RENESAS R8C/2J

R8C/2H Group, R8C/2J Group
RENESAS MCU
1.
REJ03B0217-0100
Rev.1.00
Mar 28, 2008
Overview
1.1
Features
The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core,
employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable
of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation
processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs also
use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
1.1.1
Applications
Electric power meters, electronic household appliances, office equipment, audio equipment, consumer
equipment, etc.
1.1.2
Specifications
Table 1.1 outlines the Specifications for R8C/2H Group and Table 1.2 outlines the Specifications for R8C/2J
Group.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 1 of 65
R8C/2H Group, R8C/2J Group
Table 1.1
Item
CPU
Specifications for R8C/2H Group
Function
Central processing
unit
Memory
ROM, RAM
Power Supply Voltage detection
Voltage
circuit
Detection
Comparator
I/O Ports
Clock
1. Overview
Clock generation
circuits
Interrupts
Watchdog Timer
Timer
Timer RA
Timer RB
Timer RE
Timer RF
Serial
UART0, UART2
Interface
LIN Module
Flash Memory
Operating Frequency/Supply
Voltage
Current consumption
Operating Ambient Temperature
Package
Specification
R8C/Tiny series core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
125 ns (System clock = 8 MHz, VCC = 2.7 to 5.5 V)
250 ns (System clock = 4 MHz, VCC = 2.2 to 5.5 V)
• Multiplier: 16 bits × 16 bits → 32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to Table 1.3 Product List for R8C/2H Group.
• Power-on reset
• Voltage detection 3
•
•
•
•
•
2 circuits (shared with voltage monitor 1 and voltage monitor 2)
External reference voltage input is available
Output-only: 1
CMOS I/O ports: 15, selectable pull-up resistor
2 circuits: On-chip oscillator (high-speed, low-speed)
(high-speed on-chip oscillator has a frequency adjustment function),
XCIN clock oscillation circuit (32 kHz)
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (low-speed clock, high-speed on-chip oscillator,
low-speed on-chip oscillator), wait mode, stop mode
Real-time clock (timer RE)
• External: 3 sources, Internal: 17 sources, Software: 4 sources
• Priority levels: 7 levels
15 bits × 1 (with prescaler), reset start selectable
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait oneshot generation mode
8 bits × 1
Real-time clock mode (count seconds, minutes, hours, days of week), output
compare mode
16 bits × 1 (with capture/compare register pin and compare register pin)
Input capture mode, output compare mode
Clock synchronous serial I/O/UART × 2
Hardware LIN: 1 (timer RA, UART0)
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 100 times
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
System clock = 8 MHz (VCC = 2.7 to 5.5 V)
System clock = 4 MHz (VCC = 2.2 to 5.5 V)
5 mA (VCC = 5 V, system clock = 8 MHz)
23 µA (VCC = 3 V, wait mode (low-speed on-chip oscillator on))
0.7 µA (VCC = 3 V, stop mode, BGR trimming circuit disabled)
-20 to 85°C (N version)
-40 to 85°C (D version)(1)
20-pin LSSOP
Package code: PLSP0020JB-A (previous code: 20P2F-A)
NOTE:
1. Specify the D version if D version functions are to be used.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 2 of 65
R8C/2H Group, R8C/2J Group
Table 1.2
Item
CPU
Specifications for R8C/2J Group
Function
Central processing
unit
Memory
ROM, RAM
Power Supply Voltage detection
Voltage
circuit
Detection
Comparator
I/O Ports
Clock
1. Overview
Clock generation
circuits
Interrupts
Watchdog Timer
Timer
Timer RA
Timer RB
Timer RE
Timer RF
Serial
UART0
Interface
LIN Module
Flash Memory
Operating Frequency/Supply
Voltage
Current consumption
Operating Ambient Temperature
Package
Specification
R8C/Tiny series core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
125 ns (System clock = 8 MHz, VCC = 2.7 to 5.5 V)
250 ns (System clock = 4 MHz, VCC = 2.2 to 5.5 V)
• Multiplier: 16 bits × 16 bits → 32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to Table 1.4 Product List for R8C/2J Group.
• Power-on reset
• Voltage detection 3
• 2 circuits (shared with voltage monitor 1 and voltage monitor 2)
• External reference voltage input is available
CMOS I/O ports: 12, selectable pull-up resistor
• 1 circuits: On-chip oscillator (high-speed, low-speed)
(high-speed on-chip oscillator has a frequency adjustment function),
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (high-speed on-chip oscillator, low-speed on-chip
oscillator), wait mode, stop mode
• External: 3 sources, Internal: 14 sources, Software: 4 sources
• Priority levels: 7 levels
15 bits × 1 (with prescaler), reset start selectable
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait oneshot generation mode
Not implemented
16 bits × 1 (with capture/compare register pin and compare register pin)
Input capture mode, output compare mode
Clock synchronous serial I/O/UART × 1
Hardware LIN: 1 (timer RA, UART0)
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 100 times
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
System clock = 8 MHz (VCC = 2.7 to 5.5 V)
System clock = 4 MHz (VCC = 2.2 to 5.5 V)
5 mA (VCC = 5 V, system clock = 8 MHz)
23 µA (VCC = 3 V, wait mode (low-speed on-chip oscillator on))
0.7 µA (VCC = 3 V, stop mode, BGR trimming circuit disabled)
-20 to 85°C (N version)
-40 to 85°C (D version)(1)
20-pin LSSOP
Package code: PLSP0020JB-A (previous code: 20P2F-A)
NOTE:
1. Specify the D version if D version functions are to be used.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 3 of 65
R8C/2H Group, R8C/2J Group
1.2
1. Overview
Product List
Table 1.3 lists Product List for R8C/2H Group, Figure 1.1 shows a Part Number, Memory Size, and Package of
R8C/2H Group. Table 1.4 lists Product List for R8C/2J Group, Figure 1.2 shows a Part Number, Memory Size, and
Package of R8C/2J Group.
Table 1.3
Product List for R8C/2H Group
Part No.
R5F212H1SNSP
R5F212H2SNSP
R5F212H1SDSP
R5F212H2SDSP
Part No.
ROM Capacity
4 Kbytes
8 Kbytes
4 Kbytes
8 Kbytes
Current of Mar. 2008
RAM Capacity
256 bytes
384 bytes
256 bytes
384 bytes
Package Type
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
Remarks
N version
D version
R 5 F 21 2H 1 S N SP
Package type:
SP: PLSP0020JB-A
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
S: Low-voltage version (other no symbols)
ROM capacity
1: 4 KB
2: 8 KB
R8C/2H Group
R8C/Tiny Series
Memory type
F: Flash memory version
Renesas MCU
Renesas semiconductor
Figure 1.1
Part Number, Memory Size, and Package of R8C/2H Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 4 of 65
R8C/2H Group, R8C/2J Group
Table 1.4
1. Overview
Product List for R8C/2J Group
Part No.
R5F212J0SNSP
R5F212J1SNSP
R5F212J0SDSP
R5F212J1SDSP
Part No.
ROM Capacity
2 Kbytes
4 Kbytes
2 Kbytes
4 Kbytes
Current of Mar. 2008
RAM Capacity
256 bytes
384 bytes
256 bytes
384 bytes
Package Type
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
Remarks
N version
D version
R 5 F 21 2J 1 S N SP
Package type:
SP: PLSP0020JB-A
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
S: Low-voltage version (other no symbols)
ROM capacity
0: 2 KB
1: 4 KB
R8C/2J Group
R8C/Tiny Series
Memory type
F: Flash memory version
Renesas MCU
Renesas semiconductor
Figure 1.2
Part Number, Memory Size, and Package of R8C/2J Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 5 of 65
R8C/2H Group, R8C/2J Group
1.3
1. Overview
Block Diagram
Figure 1.3 shows a Block Diagram of R8C/2H Group and Figure 1.4 shows a Block Diagram of R8C/2J Group.
I/O ports
8
2
Port P1
Port P3
2
1
3
Port P4
Port P6
Peripheral functions
UART or
clock synchronous serial I/O
(8 bits × 2 channels)
Timers
Timer RA (8 bits)
Timer RB (8 bits)
Timer RE (8 bits)
Timer RF (16 bits)
System clock
generation circuit
High-speed on-chip oscillator
Low-Speed on-chip oscillator
XCIN-XCOUT
LIN module
(1 channel)
Voltage detection circuit
(3 circuits)
Comparator
(2 circuits)
Watchdog timer
(15 bits)
R8C/Tiny Series CPU core
R0H
R1H
R0L
R1L
R2
R3
SB
ROM(1)
USP
ISP
INTB
A0
A1
FB
Memory
RAM(2)
PC
FLG
Multiplier
NOTES:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.3
Block Diagram of R8C/2H Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 6 of 65
R8C/2H Group, R8C/2J Group
1. Overview
I/O ports
8
2
Port P1
Port P3
1
1
Port P4
Port P6
Peripheral functions
UART or
clock synchronous serial I/O
(8 bits × 1 channels)
Timers
System clock
generation circuit
High-speed on-chip oscillator
Low-Speed on-chip oscillator
Timer RA (8 bits)
Timer RB (8 bits)
Timer RF (16 bits)
LIN module
(1 channel)
Voltage detection circuit
(3 circuits)
Comparator
(2 circuits)
Watchdog timer
(15 bits)
R8C/Tiny Series CPU core
R0H
R1H
R0L
R1L
R2
R3
SB
ROM(1)
USP
ISP
INTB
A0
A1
FB
Memory
RAM(2)
PC
FLG
Multiplier
NOTES:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.4
Block Diagram of R8C/2J Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 7 of 65
R8C/2H Group, R8C/2J Group
1.4
1. Overview
Pin Assignment
Figure 1.5 shows Pin Assignment (Top View) of R8C/2H Group. Table 1.5 outlines the Pin Name Information by
Pin Number of R8C/2H Group.
