产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW RESONATOR
MODEL NO 型 号:
HDR430.5M SMD-3
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2006-5-11
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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E-mail:[email protected]
Page 1 of 8
SAW RESONATOR
HDR430.5M
SMD-3
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Page 2 of 8
SAW RESONATOR
HDR430.5M
SMD-3
1. SCOPE
This specification shall cover the characteristics of 1-port SAW resonator with 430.50M used
for remote-control security.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V
10V50Hz/60Hz
-40℃ to +85℃
-45℃ to +85℃
0dBm
2.2Electronic Characteristics
Item
Unites
Minimum
Typical
Maximum
Center Frequency
MHz
430.425
430.500
430.575
1.5
2.5
Insertion Loss
dB
Quality Factor Unload Q
8000
12800
50Ω Loaded Q
1000
2000
10
25
Temperature
Turnover Temperature
℃
Stability
Freq.temp.Coefficient
ppm/℃2
0.032
ppm/yr
<±10
Frequency Aging
DC. Insulation Resistance
RF Equivalent
RLC Model
1.0
Motional Resistance R1
Ω
16
Motional Inductance L1
μH
77.403
Motional Capacitance C1
fF
1.7658
pF
2.0
Transducer Static Capacitance
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MΩ
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40
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26
Page 3 of 8
SAW RESONATOR
HDR430.5M
SMD-3
3. TEST CIRCUIT
4. DIMENSION
2.Input
6.Output
1.3.5.7.Gound
4.8 Ground
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Page 4 of 8
SAW RESONATOR
HDR430.5M
SMD-3
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.
Then release the device into the room conditions for 1 to 2 hours prior to the measurement.
It shall meet the specifications in 2.2.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in 2.2.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 2.2.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
resonator shall fulfill the specifications in 2.2.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The resonator shall fulfill the specifications in 2.2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
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Page 5 of 8
SAW RESONATOR
HDR430.5M
SMD-3
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
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Page 6 of 8
SAW RESONATOR
HDR430.5M
SMD-3
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.0
±0.3
5.5
±0.05
1.75
±0.1
4.0
±0.1
8.0
±0.1
2.0
±0.05
Ø1.5
±0.1
Ø1.0
±0.25
0.3
±0.05
2.10
±0.1
6.40
±0.1
5.20
±0.1
[Figure 2]
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Page 7 of 8
SAW RESONATOR
HDR430.5M
SMD-3
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 8 of 8