Xeon 1 Power Pure White LED OSW4XNE1E1E VER C.0 Features

Xeon 1 Power Pure White LED
OSW4XNE1E1E
VER C.0
■Features
■Outline
●
Highest Luminous Flux
●
Super Energy Efficiency
●
Long Lifetime Operation
●
Superior ESD protection
●
Superior UV Resistance
Dimension
■Applications
●
Read lights (car, bus, aircraft)
●
Portable (flashlight, bicycle)
●
Bollards / Security / Garden
●
Traffic signaling / Beacons
●
In door / Out door Commercial lights
●
Automotive Ext
Tolerances are for reference only
■Absolute Maximum Rating
Item
■Directivity
Symbol
Value
Unit
DC Forward Current
IF
400
mA
Pulse Forward Current*
IFP
500
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
1600
mW
Operating Temperature
Topr
-30 ~ +85
Storage Temperature
Tstg
-40~ +100
Lead Soldering Temperature
Tsol
260
Duty ratio max 1/10
■Electrical -Optical Characteristics
■Forward Operating Current (DC)
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
DC Forward Voltage
VF
IF=350mA
3.0
3.3
4.0
V
DC Reverse Current
IR
VR=5V
-
-
10
µA
v
IF=350mA
90
100
-
lm
CCT
IF=350mA
-
6500
-
K
Chromaticity
x
IF=350mA
-
0.31
-
-
Coordinates*
y
IF=350mA
-
0.33
-
-
2θ1/2
IF=350mA
-
140
-
deg
Luminous Flux
Color Temperature
50% Power Angle
400
Forward Current, IF (mA)
*Pulse width Max.10ms
-
/5sec
350
300
250
200
150
100
50
RJ-A=60
RJ-A=50
RJ-A=40
RJ-A=30
/W
/W
/W
/W
0
0
25
50
100
75
Ambient Temperature, TA ( )
Note: Don’t drive at rated current more than 5s without heat sink for Xeon 1 emitter series.
LED & Application Technologies
http://www.optosupply.com
VER C.0
125
Xeon 1 Power Pure White LED
OSW4XNE1E1E
VER C.0
■ Soldering Heat Reliability (DIP):
Reflow soldering Profile
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
Solder
Average ramp-up rate = 3ºC/sec. max.
Preheat temperature: 150º~180ºC
Preheat time = 120 sec. max.
Ramp-down rate = 6ºC/sec. max.
Peak temperature = 220ºC max.
Time within 3ºC of actual
peak temperature = 25 sec. max.
Duration above 200ºC is 40 sec. max.
LED & Application Technologies
http://www.optosupply.com
VER C.0