ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS

ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS
FEATURES
Ê Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5)
Ë Low Profile DIP or SMD Package
Ì Low Leakage Inductance and Winding Capacitance
Í Fast Rise Times
Î 500 or 2000Vrms Minimum Isolation
Ï Triple Core Package
ELECTRICAL SPECIFICATIONS AT 25OC PER CORE
TURNS
RATIO
(± 5%)
PART
NUMBER
A8DB101150
D8DB101150
D8CB101150
A8DB101170
D8DB101170
D8CB101170
A8DB101190
D8DB101190
D8CB101190
A8DB101240
D8DB101240
D8CB101240
A8DB101270
D8DB101270
D8CB101270
A8DB101330
D8DB101330
D8CB101330
D8DB101350
D8CB101350
D8DB101370
D8CB101370
PRIMARY
OCL
(H ± 20%)
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
PRIMARY
ET CONSTANT
(V-sec Min.)
32
32
32
40
40
40
50
50
50
75
75
75
100
100
100
150
150
150
200
200
250
250
RISE
TIME
(ns Max.)
1.5
1.5
1.5
1.7
1.7
1.7
1.9
1.9
1.9
2.4
2.4
2.4
2.7
2.7
2.7
3.3
3.3
3.3
3.5
3.5
3.7
3.7
2.8
2.8
2.8
3.0
3.0
3.0
3.0
3.0
3.0
3.2
3.2
3.2
3.4
3.4
3.4
3.5
3.5
3.5
3.5
3.5
3.6
3.6
PRI-SEC
Cw/w
(pf Max.)
PRI / SEC
LL
(H Max.)
7.0
7.0
7.0
8.0
8.0
8.0
8.0
8.0
8.0
9.0
9.0
9.0
10.0
10.0
10.0
12.0
12.0
12.0
14.0
14.0
16.0
16.0
.15
.15
.15
.15
.15
.15
.20
.20
.20
.20
.20
.20
.25
.25
.25
.25
.25
.25
.30
.30
.35
.35
DCR
(Ohms Max.)
HIPOT
Vrms Min.
.20
.20
.20
.25
.25
.25
.25
.25
.25
.30
.30
.30
.30
.30
.30
.30
.30
.30
.30
.30
.30
.30
2000
2000
500
2000
2000
500
2000
2000
500
2000
2000
500
2000
2000
500
2000
2000
500
2000
500
2000
500
PHYSICAL DIMENSIONS .... DIMENSIONS IN INCHES (mm)
NOTE: For Gull Wing Package Change "D8" to "G8"
SCHEMATIC DIAGRAM "B"
15
16
14
13
12
11
PIN#1
DOT
SEC.
.280
(7.11)
MAX
.880
(22.35)
MAX
9
10
SEC.
SEC.
"D8" PACKAGE
.212
(5.38)
MAX
PRI.
PRI.
1
2
3
4
.120 .020 (.51)
(3.05) .010 (.25)
MIN
PRI.
5
6
7
.020
(0.51)
TYP
8
.050
(1.27)
TYP
"A8" PACKAGE
PIN#1
DOT
.900
(22.86)
MAX
.100
(2.54)
.340
(8.64)
.880
(22.35)
MAX
PIN#1
DOT
.250
(6.35)
MAX
.700
(17.78)
.010
(0.25)
.300
(7.62)
"G8" PACKAGE
.400
(12.70)
MAX
.120
(3.05)
MIN
.100
(2.54)
TYP
.008R
(0.20)
.280
(7.11)
MAX
.212
(5.38)
MAX
.020 DIA
(0.51)
.020
(0.51)
TYP
.050
(1.27)
TYP
.100
(2.54)
TYP
.020 (.51)
.010 (.25)
.008R
(0.20)
.030 (0.76)
FLAT
.020 (0.51)
.425 (10.80)
.390 (9.90)
.300
(7.62)
Specifications subject to change without notice.
14
20381 Barents Sea Circle
Lake Forest, California 92630
Phone: (949) 452-0511
Fax:
(949) 452-0512
.010
(0.25)
TYP
ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS
FEATURES
Ê Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5)
Ë Low Profile soic Type SMD Package
Ì Low Leakage Inductance and Winding Capacitance
Í Fast Rise Times
Î 2000Vrms Minimum Isolation
Ï Triple Core Package
ELECTRICAL SPECIFICATIONS AT 25OC PER CORE
TURNS
RATIO
(± 5%)
PART
NUMBER
TSD-470
TSD-471
TSD-472
TSD-473
TSD-474
TSD-475
TSD-842
PRIMARY
OCL
(H Min)
1:1
1:1
1:1
1:1
1:1
1:1
1:1
PRIMARY
ET CONSTANT
(V-sec Min)
35
50
75
100
150
250
90
RISE
TIME
(ns Max.)
2.1
2.2
2.4
2.5
3.0
3.5
3.0
1.6
1.7
1.8
1.8
2.5
3.0
1.8
PRI / SEC
Cw/w
(pf Max)
PRI
LL
(H Max)
DCR
( Max)
PRI / SEC
5.0
5.0
7.0
8.0
10.0
15.0
10.0
.10
.10
.10
.10
.20
.25
.20
.15 / .15
.15 / .15
.17 / .17
.20 / .20
.30 / .30
.30 / .30
.30 / .30
HIPOT
SCHEVrms Min MATIC
2000
2000
2000
2000
2000
2000
2000
B
B
B
B
B
B
B
VARIATIONS AVAILABLE. FOR INTERMEDIATE VALUES AND/
OR CUSTOM DESIGNS PLEASE CONSULT THE FACTORY.
SCHEMATIC DIAGRAM "B"
15
16
1
14
13
12
11
9
10
SEC.
SEC.
SEC.
PRI.
PRI.
PRI.
2
3
4
5
PHYSICAL DIMENSIONS .... IN INCHES (mm)
6
7
8
FIGURE 3: RECOMMENDED PCB LAYOUT
DIMENSION IN INCHES, (mm)
"G1" PACKAGE
16 15 14 13 12 11 10 9
16x.075 (1.91)
.270 (6.86)
1
P TSD-XXX
M YYWW
PIN#1
WHITE DOT
1
2
3
4
5
6
7
16
7x.050 (1.27)
16x.025 (.64)
8
.460
(11.68)
MAX
.280
(7.11)
MAX
.210
(5.33)
MAX
.050
.019 (1.27)
(0.48) TYP
TYP
.010 (.25)
.004 (.10)
8
.020 (0.51) MIN
9
.010
(0.25)
TYP
.370 (9.40)
Specifications subject to change without notice.
15
20381 Barents Sea Circle
Lake Forest, California 92630
Phone: (949) 452-0511
Fax:
(949) 452-0512