Figure 1.6 shows Pin Assignment (Top View) of R8C/2J Group. Table 1.6 outlines the Pin Name Information by
Pin Number of R8C/2J Group.
20
P6_3/TXD2
P3_7/TRAO/TRFO11
2
19
P3_3/TRFO10/TRFI
RESET
3
18
P1_0/KI0/TRFO00/VCMP1
XCOUT/(P4_4)(1)
4
17
P1_1/KI1/TRFO01/VCMP2
VSS
5
16
P6_5/CLK2/TREO
XCIN/(P4_3)(1)
6
15
P1_2/KI2/TRFO02/CVREF
VCC
7
14
P1_3/KI3/VCOUT1/TRBO
MODE
8
13
P1_4/TXD0
P4_5/INT0
9
12
P1_5/RXD0/(TRAIO)/(INT1)(1)
10
11
P1_6/CLK0/VCOUT2
P1_7/TRAIO/INT1
R8C/2H Group
1
PLSP0020JB-A
(20P2F-A)
(top view)
P6_4/RXD2
NOTES:
1. Can be assigned to the pin in parentheses by a program.
2. Confirm the pin 1 position on the package by referring to the package dimensions.
Figure 1.5
Pin Assignment (Top View) of R8C/2H Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 8 of 65
R8C/2H Group, R8C/2J Group
Table 1.5
Pin
Number
1. Overview
Pin Name Information by Pin Number of R8C/2H Group
Control Pin
Port
1
P6_4
2
P3_7
3
RESET
4
XCOUT
5
VSS
6
XCIN
7
VCC
8
MODE
I/O Pin Functions for of Peripheral Modules
Interrupt
Timer
Comparator
RXD2
TRAO/TRFO11
(P4_4)
(P4_3)
9
P4_5
INT0
10
P1_7
INT1
TRAIO
(INT1)(1)
(TRAIO)(1)
11
P1_6
12
P1_5
13
P1_4
14
P1_3
15
P1_2
16
P6_5
17
P1_1
18
P1_0
19
P3_3
20
P6_3
CLK0
Page 9 of 65
VCOUT2
RXD0
TXD0
KI3
TRBO
VCOUT1
KI2
TRFO02
CVREF
TREO
CLK2
KI1
TRFO01
VCMP2
KI0
TRFO00
VCMP1
TRFO10/TRFI
NOTE:
1. Can be assigned to the pin in parentheses by a program.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Serial Interface
TXD2
R8C/2H Group, R8C/2J Group
1. Overview
20
NC
P3_7/TRAO/TRFO11
2
19
P3_3/TRFO10/TRFI
RESET
3
18
P1_0/KI0/TRFO00/VCMP1
NC
4
17
P1_1/KI1/TRFO01/VCMP2
VSS
5
16
P6_5
NC
6
15
P1_2/KI2/TRFO02/CVREF
VCC
7
14
P1_3/KI3/VCOUT1/TRBO
MODE
8
13
P1_4/TXD0
P4_5/INT0
9
12
P1_5/RXD0/(TRAIO)/(INT1)(1)
10
11
P1_6/CLK0/VCOUT2
P1_7/TRAIO/INT1
R8C/2J Group
1
PLSP0020JB-A
(20P2F-A)
(top view)
NC
NOTES:
1. Can be assigned to the pin in parentheses by a program.
2. Confirm the pin 1 position on the package by referring to the package dimensions.
NC…Non-Connection
Figure 1.6
Pin Assignment (Top View) of R8C/2J Group
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 10 of 65
R8C/2H Group, R8C/2J Group
Table 1.6
1. Overview
Pin Name Information by Pin Number of R8C/2J Group
Pin
Number
Control Pin
1
NC(2)
2
I/O Pin Functions for of Peripheral Modules
Port
Interrupt
P3_7
3
RESET
4
NC(2)
5
VSS
6
NC(2)
7
VCC
8
MODE
9
Timer
Serial Interface
Comparator
CLK0
VCOUT2
TRAO/TRFO11
P4_5
INT0
10
P1_7
INT1
11
P1_6
12
P1_5
13
P1_4
14
TRAIO
(INT1)(1)
(TRAIO)(1)
P1_3
KI3
TRBO
VCOUT1
15
P1_2
KI2
TRFO02
CVREF
16
P6_5
17
P1_1
KI1
TRFO01
VCMP2
18
P1_0
KI0
TRFO00
VCMP1
19
20
P3_3
TXD0
TRFO10/TRFI
NC(2)
NOTES:
1. Can be assigned to the pin in parentheses by a program.
2. NC(Non-Connection)
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 11 of 65
RXD0
R8C/2H Group, R8C/2J Group
1.5
1. Overview
Pin Functions
Table 1.7 lists Pin Functions of R8C/2H Group and Table 1.8 lists Pin Functions of R8C/2J Group.
Table 1.7
Pin Functions of R8C/2H Group
Type
I/O Type
Description
VCC, VSS
–
Apply 2.2 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin.
Reset input
RESET
I
Input “L” on this pin resets the MCU.
MODE
MODE
I
Connect this pin to VCC via a resistor.
XCIN clock input
XCIN
I
XCIN clock output
XCOUT
O
These pins are provided for XCIN clock generation circuit I/O.
Connect a crystal oscillator between the XCIN and XCOUT
pins.(1) To use an external clock, input it to the XCIN pin and
leave the XCOUT pin open.
INT interrupt input
INT0, INT1
I
INT interrupt input pins
Key input interrupt
KI0 to KI3
I
Key input interrupt input pins
Power supply input
Timer RA
Symbol
TRAIO
I/O
Timer RA I/O pin
TRAO
O
Timer RA output pin
Timer RB
TRBO
O
Timer RB output pin
Timer RE
TREO
O
Divided clock output pin
Timer RF
TRFI
I
Timer RF input pin
TRFO00 to TRFO02,
TRFO10 to TRFO11
O
Timer RF output pins
Serial interface
Comparator
CLK0, CLK2
I/O
RXD0, RXD2
I
Clock I/O pin
TXD0, TXD2
O
Serial data output pin
VCMP1, VCMP2
I
Analog input pins to comparator
Serial data input pin
CVREF
I
Reference voltage input pin to comparator
VCOUT1, VCOUT2
O
Comparator output pins
I/O port
P1_0 to P1_7,
P3_3, P3_7,
P4_3, P4_5,
P6_3 to P6_5
I/O
CMOS I/O ports. Each port has an I/O select direction
register, allowing each pin in the port to be directed for input
or output individually.
Any port set to input can be set to use a pull-up resistor or not
by a program.
Output port
P4_4
O
Output-only port
I: Input
O: Output
I/O: Input and output
NOTE:
1. Refer to the oscillator manufacturer for oscillation characteristics.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 12 of 65
R8C/2H Group, R8C/2J Group
Table 1.8
1. Overview
Pin Functions of R8C/2J Group
Type
Symbol
I/O Type
Description
Power supply input
VCC, VSS
–
Apply 2.2 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin.
Reset input
RESET
I
Input “L” on this pin resets the MCU.
MODE
MODE
I
Connect this pin to VCC via a resistor.
INT interrupt input
INT0, INT1
I
INT interrupt input pins
Key input interrupt
KI0 to KI3
I
Key input interrupt input pins
Timer RA
TRAIO
TRAO
O
Timer RA output pin
Timer RB
TRBO
O
Timer RB output pin
Timer RF
TRFI
I
Timer RF input pin
TRFO00 to TRFO02,
TRFO10 to TRFO11
O
Timer RF output pins
Serial interface
Comparator
I/O port
I: Input
I/O
Timer RA I/O pin
CLK0
I/O
RXD0
I
Clock I/O pin
TXD0
O
Serial data output pin
VCMP1, VCMP2
I
Analog input pins to comparator
Serial data input pin
CVREF
I
Reference voltage input pin to comparator
VCOUT1, VCOUT2
O
Comparator output pins
P1_0 to P1_7,
P3_3, P3_7,
P4_5, P6_5
I/O
CMOS I/O ports. Each port has an I/O select direction
register, allowing each pin in the port to be directed for input
or output individually.
Any port set to input can be set to use a pull-up resistor or not
by a program.
O: Output
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
I/O: Input and output
Page 13 of 65
R8C/2H Group, R8C/2J Group
2.
2. Central Processing Unit (CPU)
Central Processing Unit (CPU)
Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a
register bank. There are two sets of register bank.
b31
b15
R2
R3
b8b7
b0
R0H (high-order of R0) R0L (low-order of R0)
R1H (high-order of R1) R1L (low-order of R1)
Data registers(1)
R2
R3
A0
A1
FB
b19
b15
Address registers(1)
Frame base register(1)
b0
Interrupt table register
INTBL
INTBH
The 4 high order bits of INTB are INTBH and
the 16 low order bits of INTB are INTBL.
b19
b0
Program counter
PC
b15
b0
USP
User stack pointer
ISP
Interrupt stack pointer
SB
Static base register
b15
b0
FLG
b15
b8
IPL
b7
Flag register
b0
U I O B S Z D C
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bit
Processor interrupt priority level
Reserved bit
NOTE:
1. These registers comprise a register bank. There are two register banks.
Figure 2.1
CPU Registers
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 14 of 65
R8C/2H Group, R8C/2J Group
2.1
2. Central Processing Unit (CPU)
Data Registers (R0, R1, R2, and R3)
R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split
into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are
analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is
analogous to R2R0.
2.2
Address Registers (A0 and A1)
A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also
used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 to be used
as a 32-bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register that indicates the start address of an interrupt vector table.
2.5
Program Counter (PC)
PC is 20 bits wide and indicates the address of the next instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointers (SP), USP, and ISP, are each 16 bits wide. The U flag of FLG is used to switch between
USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register for SB relative addressing.
2.8
Flag Register (FLG)
FLG is an 11-bit register indicating the CPU state.
2.8.1
Carry Flag (C)
The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit.
