0188h
0189h
018Ah
018Bh
018Ch
018Dh
018Eh
018Fh
0190h
0191h
0192h
0193h
0194h
0195h
0196h
0197h
0198h
0199h
019Ah
019Bh
019Ch
019Dh
019Eh
019Fh
01A0h
01A1h
01A2h
01A3h
01A4h
01A5h
01A6h
01A7h
01A8h
01A9h
01AAh
01ABh
01ACh
01ADh
01AEh
01AFh
01B0h
01B1h
01B2h
01B3h
01B4h
01B5h
01B6h
01B7h
01B8h
01B9h
01BAh
01BBh
01BCh
01BDh
01BEh
01BFh
FFFFh
4. Special Function Registers (SFRs)
SFR Information (7)(1)
Register
Symbol
After reset
Flash Memory Control Register 4
FMR4
01000000b
Flash Memory Control Register 1
FMR1
1000000Xb
Flash Memory Control Register 0
FMR0
00000001b
Option Function Select Register
OFS
(Note 2)
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. The OFS register cannot be changed by a program. Use a flash programmer to write to it.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 23 of 69
R8C/26 Group, R8C/27 Group
5.
5. Electrical Characteristics
Electrical Characteristics
5.1
N, D Version
Table 5.1
Absolute Maximum Ratings
Symbol
Parameter
Rated Value
Unit
-0.3 to 6.5
V
Input voltage
-0.3 to VCC + 0.3
V
VO
Output voltage
-0.3 to VCC + 0.3
V
Pd
Power dissipation
500
mW
Topr
Operating ambient temperature
-20 to 85 (N version) /
-40 to 85 (D version)
°C
Tstg
Storage temperature
-65 to 150
°C
VCC/AVCC
Supply voltage
VI
Table 5.2
IOH(sum)
IOH(peak)
Sum of all pins IOH(peak)
Min.
2.2
−
0.8 VCC
0
−
Standard
Typ.
−
0
−
−
−
Max.
5.5
−
VCC
0.2 VCC
-160
Sum of all pins IOH(avg)
−
−
-80
mA
Except P1_0 to P1_7
P1_0 to P1_7
Except P1_0 to P1_7
P1_0 to P1_7
Sum of all pins IOL(peak)
−
−
−
−
−
−
−
−
−
−
-10
-40
-5
-20
160
mA
mA
mA
mA
mA
−
−
80
mA
−
−
−
−
0
0
0
0
0
0
0
−
−
−
−
−
−
−
−
−
−
−
−
125
10
40
5
20
20
10
5
70
20
10
5
−
mA
mA
mA
mA
MHz
MHz
MHz
kHz
MHz
MHz
MHz
kHz
−
−
20
MHz
−
−
10
MHz
−
−
5
MHz
Parameter
Supply voltage
Supply voltage
Input “H” voltage
Input “L” voltage
Peak sum output
“H” current
Average sum
output “H” current
Peak output “H”
current
IOH(avg)
Average output
“H” current
IOL(sum)
Peak sum output
“L” currents
Average sum
Sum of all pins IOL(avg)
output “L” currents
Peak output “L”
Except P1_0 to P1_7
currents
P1_0 to P1_7
Average output
Except P1_0 to P1_7
“L” current
P1_0 to P1_7
XIN clock input oscillation frequency
IOL(sum)
IOL(peak)
IOL(avg)
f(XIN)
f(XCIN)
−
Topr = 25°C
Recommended Operating Conditions
Symbol
VCC/AVCC
VSS/AVSS
VIH
VIL
IOH(sum)
Condition
XCIN clock input oscillation frequency
System clock
OCD2 = 0
XlN clock selected
OCD2 = 1
On-chip oscillator clock
selected
Conditions
3.0 V ≤ VCC ≤ 5.5 V
2.7 V ≤ VCC < 3.0 V
2.2 V ≤ VCC < 2.7 V
2.2 V ≤ VCC ≤ 5.5 V
3.0 V ≤ VCC ≤ 5.5 V
2.7 V ≤ VCC < 3.0 V
2.2 V ≤ VCC < 2.7 V
FRA01 = 0
Low-speed on-chip
oscillator clock selected
FRA01 = 1
High-speed on-chip
oscillator clock selected
3.0 V ≤ VCC ≤ 5.5 V
FRA01 = 1
High-speed on-chip
oscillator clock selected
2.7 V ≤ VCC ≤ 5.5 V
FRA01 = 1
High-speed on-chip
oscillator clock selected
2.2 V ≤ VCC ≤ 5.5 V
NOTES:
1. VCC = 2.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 24 of 69
Unit
V
V
V
V
mA
R8C/26 Group, R8C/27 Group
Table 5.3
5. Electrical Characteristics
A/D Converter Characteristics
Symbol
Parameter
−
Resolution
−
Absolute
accuracy
Conditions
Standard
Min.
Typ.
Max.
Unit
Vref = AVCC
−
−
10
Bits
10-bit mode
φAD = 10 MHz, Vref = AVCC = 5.0 V
−
−
±3
LSB
8-bit mode
φAD = 10 MHz, Vref = AVCC = 5.0 V
−
−
±2
LSB
10-bit mode
φAD = 10 MHz, Vref = AVCC = 3.3 V
−
−
±5
LSB
8-bit mode
φAD = 10 MHz, Vref = AVCC = 3.3 V
−
−
±2
LSB
10-bit mode
φAD = 5 MHz, Vref = AVCC = 2.2 V
−
−
±5
LSB
8-bit mode
φAD = 5 MHz, Vref = AVCC = 2.2 V
−
−
±2
LSB
Rladder
Resistor ladder
Vref = AVCC
10
−
40
kΩ
tconv
Conversion time 10-bit mode
φAD = 10 MHz, Vref = AVCC = 5.0 V
3.3
−
−
µs
φAD = 10 MHz, Vref = AVCC = 5.0 V
2.8
−
−
µs
2.2
−
AVCC
V
0
−
AVCC
V
0.25
−
10
MHz
8-bit mode
Vref
Reference voltage
VIA
Analog input voltage(2)
−
A/D operating
clock frequency
Without sample and hold
Vref = AVCC = 2.7 to 5.5 V
With sample and hold
Vref = AVCC = 2.7 to 5.5 V
1
−
10
MHz
Without sample and hold
Vref = AVCC = 2.2 to 5.5 V
0.25
−
5
MHz
With sample and hold
Vref = AVCC = 2.2 to 5.5 V
1
−
5
MHz
NOTES:
1. AVCC = 2.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in
8-bit mode.
P0
P1
P3
30pF
P4
P5
Figure 5.1
Ports P0, P1, and P3 to P5 Timing Measurement Circuit
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 25 of 69
R8C/26 Group, R8C/27 Group
Table 5.4
Flash Memory (Program ROM) Electrical Characteristics
Symbol
−
5. Electrical Characteristics
Parameter
Program/erase endurance(2)
Conditions
Standard
Unit
Min.
Typ.
Max.
