Fixed Inductors (Chip Inductors) 7. Signal Processing Use (Low Distortion Type) DA, FA***D Discontinued ■ Features ● General use wire wound and resin molded chip inductor. ● Low distortion type suitable for Signal processing. ● 2 line-up of Super low distortion series and low distortion type. ● Good mounting characteristic ● RoHS compliant. ELJDA ELJFA ■ Recommended Applications ● All kinds of Broadband Modem, Router and STB etc. ● Corresponds to sam IC chipset. ■ Explanation of Part Numbers ● Super Low Distortion type 1 2 3 4 5 6 7 8 9 10 & - + % " + ' 11 Packaging Design No. Product code Shape DA Chip Inductors Inductance tolerance Inductance 3225 (1210) Size : mm (inch) 390 39 μH 470 47 μH 560 56 μH 680 68 μH 820 82 μH 101 100 μH J F Taping ±5 % ● Low Distortion type 1 2 3 4 5 6 7 8 9 10 11 & - + ' " + ' % Packaging Design No. Product code Chip Inductors Shape FA 3225 (1210) Size : mm (inch) Inductance 390 39 μH 470 47 μH 560 56 μH 680 68 μH 820 82 μH 101 100 μH Inductance tolerance J ±5 % F Taping D Low distortion type ■Storage Conditions ● Package : Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew. ● Operating Temperature : –20 to +85 °C ■Storage Period ● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt. ■Packaging Methods, Soldering Conditions and Safety Precautions Please see Data Files. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Sep. 2012 1 Discontinued Fixed Inductors (Chip Inductors) ■ DA/FA***D Type 3225(1210) ● Dimensions in mm (not to scale) ● Recommended Land Pattern in mm (not to scale) 1.9 to 2.4 1.9±0.1 2.5±0.2 Marking 1.6 to 2.0 3.2±0.3 2.2±0.2 4.0 to 4.6 ■ Standard Packing Quantity ● 2000 pcs./Reel 0.6±0.2 ■ Standard Parts(Super Low Distortion type) Part No. ELJDA220JF ELJDA330JF ELJDA390JF ELJDA470JF ELJDA560JF ELJDA680JF ELJDA820JF ELJDA101JF (μH) 22 33 39 47 56 68 82 100 Inductance Tolerance Test Freq. (%) (MHz) J : ±5 % Q Test Freq. (MHz) min. 21 2.52 2.52 19 24 0.796 0.796 SRF ✽1 (MHz) min. RDC ✽2 (Ω) max. DC Current (mA) max. 23 12 11 10 8.5 7.5 7 7 2.6 4.5 5.2 5.9 6.5 9.0 10.0 13.0 155 120 110 105 100 85 80 70 SRF ✽1 (MHz) min. RDC ✽2 (Ω) max. DC Current (mA) max. 14 12 12 12 12 12 10 10 3.9 4.5 6.0 6.7 7.0 9.0 12.0 14.0 130 120 105 100 95 85 75 70 ✽1 : Self Resonant Frequency ✽2 : DC Resistance ■ Standard Parts(Low Distortion type) Part No. ELJFA220JFD ELJFA330JFD ELJFA390JFD ELJFA470JFD ELJFA560JFD ELJFA680JFD ELJFA820JFD ELJFA101JFD (μH) 22 33 39 47 56 68 82 100 Inductance Tolerance Test Freq. (%) (MHz) Q min. Test Freq. (MHz) 26 27 J : ±5 % 2.52 2.52 30 0.796 20 0.796 ✽1 : Self Resonant Frequency ✽2 : DC Resistance Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Sep. 2012 2 Fixed Inductors (Chip Inductors) ■ Packaging Methods (Taping) ● Punched Carrier Tape Dimensions in mm (not to scale) t1 ● Type □F fD0 E P0 B F W RF, QF, PF Part A P1 P2 t2 RF, QF, PF Tape running direction ● Embossed Carrier Tape Dimensions in mm (not to scale) A B W E F P1 0.71 1.21 8.0 1.75 3.5 2.0 P2 P0 0D0 2.0 4.0 01.5 t1 0.7 max. t2 1.0 max. E F ● Type □E, Type ND, Type □C A t1 E f D0 F 1.0 1.8 8.0 1.75 3.5 4.0 ND 1.45 2.25 8.0 1.75 3.5 4.0 NC, FC, PC, LC, SC 2.40 2.90 8.0 1.75 3.5 4.0 P2 P0 0D0 0D1 t1 t2 2.0 4.0 01.5 00.6 (0.27) B f D1 P1 P2 P0 Tape running direction t2 F B Chip component P1 f D0 t1 P2 P0 Tape running direction 4.0 01.5 01.0 (0.25) 1.55 4.0 01.5 01.1 (0.25) 1.85 B W E F P1 3.60 8.0 1.75 3.5 4.0 P2 P0 0D0 t1 t2 2.0 4.0 01.5 (0.25) 2.40 NA, FA, PA, LA, SA, EA, DA ● Type □B P2 P0 B W F A t2 2.0 2.0 E t2 ND NC, FC, PC, LC, SC A NA, FA, PA, LA, 2.80 SA, EA, DA W A Chip component 1.2 ● Type □A E f D0 t1 P1 RE, QE, PE RE, QE, PE Chip component W W A B Tape running direction P1 A B W E F P1 FB, PB 3.60 4.90 12.0 1.75 5.5 8.0 P2 P0 0D0 t1 t2 FB, PB 2.0 4.0 01.5 (0.30) 3.50 ● Taping Reel Dimensions in mm (not to scale) Parts Types E C A B RF, QF, PF, RE, QE, PE, ND, 180 NC, FC, PC, LC, SC, NA, FA, PA, LA, SA, EA, DA D FB, PB W 180 B C D E W 60 13 21 2 9 60 13 21 2 13 A ■ Standard Packing Quantity/Reel Quantity Types RF, QF, PF RE, QE, PE, ND NC, FC, PC, LC, SC NA, FA, PA, LA, SA, EA, DA FB, PB Quantity 10000 3000 2000 2000 500 ✽ Under conditions of high temperature and humidity deterioration of the taping and packaging may be accelerated. Please carefully control storage conditions and use the product within 6 months of receipt. pcs. pcs. pcs. pcs. pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 Sep. 2012 3 Fixed Inductors (Chip Inductors) Soldering Conditions Temperature (°C) ■ Reflow soldering conditions T3 T2 T1 t2 t1 0 Time ● Pb free solder recommended temperature profile Preheat Soldering Peak Temperature T1 [°C] t1 [s] T2 [°C] t2 [s] T3 T3 Limit Time of Reflow □F 150 to 180 60 to 120 230 °C 40 max. 250 °C, 10 s 260 °C, 10 s 2 times max. □E 150 to 180 60 to 120 230 °C 40 max. 250 °C, 10 s 260 °C, 10 s 2 times max. □D 150 to 180 60 to 120 230 °C 40 max. 245 °C, 10 s 250 °C, 10 s 2 times max. □C 150 to 180 60 to 120 230 °C 40 max. 245 °C, 10 s 250 °C, 10 s 2 times max. □A 150 to 180 60 to 120 230 °C 40 max. 245 °C, 10 s 250 °C, 10 s 2 times max. □B 150 to 180 60 to 120 230 °C 40 max. 245 °C, 10 s 250 °C, 10 s 2 times max. Type ■ Flow soldering conditions Preheat: 130 to 150 °C, 60 to 180 s, Soldering: 260 °C, 5 s max. ■ Notes ● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt. ● In case the product has been stored for a period longer than 6 months, use the product only after confirmation of its solderability. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 Sep. 2012 4 Fixed Inductors (Chip Inductors) Safety Precautions (Common precautions for Chip Inductors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffic lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault Precautions for use 1. Operation range and environments 1 These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric applianc es, office equipment, information and com mu nication equipment) 2 These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. • In liquid, such as water, oil, chemicals, or organic solvent • In direct sunlight, outdoors, or in dust • In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 • In an environment where these products cause dew condensation 2. Handling 1 Do not bring magnets or magnetized materials close to the product. The influence of their magnetic field can change the inductance value. 2 Do not apply strong mechanical shocks by either dropping or collision with other parts. Excessive schock can damage the part. 3. Land pattern design 1 Please refer to the recommended land pattern for each type shown on the datasheet. 2 Avoid placing the chip inductor on any metal pattern except the recommended land pattern because a drop of Q and mutual conductance may occur. 3 In case of flow soldering, venting of soldering flux gases should be made for high density assemblies to get a good solder connection. 4 In case of reflow soldering, consider the layout because taller components close to chip inductor tend to block thermal conduction. 4. Mounting 1 In general, magnetic and electric characteristics of ferrite cores can be changed by applying excessively strong force. Placement force should not exceed 20 N. 2 Do not bend or twist the PWB after mounting the part. 5. Cleaning 1 Do not use acid or alkali agents. Some cleaning solvents may damage the part. Confirm by testing the reliability in advance of mass production. 2 If Ultrasonic cleaning is used, please confirm the reliability in advance. It is possible that combined resonance of component and PWB and cavitation can cause an abnormal vibration mode to exist causing damage. 6. Caution about applying excessive current The rated current is defined as the smaller value of either the current value when the inductance drops 10 % down from the initial point or the current value when the average temperature of coil inside rises 20 °C up from the initial point. Do not operate product over the specific max. current. <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Sep. 2012 5 Fixed Inductors (Chip Inductors) Chip Inductors Type: Discontinued ：Wirewound Chip Inductor. □D, □C, □A, □B □F, □E, □D, □C, □A, □B □F □E □D □C □A □B (Size 1005) (Size 1608) (Size 2012) (Size 2520) (Size 3225) (Size 4532) Ceramic Core/Laser-Cut and wire wound type chip inductors for automatic and high-density mounting Wide variation product line-up correspond to various needs ■ Recommended Applications ● Cellular phones, wireless communication equipment (W-LAN, Bluetooth), various modules, HIC, TV, VTR, PC & peripherals, DVD, DSC, STB. ■ Inductors · Selection Guide Technology Case Usage Size : mm (inch) Non wound Wire wound Discontinued Size 1005 (0402) Size 1608 (0603) Size 2012 (0805) Size 2520 (1008) Size 3225 (1210) Size 4532 (1812) ELJRF ELJRE ELJND ELJNC ELJNA 1.0–100 nH 1.0–220 nH 10–1000 nH 10–820 nH 47–8200 nH ELJQF ELJQE 1.0–39 nH 2.2–56 nH ELJFC ELJFA ELJFB 0.22–100 µH 0.22–220 µH 0.22–1000 µH High Freq. Use High Freq. High-Q General Use ELJPF ELJPE ELJPC/PC□3 ELJLC ELJPA/PA□2 ELJLA ELJPB 2.2–10 nH 2.2–22 nH 1.0–33 µH 1.0–330 µH 10–220 µH ELJSC ELJSA 27–100 µH 10–270 µH High Power Magnetically Shielded ELJEA Low DC Resistance 1.0–330 µH ELJDA/ELJFA Signal Processing Use (Low Distortion Type) 39–100 µH Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 Sep. 2012 6