2.8.2
Debug Flag (D)
The D flag is for debugging only. Set it to 0.
2.8.3
Zero Flag (Z)
The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0.
2.8.4
Sign Flag (S)
The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0.
2.8.5
Register Bank Select Flag (B)
Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1.
2.8.6
Overflow Flag (O)
The O flag is set to 1 when an operation results in an overflow; otherwise to 0.
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R8C/2H Group, R8C/2J Group
2.8.7
2. Central Processing Unit (CPU)
Interrupt Enable Flag (I)
The I flag enables maskable interrupts.
Interrupt are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0
when an interrupt request is acknowledged.
2.8.8
Stack Pointer Select Flag (U)
ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.
The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software
interrupt numbers 0 to 31 is executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7.
If a requested interrupt has higher priority than IPL, the interrupt is enabled.
2.8.10
Reserved Bit
If necessary, set to 0. When read, the content is undefined.
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R8C/2H Group, R8C/2J Group
3.
3. Memory
Memory
Figure 3.1 is a Memory Map of R8C/2H Group and Figure 3.2 is a Memory Map of R8C/2J Group. The R8C/2H group
has 1 Mbyte of address space from addresses 00000h to FFFFFh.
The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 4-Kbyte internal
ROM area is allocated addresses 0F000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each
interrupt routine.
The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 256-bytes internal
RAM area is allocated addresses 00400h to 004FFh. The internal RAM is used not only for storing data but also for
calling subroutines and as stacks when interrupt requests are acknowledged.
Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers
are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot
be accessed by users.
00000h
002FFh
SFR
(Refer to 4. Special
Function Registers
(SFRs))
00400h
Internal RAM
0XXXh
0FFDCh
Undefined instruction
Overflow
BRK instruction
Address match
Single step
Watchdog timer/voltage monitor/comparator
(Reserved)
(Reserved)
Reset
0YYYYh
Internal ROM
(program ROM)
0FFFFh
0FFFFh
FFFFFh
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Internal ROM
Part Number
Figure 3.1
Internal RAM
Size
Address 0YYYYh
Size
Address 0XXXXh
R5F212H1SNSP, R5F212H1SDSP
4 Kbytes
0F000h
256 bytes
004FFh
R5F212H2SNSP, R5F212H2SDSP
8 Kbytes
0E000h
384 bytes
0057Fh
Memory Map of R8C/2H Group
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R8C/2H Group, R8C/2J Group
00000h
002FFh
3. Memory
SFR
(Refer to 4. Special
Function Registers
(SFRs))
00400h
Internal RAM
0XXXh
0FFDCh
Undefined instruction
Overflow
BRK instruction
Address match
Single step
Watchdog timer/voltage monitor/comparator
(Reserved)
(Reserved)
Reset
0YYYYh
Internal ROM
(program ROM)
0FFFFh
0FFFFh
FFFFFh
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Internal ROM
Part Number
Figure 3.2
Internal RAM
Size
Address 0YYYYh
Size
Address 0XXXXh
R5F212J0SNSP, R5F212J0SDSP
2 Kbytes
0F800h
256 bytes
004FFh
R5F212J1SNSP, R5F212J1SDSP
4 Kbytes
0F000h
384 bytes
0057Fh
Memory Map of R8C/2J Group
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R8C/2H Group, R8C/2J Group
4.
4. Special Function Registers (SFRs)
Special Function Registers (SFRs)
An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.12 list the special
function registers.
Table 4.1
Address
0000h
0001h
0002h
0003h
0004h
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
SFR Information (1)(1)
Register
Symbol
After reset
Processor Mode Register 0
Processor Mode Register 1
System Clock Control Register 0
System Clock Control Register 1
PM0
PM1
CM0
CM1
00h
00h
01011000b
00h
Protect Register
PRCR
00h
System Clock Select Register(3)
Watchdog Timer Reset Register
Watchdog Timer Start Register
Watchdog Timer Control Register
Address Match Interrupt Register 0
OCD
WDTR
WDTS
WDC
RMAD0
Address Match Interrupt Enable Register
Address Match Interrupt Register 1
AIER
RMAD1
00000100b
XXh
XXh
00X11111b
00h
00h
00h
00h
00h
00h
00h
Count Source Protection Mode Register
CSPR
00h
10000000b(2)
High-Speed On-Chip Oscillator Control Register 0
High-Speed On-Chip Oscillator Control Register 1
High-Speed On-Chip Oscillator Control Register 2
HRA0
HRA1
HRA2
00h
When Shipping
00h
Clock Prescaler Reset Flag(3)
High-Speed On-Chip Oscillator Control Register 4
CPSRF
FRA4
00h
When Shipping
High-Speed On-Chip Oscillator Control Register 6
FRA6
When Shipping
BGR Trimming Auxiliary Register A
BGR Trimming Auxiliary Register B
BGRTRMA
BGRTRMB
When Shipping
When Shipping
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. The CSPROINI bit in the OFS register is set to 0.
3. This register is not implemented in the R8C/2J Group.
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R8C/2H Group, R8C/2J Group
Table 4.2
Address
0030h
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
0040h
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
0058h
0059h
005Ah
005Bh
005Ch
005Dh
005Eh
005Fh
0060h
0061h
0062h
0063h
0064h
0065h
0066h
0067h
0068h
0069h
006Ah
006Bh
006Ch
006Dh
006Eh
006Fh
4. Special Function Registers (SFRs)
SFR Information (2)(1)
Register
Symbol
After reset
Voltage Detection Register 1(2)
Voltage Detection Register 2(2)
VCA1
VCA2
00001000b
Voltage Monitor 1 Circuit Control Register(5)
Voltage Monitor 2 Circuit Control Register(5)
Voltage Monitor 0 Circuit Control Register(2)
VW1C
VW2C
VW0C
00001010b
00000010b
Voltage Detection Circuit External Input Control Register
Comparator Mode Register
Voltage Monitor Circuit Edge Select Register
BGR Control Register
BGR Trimming Register
VCAB
ALCMR
VCAC
BGRCR
BGRTRM
00h
00h
00h
00h
When Shipping
Comparator 1 Interrupt Control Register
Comparator 2 Interrupt Control Register
VCMP1IC
VCMP2IC
XXXXX000b
XXXXX000b
Timer RE Interrupt Control Register(6)
UART2 Transmit Interrupt Control Register(6)
UART2 Receive Interrupt Control Register(6)
Key Input Interrupt Control Register
TREIC
S2TIC
S2RIC
KUPIC
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
Compare 1 Interrupt Control Register
UART0 Transmit Interrupt Control Register
UART0 Receive Interrupt Control Register
CMP1IC
S0TIC
S0RIC
XXXXX000b
XXXXX000b
XXXXX000b
Timer RA Interrupt Control Register
TRAIC
XXXXX000b
Timer RB Interrupt Control Register
INT1 Interrupt Control Register
TRBIC
INT1IC
XXXXX000b
XX00X000b
Timer RF Interrupt Control Register
Compare 0 Interrupt Control Register
INT0 Interrupt Control Register
TRFIC
CMP0IC
INT0IC
XXXXX000b
XXXXX000b
XX00X000b
Capture Interrupt Control Register
CAPIC
XXXXX000b
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register.
3. The LVD0ON bit in the OFS register is set to 1 and hardware reset.
4. Power-on reset, voltage monitor 0 reset, or the LVD0ON bit in the OFS register is set to 0 and hardware reset.
5. Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect b2 and b3.
