QUAD FLAT NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC LCC-64P-M24 64-pin plastic QFN Lead pitch 0.50 mm Package width × package length 9.00 mm × 9.00 mm Sealing method Plastic mold Mounting height 0.90 mm MAX Weight - (LCC-64P-M24) 64-pin plastic QFN (LCC-64P-M24) 9.00±0.10 (.354±.004) 6.00±0.10 (.236±.004) 9.00±0.10 (.354±.004) 0.25±0.05 (.010±.002) 6.00±0.10 (.236±.004) INDEX AREA 0.45 (.018) 1PIN ID (0.20R (.008R)) 0.85±0.05 (.033±.002) 0.05 (.002) MAX C 2011 FUJITSU SEMICONDUCTOR LIMITED HMbC64-24Sc-2-1 0.50 (.020) (TYP) 0.40±0.05 (.016±.002) (0.20 (.008)) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 1107