产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF110M3 SMD-21
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2005-10-10
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 9
SAW FILTER
HDF110M3 SMD-21
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Page 2 of 9
SAW FILTER
HDF110M3 SMD-21
1. SCOPE
This specification shall cover the characteristics of SAW filter With 110M3 used for IF
applications.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
0V
10V50Hz/60Hz
-40℃ to +85℃
-45℃ to +85℃
0dBm
Electronic Characteristics
2-1.Typical frequency response
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Page 3 of 9
SAW FILTER
HDF110M3 SMD-21
2-2.Electrical characteristics
Parameter
Minimum Typical Maximum Unit
Center Frequency Fc(between -3dB points)
Insertion loss at 110.0 MHz
(Including loss in matching elements)
Bnd width
B-3dB
B-1dB
Group delay ripple(p-p)
Fc+/-1.6MHz
Rejection(4)
60.0MHz
……
100.0MHz
100.0MHz
……
105.5MHz
114.5MHz
……
120.0MHz
120.0MHz
…… 160.0MHz
109.90
110.0
110.1
10.0
3.75
6.8
4.0
3.1
45
80
40
36
36
38
Temperature coefficient of frequency TCf
42
41
41
43
-18
MHz
dB
MHz
nsec.
dB
ppm/K
3. TEST CIRCUIT
Actual matching values may vary due to PCB layout and parasitics
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Page 4 of 9
SAW FILTER
HDF110M3 SMD-21
4. DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in 2-2.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in 2-2.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 2-2.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in 2-2.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 2-2.
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Page 5 of 9
SAW FILTER
HDF110M3 SMD-21
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
(2) Label
Device Name
User Product Name
Quantity
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Page 6 of 9
SAW FILTER
HDF110M3 SMD-21
Lot No.
(3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
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Page 7 of 9
SAW FILTER
HDF110M3 SMD-21
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.00
±0.30
7.50
±0.10
1.75
±0.10
4.00
±0.10
8.00
±0.10
2.00
±0.10
Ø1.50
Ø1.5
±0.25
0.25
±0.05
2.20
±0.10
5.80
±0.10
7.30
±0.10
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
16.8
±0.3
3
max.
1.0
max.
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Page 8 of 9
SAW FILTER
HDF110M3 SMD-21
9. CAUTION
9-1. This is an electrostatic sensitive device. Please avoid static voltage during operation and
storage.
9-2. Sudden change of temperature shall be avoided, deterioration lf the characteristics can occur.
9-3. Ultrasonic vibration may cause deterioration and destruction of the components. Please
avoid ultrasonic cleaning.
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E-mail:[email protected]
Page 9 of 9