R8C/26 Group
100(3)
−
−
times
R8C/27 Group
1,000(3)
−
−
times
µs
−
Byte program time
−
50
400
−
Block erase time
−
0.4
9
s
td(SR-SUS)
Time delay from suspend request until
suspend
−
−
97 + CPU clock
× 6 cycles
µs
−
Interval from erase start/restart until
following suspend request
650
−
−
µs
−
Interval from program start/restart until
following suspend request
0
−
−
ns
−
Time from suspend until program/erase
restart
−
−
3 + CPU clock
× 4 cycles
µs
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
2.2
−
5.5
V
−
Program, erase temperature
0
−
60
°C
−
Data hold time(7)
20
−
−
year
Ambient temperature = 55°C
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 100 or 1,000), each block can be erased n times. For example, if 1,024
1-byte writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. It is also advisable to retain data on the erasure endurance of each block and limit
the number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 26 of 69
R8C/26 Group, R8C/27 Group
Table 5.5
5. Electrical Characteristics
Flash Memory (Data flash Block A, Block B) Electrical Characteristics(4)
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
−
Program/erase endurance(2)
10,000(3)
−
−
times
−
Byte program time
(program/erase endurance ≤ 1,000 times)
−
50
400
µs
−
Byte program time
(program/erase endurance > 1,000 times)
−
65
−
µs
−
Block erase time
(program/erase endurance ≤ 1,000 times)
−
0.2
9
s
−
Block erase time
(program/erase endurance > 1,000 times)
−
0.3
−
s
td(SR-SUS)
Time delay from suspend request until
suspend
−
−
97 + CPU clock
× 6 cycles
µs
−
Interval from erase start/restart until
following suspend request
650
−
−
µs
−
Interval from program start/restart until
following suspend request
0
−
−
ns
−
Time from suspend until program/erase
restart
−
−
3 + CPU clock
× 4 cycles
µs
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
2.2
−
5.5
V
−
Program, erase temperature
-20(8)
−
85
°C
−
Data hold time(9)
20
−
−
year
Ambient temperature = 55°C
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 10,000), each block can be erased n times. For example, if 1,024 1-byte
writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. Standard of block A and block B when program and erase endurance exceeds 1,000 times. Byte program time to 1,000 times
is the same as that in program ROM.
5. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. In addition, averaging the erasure endurance between blocks A and B can further
reduce the actual erasure endurance. It is also advisable to retain data on the erasure endurance of each block and limit the
number of erase operations to a certain number.
6. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
7. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
8. -40°C for D version.
9. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 27 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Suspend request
(maskable interrupt request)
FMR46
Clock-dependent
time
Fixed time
Access restart
td(SR-SUS)
Figure 5.2
Table 5.6
Time delay until Suspend
Voltage Detection 0 Circuit Electrical Characteristics
Symbol
Parameter
Condition
Vdet0
Voltage detection level
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(2)
Vccmin
MCU operating voltage minimum value
VCA25 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
2.2
2.3
2.4
V
−
0.9
−
µA
−
−
300
µs
2.2
−
−
V
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version).
2. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2
register to 0.
Table 5.7
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Vdet1
Parameter
Condition
Voltage detection level(4)
−
Voltage monitor 1 interrupt request generation
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
time(2)
VCA26 = 1, VCC = 5.0 V
Standard
Min.
Typ.
Max.
2.70
2.85
3.00
Unit
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version).
2. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1.
3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2
register to 0.
4. This parameter shows the voltage detection level when the power supply drops.
The voltage detection level when the power supply rises is higher than the voltage detection level when the power supply
drops by approximately 0.1 V.
Table 5.8
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Vdet2
Parameter
Condition
Voltage detection level
−
Voltage monitor 2 interrupt request generation
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
time(2)
VCA27 = 1, VCC = 5.0 V
Standard
Min.
Typ.
Max.
3.3
3.6
3.9
Unit
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version).
2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2.
3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2
register to 0.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 28 of 69
R8C/26 Group, R8C/27 Group
Table 5.9
5. Electrical Characteristics
Power-on Reset Circuit, Voltage Monitor 0 Reset Electrical Characteristics(3)
Symbol
Parameter
Condition
Standard
Min.
Typ.
Unit
Max.
Vpor1
Power-on reset valid voltage(4)
−
−
0.1
V
Vpor2
Power-on reset or voltage monitor 0 reset valid
voltage
0
−
Vdet0
V
trth
External power VCC rise gradient(2)
20
−
−
mV/msec
NOTES:
1. The measurement condition is Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. This condition (external power VCC rise gradient) does not apply if VCC ≥ 1.0 V.
3. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVD0ON bit in the OFS register to 0, the
VW0C0 and VW0C6 bits in the VW0C register to 1 respectively, and the VCA25 bit in the VCA2 register to 1.
4. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on
reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if -20°C ≤ Topr ≤ 85°C, maintain tw(por1) for
3,000 s or more if -40°C ≤ Topr < -20°C.
Vdet0(3)
Vdet0(3)
2.2 V
trth
trth
External
Power VCC
Vpor2
Vpor1
Sampling time(1, 2)
tw(por1)
Internal
reset signal
(“L” valid)
1
× 32
fOCO-S
1
× 32
fOCO-S
NOTES:
1. When using the voltage monitor 0 digital filter, ensure that the voltage is within the MCU operation voltage
range (2.2 V or above) during the sampling time.
2. The sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details.
3. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual for details.
Figure 5.3
Reset Circuit Electrical Characteristics
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 29 of 69
R8C/26 Group, R8C/27 Group
Table 5.10
High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
fOCO40M
5. Electrical Characteristics
Parameter
High-speed on-chip oscillator frequency
temperature • supply voltage dependence
High-speed on-chip oscillator frequency when
correction value in FRA7 register is written to
FRA1 register(4)
−
Value in FRA1 register after reset
−
Oscillation frequency adjustment unit of highspeed on-chip oscillator
−
Oscillation stability time
−
Self power consumption at oscillation
Condition
Standard
Unit
Min.
Typ.
Max.
VCC = 4.75 to 5.25 V
0°C ≤ Topr ≤ 60°C(2)
39.2
40
40.8
MHz
VCC = 3.0 to 5.5 V
-20°C ≤ Topr ≤ 85°C(2)
38.8
40
41.2
MHz
VCC = 3.0 to 5.5 V
-40°C ≤ Topr ≤ 85°C(2)
38.4
40
41.6
MHz
VCC = 2.7 to 5.5 V
-20°C ≤ Topr ≤ 85°C(2)
38
40
42
MHz
VCC = 2.7 to 5.5 V
-40°C ≤ Topr ≤ 85°C(2)
37.6
40
42.4
MHz
VCC = 2.2 to 5.5 V
-20°C ≤ Topr ≤ 85°C(3)
35.2
40
44.8
MHz
VCC = 2.2 to 5.5 V
-40°C ≤ Topr ≤ 85°C(3)
34
40
46
MHz
VCC = 5.0 V ± 10%
-20°C ≤ Topr ≤ 85°C(2)
38.8
40
40.8
MHz
VCC = 5.0 V ± 10%
-40°C ≤ Topr ≤ 85°C(2)
38.4
40
40.8
MHz
−
36.864
−
MHz
-3%
−
3%
%
08h(3)
−
F7h(3)
−
Adjust FRA1 register
(value after reset) to -1
−
+0.3
−
MHz
−
10
100
µs
VCC = 5.0 V, Topr = 25°C
−
400
−
µA
VCC = 5.0 V, Topr = 25°C
VCC = 3.0 to 5.5 V
-20°C ≤ Topr ≤ 85°C
NOTES:
1. VCC = 2.2 to 5.5 V, Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. These standard values show when the FRA1 register value after reset is assumed.
3. These standard values show when the corrected value of the FRA6 register is written to the FRA1 register.
4. This enables the setting errors of bit rates such as 9600 bps and 38400 bps to be 0% when the serial interface is used in
UART mode.
Table 5.11
Low-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
fOCO-S
Low-speed on-chip oscillator frequency
30
125
250
−
Oscillation stability time
−
10
100
µs
−
Self power consumption at oscillation
−
15
−
µA
VCC = 5.0 V, Topr = 25°C
kHz
NOTE:
1. VCC = 2.2 to 5.5 V, Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
Table 5.12
Power Supply Circuit Timing Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
td(P-R)
Time for internal power supply stabilization during
power-on(2)
1
−
2000
µs
td(R-S)
STOP exit time(3)
−
−
150
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = 25°C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 30 of 69
R8C/26 Group, R8C/27 Group
Table 5.13
Symbol
5. Electrical Characteristics
Timing Requirements of Clock Synchronous Serial I/O with Chip Select(1)
Parameter
Conditions
Standard
Min.
Typ.