6. This register is not implemented in the R8C/2J Group.
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00h(3)
00100000b(4)
1000X010b(3)
1100X011b(4)
R8C/2H Group, R8C/2J Group
Table 4.3
Address
0070h
0071h
0072h
0073h
0074h
0075h
0076h
0077h
0078h
0079h
007Ah
007Bh
007Ch
007Dh
007Eh
007Fh
0080h
0081h
0082h
0083h
0084h
0085h
0086h
0087h
0088h
0089h
008Ah
008Bh
008Ch
008Dh
008Eh
008Fh
0090h
0091h
0092h
0093h
0094h
0095h
0096h
0097h
0098h
0099h
009Ah
009Bh
009Ch
009Dh
009Eh
009Fh
00A0h
00A1h
00A2h
00A3h
00A4h
00A5h
00A6h
00A7h
00A8h
00A9h
00AAh
00ABh
00ACh
00ADh
00AEh
00AFh
4. Special Function Registers (SFRs)
SFR Information (3)(1)
Register
Symbol
UART0 Transmit/Receive Mode Register
UART0 Bit Rate Register
UART0 Transmit Buffer Register
U0MR
U0BRG
U0TB
UART0 Transmit/Receive Control Register 0
UART0 Transmit/Receive Control Register 1
UART0 Receive Buffer Register
U0C0
U0C1
U0RB
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
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After reset
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
R8C/2H Group, R8C/2J Group
Table 4.4
Address
00B0h
00B1h
00B2h
00B3h
00B4h
00B5h
00B6h
00B7h
00B8h
00B9h
00BAh
00BBh
00BCh
00BDh
00BEh
00BFh
00C0h
00C1h
00C2h
00C3h
00C4h
00C5h
00C6h
00C7h
00C8h
00C9h
00CAh
00CBh
00CCh
00CDh
00CEh
00CFh
00D0h
00D1h
00D2h
00D3h
00D4h
00D5h
00D6h
00D7h
00D8h
00D9h
00DAh
00DBh
00DCh
00DDh
00DEh
00DFh
00E0h
00E1h
00E2h
00E3h
00E4h
00E5h
00E6h
00E7h
00E8h
00E9h
00EAh
00EBh
00ECh
00EDh
00EEh
00EFh
4. Special Function Registers (SFRs)
SFR Information (4)(1)
Register
Symbol
After reset
Port P1 Register
P1
00h
Port P1 Direction Register
PD1
00h
Port P3 Register
P3
00h
Port P3 Direction Register
Port P4 Register
PD3
P4
00h
00h
Port P4 Direction Register
PD4
00h
Port P6 Register
P6
00h
Port P6 Direction Register
PD6
00h
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
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R8C/2H Group, R8C/2J Group
Table 4.5
Address
00F0h
00F1h
00F2h
00F3h
00F4h
00F5h
00F6h
00F7h
00F8h
00F9h
00FAh
00FBh
00FCh
00FDh
00FEh
00FFh
0100h
0101h
0102h
0103h
0104h
0105h
0106h
0107h
0108h
0109h
010Ah
010Bh
010Ch
010Dh
010Eh
010Fh
0110h
0111h
0112h
0113h
0114h
0115h
0116h
0117h
0118h
0119h
011Ah
011Bh
011Ch
011Dh
011Eh
011Fh
0120h
0121h
0122h
0123h
0124h
0125h
0126h
0127h
0128h
0129h
012Ah
012Bh
012Ch
012Dh
012Eh
012Fh
4. Special Function Registers (SFRs)
SFR Information (5)(1)
Register
Symbol
After reset
Pin Select Register 2
PINSR2
00h
Port Mode Register
External Input Enable Register
INT Input Filter Select Register
Key Input Enable Register
Pull-Up Control Register 0
Pull-Up Control Register 1
PMR
INTEN
INTF
KIEN
PUR0
PUR1
00h
00h
00h
00h
00h
00h
Timer RA Control Register
Timer RA I/O Control Register
Timer RA Mode Register
Timer RA Prescaler Register
Timer RA Register
TRACR
TRAIOC
TRAMR
TRAPRE
TRA
00h
00h
00h
FFh
FFh
LIN Control Register
LIN Status Register
Timer RB Control Register
Timer RB One-Shot Control Register
Timer RB I/O Control Register
Timer RB Mode Register
Timer RB Prescaler Register
Timer RB Secondary Register
Timer RB Primary Register
LINCR
LINST
TRBCR
TRBOCR
TRBIOC
TRBMR
TRBPRE
TRBSC
TRBPR
00h
00h
00h
00h
00h
00h
FFh
FFh
FFh
Timer RE Second Data Register / Counter Data Register(2)
Timer RE Minute Data Register / Compare Data Register(2)
Timer RE Hour Data Register(2)
Timer RE Day of Week Data Register(2)
Timer RE Control Register 1(2)
Timer RE Control Register 2(2)
Timer RE Count Source Select Register(2)
Timer RE Real-Time Clock Precision Adjust Register(2)
TRESEC
TREMIN
TREHR
TREWK
TRECR1
TRECR2
TRECSR
TREOPR
XXh
XXh
X0XXXXXXb
X0000XXXb
XXX0X0X0b
00XXXXXXb
00001000b
00h
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions
2. This register is not implemented in the R8C/2J Group.
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R8C/2H Group, R8C/2J Group
Table 4.6
Address
0130h
0131h
0132h
0133h
0134h
0135h
0136h
0137h
0138h
0139h
013Ah
013Bh
013Ch
013Dh
013Eh
013Fh
0140h
0141h
0142h
0143h
0144h
0145h
0146h
0147h
0148h
0149h
014Ah
014Bh
014Ch
014Dh
014Eh
014Fh
0150h
0151h
0152h
0153h
0154h
0155h
0156h
0157h
0158h
0159h
015Ah
015Bh
015Ch
015Dh
015Eh
015Fh
0160h
0161h
0162h
0163h
0164h
0165h
0166h
0167h
0168h
0169h
016Ah
016Bh
016Ch
016Dh
016Eh
016Fh
4. Special Function Registers (SFRs)
SFR Information (6)(1)
Register
Symbol
UART2 Transmit/Receive Mode Register(2)
UART2 Bit Rate Register(2)
UART2 Transmit Buffer Register(2)
U2MR
U2BRG
U2TB
UART2 Transmit/Receive Control Register 0(2)
UART2 Transmit/Receive Control Register 1(2)
UART2 Receive Buffer Register(2)
U2C0
U2C1
U2RB
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. This register is not implemented in the R8C/2J Group.
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After reset
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
R8C/2H Group, R8C/2J Group
Table 4.7
4. Special Function Registers (SFRs)
SFR Information (7)(1)
Address
0170h
0171h
0172h
0173h
0174h
0175h
0176h
0177h
0178h
0179h
017Ah
017Bh
017Ch
017Dh
017Eh
017Fh
0180h
0181h
0182h
0183h
0184h
0185h
0186h
0187h
0188h
0189h
018Ah
018Bh
018Ch
018Dh
018Eh
018Fh
0190h
0191h
0192h
0193h
0194h
0195h
0196h
0197h
0198h
0199h
019Ah
019Bh
019Ch
019Dh
019Eh
019Fh
01A0h
01A1h
01A2h
01A3h
01A4h
01A5h
01A6h
01A7h
01A8h
01A9h
01AAh
01ABh
01ACh
01ADh
01AEh
01AFh
Register
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 25 of 65
Symbol
After reset
R8C/2H Group, R8C/2J Group
Table 4.8
Address
01B0h
01B1h
01B2h
01B3h
01B4h
01B5h
01B6h
01B7h
01B8h
01B9h
01BAh
01BBh
01BCh
01BDh
01BEh
01BFh
01C0h
01C1h
01C2h
01C3h
01C4h
01C5h
01C6h
01C7h
01C8h
01C9h
01CAh
01CBh
01CCh
01CDh
01CEh
01CFh
01D0h
01D1h
01D2h
01D3h
01D4h
01D5h
01D6h
01D7h
01D8h
01D9h
01DAh
01DBh
01DCh
01DDh
01DEh
01DFh
01E0h
01E1h
01E2h
01E3h
01E4h
01E5h
01E6h
01E7h
01E8h
01E9h
01EAh
01EBh
01ECh
01EDh
01EEh
01EFh
4. Special Function Registers (SFRs)
SFR Information (8)(1)
Register
Symbol
After reset
Flash Memory Control Register 4
FMR4
01000000b
Flash Memory Control Register 1
FMR1
1000000Xb
Flash Memory Control Register 0
FMR0
00000001b
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
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R8C/2H Group, R8C/2J Group
Table 4.9
4. Special Function Registers (SFRs)
SFR Information (9)(1)
Address
01F0h
01F1h
01F2h
01F3h
01F4h
01F5h
01F6h
01F7h
01F8h
01F9h
01FAh
01FBh
01FCh
01FDh
01FEh
01FFh
0200h
0201h
0202h
0203h
0204h
0205h
0206h
0207h
0208h
0209h
020Ah
020Bh
020Ch
020Dh
020Eh
020Fh
0210h
0211h
0212h
0213h
0214h
0215h
0216h
0217h
0218h
0219h
021Ah
021Bh
021Ch
021Dh
021Eh
021Fh
0220h
0221h
0222h
0223h
0224h
0225h
0226h
0227h
0228h
0229h
022Ah
022Bh
022Ch
022Dh
022Eh
022Fh
Register
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Rev.1.00 Mar 28, 2008
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Page 27 of 65
Symbol
After reset
R8C/2H Group, R8C/2J Group
Table 4.10
4. Special Function Registers (SFRs)
SFR Information (10)(1)
Address
0230h
0231h
0232h
0233h
0234h
0235h
0236h
0237h
0238h
0239h
023Ah
023Bh
023Ch
023Dh
023Eh
023Fh
0240h
0241h
0242h
0243h
0244h
0245h
0246h
0247h
0248h
0249h
024Ah
024Bh
024Ch
024Dh
024Eh
024Fh
0250h
0251h
0252h
0253h
0254h
0255h
0256h
0257h
0258h
0259h
025Ah
025Bh
025Ch
025Dh
025Eh
025Fh
0260h
0261h
0262h
0263h
0264h
0265h
0266h
0267h
0268h
0269h
026Ah
026Bh
026Ch
026Dh
026Eh
026Fh
Register
X: Undefined
NOTE:
1. The blank regions are reserved. Do not access locations in these regions.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 28 of 65
Symbol
After reset
R8C/2H Group, R8C/2J Group
Table 4.11
Address
0270h
0271h
0272h
0273h
0274h
0275h
0276h
0277h
0278h
0279h
027Ah
027Bh
027Ch
027Dh
027Eh
027Fh
0280h
0281h
0282h
0283h
0284h
0285h
0286h
0287h
0288h
0289h
028Ah
028Bh
028Ch
028Dh
028Eh
028Fh
0290h
0291h
0292h
0293h
0294h
0295h
0296h
0297h
0298h
0299h
029Ah
029Bh
029Ch
029Dh
029Eh
029Fh
02A0h
02A1h
02A2h
02A3h
02A4h
02A5h
02A6h
02A7h
02A8h
02A9h
02AAh
02ABh
02ACh
02ADh
02AEh
02AFh
4. Special Function Registers (SFRs)
SFR Information (11)(1)
Register
Symbol
After reset
Timer RF Register
TRF
00h
00h
Timer RF Control Register 2(4)
Timer RF Control Register 0
Timer RF Control Register 1
Capture and Compare 0 Register
TRFCR2
TRFCR0
TRFCR1
TRFM0
Compare 1 Register
TRFM1
00h
00h
00h
0000h(2)
FFFFh(3)
FFh
FFh
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. After input capture mode.
