BR8_BRIDGE MSDS

BR8 Material Safety Data Sheet
Material Content Declaration
Material
name
Lead Wire
23.98%
Substance name
e.g. Copper (Cu),
Gold (Au)
CAS no.,
if known
Copper (Cu)
7440-50-8
Phosphorus (P)
7723-14-0
Arsenic (As)
7440-38-2
Tin (Sn)
7440-31-5
Oxygen (O)
7782-44-7
Sulfur (S)
7704-34-9
Iron (Fe)
7439-89-6
Nickel (Ni)
7440-02-0
Bismuth (Bi)
7440-69-9
Antimony (Sb)
1309-64-4
Lead (Pb)
7439-92-1
Zinc (Zn)
7440-66-6
Total
Solder
Wafer
0.31%
Lead (Pb)
7439-92-1
Tin (Sn)
7440-31-5
Silver (Ag)
7440-22-4
Chip
0.32%
Silicon (Si)
Case
25.18%
Epoxy
Potting
50.04%
Epoxy
Plating
0.17%
Tin (Sn)
Total
7440-21-3
Total
25928-94-3
Total
25928-94-3
Total
7440-31-5
Total
Total mass
(mg)
Substance
mass
(mg)
1196.480
0.020
0.020
0.020
0.010
0.240
0.013
0.006
0.040
0.040
0.010
0.006
1,196.90
14.28
0.77
0.39
15.44
16.04
16.04
1,256.80
1,256.80
2,497.70
2,497.70
8.84
8.84
4991.72
% OF
Weight
(%)
ppm Of Total
Weight
99.96
0.0016
0.0016
0.0016
0.0008
0.0200
0.0011
0.0005
0.0033
0.0033
0.0008
0.0005
239,693.0
3.9
3.9
3.9
2.0
48.0
2.6
1.1
8.0
8.0
2.0
1.2
92.51
4.99
2.50
2,860.7
154.3
77.3
100.00
3,213.3
100.00
251,777.0
100.00
500,368.7
100.00
1,770.9