Unit
Max.
tSUCYC
SSCK clock cycle time
4
−
−
tCYC(2)
tHI
SSCK clock “H” width
0.4
−
0.6
tSUCYC
tLO
SSCK clock “L” width
0.4
−
0.6
tSUCYC
tRISE
SSCK clock rising
time
Master
−
−
1
tCYC(2)
Slave
−
−
1
µs
tFALL
SSCK clock falling
time
Master
−
−
1
tCYC(2)
−
−
1
µs
tSU
SSO, SSI data input setup time
100
−
−
ns
tH
SSO, SSI data input hold time
1
−
−
tCYC(2)
tLEAD
Slave
SCS setup time
Slave
1tCYC + 50
−
−
ns
tLAG
SCS hold time
Slave
1tCYC + 50
−
−
ns
tOD
SSO, SSI data output delay time
tSA
SSI slave access time
tOR
SSI slave out open time
−
−
1
tCYC(2)
2.7 V ≤ VCC ≤ 5.5 V
−
−
1.5tCYC + 100
ns
2.2 V ≤ VCC < 2.7 V
−
−
1.5tCYC + 200
ns
2.7 V ≤ VCC ≤ 5.5 V
−
−
1.5tCYC + 100
ns
2.2 V ≤ VCC < 2.7 V
−
−
1.5tCYC + 200
ns
NOTES:
1. VCC = 2.2 to 5.5 V, VSS = 0 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 31 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Master, CPHS = 1
VIH or VOH
SCS (output)
VIH or VOH
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
4-Wire Bus Communication Mode, Master, CPHS = 0
VIH or VOH
SCS (output)
VIH or VOH
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
CPHS, CPOS: Bits in SSMR register
Figure 5.4
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Master)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 32 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Slave, CPHS = 1
VIH or VOH
SCS (input)
VIH or VOH
tLEAD
tHI
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
4-Wire Bus Communication Mode, Slave, CPHS = 0
VIH or VOH
SCS (input)
VIH or VOH
tHI
tLEAD
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
CPHS, CPOS: Bits in SSMR register
Figure 5.5
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Slave)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 33 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
tHI
VIH or VOH
SSCK
VIH or VOH
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
Figure 5.6
tH
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Clock Synchronous
Communication Mode)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 34 of 69
R8C/26 Group, R8C/27 Group
Table 5.14
5. Electrical Characteristics
Timing Requirements of I2C bus Interface(1)
tSCL
SCL input cycle time
tSCLH
SCL input “H” width
Standard
Typ.
−
12tCYC + 600(2)
−
3tCYC + 300(2)
tSCLL
SCL input “L” width
500(2)
tsf
tSP
SCL, SDA input fall time
SCL, SDA input spike pulse rejection time
tBUF
SDA input bus-free time
5tCYC(2)
−
1tCYC(2)
−
tSTAH
Start condition input hold time
3tCYC(2)
−
−
ns
tSTAS
Retransmit start condition input setup time
3tCYC(2)
−
−
ns
tSTOP
Stop condition input setup time
3tCYC(2)
−
−
ns
tSDAS
Data input setup time
−
−
ns
tSDAH
Data input hold time
1tCYC + 20(2)
0
−
−
ns
Symbol
Parameter
Condition
Min.
5tCYC +
−
−
Unit
Max.
−
ns
−
ns
−
ns
−
300
−
ns
ns
−
NOTES:
1. VCC = 2.2 to 5.5 V, VSS = 0 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOP
SCL
P(2)
S(1)
tsf
Sr(3)
tSCLL
tsr
tSCL
NOTES:
1. Start condition
2. Stop condition
3. Retransmit start condition
Figure 5.7
I/O Timing of I2C bus Interface
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 35 of 69
P(2)
tSDAS
tSDAH
ns
R8C/26 Group, R8C/27 Group
Table 5.15
Electrical Characteristics (1) [VCC = 5 V]
Symbol
VOH
Parameter
Output “H” voltage Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
XOUT
VOL
Output “L” voltage Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
XOUT
VT+-VT-
5. Electrical Characteristics
Hysteresis
Condition
IOH = −5 mA
IOH = -200 µA
Drive capacity HIGH
Drive capacity LOW
Drive capacity HIGH
Drive capacity LOW
IOL = 5 mA
IOL = 200 µA
Drive capacity HIGH
Drive capacity LOW
Drive capacity HIGH
Drive capacity LOW
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, RXD0, RXD1,
CLK0, CLK1,
SSI, SCL, SDA, SSO
RESET
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
Input “H” current
Input “L” current
Pull-up resistance
Feedback
XIN
resistance
Feedback
XCIN
resistance
RAM hold voltage
VI = 5 V, VCC = 5 V
VI = 0 V, VCC = 5 V
VI = 0 V, VCC = 5 V
During stop mode
IOH = -20 mA
IOH = -5 mA
IOH = -1 mA
IOH = -500 µA
IOL = 20 mA
IOL = 5 mA
IOL = 1 mA
IOL = 500 µA
Min.
VCC - 2.0
VCC - 0.5
VCC - 2.0
VCC - 2.0
VCC - 2.0
VCC - 2.0
−
−
−
−
−
−
0.1
Standard
Typ.
−
−
−
−
−
−
−
−
−
−
−
−
0.5
Max.
VCC
VCC
VCC
VCC
VCC
VCC
2.0
0.45
2.0
2.0
2.0
2.0
−
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
0.1
1.0
−
V
−
−
−
30
−
50
1.0
5.0
-5.0
167
−
µA
−
µA
kΩ
MΩ
−
18
−
MΩ
1.8
−
−
V
NOTE:
1. VCC = 4.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 20 MHz, unless otherwise specified.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 36 of 69
R8C/26 Group, R8C/27 Group
Table 5.16
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [Vcc = 5 V]
(Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 3.3 to 5.5 V)
clock mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed
on-chip
oscillator
mode
Low-speed
on-chip
oscillator
mode
Low-speed
clock mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 37 of 69
XIN = 20 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 16 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 20 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN = 16 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator on fOCO = 20 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
XIN clock off
High-speed on-chip oscillator on fOCO = 20 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
Program operation on RAM
Flash memory off, FMSTP = 1
Min.
−
Standard
Typ.
Max.
10
17
Unit
mA
−
9
15
mA
−
6
−
mA
−
5
−
mA
−
4
−
mA
−
2.5
−
mA
−
10
15
mA
−
4
−
mA
−
5.5
10
mA
−
2.5
−
mA
−
130
300
µA
−
130
300
µA
−
30
−
µA
R8C/26 Group, R8C/27 Group
Table 5.17
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (3) [Vcc = 5 V]
(Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current Wait mode
(VCC = 3.3 to 5.5 V)
Single-chip mode,
output pins are open,
other pins are VSS
Stop mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 38 of 69
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
XIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
Min.
−
Standard
Typ.
Max.
25
75
Unit
µA
−
23
60
µA
−
4.0
−
µA
−
2.2
−
µA
−
0.8
3.0
µA
−
1.2
−
µA
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V]
Table 5.18
XIN Input, XCIN Input
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
50
−
25
−
25
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 5 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.8
Table 5.19
XIN Input and XCIN Input Timing Diagram when VCC = 5 V
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
100
−
40
−
40
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.9
TRAIO Input Timing Diagram when VCC = 5 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 39 of 69
Unit
ns
ns
ns
VCC = 5 V
R8C/26 Group, R8C/27 Group
Table 5.20
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
200
−
100
−
100
−
−
50
0
−
50
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0 or 1
VCC = 5 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 1
Figure 5.10
Table 5.21
Serial Interface Timing Diagram when VCC = 5 V
External Interrupt INTi (i = 0, 1, 3) Input
tW(INH)
INTi input “H” width
Standard
Min.
Max.
(1)
−
250
tW(INL)
INTi input “L” width
250(2)
Symbol
Parameter
−
Unit
ns
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
tW(INL)
INTi input
tW(INH)
i = 0, 1, 3
Figure 5.11
External Interrupt INTi Input Timing Diagram when VCC = 5 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 40 of 69
R8C/26 Group, R8C/27 Group
Table 5.22
Electrical Characteristics (3) [VCC = 3 V]
Symbol
VOH
5. Electrical Characteristics
Parameter
Output “H” voltage
Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
Output “L” voltage
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
Input “H” current
Input “L” current
Pull-up resistance
Feedback resistance
Feedback resistance
RAM hold voltage
Max.
