TM TM EnviroMark 828 Low-Voiding Lead-Free Water-Soluble Solder Paste Product Description Physical Properties Kester EnviroMark 828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes. (Data given for Sn96.5 Ag3.0 Cu0.5, 89.5% metal, -325+500 mesh) TM Viscosity (typical): 1700 poise Malcom viscometer @ 10rpm and 25°C Initial Tackiness (typical): 40 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 • • • • • • • • Low-voiding underneath area array components Excellent wetting on a variety of metallizations Residues are easily removed in hot DI water Long stencil life and tack time (process dependent) Tremendous brick definition and slump resistance for reduction of bridging defects Print speed up to 150 mm/sec (6 in/sec) Capable of breaks in printing of up to 60 minutes without any kneading Classified as ORH1 per J-STD-004A Reliability Properties Copper Mirror Corrosion: High Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Standard Applications 89.5% Metal – Stencil Printing 89.5% Metal – Enclosed Head Printing RoHS Compliance This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. Day 1 Day 4 Day 7 Blank EM828 1.5 ×10 Ω 1.3 ×109 Ω 9.5 ×108 Ω 9.0 × 108 Ω 9.8 × 108 Ω 1.2 × 109 Ω 9 EM828 Application Notes Availability: Kester EM828 is available in the Sn96.5Ag3.0Cu0.5 alloy with Type 3 and Type 4 powder. Type 3 powder mesh is recommended, but Type 4 powder is available for finer pitch applications. For specific packaging information see Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and the specific application. Printing Parameters: Squeegee Blade Squeegee Speed Stencil Material Temperature/Humidity 80 to 90 durometer polyurethane or stainless steel Capable to a maximum speed of 150 mm/sec (6 in/sec) Stainless Steel, Molybdenum, Nickel Plated, Brass Optimal ranges are 21-25°C (70-77°F) and 35-65% RH Kester Reflow Profile EM828 SAC Alloys Recommended Reflow Profile: 300 Peak Temp. 235 - 255 C 250 Temperature (C) The recommended reflow profile for EM828 made with SAC alloys is shown here. This profile is simply a guideline. Since EM828 is a highly active solderpaste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on you oven, board and mix of defects. Please contact Kester if you need additional profiling advice. 200 150 <2.5 C/Sec 100 Soaking Zone Reflow Zone (2.0 min.max.) 60-90 sec. typical time above 217 C (90 sec max) 60-75 sec. typical Pre-heating Zone (2.0-4.0 min. max.) 50 0 0 30 60 90 120 150 180 210 240 270 300 Time (sec.) Cleaning: EM828 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of soldering. De-ionized water is recommended for the final rinse. Water temperatures should be 49-60°C (120-140°F). Kester's 5768 Bio-Kleen® saponifier can also be used in a 1-2% ratio for aqueous cleaning systems. Storage, Handling, and Shelf Life: Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow characteristics, and overall performance. EM828 should be stabilized at room temperature prior to printing. EM828 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 6 months from date of manufacture and held at 0-10°C (32-50°F). Health & Safety: This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product. World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA Phone: (+1) 847-297-1600 • Email: [email protected] • Website: www.kester.com Asia Pacific Headquarters 500 Chai Chee Lane Singapore 469024 (+65) 6449-1133 [email protected] European Headquarters Zum Plom 5 08541 Neuensalz Germany (+49) 3741 4233-0 [email protected] Japanese Headquarters 20-11 Yokokawa 2-Chome Sumida-Ku Tokyo 130-0003 Japan (+81) 3-3624-5351 [email protected] The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details. Rev: 8Jul08