SOT23 Diodes Material Content Declaration Material name Substance name e.g. Copper (Cu), Gold (Au) Lead Frame Copper (Cu) 30.94% CAS no., if known Iron (Fe) 7439-89-6 Cobalt (Co) 7440-48-4 Silver (Ag) 7440-22-4 7440-02-0 Total 7440-21-3 Gold (Au) 7440-57-5 7429-90-5 Total 4,741.7 342.5 9.9 0.04 100.00 4,253.6 0.04 5.89 0.05 0.12 14808-60-7 68928-70-1 Total Plating 0.30% 93.08 6.72 0.19 Antimony Trioxide (Sb2O3) 1309-64-4 Brominated Epoxy Tin (Sn) Total mass (mg) 97.19 659,315.5 0.83 5,596.9 1.98 13,432.6 6.06 0.03 7440-31-5 Total 0.088 272.0 68.705 212,570.5 0.176 544.0 2.344 7,253.6 28.687 88,755.7 0.0424 0.0031 0.0001 7440-57-5 Silicon Dioxide (SiO2) ppm Of Total Weight 0.05 Total Gold (Au) % OF Weight (%) 2.76 Silicon (Si) Aluminuim (Al) Bonding Wire 0.42% Molding 67.83% 0.0024 1.8990 0.0049 0.0648 0.7929 7440-50-8 Nickel (Ni) Chip 0.51% Substance mass (mg) 0.03 8.93 100.00 2,910.4