VCC
Unit
V
VCC - 0.5
−
VCC
V
IOH = -1 mA
VCC - 0.5
−
VCC
V
IOH = -0.1 mA
VCC - 0.5
−
VCC
V
IOH = -50 µA
VCC - 0.5
−
VCC
V
−
−
0.5
V
Drive capacity
HIGH
Drive capacity
LOW
Drive capacity
HIGH
Drive capacity
LOW
IOL = 5 mA
−
−
0.5
V
IOL = 1 mA
−
−
0.5
V
IOL = 0.1 mA
−
−
0.5
V
IOL = 50 µA
−
−
0.5
V
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, RXD0, RXD1,
CLK0, CLK1,
SSI, SCL, SDA, SSO
0.1
0.3
−
V
RESET
0.1
0.4
−
V
−
−
−
66
−
−
1.8
160
3.0
18
−
4.0
-4.0
500
−
−
−
µA
−
Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
Hysteresis
Standard
Typ.
−
IOH = -5 mA
XOUT
VT+-VT-
IOH = -1 mA
Min.
VCC - 0.5
Drive capacity
HIGH
Drive capacity
LOW
Drive capacity
HIGH
Drive capacity
LOW
IOL = 1 mA
XOUT
VOL
Condition
VI = 3 V, VCC = 3 V
VI = 0 V, VCC = 3 V
VI = 0 V, VCC = 3 V
XIN
XCIN
During stop mode
µA
kΩ
MΩ
MΩ
V
NOTE:
1. VCC = 2.7 to 3.3 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 10 MHz, unless otherwise specified.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 41 of 69
R8C/26 Group, R8C/27 Group
Table 5.23
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [Vcc = 3 V]
(Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 2.7 to 3.3 V)
clock mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed
on-chip
oscillator
mode
Low-speed
on-chip
oscillator
mode
Low-speed
clock mode
Wait mode
Stop mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 42 of 69
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
Program operation on RAM
Flash memory off, FMSTP = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
XIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
Min.
−
Standard
Typ.
Max.
6
−
Unit
mA
−
2
−
mA
−
5
9
mA
−
2
−
mA
−
130
300
µA
−
130
300
µA
−
30
−
µA
−
25
70
µA
−
23
55
µA
−
3.8
−
µA
−
2.0
−
µA
−
0.7
3.0
µA
−
1.1
−
µA
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) [VCC = 3 V]
Table 5.24
XIN Input, XCIN Input
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
100
−
40
−
40
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 3 V
tWH(XIN)
XIN input
tWL(XIN)
XIN Input and XCIN Input Timing Diagram when VCC = 3 V
Figure 5.12
Table 5.25
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
300
−
120
−
120
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.13
TRAIO Input Timing Diagram when VCC = 3 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 43 of 69
Unit
ns
ns
ns
VCC = 3 V
R8C/26 Group, R8C/27 Group
Table 5.26
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
300
−
150
−
150
−
−
80
0
−
70
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi Input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0 or 1
VCC = 3 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 1
Figure 5.14
Table 5.27
Serial Interface Timing Diagram when VCC = 3 V
External Interrupt INTi (i = 0, 1, 3) Input
INTi input “H” width
Standard
Min.
Max.
−
380(1)
INTi input “L” width
380(2)
Symbol
tW(INH)
tW(INL)
Parameter
Unit
−
ns
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
tW(INL)
INTi input
tW(INH)
i = 0, 1, 3
Figure 5.15
External Interrupt INTi Input Timing Diagram when VCC = 3 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 44 of 69
R8C/26 Group, R8C/27 Group
Table 5.28
Electrical Characteristics (5) [VCC = 2.2 V]
Symbol
VOH
5. Electrical Characteristics
Parameter
Output “H” voltage
Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
Output “L” voltage
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
Input “H” current
Input “L” current
Pull-up resistance
Feedback resistance
Feedback resistance
RAM hold voltage
Max.
VCC
V
−
VCC
V
IOH = -1 mA
VCC - 0.5
−
VCC
V
IOH = -0.1 mA
VCC - 0.5
−
VCC
V
IOH = -50 µA
VCC - 0.5
−
VCC
V
−
−
0.5
V
Drive capacity
HIGH
Drive capacity
LOW
Drive capacity
HIGH
Drive capacity
LOW
IOL = 2 mA
−
−
0.5
V
IOL = 1 mA
−
−
0.5
V
IOL = 0.1 mA
−
−
0.5
V
IOL = 50 µA
−
−
0.5
V
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, RXD0, RXD1,
CLK0, CLK1,
SSI, SCL, SDA, SSO
0.05
0.3
−
V
RESET
0.05
0.15
−
V
−
−
−
100
−
−
1.8
200
5
35
−
4.0
-4.0
600
−
−
−
µA
−
VI = 2.2 V
VI = 0 V
VI = 0 V
XIN
XCIN
During stop mode
NOTE:
1. VCC = 2.2 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 5 MHz, unless otherwise specified.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Unit
VCC - 0.5
Except P1_0 to P1_7,
XOUT
P1_0 to P1_7
Hysteresis
Standard
Typ.
−
IOH = -2 mA
XOUT
VT+-VT-
IOH = -1 mA
Min.
VCC - 0.5
Drive capacity
HIGH
Drive capacity
LOW
Drive capacity
HIGH
Drive capacity
LOW
IOL = 1 mA
XOUT
VOL
Condition
Page 45 of 69
µA
kΩ
MΩ
MΩ
V
R8C/26 Group, R8C/27 Group
Table 5.29
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (6) [Vcc = 2.2 V]
(Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 2.2 to 2.7 V)
clock mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed
on-chip
oscillator
mode
Low-speed
on-chip
oscillator
mode
Low-speed
clock mode
Wait mode
Stop mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 46 of 69
XIN = 5 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 5 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator on fOCO = 5 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
XIN clock off
High-speed on-chip oscillator on fOCO = 5 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
Program operation on RAM
Flash memory off, FMSTP = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
XIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
Min.
−
Standard
Typ.
Max.
3.5
−
Unit
mA
−
1.5
−
mA
−
3.5
−
mA
−
1.5
−
mA
−
100
230
µA
−
100
230
µA
−
25
−
µA
−
22
60
µA
−
20
55
µA
−
3.0
−
µA
−
1.8
−
µA
−
0.7
3.0
µA
−
1.1
−
µA
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C) [VCC = 2.2 V]
Table 5.30
XIN Input, XCIN Input
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
200
−
90
−
90
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 2.2 V
tWH(XIN)
XIN input
tWL(XIN)
XIN Input and XCIN Input Timing Diagram when VCC = 2.2 V
Figure 5.16
Table 5.31
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
500
−
200
−
200
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.17
TRAIO Input Timing Diagram when VCC = 2.2 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 47 of 69
Unit
ns
ns
ns
VCC = 2.2 V
R8C/26 Group, R8C/27 Group
Table 5.32
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
800
−
400
−
400
−
−
200
0
−
150
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0 or 1
VCC = 2.2 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 1
Figure 5.18
Table 5.33
Serial Interface Timing Diagram when VCC = 2.2 V
External Interrupt INTi (i = 0, 1, 3) Input
tW(INH)
INTi input “H” width
Standard
Min.
Max.