3. After output compare mode.
4. This register is not implemented in the R8C/2J Group.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 29 of 65
R8C/2H Group, R8C/2J Group
Table 4.12
SFR Information (12)(1)
Address
02B0h
02B1h
02B2h
02B3h
02B4h
02B5h
02B6h
02B7h
02B8h
02B9h
02BAh
02BBh
02BCh
02BDh
02BEh
02BFh
02C0h
02C1h
02C2h
02C3h
02C4h
02C5h
02C6h
02C7h
02C8h
02C9h
02CAh
02CBh
02CCh
02CDh
02CEh
02CFh
02D0h
02D1h
02D2h
02D3h
02D4h
02D5h
02D6h
02D7h
02D8h
02D9h
02DAh
02DBh
02DCh
02DDh
02DEh
02DFh
02E0h
02EFh
02F0h
02F1h
02F2h
02F3h
02F4h
02F5h
02F6h
02F7h
02F8h
02F9h
02FAh
02FBh
02FCh
02FDh
02FEh
02FFh
FFFFh
4. Special Function Registers (SFRs)
Register
Symbol
After reset
Pin Select Register 4
PINSR4
00h
Timer RF Output Control Register
TRFOUT
00h
Option Function Select Register
OFS
(Note 2)
X: Undefined
NOTES:
1. The blank regions are reserved. Do not access locations in these regions.
2. The OFS register cannot be changed by a program. Use a flash programmer to write to it.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 30 of 65
R8C/2H Group, R8C/2J Group
5.
5. Electrical Characteristics
Electrical Characteristics
5.1
R8C/2H Group
Table 5.1
Absolute Maximum Ratings
Symbol
Parameter
Rated Value
Unit
−0.3 to 6.5
V
Input voltage
−0.3 to VCC + 0.3
V
VO
Output voltage
−0.3 to VCC + 0.3
V
Pd
Power dissipation
500
mW
Topr
Operating ambient temperature
−20 to 85 (N version) /
−40 to 85 (D version)
°C
Tstg
Storage temperature
−65 to 150
°C
VCC
Supply voltage
VI
Table 5.2
IOH(sum)
IOH(peak)
IOH(avg)
IOL(sum)
IOL(sum)
IOL(peak)
IOL(avg)
f(XCIN)
−
Topr = 25°C
Recommended Operating Conditions
Symbol
VCC
VSS
VIH
VIL
IOH(sum)
Condition
Parameter
Conditions
Supply voltage
Supply voltage
Input “H” voltage
Input “L” voltage
Peak sum output “H”
Sum of all pins IOH(peak)
current
Average sum output “H”
Sum of all pins IOH(avg)
current
Peak output “H” current
All pins
Average output “H”
All pins
current
Peak sum output “L”
Sum of all pins IOL(peak)
currents
Average sum output “L”
Sum of all pins IOL(avg)
currents
Peak output “L” currents
All pins
Average output “L” current All pins
XCIN clock input oscillation frequency
System clock
OCD2 = 0
XClN clock selected
OCD2 = 1
On-chip oscillator clock
selected
2.2 V ≤ VCC ≤ 5.5 V
2.2 V ≤ VCC ≤ 5.5 V
HRA01 = 0
Low-speed on-chip
oscillator selected
HRA01 = 1
High-speed on-chip
oscillator selected
2.7 V ≤ VCC ≤ 5.5 V
HRA01 = 1
High-speed on-chip
oscillator selected
2.2 V ≤ VCC ≤ 5.5 V
Min.
2.2
−
0.8 VCC
0
−
Standard
Typ.
−
0
−
−
−
Max.
5.5
−
VCC
0.2 VCC
−160
−
−
−80
mA
−
−
−
−
−10
−5
mA
mA
−
−
160
mA
−
−
80
mA
−
−
0
0
−
−
−
−
10
5
70
70
mA
mA
kHz
kHz
−
125
−
kHz
−
−
8
MHz
−
−
4
MHz
NOTES:
1. VCC = 2.2 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
P1
P3
P4
30pF
P6
Figure 5.1
Ports P1, P3, P4, and P6 Timing Measurement Circuit
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 31 of 65
Unit
V
V
V
V
mA
R8C/2H Group, R8C/2J Group
Table 5.3
5. Electrical Characteristics
Flash Memory (Program ROM) Electrical Characteristics
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
100(3)
−
−
times
Byte program time
−
50
400
µs
−
Block erase time
−
0.4
9
s
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
2.2
−
5.5
V
−
Program, erase temperature
0
−
60
°C
−
Data hold time(7)
20
−
−
year
−
Program/erase endurance(2)
−
Ambient temperature = 55°C
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024
1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance
still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the
number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 32 of 65
R8C/2H Group, R8C/2J Group
Table 5.4
5. Electrical Characteristics
Voltage Detection 0 Circuit Electrical Characteristics
Symbol
Parameter
Condition
Vdet0
Voltage detection level
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(2)
Vccmin
MCU operating voltage minimum value
VCA25 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
2.2
2.3
2.4
V
−
0.9
−
µA
−
−
300
µs
2.2
−
−
V
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2
register to 0.
Table 5.5
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Vdet1
−
Parameter
Condition
Voltage detection level(4)
Voltage monitor 1 interrupt request generation
time(2)
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
VCA26 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
2.70
2.85
3.00
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1.
3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2
register to 0.
4. This parameter shows the voltage detection level when the power supply drops.
The voltage detection level when the power supply rises is higher than the voltage detection level when the power supply
drops by approximately 0.1 V.
Table 5.6
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Parameter
Vdet2
Voltage detection level
−
Voltage monitor 2 interrupt request generation time(2)
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
Condition
VCA27 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
3.3
3.6
3.9
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2.
3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2
register to 0.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 33 of 65
R8C/2H Group, R8C/2J Group
Table 5.7
5. Electrical Characteristics
Power-on Reset Circuit, Voltage Monitor 0 Reset Electrical Characteristics(3)
Symbol
Parameter
Condition
Standard
Min.
Typ.
Unit
Max.
Vpor1
Power-on reset valid voltage(4)
−
−
0.1
V
Vpor2
Power-on reset or voltage monitor 0 reset valid
voltage
0
−
Vdet0
V
trth
External power VCC rise gradient(2)
20
−
−
mV/msec
NOTES:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. This condition (external power VCC rise gradient) does not apply if VCC ≥ 1.0 V.
3. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVD0ON bit in the OFS register to 0, the
VW0C0 and VW0C6 bits in the VW0C register to 1 respectively, and the VCA25 bit in the VCA2 register to 1.
4. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on
reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if −20°C ≤ Topr ≤ 85°C, maintain tw(por1) for
3,000 s or more if −40°C ≤ Topr < −20°C.
Vdet0(3)
Vdet0(3)
2.2 V
trth
trth
External
Power VCC
Vpor2
Vpor1
Sampling time(1, 2)
tw(por1)
Internal
reset signal
(“L” valid)
1
× 32
fOCO-S
1
× 32
fOCO-S
NOTES:
1. When using the voltage monitor 0 digital filter, ensure that the voltage is within the MCU operation voltage
range (2.2 V or above) during the sampling time.
2. The sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details.
3. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual for details.
Figure 5.2
Reset Circuit Electrical Characteristics
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 34 of 65
R8C/2H Group, R8C/2J Group
Table 5.8
Comparator Electrical Characteristics
Symbol
Vref
Vcref
5. Electrical Characteristics
Parameter
Internal reference voltage
External input reference voltage
Standard
Condition
VCC = 2.2 V to 5.5 V, Topr = 25°C
Min.
Typ.
Max.
Unit
1.15
1.25
1.35
V
VCC = 2.2 V to 5.5 V,
Topr = −40 to 85°C
−
1.25
−
V
VCC = 2.2 V to 4.0 V
0.5
−
VCC − 1.1
V
VCC = 4.0 V to 5.5 V
0.5
−
VCC − 1.5
V
−0.3
−
VCC + 0.3
V
Vcin
External comparison voltage input
range
Vofs
Input offset voltage
−
20
120
mV
Tcrsp
Response time
−
4
−
µs
NOTE:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Table 5.9
High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
fOCO-F
Parameter
High-speed on-chip oscillator frequency
temperature • supply voltage dependence
Condition
Standard
Unit
Min.
Typ.
Max.
VCC = 4.75 V to 5.25 V
Topr = 0 to 60°C(2)
7.76
8
8.24
MHz
VCC = 2.7 V to 5.5 V
Topr = −20 to 85°C(2)
7.68
8
8.32
MHz
VCC = 2.7 V to 5.5 V
Topr = −40 to 85°C(2)
7.44
8
8.32
MHz
VCC = 2.2 V to 5.5 V
Topr = −20 to 85°C(3)
7.04
8
8.96
MHz
VCC = 2.2 V to 5.5 V
Topr = −40 to 85°C(3)
6.8
8
9.2
MHz
NOTES:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. These standard values show when the HRA1 register is set to the value before shipment and the HRA2 register is set to 00h.
3. These standard values show when the correction value in the FRA6 register is written into the HRA1 register.
Table 5.10
Low-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
fOCO-S
Low-speed on-chip oscillator frequency
30
125
250
−
Oscillation stability time
−
10
100
µs
−
Self power consumption at oscillation
−
15
−
µA
VCC = 5.0 V, Topr = 25°C
kHz
NOTE:
1. VCC = 2.2 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Table 5.11
Power Supply Circuit Timing Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
td(P-R)
Time for internal power supply stabilization during
power-on(2)
1
−
2000
µs
td(R-S)
STOP exit time(3)
−
−
150
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = 25°C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 35 of 65
R8C/2H Group, R8C/2J Group
Table 5.12
Electrical Characteristics (1) [VCC = 5 V]
Symbol
VOH
5. Electrical Characteristics
Parameter
Output “H” voltage
Condition
Standard
Typ.
Max.
IOH = −5 mA
VCC − 2.0
−
VCC
IOH = −200 µA
VCC − 0.5
−
VCC
V
−
−
2.0
V
VOL
Output “L” voltage
IOL = 5 mA
VT+-VT-
Hysteresis
IIH
Input “H” current
VI = 5 V, VCC = 5 V
IIL
Input “L” current
VI = 0 V, VCC = 5 V
VI = 0 V, VCC = 5 V
−
During stop mode
2.0
IOL = 200 µA
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, RXD2,
CLK0, CLK2
RESET
RPULLUP Pull-up resistance
RfXCIN
Feedback resistance
VRAM
RAM hold voltage
XCIN
Page 36 of 65
V
−
−
0.45
V
0.1
0.5
−
V
0.1
1.0
−
V
−
−
5.0
µA
−
−
−5.0
µA
30
50
167
kΩ
18
−
MΩ
−
−
V
NOTE:
1. VCC = 4.2 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Unit
Min.
