CAS300M17BM2 MCDS

Part Number
Date
ROHS Compliant
Revision
Material Content Data Sheet
Item
Base Plate Including Metallization
Substrate Including Metallization
Chip Including Metallization
Solders
Wire Bonds
Housing
Encapsulation
Terminal Including Plating
Nut
SMT Resistor*
CAS300M17BM2
9/3/2014
Yes
1.0
Material Group
Non Noble Metal
Non Noble Metal
Inorganic Material
Non Noble Metal
Inorganic Material
Non Noble Metal
Non Noble Metal
Noble Metal
Non Noble Metal + Noble Metal
Non noble metal
Non noble metal
Noble Metal
Non Noble Metal
Inorganic Material
Inorganic Material
Polymers
Non Noble Metal
Non Noble Metal
Non Noble Metal
Materials
Copper
Nickel
Aluminum Nitride
Copper
Silicon Carbide
Aluminum
Nickel
Silver
Alloy
Tin
Copper
Silver
Aluminum
PBT
Fiber Glass
Silicone Gel/Rubber
Copper
Nickel
Stainless Steel
Total Mass (grams)
CAS Number
7440-50-8
7440-02-0
24304-00-5
7440-50-8
409-21-2
7429-90-5
7440-02-0
7440-22-4
7440-31-5
7440-50-8
7440-22-4
7429-90-5
24968-12-5
65997-17-3
63394-02-5
7440-50-8
7440-02-0
65997-19-5
Mass (gm)
Average Mass (%)
Cumulative Mass (%)
145.40
49.56%
49.6%
17.72
6.04%
55.60%
0.91
0.31%
55.91%
4.63
1.58%
57.49%
0.44
60.20
0.15%
20.52%
57.64%
78.16%
32.10
21.98
10.94%
7.49%
89.10%
96.60%
9.98
0.07
3.40%
0.02%
100.00%
293.36
100.0%
Traces
x
x
x
x
x
x
x
x
x
x
NOTES
1. All or part of this material declaration is based on information provided by third parties and/or external testing. Cree reasonably believes this
information is complete and accurate, but no warranty is provided with respect to this information.
2. This information is based on information currently available to Cree and is subject to change without prior notice.
Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks of Cree, Inc.
CAS300M17BM2 Material Content Data Sheet Rev -
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