(1)
−
1000
tW(INL)
INTi input “L” width
1000(2)
Symbol
Parameter
−
Unit
ns
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 2.2 V
tW(INL)
INTi input
tW(INH)
i = 0, 1, 3
Figure 5.19
External Interrupt INTi Input Timing Diagram when VCC = 2.2 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 48 of 69
R8C/26 Group, R8C/27 Group
5.2
5. Electrical Characteristics
J, K Version
Table 5.34
Absolute Maximum Ratings
Symbol
VCC/AVCC
VI
VO
Pd
Parameter
Supply voltage
Input voltage
Output voltage
Power dissipation
Topr
Operating ambient temperature
Tstg
Storage temperature
Table 5.35
IOH(peak)
IOH(avg)
IOL(sum)
IOL(peak)
IOL(avg)
f(XIN)
−
-40 °C ≤ Topr ≤ 85 °C
85 °C ≤ Topr ≤ 125 °C
Rated Value
-0.3 to 6.5
-0.3 to VCC + 0.3
-0.3 to VCC + 0.3
300
125
-40 to 85 (J version) /
-40 to 125 (K version)
-65 to 150
Unit
V
V
V
mW
mW
°C
°C
Recommended Operating Conditions
Symbol
VCC/AVCC
VSS/AVSS
VIH
VIL
IOH(sum)
Condition
Parameter
Supply voltage
Supply voltage
Input “H” voltage
Input “L” voltage
Peak sum output Sum of all pins
“H” current
IOH(peak)
Peak output “H”
current
Average output
“H” current
Peak sum output Sum of all pins
“L” currents
IOL(peak)
Peak output “L”
currents
Average output
“L” current
XIN clock input oscillation frequency
System clock
OCD2 = 0
XlN clock selected
OCD2 = 1
On-chip oscillator
clock selected
Conditions
3.0 V ≤ VCC ≤ 5.5 V (other than K
version)
3.0 V ≤ VCC ≤ 5.5 V (K version)
2.7 V ≤ VCC < 3.0 V
3.0 V ≤ VCC ≤ 5.5 V (other than K
version)
3.0 V ≤ VCC ≤ 5.5 V (K version)
2.7 V ≤ VCC < 3.0 V
FRA01 = 0
Low-speed on-chip oscillator clock
selected
FRA01 = 1
High-speed on-chip oscillator clock
selected (other than K version)
FRA01 = 1
High-speed on-chip oscillator clock
selected
Min.
2.7
−
0.8 VCC
0
−
Standard
Typ.
−
0
−
−
−
Max.
5.5
−
VCC
0.2 VCC
-60
−
−
-10
mA
−
−
-5
mA
−
−
60
mA
−
−
10
mA
−
−
5
mA
0
−
20
MHz
0
0
0
−
16
10
20
MHz
MHz
MHz
0
0
−
−
125
16
10
−
MHz
MHz
kHz
−
−
20
MHz
−
−
10
MHz
−
−
−
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 49 of 69
Unit
V
V
V
V
mA
R8C/26 Group, R8C/27 Group
Table 5.36
A/D Converter Characteristics
Symbol
−
−
Rladder
tconv
Vref
VIA
−
5. Electrical Characteristics
Parameter
Resolution
Absolute
accuracy
Conditions
Vref = AVCC
φAD = 10 MHz, Vref = AVCC = 5.0 V
φAD = 10 MHz, Vref = AVCC = 5.0 V
φAD = 10 MHz, Vref = AVCC = 3.3 V
φAD = 10 MHz, Vref = AVCC = 3.3 V
Vref = AVCC
φAD = 10 MHz, Vref = AVCC = 5.0 V
φAD = 10 MHz, Vref = AVCC = 5.0 V
10-bit mode
8-bit mode
10-bit mode
8-bit mode
Resistor ladder
Conversion time 10-bit mode
8-bit mode
Reference voltage
Analog input voltage(2)
A/D operating
Without sample and hold
clock frequency With sample and hold
Min.
−
−
−
−
−
10
3.3
2.8
2.7
0
0.25
1
Standard
Typ.
Max.
−
10
−
±3
−
±2
−
±5
−
±2
−
40
−
−
−
−
−
AVCC
−
AVCC
−
−
10
10
Unit
Bits
LSB
LSB
LSB
LSB
kΩ
µs
µs
V
V
MHz
MHz
NOTES:
1. AVCC = 2.7 to 5.5 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in
8-bit mode.
P0
P1
P3
30pF
P4
P5
Figure 5.20
Ports P0, P1, and P3 to P5 Timing Measurement Circuit
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 50 of 69
R8C/26 Group, R8C/27 Group
Table 5.37
Flash Memory (Program ROM) Electrical Characteristics
Symbol
−
−
Parameter
Program/erase endurance(2)
−
Byte program time
Block erase time
Time delay from suspend request until
suspend
Interval from erase start/restart until
following suspend request
Interval from program start/restart until
following suspend request
Time from suspend until program/erase
restart
Program, erase voltage
Read voltage
Program, erase temperature
−
Data hold time(7)
−
td(SR-SUS)
−
−
−
−
−
5. Electrical Characteristics
Conditions
Min.
Standard
Typ.
−
Unit
Max.
−
times
R8C/26 Group
100(3)
R8C/27 Group
1,000(3)
−
−
−
−
−
times
50
0.4
−
µs
650
−
400
9
97 + CPU clock
× 6 cycles
−
µs
0
−
−
ns
−
−
µs
2.7
2.7
0
20
−
3 + CPU clock
× 4 cycles
5.5
5.5
60
−
Ambient temperature = 55°C
−
−
−
s
µs
V
V
°C
year
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 100 or 1,000), each block can be erased n times. For example, if 1,024
1-byte writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. It is also advisable to retain data on the erasure endurance of each block and limit
the number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 51 of 69
R8C/26 Group, R8C/27 Group
Table 5.38
Flash Memory (Data flash Block A, Block B) Electrical Characteristics(4)
Symbol
−
−
−
−
−
td(SR-SUS)
−
−
−
−
−
−
−
5. Electrical Characteristics
Parameter
Conditions
Program/erase endurance(2)
Byte program time
(program/erase endurance ≤ 1,000 times)
Byte program time
(program/erase endurance > 1,000 times)
Block erase time
(program/erase endurance ≤ 1,000 times)
Block erase time
(program/erase endurance > 1,000 times)
Data hold
Ambient temperature = 55°C
Standard
Typ.
−
Unit
Max.
−
times
50
400
µs
−
65
−
µs
−
0.2
9
s
−
0.3
−
s
−
−
µs
650
−
97 + CPU clock
× 6 cycles
−
µs
0
−
−
ns
−
−
µs
2.7
2.7
-40
−
3 + CPU clock
× 4 cycles
5.5
5.5
20
−
10,000(3)
−
Time delay from suspend request until
suspend
Interval from erase start/restart until
following suspend request
Interval from program start/restart until
following suspend request
Time from suspend until program/erase
restart
Program, erase voltage
Read voltage
Program, erase temperature
time(9)
Min.
−
−
85(8)
−
V
V
°C
year
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 10,000), each block can be erased n times. For example, if 1,024 1-byte
writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. Standard of block A and block B when program and erase endurance exceeds 1,000 times. Byte program time to 1,000 times
is the same as that in program ROM.
5. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. In addition, averaging the erasure endurance between blocks A and B can further
reduce the actual erasure endurance. It is also advisable to retain data on the erasure endurance of each block and limit the
number of erase operations to a certain number.
6. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
7. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
8. 125°C for K version.
9. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 52 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Suspend request
(maskable interrupt request)
FMR46
Clock-dependent
time
Fixed time
Access restart
td(SR-SUS)
Figure 5.21
Table 5.39
Time delay until Suspend
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Parameter
Vdet1
Voltage detection level(2, 4)
td(Vdet1-A)
Voltage monitor 1 reset generation time(5)
Voltage detection circuit self power consumption
Waiting time until voltage detection circuit operation
starts(3)
MCU operating voltage minimum value
−
td(E-A)
Vccmin
Condition
VCA26 = 1, VCC = 5.0 V
Min.
2.70
Standard
Typ.
Max.
2.85
3.0
Unit
V
−
40
200
µs
−
0.6
−
−
100
µA
−
2.70
−
−
V
µs
NOTES:
1. The measurement condition is VCC = 2.7 to 5.5 V and Topr = -40 to 85°C (J version) / -40 to 125°C (K version).
2. Hold Vdet2 > Vdet1.
3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2
register to 0.