R8C/2H Group, R8C/2J Group
Table 5.13
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [Vcc = 5 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 3.3 to 5.5 V)
on-chip oscillator mode
Single-chip mode,
output pins are open,
other pins are VSS
Low-speed
on-chip oscillator mode
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 37 of 65
Unit
mA
−
2
−
mA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
130
300
µA
−
130
300
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
Program operation on RAM
Flash memory off, FMSTP = 1
−
30
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
25
75
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
23
60
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
4
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
2.2
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
8
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
6
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.8
3
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.2
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
8
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
FMR47 = 1
Stop mode
Standard
Typ. Max.
5
8
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
Low-speed clock mode High-speed on-chip oscillator off
Wait mode
Min.
−
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V]
Table 5.14
XCIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XCIN)
XCIN input cycle time
14
−
µs
tWH(XCIN)
XCIN input “H” width
7
−
µs
tWL(XCIN)
XCIN input “L” width
7
−
µs
VCC = 5 V
tC(XCIN)
tWH(XCIN)
XCIN input
tWL(XCIN)
Figure 5.3
Table 5.15
XCIN Input Timing Diagram when VCC = 5 V
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
100
−
ns
tWH(TRAIO)
TRAIO input “H” width
40
−
ns
tWL(TRAIO)
TRAIO input “L” width
40
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.4
TRAIO Input Timing Diagram when VCC = 5 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 38 of 65
VCC = 5 V
R8C/2H Group, R8C/2J Group
Table 5.16
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLKi input cycle time
200
−
ns
tW(CKH)
CLKi input “H” width
100
−
ns
tW(CKL)
CLKi input “L” width
100
−
ns
td(C-Q)
TXDi output delay time
−
50
ns
th(C-Q)
TXDi hold time
0
−
ns
tsu(D-C)
RXDi input setup time
50
−
ns
th(C-D)
RXDi input hold time
90
−
ns
i = 0 or 2
VCC = 5 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 2
Figure 5.5
Table 5.17
Serial Interface Timing Diagram when VCC = 5 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tW(INH)
INTi input “H” width
250(1)
−
ns
tW(INL)
INTi input “L” width
250(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.6
External Interrupt INTi Input Timing Diagram when VCC = 5 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 39 of 65
R8C/2H Group, R8C/2J Group
Table 5.18
5. Electrical Characteristics
Electrical Characteristics (3) [VCC = 3 V]
Symbol
Parameter
Condition
Standard
Min.
Unit
Typ.
Max.
VCC − 0.5
−
VCC
V
−
−
0.5
V
0.1
0.3
−
V
0.1
0.4
−
V
−
−
4.0
µA
VOH
Output “H” voltage
IOH = −1 mA
VOL
Output “L” voltage
IOL = 1 mA
VT+-VT-
Hysteresis
IIH
Input “H” current
VI = 3 V, VCC = 3 V
IIL
Input “L” current
VI = 0 V, VCC = 3 V
−
−
−4.0
µA
VI = 0 V, VCC = 3 V
66
160
500
kΩ
−
18
−
MΩ
During stop mode
1.8
−
−
V
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, RXD2,
CLK0, CLK2
RESET
RPULLUP Pull-up resistance
RfXCIN
Feedback resistance
VRAM
RAM hold voltage
XCIN
NOTE:
1. VCC =2.7 to 3.3 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 40 of 65
R8C/2H Group, R8C/2J Group
Table 5.19
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [Vcc = 3 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 2.7 to 3.3 V)
on-chip oscillator mode
Single-chip mode,
output pins are open,
other pins are VSS
Low-speed
on-chip oscillator mode
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 41 of 65
Unit
mA
−
2
−
mA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
130
300
µA
−
130
300
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
Program operation on RAM
Flash memory off, FMSTP = 1
−
30
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
25
70
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
23
55
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
3.8
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
2
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
8
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
6
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.7
3
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.1
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
7
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
FMR47 = 1
Stop mode
Standard
Typ. Max.
5
−
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
Low-speed clock mode High-speed on-chip oscillator off
Wait mode
Min.
−
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) [VCC = 3 V]
Table 5.20
XCIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XCIN)
XCIN input cycle time
14
−
µs
tWH(XCIN)
XCIN input “H” width
7
−
µs
tWL(XCIN)
XCIN input “L” width
7
−
µs
VCC = 3 V
tC(XCIN)
tWH(XCIN)
XCIN input
tWL(XCIN)
Figure 5.7
XCIN Input Timing Diagram when VCC = 3 V
Table 5.21
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
300
−
ns
tWH(TRAIO)
TRAIO input “H” width
120
−
ns
tWL(TRAIO)
TRAIO input “L” width
120
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.8
TRAIO Input Timing Diagram when VCC = 3 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 42 of 65
VCC = 3 V
R8C/2H Group, R8C/2J Group
Table 5.22
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLKi input cycle time
300
−
ns
tW(CKH)
CLKi input “H” width
150
−
ns
tW(CKL)
CLKi Input “L” width
150
−
ns
td(C-Q)
TXDi output delay time
−
80
ns
th(C-Q)
TXDi hold time
0
−
ns
tsu(D-C)
RXDi input setup time
70
−
ns
th(C-D)
RXDi input hold time
90
−
ns
i = 0 or 2
VCC = 3 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 2
Figure 5.9
Table 5.23
Serial Interface Timing Diagram when VCC = 3 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tW(INH)
INTi input “H” width
380(1)
−
ns
tW(INL)
INTi input “L” width
380(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.10
External Interrupt INTi Input Timing Diagram when VCC = 3 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 43 of 65
R8C/2H Group, R8C/2J Group
Table 5.24
5. Electrical Characteristics
Electrical Characteristics (5) [VCC = 2.2 V]
Symbol
Parameter
Condition
Standard
Min.
Unit
Typ.
Max.
VCC − 0.5
−
VCC
V
−
−
0.5
V
0.05
0.3
−
V
0.05
0.15
−
V
−
−
4.0
µA
VOH
Output “H” voltage
IOH = −1 mA
VOL
Output “L” voltage
IOL = 1 mA
VT+-VT-
Hysteresis
IIH
Input “H” current
VI = 2.2 V
IIL
Input “L” current
VI = 0 V
−
−
−4.0
µA
VI = 0 V
100
200
600
kΩ
−
35
−
MΩ
During stop mode
1.8
−
−
V
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, RXD2,
CLK0, CLK2
RESET
RPULLUP Pull-up resistance
RfXCIN
Feedback resistance
VRAM
RAM hold voltage
XCIN
NOTE:
1. VCC = 2.2 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 44 of 65
R8C/2H Group, R8C/2J Group
Table 5.25
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (6) [Vcc = 2.2 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed
(VCC = 2.2 to 2.7 V)
on-chip oscillator mode
Single-chip mode,
output pins are open,
other pins are VSS
Low-speed
on-chip oscillator mode
High-speed on-chip oscillator on = 4 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 45 of 65
Unit
mA
−
1.5
−
mA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
100
230
µA
−
100
230
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
Program operation on RAM
Flash memory off, FMSTP = 1
−
25
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
22
60
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
20
55
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
3
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.8
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (high drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
7
−
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
BGR trimming circuit enabled (BGRCR0 = 0)
−
6
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.7
3
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.1
−
µA
XCIN clock off, Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
7
µA
XCIN clock off, Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (low drive)
FMR47 = 1
Stop mode
Standard
Typ. Max.
3.5
−
High-speed on-chip oscillator on = 4 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
Low-speed clock mode High-speed on-chip oscillator off
Wait mode
Min.
−
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C) [VCC = 2.2 V]
Table 5.26
XCIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XCIN)
XCIN input cycle time
14
−
µs
tWH(XCIN)
XCIN input “H” width
7
−
µs
tWL(XCIN)
XCIN input “L” width
7
−
µs
VCC = 2.2 V
tC(XCIN)
tWH(XCIN)
XCIN input
tWL(XCIN)
Figure 5.11
XCIN Input Timing Diagram when VCC = 2.2 V
Table 5.27
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
500
−
ns
tWH(TRAIO)
TRAIO input “H” width
200
−
ns
tWL(TRAIO)
TRAIO input “L” width
200
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.12
TRAIO Input Timing Diagram when VCC = 2.2 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 46 of 65
VCC = 2.2 V
R8C/2H Group, R8C/2J Group
Table 5.28
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLKi input cycle time
800
−
ns
tW(CKH)
CLKi input “H” width
400
−
ns
tW(CKL)
CLKi input “L” width
400
−
ns
td(C-Q)
TXDi output delay time
−
200
ns
th(C-Q)
TXDi hold time
0
−
ns
tsu(D-C)
RXDi input setup time
150
−
ns
th(C-D)
RXDi input hold time
90
−
ns
i = 0 or 2
VCC = 2.2 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0 or 2
Figure 5.13
Table 5.29
Serial Interface Timing Diagram when VCC = 2.2 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
tW(INH)
tW(INL)
Standard
Parameter
Unit
Min.
Max.
INTi input “H” width
1000(1)
−
ns
INTi input “L” width
1000(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 2.2 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.14
External Interrupt INTi Input Timing Diagram when VCC = 2.2 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 47 of 65
R8C/2H Group, R8C/2J Group
5.2
5. Electrical Characteristics
R8C/2J Group
Table 5.30
Absolute Maximum Ratings
Symbol
Parameter
Rated Value
Unit
−0.3 to 6.5
V
Input voltage
−0.3 to VCC + 0.3
V
VO
Output voltage
−0.3 to VCC + 0.3
V
Pd
Power dissipation
500
mW
Topr
Operating ambient temperature
−20 to 85 (N version) /
−40 to 85 (D version)
°C
Tstg
Storage temperature
−65 to 150
°C
VCC
Supply voltage
VI
Table 5.31
IOH(sum)
IOH(peak)
IOH(avg)
IOL(sum)
IOL(sum)
IOL(peak)
IOL(avg)
−
Topr = 25°C
Recommended Operating Conditions
Symbol
VCC
VSS
VIH
VIL
IOH(sum)
Condition
Sum of all pins IOH(peak)
Min.
