SOT23 Diodes_SMD MSDS

SOT23 Diodes
Material Content Declaration
Material
name
Substance name e.g.
Copper (Cu), Gold
(Au)
Lead Frame Copper (Cu)
30.94%
CAS no., if
known
Iron (Fe)
7439-89-6
Cobalt (Co)
7440-48-4
Silver (Ag)
7440-22-4
7440-02-0
Total
7440-21-3
Gold (Au)
7440-57-5
7429-90-5
Total
4,741.7
342.5
9.9
0.04
100.00
4,253.6
0.04
5.89
0.05
0.12
14808-60-7
68928-70-1
Total
Plating
0.30%
93.08
6.72
0.19
Antimony Trioxide (Sb2O3) 1309-64-4
Brominated Epoxy
Tin (Sn)
Total mass (mg)
97.19 659,315.5
0.83
5,596.9
1.98
13,432.6
6.06
0.03
7440-31-5
Total
0.088
272.0
68.705 212,570.5
0.176
544.0
2.344
7,253.6
28.687
88,755.7
0.0424
0.0031
0.0001
7440-57-5
Silicon Dioxide (SiO2)
ppm Of Total
Weight
0.05
Total
Gold (Au)
% OF
Weight
(%)
2.76
Silicon (Si)
Aluminuim (Al)
Bonding
Wire
0.42%
Molding
67.83%
0.0024
1.8990
0.0049
0.0648
0.7929
7440-50-8
Nickel (Ni)
Chip
0.51%
Substance
mass
(mg)
0.03
8.93
100.00
2,910.4