4. This parameter shows the voltage detection level when the power supply drops.
The voltage detection level when the power supply rises is higher than the voltage detection level when the power supply
drops by approximately 0.1 V.
5. Time until the voltage monitor 1 reset is generated after the voltage passes Vdet1 when VCC falls. When using the digital filter,
its sampling time is added to td(Vdet1-A). When using the voltage monitor 1 reset, maintain this time until VCC = 2.0 V after the
voltage passes Vdet1 when the power supply falls.
Table 5.40
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Vdet2
td(Vdet2-A)
−
td(E-A)
Parameter
Voltage detection level(2)
Voltage monitor 2 reset/interrupt request generation
time(3, 5)
Voltage detection circuit self power consumption
Waiting time until voltage detection circuit operation
starts(4)
Condition
VCA27 = 1, VCC = 5.0 V
Min.
3.3
Standard
Typ.
Max.
3.6
3.9
Unit
V
−
40
200
µs
−
0.6
−
−
100
µA
−
µs
NOTES:
1. The measurement condition is VCC = 2.7 to 5.5 V and Topr = -40 to 85°C (J version) / -40 to 125°C (K version).
2. Hold Vdet2 > Vdet1.
3. Time until the voltage monitor 2 reset/interrupt request is generated after the voltage passes Vdet2.
4. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2
register to 0.
5. When using the digital filter, its sampling time is added to td(Vdet2-A). When using the voltage monitor 2 reset, maintain this time
until VCC = 2.0 V after the voltage passes Vdet2 when the power supply falls.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 53 of 69
R8C/26 Group, R8C/27 Group
Power-on Reset Circuit, Voltage Monitor 1 Reset Electrical Characteristics(3)
Table 5.41
Symbol
Vpor1
5. Electrical Characteristics
trth
Standard
Typ.
−
Max.
0.1
0
−
Vdet1
VCC ≤ 3.6 V
20(2)
−
−
mV/msec
VCC > 3.6 V
20(2)
−
2,000
mV/msec
Condition
Power-on reset valid voltage(4)
Power-on reset or voltage monitor 1 reset valid
voltage
External power VCC rise gradient
Vpor2
Min.
−
Parameter
Unit
V
V
NOTES:
1. The measurement condition is Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. This condition (the minimum value of external power VCC rise gradient) does not apply if Vpor2 ≥ 1.0 V.
3. To use the power-on reset function, enable voltage monitor 1 reset by setting the LVD1ON bit in the OFS register to 0, the
VW1C0 and VW1C6 bits in the VW1C register to 1 respectively, and the VCA26 bit in the VCA2 register to 1.
4. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on
reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if -20°C ≤ Topr ≤ 125°C, maintain tw(por1) for
3,000 s or more if -40°C ≤ Topr < -20°C.
Vdet1(3)
External
power VCC
Vdet1(3)
trth
trth
2.0 V
td(Vdet1-A)
Vpor2
Vpor1
tw(por1)
Sampling time(1, 2)
Internal reset
signal
(“L” valid)
1
× 32
fOCO-S
1
× 32
fOCO-S
NOTES:
1. When using the voltage monitor 1 digital filter, ensure VCC is 2.0 V or higher during the sampling time.
2. The sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details.
3. Vdet1 indicates the voltage detection level of the voltage detection 1 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual for details.
Figure 5.22
Reset Circuit Electrical Characteristics
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 54 of 69
R8C/26 Group, R8C/27 Group
Table 5.42
High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
fOCO40M
−
5. Electrical Characteristics
Parameter
High-speed on-chip oscillator frequency
temperature · supply voltage dependence
Value in FRA1 register after reset
Oscillation frequency adjustment unit of highspeed on-chip oscillator
Oscillation stability time
Self power consumption at oscillation
−
−
−
Condition
VCC = 4.75 to 5.25 V
0°C ≤ Topr ≤ 60°C(2)
VCC = 3.0 to 5.5 V
-20°C ≤ Topr ≤ 85°C(2)
VCC = 3.0 to 5.5 V
-40°C ≤ Topr ≤ 85°C(2)
VCC = 3.0 to 5.5 V
-40°C ≤ Topr ≤ 125°C(2)
VCC = 2.7 to 5.5 V
-40°C ≤ Topr ≤ 125°C(2)
Adjust FRA1 register
(value after reset) to -1
Min.
39.2
Standard
Typ.
40
Max.
40.8
MHz
38.8
40
41.2
MHz
38.4
40
41.6
MHz
38
40
42
MHz
37.6
40
42.4
MHz
08h
−
−
+0.3
F7h
−
−
MHz
−
10
400
100
−
µA
VCC = 5.0 V, Topr = 25°C
−
Unit
µs
NOTES:
1. VCC = 2.7 to 5.5 V, Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. These standard values show when the FRA1 register value after reset is assumed.
Table 5.43
Low-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
fOCO-S
−
−
Parameter
Low-speed on-chip oscillator frequency
Oscillation stability time
Self power consumption at oscillation
Condition
VCC = 5.0 V, Topr = 25°C
Standard
Typ.
125
10
15
Min.
40
−
−
Max.
250
100
−
Unit
kHz
µs
µA
NOTE:
1. VCC = 2.7 to 5.5 V, Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
Table 5.44
Power Supply Circuit Timing Characteristics
Symbol
Parameter
td(P-R)
Time for internal power supply stabilization during
power-on(2)
td(R-S)
STOP exit time(3)
Condition
NOTES:
1. The measurement condition is VCC = 2.7 to 5.5 V and Topr = 25°C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 55 of 69
Min.
1
−
Standard
Typ.
Max.
−
2000
−
150
Unit
µs
µs
R8C/26 Group, R8C/27 Group
Table 5.45
Symbol
Timing Requirements of Clock Synchronous Serial I/O with Chip Select(1)
Parameter
tSUCYC
SSCK clock cycle time
tHI
tLO
tRISE
SSCK clock “H” width
SSCK clock “L” width
SSCK clock rising
time
tFALL
5. Electrical Characteristics
SSCK clock falling
time
Conditions
Standard
Typ.
−
−
Unit
Max.
−
−
−
−
−
−
−
100
1
−
1
−
−
tCYC(2)
µs
ns
−
−
tCYC(2)
Slave
1tCYC + 50
−
−
ns
Slave
1tCYC + 50
−
−
ns
−
−
1
−
−
−
−
1.5tCYC + 100
1.5tCYC + 100
tCYC(2)
ns
ns
Master
Slave
Master
Slave
SSO, SSI data input setup time
SSO, SSI data input hold time
tLEAD
SCS setup time
tOD
SCS hold time
SSO, SSI data output delay time
tSA
tOR
SSI slave access time
SSI slave out open time
−
0.6
0.6
1
1
1
NOTES:
1. VCC = 2.7 to 5.5 V, VSS = 0 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
tCYC(2)
tSUCYC
tSUCYC
0.4
0.4
−
tSU
tH
tLAG
Min.
4
Page 56 of 69
tCYC(2)
µs
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Master, CPHS = 1
VIH or VOH
SCS (output)
VIH or VOH
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
4-Wire Bus Communication Mode, Master, CPHS = 0
VIH or VOH
SCS (output)
VIH or VOH
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
CPHS, CPOS: Bits in SSMR register
Figure 5.23
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Master)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 57 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Slave, CPHS = 1
VIH or VOH
SCS (input)
VIH or VOH
tLEAD
tHI
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
4-Wire Bus Communication Mode, Slave, CPHS = 0
VIH or VOH
SCS (input)
VIH or VOH
tHI
tLEAD
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
CPHS, CPOS: Bits in SSMR register
Figure 5.24
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Slave)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 58 of 69
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
tHI
VIH or VOH
SSCK
VIH or VOH
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
Figure 5.25
tH
I/O Timing of Clock Synchronous Serial I/O with Chip Select (Clock Synchronous
Communication Mode)
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 59 of 69
R8C/26 Group, R8C/27 Group
Table 5.46
5. Electrical Characteristics
Timing Requirements of I2C bus Interface(1)
tSCL
SCL input cycle time
tSCLH
SCL input “H” width
Standard
Typ.