2.2
−
0.8 VCC
0
−
Standard
Typ.
−
0
−
−
−
Max.
5.5
−
VCC
0.2 VCC
−160
Sum of all pins IOH(avg)
−
−
−80
mA
All pins
All pins
−
−
−
−
−10
−5
mA
mA
Sum of all pins IOL(peak)
−
−
160
mA
Sum of all pins IOL(avg)
−
−
80
mA
All pins
All pins
−
−
−
−
−
125
10
5
−
mA
mA
kHz
−
−
8
MHz
−
−
4
MHz
Parameter
Supply voltage
Supply voltage
Input “H” voltage
Input “L” voltage
Peak sum output “H”
current
Average sum output “H”
current
Peak output “H” current
Average output “H”
current
Peak sum output “L”
currents
Average sum output “L”
currents
Peak output “L” currents
Average output “L” current
System clock
Conditions
HRA01 = 0
Low-speed on-chip
oscillator selected
HRA01 = 1
High-speed on-chip
oscillator selected
2.7 V ≤ VCC ≤ 5.5 V
HRA01 = 1
High-speed on-chip
oscillator selected
2.2 V ≤ VCC ≤ 5.5 V
NOTES:
1. VCC = 2.2 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
P1
P3
P4
30pF
P6
Figure 5.15
Ports P1, P3, P4, and P6 Timing Measurement Circuit
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 48 of 65
Unit
V
V
V
V
mA
R8C/2H Group, R8C/2J Group
Table 5.32
5. Electrical Characteristics
Flash Memory (Program ROM) Electrical Characteristics
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
100(3)
−
−
times
Byte program time
−
50
400
µs
−
Block erase time
−
0.4
9
s
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
2.2
−
5.5
V
−
Program, erase temperature
0
−
60
°C
−
Data hold time(7)
20
−
−
year
−
Program/erase endurance(2)
−
Ambient temperature = 55°C
NOTES:
1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024
1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance
still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the
number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. The data hold time includes time that the power supply is off or the clock is not supplied.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 49 of 65
R8C/2H Group, R8C/2J Group
Table 5.33
5. Electrical Characteristics
Voltage Detection 0 Circuit Electrical Characteristics
Symbol
Parameter
Condition
Vdet0
Voltage detection level
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(2)
Vccmin
MCU operating voltage minimum value
VCA25 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
2.2
2.3
2.4
V
−
0.9
−
µA
−
−
300
µs
2.2
−
−
V
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2
register to 0.
Table 5.34
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Vdet1
−
Parameter
Condition
Voltage detection level(4)
Voltage monitor 1 interrupt request generation
time(2)
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
VCA26 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
2.70
2.85
3.00
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1.
3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2
register to 0.
4. This parameter shows the voltage detection level when the power supply drops.
The voltage detection level when the power supply rises is higher than the voltage detection level when the power supply
drops by approximately 0.1 V.
Table 5.35
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Parameter
Vdet2
Voltage detection level
−
Voltage monitor 2 interrupt request generation time(2)
−
Voltage detection circuit self power consumption
td(E-A)
Waiting time until voltage detection circuit operation
starts(3)
Condition
VCA27 = 1, VCC = 5.0 V
Standard
Unit
Min.
Typ.
Max.
3.3
3.6
3.9
V
−
40
−
µs
−
0.6
−
µA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2.
3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2
register to 0.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 50 of 65
R8C/2H Group, R8C/2J Group
Table 5.36
5. Electrical Characteristics
Power-on Reset Circuit, Voltage Monitor 0 Reset Electrical Characteristics(3)
Symbol
Parameter
Condition
Standard
Min.
Typ.
Unit
Max.
Vpor1
Power-on reset valid voltage(4)
−
−
0.1
V
Vpor2
Power-on reset or voltage monitor 0 reset valid
voltage
0
−
Vdet0
V
trth
External power VCC rise gradient(2)
20
−
−
mV/msec
NOTES:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. This condition (external power VCC rise gradient) does not apply if VCC ≥ 1.0 V.
3. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVD0ON bit in the OFS register to 0, the
VW0C0 and VW0C6 bits in the VW0C register to 1 respectively, and the VCA25 bit in the VCA2 register to 1.
4. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on
reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if −20°C ≤ Topr ≤ 85°C, maintain tw(por1) for
3,000 s or more if −40°C ≤ Topr < −20°C.
Vdet0(3)
Vdet0(3)
2.2 V
trth
trth
External
Power VCC
Vpor2
Vpor1
Sampling time(1, 2)
tw(por1)
Internal
reset signal
(“L” valid)
1
× 32
fOCO-S
1
× 32
fOCO-S
NOTES:
1. When using the voltage monitor 0 digital filter, ensure that the voltage is within the MCU operation voltage
range (2.2 V or above) during the sampling time.
2. The sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details.
3. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual for details.
Figure 5.16
Reset Circuit Electrical Characteristics
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 51 of 65
R8C/2H Group, R8C/2J Group
Table 5.37
Comparator Electrical Characteristics
Symbol
Vref
Vcref
5. Electrical Characteristics
Parameter
Internal reference voltage
External input reference voltage
Standard
Condition
VCC = 2.2 V to 5.5 V, Topr = 25°C
Min.
Typ.
Max.
Unit
1.15
1.25
1.35
V
VCC = 2.2 V to 5.5 V,
Topr = −40 to 85°C
−
1.25
−
V
VCC = 2.2 V to 4.0 V
0.5
−
VCC − 1.1
V
VCC = 4.0 V to 5.5 V
0.5
−
VCC − 1.5
V
−0.3
−
VCC + 0.3
V
Vcin
External comparison voltage input
range
Vofs
Input offset voltage
−
20
120
mV
Tcrsp
Response time
−
4
−
µs
NOTE:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Table 5.38
High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
fOCO-F
Parameter
High-speed on-chip oscillator frequency
temperature • supply voltage dependence
Condition
Standard
Unit
Min.
Typ.
Max.
VCC = 4.75 V to 5.25 V
Topr = 0 to 60°C(2)
7.76
8
8.24
MHz
VCC = 2.7 V to 5.5 V
Topr = −20 to 85°C(2)
7.68
8
8.32
MHz
VCC = 2.7 V to 5.5 V
Topr = −40 to 85°C(2)
7.44
8
8.32
MHz
VCC = 2.2 V to 5.5 V
Topr = −20 to 85°C(3)
7.04
8
8.96
MHz
VCC = 2.2 V to 5.5 V
Topr = −40 to 85°C(3)
6.8
8
9.2
MHz
NOTES:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. These standard values show when the HRA1 register is set to the value before shipment and the HRA2 register is set to 00h.
3. These standard values show when the correction value in the FRA6 register is written into the HRA1 register.
Table 5.39
Low-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
fOCO-S
Low-speed on-chip oscillator frequency
30
125
250
−
Oscillation stability time
−
10
100
µs
−
Self power consumption at oscillation
−
15
−
µA
VCC = 5.0 V, Topr = 25°C
kHz
NOTE:
1. VCC = 2.2 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Table 5.40
Power Supply Circuit Timing Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
td(P-R)
Time for internal power supply stabilization during
power-on(2)
1
−
2000
µs
td(R-S)
STOP exit time(3)
−
−
150
µs
NOTES:
1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = 25°C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 52 of 65
R8C/2H Group, R8C/2J Group
Table 5.41
Electrical Characteristics (1) [VCC = 5 V]
Symbol
VOH
5. Electrical Characteristics
Parameter
Output “H” voltage
VOL
Output “L” voltage
VT+-VT-
Hysteresis
Condition
Standard
Unit
Min.
Typ.
Max.
IOH = −5 mA
VCC − 2.0
−
VCC
IOH = −200 µA
VCC − 0.5
−
VCC
V
−
−
2.0
V
IOL = 5 mA
IOL = 200 µA
V
−
−
0.45
V
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, CLK0
0.1
0.5
−
V
RESET
0.1
1.0
−
V
µA
IIH
Input “H” current
VI = 5 V, VCC = 5 V
−
−
5.0
IIL
Input “L” current
VI = 0 V, VCC = 5 V
−
−
−5.0
µA
VI = 0 V, VCC = 5 V
30
50
167
kΩ
During stop mode
2.0
−
−
V
RPULLUP Pull-up resistance
VRAM
RAM hold voltage
NOTE:
1. VCC = 4.2 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 53 of 65
R8C/2H Group, R8C/2J Group
Table 5.42
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [Vcc = 5 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
Power supply current High-speed
(VCC = 3.3 to 5.5 V)
on-chip oscillator
mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
−
5
8
mA
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
2
−
mA
Low-speed
on-chip oscillator
mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
130
300
µA
Wait mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
25
75
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
23
60
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.8
3
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.2
−
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
8
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Stop mode
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 54 of 65
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V]
Table 5.43
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
100
−
ns
tWH(TRAIO)
TRAIO input “H” width
40
−
ns
tWL(TRAIO)
TRAIO input “L” width
40
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.17
TRAIO Input Timing Diagram when VCC = 5 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 55 of 65
VCC = 5 V
R8C/2H Group, R8C/2J Group
Table 5.44
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
200
−
ns
tW(CKH)
CLK0 input “H” width
100
−
ns
tW(CKL)
CLK0 input “L” width
100
−
ns
td(C-Q)
TXD0 output delay time
−
50
ns
th(C-Q)
TXD0 hold time
0
−
ns
tsu(D-C)
RXD0 input setup time
50
−
ns
th(C-D)
RXD0 input hold time
90
−
ns
VCC = 5 V
tC(CK)
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 5.18
Table 5.45
Serial Interface Timing Diagram when VCC = 5 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
tW(INH)
tW(INL)
Standard
Parameter
Unit
Min.
