Thermoelectric Cooling Solutions HHL09.1MC0614203 Performance Parameters Mounted TEC Type ΔTmax K Qmax W Imax A Umax V Rt K/W H mm 17.1 0.028 1.4 1MC06-142-03 (n=142) 1MC06-142-03 65 49.3 4.9 Performance data is specified at 300K, vacuum (thermal resistance incl.) Dimensions Manufacturing options A. Header material: CuW (20%-80%) base, Kovar frame D. TEC Ceramics Material: 1.Pure Al2O3(100%) - used by default 2.Alumina (Al2O3- 96%) F. Thermistor (optional) Can be mounted to cold side ceramics edge. 3.Aluminum Nitride (AlN) B. Header surface finish: Au plaiting (base and pins) G. Thermistor mounting: E. TEC Cold Side Finish: Epoxy gluing 1. Blank ceramics (not metallized) C. TEC to Header mounting: Solder 206 (Tmelt =206°C, Sn-Ag-In-Cu, flux-free process) 2. Metallized (Au plaiting) 3. Metallized and pre-tinned (various solder for pre-tinning available) H. Pinout configuration: the drawing contains standard pinout, can be revised by request) 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 1 of 5 Thermoelectric Cooling Solutions 1MC06-142-03 Performance Data @ 27ºC, Vacuum ΔTmax K Qmax W Imax A Umax V @50ºC, N2 ΔTmax K Qmax W Imax A Umax V 1MC06-142-03 65 49.3 4.9 17.1 1MC06-142-03 70 53.5 4.8 18.7 Note: Performance data is specified at optimal heatsink. HHL Package base thermal resistance is included into estimations. Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly. Application Tips 1. Never heat up the sub-assembly more than 200˚C. 2. Never use the sub-assembly without an attached heat sink. Header is NOT a heatsink by itself. 3. Connect TE cooler to DC power supply according to specified polarity. 4. Do not apply current/voltage higher than specified max values Mounting to TEC cold side 1. Soldering of object to be cooled. Method suitable for a TE module with the metallized cold side (Ordering Options. Item E). Soldering requires careful TEC Mounting to the cold side procedures: A. Never overheat TEC (Application Tips. Item 1). B. Use solder with melting point less than 200ºC. 2. Gluing of object to be cooled. Method available by glues with good thermoconductive properties. Not recommended for high vacuum applications and long operations at high temperature. HHL Package 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 2 of 5 Thermoelectric Cooling Solutions Sub-assembly Overview HHL 9pin Package (CuW base, Kovar frame) Laser Labeling is available for HHL package (optional) Thermoelectric Cooler 1MC06-142-03 TEC to Package High-Temp. Mounting by Soldering (Lead-Free Solder 206, Sn-Ag-In-Cu, vacuum flux-free process) TE Cooler Lead Free Internal Assembly Solder (Lead-Free Solder 230, Sn-Sb) CuW Base (20%-80%) Thermistor (optional) NTC Thermistor 2.2kOhm or 10kOhm Flexible pinout for TEC and thermistor HHL 9pin Package Drawing 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 3 of 5 Thermoelectric Cooling Solutions Contacts RMT Ltd. Headquarters Warshavskoe sh. 46, 115230, Moscow, Russia Phone: +7-499-678-2082 Fax: +7-499-678-2083 Web: www.rmtltd.ru Email: [email protected] EUROPE/USA - TEC Microsystems GmbH Schwarzschildstrasse 3, 12489 Berlin, Germany Tel. +49 30 6789 3314 Fax+49 30 6789 3315 Web: www.tec-microsystems.com Email: [email protected] CHINA - ProTEC Ltd. 深圳市南山区登良路恒裕中心B座207 电话：+86-755-61596066 传真：+86-755-61596036 邮编：518054 Web: www.protecltd.com Email: [email protected] 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 4 of 5 Thermoelectric Cooling Solutions Legal Notice All logos, images, trademarks and product names (collectively Materials) are proprietary to RMT Ltd and/ or any of its affiliates, or subsidiaries, or other respective owners that have granted RMT Ltd the permission and/or license to use such Materials. All images are provided by RMT Ltd. and are subjects of copyright protection. RMT Ltd, TEC Microsystems GmbH and ProTEC Ltd. do not grant a copyright license (express or implied) to the Recipient, except that Recipient may reproduce the logos, images and text materials in this press-release without any alteration for non-promotional or editorial purposes only with a written note about materials owner. Copyright protection warning Graphic materials and text from this datasheet may not be used commercially without a prior response in writing on company letterhead and signed by RMT Ltd authority. Thank you for respecting the intellectual property rights protected by the International Copyright laws. All Images contain RMT hidden watermark for the immediate proof of their origin. RMT Ltd. RMT Image Hidden Watermark 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 5 of 5