−
12tCYC + 600(2)
−
3tCYC + 300(2)
tSCLL
SCL input “L” width
500(2)
tsf
tSP
SCL, SDA input fall time
SCL, SDA input spike pulse rejection time
tBUF
SDA input bus-free time
5tCYC(2)
−
1tCYC(2)
−
tSTAH
Start condition input hold time
3tCYC(2)
−
−
ns
tSTAS
Retransmit start condition input setup time
3tCYC(2)
−
−
ns
tSTOP
Stop condition input setup time
3tCYC(2)
−
−
ns
tSDAS
Data input setup time
−
−
ns
tSDAH
Data input hold time
1tCYC + 20(2)
0
−
−
ns
Symbol
Parameter
Condition
Min.
5tCYC +
−
−
Unit
Max.
−
ns
−
ns
−
ns
−
300
−
ns
ns
−
NOTES:
1. VCC = 2.7 to 5.5 V, VSS = 0 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOP
SCL
P(2)
S(1)
tsf
Sr(3)
tSCLL
tsr
tSCL
NOTES:
1. Start condition
2. Stop condition
3. Retransmit start condition
Figure 5.26
I/O Timing of I2C bus Interface
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 60 of 69
P(2)
tSDAS
tSDAH
ns
R8C/26 Group, R8C/27 Group
Table 5.47
Electrical Characteristics (1) [VCC = 5 V]
Symbol
VOH
Parameter
Output “H” voltage
Except XOUT
XOUT
VOL
Output “L” voltage
Except XOUT
XOUT
VT+-VT-
5. Electrical Characteristics
Hysteresis
Condition
IOH = -5 mA
IOH = -200 µA
Drive capacity HIGH
Drive capacity LOW
IOL = 5 mA
IOL = 200 µA
Drive capacity HIGH
Drive capacity LOW
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, RXD0, RXD1,
CLK0, CLK1,
SSI, SCL, SDA, SSO
RESET
IIH
IIL
RPULLUP
RfXIN
VRAM
Input “H” current
Input “L” current
Pull-up resistance
Feedback
resistance
RAM hold voltage
VI = 5 V, VCC = 5V
VI = 0 V, VCC = 5V
VI = 0 V, VCC = 5V
XIN
During stop mode
IOH = -1 mA
IOH = -500 µA
IOL = 1 mA
IOL = 500 µA
Min.
VCC - 2.0
VCC - 0.3
VCC - 2.0
VCC - 2.0
−
−
−
−
0.1
Standard
Typ.
−
−
−
−
−
−
−
−
0.5
Max.
VCC
VCC
VCC
VCC
2.0
0.45
2.0
2.0
−
Unit
V
V
V
V
V
V
V
V
V
0.1
1.0
−
V
−
−
−
30
−
50
1.0
5.0
-5.0
167
−
µA
−
µA
kΩ
MΩ
2.0
−
−
V
NOTE:
1. VCC = 4.2 to 5.5 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), f(XIN) = 20 MHz, unless otherwise specified.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 61 of 69
R8C/26 Group, R8C/27 Group
Table 5.48
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [Vcc = 5 V]
(Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 3.3 to 5.5 V)
clock mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed
on-chip
oscillator
mode
Low-speed
on-chip
oscillator
mode
Wait mode
Stop mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 62 of 69
XIN = 20 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
Min.
−
Standard
Typ.
Max.
10
17
Unit
mA
XIN = 16 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
−
9
15
mA
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
−
6
−
mA
XIN = 20 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
5
−
mA
XIN = 16 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
4
−
mA
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
2.5
−
mA
XIN clock off
High-speed on-chip oscillator on fOCO = 20 MHz (J version)
Low-speed on-chip oscillator on = 125 kHz
No division
−
10
15
mA
XIN clock off
High-speed on-chip oscillator on fOCO = 20 MHz (J version)
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
4
−
mA
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
−
5.5
10
mA
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
2.5
−
mA
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
130
300
µA
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
25
75
µA
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
23
60
µA
XIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
0.8
3.0
µA
XIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
1.2
−
µA
XIN clock off, Topr = 125°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
4.0
−
µA
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V]
Table 5.49
XIN Input
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
Standard
Min.
Max.
50
−
25
−
25
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
tC(XIN)
Unit
ns
ns
ns
VCC = 5 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.27
Table 5.50
XIN Input Timing Diagram when VCC = 5 V
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
100
−
40
−
40
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.28
TRAIO Input Timing Diagram when VCC = 5 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 63 of 69
Unit
ns
ns
ns
VCC = 5 V
R8C/26 Group, R8C/27 Group
Table 5.51
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
200
−
100
−
100
−
−
50
0
−
50
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0 or 1
VCC = 5 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 1
Figure 5.29
Table 5.52
Serial Interface Timing Diagram when VCC = 5 V
External Interrupt INTi (i = 0, 1, 3) Input
INTi input “H” width
Standard
Min.
Max.
−
250(1)
INTi input “L” width
250(2)
Symbol
tW(INH)
tW(INL)
Parameter
−
Unit
ns
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
tW(INL)
INTi input
tW(INH)
i = 0, 1, 3
Figure 5.30
External Interrupt INTi Input Timing Diagram when VCC = 5 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 64 of 69
R8C/26 Group, R8C/27 Group
Table 5.53
Electrical Characteristics (3) [VCC = 3 V]
Symbol
VOH
VOL
VT+-VT-
IIH
IIL
RPULLUP
RfXIN
VRAM
5. Electrical Characteristics
Parameter
Output “H” voltage
Except XOUT
XOUT
Output “L” voltage
Input “H” current
Input “L” current
Pull-up resistance
Feedback resistance
RAM hold voltage
IOH = -1 mA
Drive capacity
HIGH
Drive capacity
LOW
IOL = 1 mA
Drive capacity
HIGH
Drive capacity
LOW
Standard
Typ.
−
−
Max.
VCC
VCC
Unit
IOH = -0.1 mA
Min.
VCC - 0.5
VCC - 0.5
IOH = -50 µA
VCC - 0.5
−
VCC
V
V
V
−
−
IOL = 0.1 mA
−
−
0.5
0.5
V
V
IOL = 50 µA
−
−
0.5
V
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, RXD0, RXD1,
CLK0,CLK1,
SSI, SCL, SDA, SSO
0.1
0.3
−
V
RESET
0.1
0.4
−
V
−
−
−
66
−
2.0
160
3.0
−
4.0
-4.0
500
−
−
µA
−
Except XOUT
XOUT
Hysteresis
Condition
VI = 3 V, VCC = 3V
VI = 0 V, VCC = 3V
VI = 0 V, VCC = 3V
XIN
During stop mode
µA
kΩ
MΩ
V
NOTE:
1. VCC = 2.7 to 3.3 V at Topr = -40 to 85°C (J version) / -40 to 125°C (K version), f(XIN) = 10 MHz, unless otherwise specified.
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 65 of 69
R8C/26 Group, R8C/27 Group
Table 5.54
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [Vcc = 3 V]
(Topr = -40 to 85°C (J version) / -40 to 125°C (K version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 2.7 to 3.3 V)
clock mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed
on-chip
oscillator
mode
Low-speed
on-chip
oscillator
mode
Wait mode
Stop mode
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 66 of 69
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
No division
XIN = 10 MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
XIN clock off
High-speed on-chip oscillator on fOCO = 10 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
XIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
XIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
XIN clock off, Topr = 125°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
Min.
−
Standard
Typ.
Max.
6
−
Unit
mA
−
2
−
mA
−
5
9
mA
−
2
−
mA
−
130
300
µA
−
25
70
µA
−
23
55
µA
−
0.7
3.0
µA
−
1.1
−
µA
−
3.8
−
µA
R8C/26 Group, R8C/27 Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) [VCC = 3 V]
XIN Input
Table 5.55
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
Standard
Min.
Max.