Max.
INTi input “H” width
250(1)
−
ns
INTi input “L” width
250(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.19
External Interrupt INTi Input Timing Diagram when VCC = 5 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 56 of 65
R8C/2H Group, R8C/2J Group
Table 5.46
5. Electrical Characteristics
Electrical Characteristics (3) [VCC = 3 V]
Symbol
Parameter
Condition
Standard
Unit
Typ.
Max.
VCC − 0.5
−
VCC
V
−
−
0.5
V
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, CLK0
0.1
0.3
−
V
RESET
0.1
0.4
−
V
µA
VOH
Output “H” voltage
IOH = −1 mA
VOL
Output “L” voltage
IOL = 1 mA
VT+-VT-
Hysteresis
Min.
IIH
Input “H” current
VI = 3 V, VCC = 3 V
−
−
4.0
IIL
Input “L” current
VI = 0 V, VCC = 3 V
−
−
−4.0
µA
VI = 0 V, VCC = 3 V
66
160
500
kΩ
During stop mode
1.8
−
−
V
RPULLUP Pull-up resistance
VRAM
RAM hold voltage
NOTE:
1. VCC =2.7 to 3.3 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 57 of 65
R8C/2H Group, R8C/2J Group
Table 5.47
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [Vcc = 3 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
Power supply current High-speed
(VCC = 2.7 to 3.3 V)
on-chip oscillator
mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
−
5
−
mA
High-speed on-chip oscillator on = 8 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
2
−
mA
Low-speed
on-chip oscillator
mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
130
300
µA
Wait mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
25
70
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
23
55
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.7
3
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.1
−
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
7
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Stop mode
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 58 of 65
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) [VCC = 3 V]
Table 5.48
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
300
−
ns
tWH(TRAIO)
TRAIO input “H” width
120
−
ns
tWL(TRAIO)
TRAIO input “L” width
120
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.20
TRAIO Input Timing Diagram when VCC = 3 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 59 of 65
VCC = 3 V
R8C/2H Group, R8C/2J Group
Table 5.49
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
300
−
ns
tW(CKH)
CLK0 input “H” width
150
−
ns
tW(CKL)
CLK0 Input “L” width
150
−
ns
td(C-Q)
TXD0 output delay time
−
80
ns
th(C-Q)
TXD0 hold time
0
−
ns
tsu(D-C)
RXD0 input setup time
70
−
ns
th(C-D)
RXD0 input hold time
90
−
ns
VCC = 3 V
tC(CK)
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 5.21
Table 5.50
Serial Interface Timing Diagram when VCC = 3 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
tW(INH)
tW(INL)
Standard
Parameter
Unit
Min.
Max.
INTi input “H” width
380(1)
−
ns
INTi input “L” width
380(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.22
External Interrupt INTi Input Timing Diagram when VCC = 3 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 60 of 65
R8C/2H Group, R8C/2J Group
Table 5.51
5. Electrical Characteristics
Electrical Characteristics (5) [VCC = 2.2 V]
Symbol
Parameter
Condition
Standard
Unit
Typ.
Max.
VCC − 0.5
−
VCC
V
−
−
0.5
V
INT0, INT1,
KI0, KI1, KI2, KI3,
RXD0, CLK0
0.05
0.3
−
V
RESET
0.05
0.15
−
V
VOH
Output “H” voltage
IOH = −1 mA
VOL
Output “L” voltage
IOL = 1 mA
VT+-VT-
Hysteresis
Min.
IIH
Input “H” current
VI = 2.2 V
−
−
4.0
µA
IIL
Input “L” current
VI = 0 V
−
−
−4.0
µA
VI = 0 V
100
200
600
kΩ
−
35
−
MΩ
1.8
−
−
V
RPULLUP Pull-up resistance
RfXCIN
Feedback resistance
VRAM
RAM hold voltage
XCIN
During stop mode
NOTE:
1. VCC = 2.2 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 61 of 65
R8C/2H Group, R8C/2J Group
Table 5.52
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (6) [Vcc = 2.2 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
Power supply current High-speed
(VCC = 2.2 to 2.7 V)
on-chip oscillator
mode
Single-chip mode,
output pins are open,
other pins are VSS
High-speed on-chip oscillator on = 4 MHz
Low-speed on-chip oscillator on = 125 kHz
No division
−
3.5
−
mA
High-speed on-chip oscillator on = 4 MHz
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
1.5
−
mA
Low-speed
on-chip oscillator
mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR47 = 1
−
100
230
µA
Wait mode
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
22
60
µA
High-speed on-chip oscillator off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
VCA20 = 1
−
20
55
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
0.7
3
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit disabled (BGRCR0 = 1)
−
1.1
−
µA
Topr = 25°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5
7
µA
Topr = 85°C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
BGR trimming circuit enabled (BGRCR0 = 0)
−
5.5
−
µA
Stop mode
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 62 of 65
R8C/2H Group, R8C/2J Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C) [VCC = 2.2 V]
Table 5.53
TRAIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRAIO)
TRAIO input cycle time
500
−
ns
tWH(TRAIO)
TRAIO input “H” width
200
−
ns
tWL(TRAIO)
TRAIO input “L” width
200
−
ns
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.23
TRAIO Input Timing Diagram when VCC = 2.2 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 63 of 65
VCC = 2.2 V
R8C/2H Group, R8C/2J Group
Table 5.54
5. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
800
−
ns
tW(CKH)
CLK0 input “H” width
400
−
ns
tW(CKL)
CLK0 input “L” width
400
−
ns
td(C-Q)
TXD0 output delay time
−
200
ns
th(C-Q)
TXD0 hold time
0
−
ns
tsu(D-C)
RXD0 input setup time
150
−
ns
th(C-D)
RXD0 input hold time
90
−
ns
VCC = 2.2 V
tC(CK)
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 5.24
Table 5.55
Serial Interface Timing Diagram when VCC = 2.2 V
External Interrupt INTi (i = 0 or 1) Input
Symbol
tW(INH)
tW(INL)
Standard
Parameter
Unit
Min.
Max.
INTi input “H” width
1000(1)
−
ns
INTi input “L” width
1000(2)
−
ns
NOTES:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 2.2 V
tW(INL)
INTi input
tW(INH)
i = 0 or 1
Figure 5.25
External Interrupt INTi Input Timing Diagram when VCC = 2.2 V
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 64 of 65
R8C/2H Group, R8C/2J Group
Package Dimensions
Package Dimensions
Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of
the Renesas Technology website.
JEITA Package Code
P-LSSOP20-4.4x6.5-0.65
RENESAS Code
PLSP0020JB-A
MASS[Typ.]
0.1g
11
*1
E
20
HE
Previous Code
20P2F-A
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
F
1
Index mark
10
c
A1
Reference Dimension in Millimeters
Symbol
D
A
L
*2
A2
*3
e
y
bp
Detail F
D
E
A2
A
A1
bp
c
HE
e
y
L
Rev.1.00 Mar 28, 2008
REJ03B0217-0100
Page 65 of 65
Min
6.4
4.3
Nom Max
6.5 6.6
4.4 4.5
1.15
1.45
0.1 0.2
0
0.17 0.22 0.32
0.13 0.15 0.2
0°
10°
6.2 6.4 6.6
0.53 0.65 0.77
0.10
0.3 0.5 0.7
REVISION HISTORY
REVISION HISTORY
R8C/2H Group, R8C/2J Group Datasheet
R8C/2H Group, R8C/2J Group Datasheet
Description
Rev.
Date
0.01
Jun 18, 2007
−
First Edition issued
0.10
Jul 20, 2007
20
Table 4.2: 0038h After reset;
“0000X010b” → “1000X010b”, “0100X011b” → “1100X011b”
Page
Summary
31 to 64 5. Electrical Characteristics added
0.20
Nov 12, 2007
2
Table 1.1 I/O Ports: “• Output-only: 1” added
“• CMOS I/O ports: 16” → “• CMOS I/O ports: 15”
6
Figure 1.3 revised
8
Figure 1.5 revised
9
Table 1.5 Pin Number: 4, 6, 16 revised
12
Table 1.7 I/O port: “P4_3 to P4_5” → “P4_3, P4_5”
Timer RE, Output port added
19
Table 4.1 0006h “01001000b” → “01011000b”
23
Table 4.5 0118h to 011Dh: After reset revised
011Fh “Timer RE Real-Time Clock Precision Adjust Register”
added
31, 48
Table 5.2, Table 5.31 NOTE2 revised
54, 58
Table 5.42, Table 5.47 revised
62
1.00
Mar 28, 2008
Table 5.52 revised
All pages “Under development” deleted
2, 3
Table 1.1, Table 1.2 revised
4, 5
Table 1.3, Table 1.4; “(D): Under development” deleted
17, 18
Figure 3.1, Figure 3.2; “Expanded area” deleted
19
Table 4.1 “002Eh” “002Fh” revised
20
Table 4.2 “003Eh” “003Fh” revised
32
Table 5.3 revised
Old Figure 5.2 deleted
35
Table 5.8, Table 5.11 revised
Table 5.9 revised, NOTE3 added
37
Table 5.13 revised
41
Table 5.19 revised
45
Table 5.25 revised
49
Table 5.32 revised
Old Figure 5.17 deleted
52
Table 5.37, Table 5.40 revised
Table 5.38 revised, NOTE3 added
54
Table 5.42 revised
58
Table 5.47 revised
C-1
REVISION HISTORY
Rev.
Date
1.00
Mar 28, 2008
R8C/2H Group, R8C/2J Group Datasheet
Description
Page
62
Summary
Table 5.52 revised
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