100
−
40
−
40
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
tC(XIN)
Unit
ns
ns
ns
VCC = 3 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.31
XIN Input Timing Diagram when VCC = 3 V
Table 5.56
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
300
−
120
−
120
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.32
TRAIO Input Timing Diagram when VCC = 3 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 67 of 69
Unit
ns
ns
ns
VCC = 3 V
R8C/26 Group, R8C/27 Group
Table 5.57
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
300
−
150
−
150
−
−
80
0
−
70
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi Input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0 or 1
VCC = 3 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 1
Figure 5.33
Table 5.58
Serial Interface Timing Diagram when VCC = 3 V
External Interrupt INTi (i = 0, 1, 3) Input
INTi input “H” width
Standard
Min.
Max.
−
380(1)
INTi input “L” width
380(2)
Symbol
tW(INH)
tW(INL)
Parameter
Unit
−
ns
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
tW(INL)
INTi input
tW(INH)
i = 0, 1, 3
Figure 5.34
External Interrupt INTi Input Timing Diagram when VCC = 3 V
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
Page 68 of 69
R8C/26 Group, R8C/27 Group
Package Dimensions
Package Dimensions
Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of
the Renesas Technology website.
JEITA Package Code
P-LQFP32-7x7-0.80
RENESAS Code
PLQP0032GB-A
Previous Code
32P6U-A
MASS[Typ.]
0.2g
HD
*1
D
24
17
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
16
25
bp
c
c1
HE
*2
E
b1
Reference Dimension in Millimeters
Symbol
32
9
1
ZE
Terminal cross section
8
ZD
c
A
A1
F
A2
Index mark
L
D
E
A2
HD
HE
A
A1
bp
b1
c
c1
L1
y
e
Rev.2.10 Sep 26, 2008
REJ03B0168-0210
*3
Detail F
bp
Page 69 of 69
x
e
x
y
ZD
ZE
L
L1
Min Nom Max
6.9 7.0 7.1
6.9 7.0 7.1
1.4
8.8 9.0 9.2
8.8 9.0 9.2
1.7
0.1 0.2
0
0.32 0.37 0.42
0.35
0.09 0.145 0.20
0.125
0°
8°
0.8
0.20
0.10
0.7
0.7
0.3 0.5 0.7
1.0
REVISION HISTORY
REVISION HISTORY
R8C/26 Group, R8C/27 Group Datasheet
R8C/26 Group, R8C/27 Group Datasheet
Description
Rev.
Date
0.10
Nov 14, 2005
−
0.20
Feb 06, 2006
2, 3
Page
Summary
First edition issued
Table 1.1 Functions and Specifications for R8C/26Group and Table 1.2
Functions and Specifications for R8C/27 Group;
Minimum instruction execution time and Supply voltage revised
9
Table 1.6 Pin Name Information by Pin Number;
“XOUT” → “XOUT/XCOUT” and “XIN” → “XIN/XCIN” revised
18
Table 4.4 SFR Information (4);
00FEh: “DRR” → “P1DRR” revised
19
Table 4.5 SFR Information (5);
-0119h: “Timer RE Minute Data Register / Compare Register” →
“Timer RE Minute Data Register / Compare Data Register”
-011Ah: “Timer RE Time Data Register” →
“Timer RE Hour Data Register”
-011Bh: “Timer RE Day Data Register” →
“Timer RE Day of Week Data Register” revised
22 to 45 5. Electrical Characteristics added
1.00
Nov 08, 2006
All pages “Preliminary” deleted
2
Table 1.1 revised
3
Table 1.2 revised
4
Figure 1.1 revised
5
Table 1.3 revised
6
Table 1.4 revised
7
Figure 1.4 revised
9
Table 1.6 revised
15
Table 4.1;
• 001Ch: “00h” → “00h, 10000000b” revised
• 000Fh: “000XXXXXb” → “00X11111b” revised
• 0029h: “High-Speed On-Chip Oscillator Control Register 4, FRA4,
When shipping” added
• 002Bh: “High-Speed On-Chip Oscillator Control Register 6, FRA6,
When shipping” added
• 0032h: “00h, 01000000b” → “00h, 00100000b” revised
• 0038h: “00001000b, 01001001b” → “0000X000b, 0100X001b” revised
• NOTE3 and 4 revised; NOTE6 added
18
Table 4.4;
• 00E0h, 00E1h, 00E5h, 00E8h, 00E9h: “XXh” → “00h” revised
• 00FDh: “XX00000000b” → “00h” revised
22
Table 5.2 revised
23
Figure 5.1 title revised
24
Table 5.4 revised
25
Table 5.5 revised
26
Figure 5.2 title revised and Table 5.7 NOTE4 added
A-1
REVISION HISTORY
Rev.
Date
1.00
Nov 08, 2006
1.10
Nov 29, 2006
R8C/26 Group, R8C/27 Group Datasheet
Description
Page
Summary
27
Table 5.9, Figure 5.3 revised and Table 5.10 deleted
28
Table 5.10, Table 5.11 revised
34
Table 5.15 revised
35
Table 5.16 revised
36
Table 5.17 revised
39
Table 5.22 revised
40
Table 5.23 revised
44
Table 5.29 revised
47
Package Dimensions; “Diagrams showing the latest...website.” added
All pages “J, K version” added
1
1 “J and K versions are under development...notice.” added
1.1 revised
2
Table 1.1 revised
3
Table 1.2 revised
4
Figure 1.1 NOTE3 added
5
Table 1.3, Figure 1.2 revised
6
Table 1.4, Figure 1.3 revised
7
Figure 1.4 NOTE3 added
8
Table 1.5 revised
9
Table 1.6 NOTE2 added
13
Figure 3.1 revised
14
Figure 3.2 revised
15
Table 4.1; “0000h to 003Fh” → “0000h to 002Fh” revised
• NOTE3 added
16
Table 4.2; “0040h to 007Fh” → “0030h to 007Fh” revised
• 0032h, 0036h: “After reset” is revised
• 0038h: NOTE revised
• NOTES 2, 5, 6 revised and NOTE 7, 8 added
19
Table 4.5 NOTE2 added
28
Table 5.10 revised
48 to 66 5.2 J, K Version added
1.20
Jan 17, 2007
18
Table 4.4 NOTE2 added
1.30
May 25, 2007
2
Table 1.1 revised
3
Table 1.2 revised
5
Table 1.3 revised
6
Figure 1.2 revised
7
Table 1.4 revised
8
Figure 1.3 revised
9
Figure 1.4 NOTE4 added
15
Figure 3.1 part number revised
A-2
REVISION HISTORY
Rev.
Date
1.30
May 25, 2007
R8C/26 Group, R8C/27 Group Datasheet
Description
Page
Summary
16
Figure 3.2 part number revised
30
Table 5.10 revised
53
Table 5.39 NOTE4 added
55
Table 5.42 revised
1.40a
Jun 14, 2007
5, 7
Table 1.3 and Table 1.4 revised
2.00
Mar 01, 2008
1, 49
1.1, 5.2 “J and K versions are ...” deleted
5, 7
Table 1.3, Table 1.4 revised
11
Table 1.6 NOTE3 added
15, 16
17
Table 4.1 “002Ch” added
18
Table 4.2 “0036h”; J, K version “0100X000b” → “0100X001b”
24, 49
2.10
Sep 26, 2008
Figure 3.1, Figure 3.2; “Expanded area” deleted
Table 5.2, Table 5.35; NOTE2 revised
30
Table 5.10 revised, NOTE4 added
−
“RENESAS TECHNICAL UP DATE” reflected: TN-16C-A172A/E
26, 51
Table 5.4, Table 5.37 NOTE2, NOTE4 revised
27, 52
Table 5.5, Table 5.38 NOTE2, NOTE5 revised
53
Table 5.39 Parameter: Voltage monitor 1 reset generation time added
NOTE5 added
Table 5.40 revised
54
Table 5.41 revised
Figure 5.22 revised
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A-3
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Notes:
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warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
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but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
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destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
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4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
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(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
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Colophon .7.2